Welcome Reception (All Attendees Are Invited To Attend)
Thank you to the Device Packaging Reception Sponsors:
Microelectronics Foundation Texas Hold'Em Tournament NO EXPERIENCE NECESSARY - Beginners Luck Actually Helps!!
(Separate Registration - Limited Seating) To Benefit the IMAPS Microelectronics Foundation
Monday, March 10th
5:00 pm – 6:30 pm
All Attendees are Invited!
you register for the
"COMBO" Registration with Device Packaging Conference &
the Global Business Council
Morning Technical Sessions
OPENING COMMENTS General Chair:
Ron Huemoeller, Amkor Technology
KEYNOTE – MOBILE PRODUCTS CHALLENGES AND DIRECTIONS IN MOBILE DEVICE PACKAGING Steve Bezuk, Senior Director, Engineering
QUALCOMM CDMA TECHNOLOGIES
Abstract: Mobile devices such as phones, tablets and subnotebooks are driving innovation in device packaging. These devices currently are jammed full of advanced capabilities, such as HD video, GPS, WLAN, cellular, touchscreens, Bluetooth, and dual cameras - with significantly more functionality than "sophisticated" notebooks. These features drive demand for mobile devices and provide significant challenges to the packaging community for solutions such as thinner packages while still controlling warpage, new materials, both polymers and solders, as well as innovative structures moving into 2.5 and 3D. Solving these challenges allows innovation to drive demand for mobile devices, providing a providing a platform for many innovative uses that are still being tapped, such as entertainment, video recording, web access, computer vision, augmented reality, all readable, recognizable, locatable, addressable, and controllable through the internet, the Internet of Things (IOT) concept. This talk will discuss current and future innovations to address these formidable issues in the mobile environment.
Dr. Bezuk is Senior Director of IC Package Engineering at Qualcomm. Steve’s group is responsible for current and future generations of packaging technologies for all of Qualcomm’s wireless applications. Prior to joining Qualcomm Steve was with Kyocera, Unisys, Sperry-Univac and RCA’s Sarnoff Research Center. Steve has worked and managed groups in a variety of areas, including of amorphous silicon research, CMOS, Bipolar and GaAs IC process development, Laser enhanced materials processing, and wirebond, TAB, Flip Chip, MEMS, and TSV packaging.
Steve is also very active in the IEEE CPMT and is their current VP of Technology. Steve is also active with the ECTC Conference for the society and was the General Chair for the 2004 ECTC conference and is the Current Publications Chair.
Steve has a B.S. in Chemistry from the University of Pittsburgh and a Ph.D. in Chemistry from the University of Minnesota.
KEYNOTE – MOBILE MARKET MOBILE PACKAGING AND INTERCONNECT TRENDS Brandon Prior, Senior Consultant
PRISMARK PARTNERS LLC
Abstract: This paper will focus on emerging and fast growth package solutions to meet mobile products' density and cost requirements. A short review of where package miniaturization and modularization has taken us so far, and where it will lead in the next 5 years. Teardowns of high density systems and packages will be used to illustrate key points.
Brandon Prior joined Prismark in 1996 and has been the primary author and editor of Prismark's Semiconductor and Packaging Quarterly Report since 2000. His research focuses on all aspects of back end assembly, including advanced leadframe and array packages, wafer bumping, MEMS, and related system level analyses. He serves as Prismark's primary contact and research person in the area of IC Packaging Technologies, and works with the leading component and materials providers, IDMs, foundries, and equipment manufacturers. Brandon has BA and BE degrees from Dartmouth College and the Thayer School of Engineering in Hanover NH.
Poster Speakers: Teaser for Wednesday's Interactive Session & "Happy Hour"
3D Panel Discussion: What's Driving the Next Technology Revolution in Packaging? Industry leaders representing technology, equipment and research to tackle the questions on what is driving
the next technology revolution in Packaging.
Panel Food/Beverage Sponsored by:
E. Jan Vardaman, TechSearch International
Sitaram Arkalgud, Invensas Corporation
Vice President, 3D Technology
John Dzarnoski, Starkey Hearing Technologies
Director of Microelectronic Packaging
Ron Huemoeller, Amkor Technology
Senior Vice President, Advanced 3DIC
Ravi Mahajan, Intel Corporation
Senior Principal Engineer, High Density Interconnect Pathfinding, Assembly Technology
Robert Patti, Tezzaron Semiconductor Corp.
Early Rate Ends: February 7, 2014 All registration fees increase after the deadline
On-line Registration Now Closed
Morning Technical Sessions
KEYNOTE – GRAPHICS PRODUCTS DIE STACKING IS HAPPENING IN MAINSTREAM COMPUTING Bryan Black, Senior Fellow
Abstract: Die stacking has proven effective in MEMs and FPGA solutions but has yet to impact mainstream computing CPUs and GPUs. This talk will walk through how die stacking will enter mainstream computing and how it will change the industry in the future.
Bryan Black received his Ph.D. from Carnegie Mellon. With over 20 years of experience Black has had the honor of working at Motorola, Intel, and AMD. He has done a little of everything from devices to circuits to microarchitecture to DRAM to test to packaging. Black is currently a Senior AMD Fellow and runs the AMD die stacking program.
KEYNOTE – GRAPHICS MARKET THE MARKET TRENDS IN GRAPHIC PRODUCTS:
FROM HANDHELDS TO SUPERCOMPUTERS
THERE'S A GPU IN YOUR FUTURE John Peddie, Founder
JPR (JOHN PEDDIE RESEARCH)
Abstract: The market for graphics chips in PCs and mobile devices is soaring. Although the PC market growth has slowed, the mobile market has more than offset that. The net result is we are seeing shipment levels approaching 2 billion units.
Dr. Jon Peddie is one of the pioneers of the graphics industry, and formed Jon Peddie Research (JPR) to provide customer intimate consulting and market forecasting services. Peddie lectures at numerous conferences on topics pertaining to graphics technology and the emerging trends in digital media technology. Recently named one of the most influential analysts, regularly advises investors in the GLG network, he is frequently quoted in trade and business publications, was the former president of Siggraph Pioneers, and he is also the author of several books his most recent, The History of Visual Magic in Computers.
Advanced 3D Packaging
Flip Chip & Wafer Level Packaging
Packaging Innovations &
System Challenges for: MEMS, Microsystems & Devices
Chairs: Dingyou Zhang, GlobalFoundries; Diane Scheele, Dynaloy - A subsidiary of Eastman Chemical Company
Alignment Process for Fabrication of Mirror-based Optical Via using Maskless Lithography Tool with Buffer Coat Materials
Sunglin Wang, University of Arizona, College of Optical Sciences (Chris Summitt, Tao Ge, Lee Johnson, Melissa Zaverton, Tom Milster, Yuzuru Takashima)
Interactive Poster Session & "Happy Hour" NEW FORMAT THIS YEAR
In The Foyer: 5:30 pm - 6:30 pm (Poster Presenter Setup - 4:00 pm - 5:00 pm)
Poster Session Sponsored by:
Cost Comparison of Temporary Bond and Debond Methods For Thin Wafer Handling
Amy Palesko, SavanSys Solutions, LLC (Chet Palesko)
Optical and Acoustic Metrology Techniques for 2.5 And 3D Advanced Packaging
Priya Mukundhan, Rudolph Technologies (Parker Huang, Bruce Chiu, Jay Chao, Chun Hung Lu, Stephen Chen, Jay Chen, Fei Shen, Jian Ding, Johnny Dai, Timothy Kryman)
A Comparison of Through Sapphire Via Process Development at Laser Services Suppliers
Syed Sajid Ahmad, Center for Nanoscale Science and Engineering, NDSU (Fred Haring, Aaron Reinholz)
High Throughput Thin Wafer Support Technology for 3DIC
John Moore, Daetec, LLC (Jared Pettit, David Young, Alman Law)
Direct EP/EPAG - Ultrathin Surface Finish for Soldering and Wire Bonding
Mustafa Oezkoek, Atotech (Gustavo Ramos, Arnd Kilian, Jens Wegricht)
Manufacturing Readiness of BVA(TM) Technology for Fine-Pitch Package-on-Package
Rajesh Katkar, Invensas Corporation (Wael Zohni, Rey Co, Rizza Cizek)
Magnetic Field Imaging for 3D Applications
Jan Gaudestad, Neocera (Antonio Orozco)
Temporary Bonding Cost Of Ownership:
The Link Between Low Total Thickness Variation and Chip Yield
Thomas Uhrmann, EV Group (Jorgen Burggraf, Harald Wiesbauer, Julian Bravin, Thorsten Matthias, Markus Wimplinger, Paul Lindner, EV Group GmbH; Herman Meynen, Yann Civale, Dow Corning Europe S.A.; Ranjith John, Sheng Wang, Peng-Fei Fu, Craig Yeakle, Gary Aw, Down Corning Corporation)
Fault Detection and Classification in Advanced Packaging
Richard Beaver, Rudolph Technologies
Impact of Reprocessing Technique on First Level Interconnects of Pb-Free to SnPb Reballed Area Array Flip Chip Devices
Joelle Arnold, DfR Solutions (Melissa Keener, Steph Gulbrandsen, Nathan Blattau, DfR Solutions; David Kayser, NAWCAD)
Electrical Performance Comparison Between fcBGA and eWLB Packages
Kai Liu, STATS ChipPAC (YongTaek Lee, HyunTai Kim, MaPhooPwint Hlaing, Gwang. Kim, Susan Park, Billy Ahn)
Cracking of Interconnect Structures Mimicking Stresses During Flip Chip Packaging
Ibon Ocaña, CEIT and Tecnun
Fatigue Testing of Bulk Materials Using a Microsystems Based Approach
Li-Anne Liew, University of Colorado & National Institute of Standards and Technology (David Read, Nicholas Barbosa III)
Cu Migration in Polycrystalline CdTe Solar Cells
D. Guo, Arizona State University (R. Akis, D. Brinkman, D. Vasileska, Arizona State University; I. Sankin, T. Fang, First Solar)
Electrical and Thermal Transport in Alternative Device Technologies
S. Qazi, Arizona State University (K. Raleva, University Sts Cyril and Methodius; D. Vasileska, Arizona State University)
Poster Session "Happy Hour" Sponsored by:
Post-Conference Presentations USB Flash Drive
This year the Conference technical & exhibitor presentations will be published and distributed to all "full conference" attendees & exhibitors on USB Flash Drives. These drives will be mailed to attendees and exhibitors following the Conference.
7:00 am –
7:00 am –
8:00 am -
KEYNOTE – AUTOMOTIVE PRODUCTS TRENDS IN AUTOMOTIVE PACKAGING Glenn G. Daves, Director of Packaging Solutions Development
FREESCALE SEMICONDUCTOR, INC.
Abstract: The long-term trend in automobiles has been increasing electronics content over time. This trend is expected to continue and drives diverse functional, form factor, and reliability requirements. These requirements, in turn, are leading to changes in the package types selected and the performance specifications of the packages used for automotive electronics. Several examples will be given.
Glenn G. Daves is the Director of Packaging Solutions Development at Freescale Semiconductor, Inc. Freescale's packaging portfolio spans the range from low pin count molded wirebond packages, to high pin count flip chip, to specialty MEMS sensor and analog power packages. It also spans diverse markets: consumer, industrial, automotive, medical, and military. Prior to joining Freescale, Glenn led global packaging product and technology development at the IBM Corporation. He has also held leadership positions in project management, test and burn-in engineering, and assembly manufacturing engineering. Glenn holds twenty-one U.S. patents and has degrees from Brown University, the University of Illinois at Urbana-Champaign, and Alliance Theological Seminary.
8:45 am -
KEYNOTE – AUTOMOTIVE MARKET PRESENT AND FUTURE APPLICATIONS OF MEMS
FOR AUTOMOTIVE INDUSTRY Thibault Buisson, Technology & Market Analyst
Abstract: MEMS are found in many applications, ranging from large volume consumer applications such as mobile phones to specific high end devices for defense or space. MEMS market will continue to see steady, sustainable double digit growth for the next six years, with 20% compound average annual growth in units and 13% growth in revenues, to become a $21 billion market by 2017.
Automotive applications represent today around 20% of the MEMS market in revenue and are expected to see a 5.4 % growth in the next five years, which means that the penetration of MEMS devices in this market will remain limited. Today, MEMS family in cars is mainly represented by pressure sensors for Tire Pressure Monitoring and Manifold Air Pressure sensing, and accelerometers in ABS and stabilization systems. These applications are reaching maturity, which mean that their growth gets directly related to the car sales. To find new growth opportunities, system integrators have been trying to develop new MEMS based systems to enhance safety, comfort and reduce pollution and energy consumption.
The presentation will show emerging applications and the challenges they face from a technical and a market point of view.
Thibault Buisson is a member of the Advanced Packaging team at Yole Développement. He graduated from INPG with a Master of Research in Micro and Nano electronics and from Polytech’ Grenoble with an engineering degree in Material Sciences. He then joined NXP Semiconductors as R&D process engineer in the thermal treatment area to develop CMOS technology node devices from 65 to 45nm. Afterwards, he joined IMEC Leuven and worked for more than 5 years as process integration engineer in the field of 3D technology. During this time, he has worked on several topics from TSV to micro-bumping and stacking. He has authored or co-authored fifteen international publications in the semiconductor field.
9:30 am –
Break in Foyer
Advanced 3D Packaging 1
Advanced 3D Packaging 2
Packaging Innovations &
System Challenges for: Photonics Packaging
PROCESSING and MATERIAL ADVANCEMENTS
Chairs: Cristina Chu, TEL NEXX; Kimberly Pollard, Dynaloy - A subsidiary of Eastman Chemical Company
3D DESIGN, MODELING and RELIABILITY
Chairs: Keith Cooper, SETNA; Venky Sundaram, Georgia Tech University
PHOTONIC DEVICES AND MATERIALS
Chairs:Bob Kuo, Amkor; John Mazurowski, Penn State University