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10th International Conference and Exhibition on
Device Packaging

www.imaps.org/devicepackaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA



Conference and Technical Workshops
March 11-13, 2014
Exhibition and Technology Showcase
March 11-12, 2014
Professional Development Courses
March 10, 2014
GBC Spring Conference
March 9-10, 2014

In conjunction with the Global Business Council (GBC) Spring Conference, March 9-10


Courtesy of Rensselaer Polytechnic Institute

Courtesy of US Army RDEDCOM AMRDEC


General Chair:

Ron Huemoeller
Amkor Technology

General Chair-elect
(Panels & Keynotes):

Paul Siblerud
Strategic Tech Analysis, LLC
Past General Chair
(PDCs):

James Lu
Rensselaer Polytechnic Institute

3D & 2.5D Packaging
Topical Workshop
Flip Chip & Wafer Level Packaging
Topical Workshop
Packaging Innovations & System Challenges for:
Microsystems & Devices
Topical Workshop
Photonics & LED Packaging
Topical Workshop
Technical Co-Chair:
Rozalia Beica
Yole Developpement
rbeica@gmail.com
Technical Co-Chair:
Jon Aday
Qualcomm
jaday@qti.qualcomm.com
Technical Co-Chair:
Robert Dean
Auburn University deanron@auburn.edu
Technical Co-Chair:
John Mazurowski
Penn State Electro Optics Center
jmazurowski@eoc.psu.edu
Technical Co-Chair:
Peter Ramm
Fraunhofer EMFT Munich
peter.ramm@emft.fraunhofer.de
Technical Co-Chair:
Linda Bal
Freescale Semiconductor
Linda.Bal@freescale.com
Technical Co-Chair:
Russell Shumway
Amkor Technology
russell.shumway@amkor.com
Technical Co-Chair:
Bob Kuo
Amkor Technology
Bob.Kuo@amkor.com


Technical Presentations Now Linked to IMAPSource below!



Technical Program

SUNDAY, MARCH 9

5:30 pm - 7:30 pm

Registration

5:30 pm - 7:30 pm

GBC Welcome Reception
(Beverages and appetizers)

Thank you to the GBC Reception Sponsors:
DPC/GBC Premier Sponsor: Solid State Equipment Corp. DPC/GBC Premier Sponsor: Amkor Technology DPC/GBC Premier Sponsor: ASE US, Inc.

 

7:30 pm - 9:00 pm

GBC Speaker Dinner
(By Invitation Only)

Thank you to the GBC Speaker Dinner Sponsors:
DPC/GBC Premier Sponsor: Solid State Equipment Corp. DPC/GBC Premier Sponsor: Amkor Technology DPC/GBC Premier Sponsor: ASE US, Inc.

MONDAY, MARCH 10

7:00 am -
7:00 pm

GBC and Device Packaging Registration

7:00 am -
8:00 am

Continental Breakfast

8:00 am -
5:00 pm

8:00 am - Noon

Morning Professional Development Courses (PDCs)
* Click on PDC title to see full description *

PDC1: Next Frontier in Electronics: Systems Scaling for Smart Mobile Systems
Course Leader: Rao R. Tummala, Georgia Tech 3D Systems Packaging Research Center
PDC2: nanoMEMS Frontiers
Course Leader: Slobodan Petrovic, Oregon Institute of Technology
PDC3: Mechanical Design and Reliability Analysis in Microelectronics Packaging
Course Leader: Amaneh Tasooji, Arizona State University
PDC4: Adhesion Fundamentals for Microelectronic Packaging
Course Leader: Raymond A. Pearson, Lehigh University

10:00 am - 10:20 am

Break

12:00 pm - 1:00 pm

Lunch
Only provided for those attendees registered for both Morning and Afternoon PDCs

1:00 pm - 5:00 pm

Afternoon Professional Development Courses (PDCs)
* Click on PDC title to see full description *

PDC5: Industry Updates/Trends: 2.5D/3D, Flip Chip, MEMS, LED & Photonics (1Q2014-2Q2013)
Course Leaders: Phillip G. Creter, Creter & Associates
PDC6: Package Level Integration - 2-D, 2.5-D and 3-D : Impact on Handheld Systems
Course Leader: Dev Gupta, APSTL
PDC7: Basics of Conventional and Advanced Chip Packaging
Course Leader: Syed Sajid Ahmad, Center for Nanoscale Science and Engineering, NDSU
PDC8: Polymer Challenges in 2.5D and 3D Packaging
Course Leader: Jeffrey Gotro, InnoCentrix, LLC

3:00 pm - 3 20 pm

Break

5:00 pm - 6:30 pm

Welcome Reception (All Attendees Are Invited To Attend)

Thank you to the Device Packaging Reception Sponsors:
DPC/GBC Premier Sponsor: Solid State Equipment Corp. DPC/GBC Premier Sponsor: Amkor Technology DPC/GBC Premier Sponsor: ASE US, Inc.

7:00 pm - 10:00 pm

Microelectronics Foundation Texas Hold'Em Tournament
NO EXPERIENCE NECESSARY - Beginners Luck Actually Helps!!
(Separate Registration - Limited Seating)
To Benefit the IMAPS Microelectronics Foundation


Welcome Reception

Monday, March 10th
5:00 pm – 6:30 pm

All Attendees are Invited!


$100 Discount

when you register for the
"COMBO" Registration with Device Packaging Conference &
the Global Business Council Conference (GBC)

ALLVIA - Event Sponsor

 

TUESDAY, MARCH 11   
Morning Technical Sessions

7:00 am -
7:00 pm

Registration

7:00 am -
8:00 am

Continental Breakfast

Sponsored by:
Breakfast Sponsor: ASE US, Inc.

8:00 am -
8:20 am

OPENING COMMENTS
General Chair:
Ron Huemoeller, Amkor Technology

8:20 am -
8:50 am

KEYNOTE – MOBILE PRODUCTS
CHALLENGES AND DIRECTIONS IN MOBILE DEVICE PACKAGING
Steve Bezuk, Senior Director, Engineering
QUALCOMM CDMA TECHNOLOGIES

Abstract: Mobile devices such as phones, tablets and subnotebooks are driving innovation in device packaging. These devices currently are jammed full of advanced capabilities, such as HD video, GPS, WLAN, cellular, touchscreens, Bluetooth, and dual cameras - with significantly more functionality than "sophisticated" notebooks. These features drive demand for mobile devices and provide significant challenges to the packaging community for solutions such as thinner packages while still controlling warpage, new materials, both polymers and solders, as well as innovative structures moving into 2.5 and 3D. Solving these challenges allows innovation to drive demand for mobile devices, providing a providing a platform for many innovative uses that are still being tapped, such as entertainment, video recording, web access, computer vision, augmented reality, all readable, recognizable, locatable, addressable, and controllable through the internet, the Internet of Things (IOT) concept. This talk will discuss current and future innovations to address these formidable issues in the mobile environment.

Dr. Bezuk is Senior Director of IC Package Engineering at Qualcomm. Steve’s group is responsible for current and future generations of packaging technologies for all of Qualcomm’s wireless applications. Prior to joining Qualcomm Steve was with Kyocera, Unisys, Sperry-Univac and RCA’s Sarnoff Research Center. Steve has worked and managed groups in a variety of areas, including of amorphous silicon research, CMOS, Bipolar and GaAs IC process development, Laser enhanced materials processing, and wirebond, TAB, Flip Chip, MEMS, and TSV packaging.

Steve is also very active in the IEEE CPMT and is their current VP of Technology. Steve is also active with the ECTC Conference for the society and was the General Chair for the 2004 ECTC conference and is the Current Publications Chair.

Steve has a B.S. in Chemistry from the University of Pittsburgh and a Ph.D. in Chemistry from the University of Minnesota.

8:50 am -
9:35 am

Keynote - Brandon Prior

KEYNOTE – MOBILE MARKET
MOBILE PACKAGING AND INTERCONNECT TRENDS
Brandon Prior, Senior Consultant
PRISMARK PARTNERS LLC

Abstract: This paper will focus on emerging and fast growth package solutions to meet mobile products' density and cost requirements. A short review of where package miniaturization and modularization has taken us so far, and where it will lead in the next 5 years. Teardowns of high density systems and packages will be used to illustrate key points.

Brandon Prior joined Prismark in 1996 and has been the primary author and editor of Prismark's Semiconductor and Packaging Quarterly Report since 2000. His research focuses on all aspects of back end assembly, including advanced leadframe and array packages, wafer bumping, MEMS, and related system level analyses. He serves as Prismark's primary contact and research person in the area of IC Packaging Technologies, and works with the leading component and materials providers, IDMs, foundries, and equipment manufacturers. Brandon has BA and BE degrees from Dartmouth College and the Thayer School of Engineering in Hanover NH.

9:40 am - 10:00 am

Poster Speakers: Teaser for Wednesday's Interactive Session & "Happy Hour"

10:00 am -
7:00 pm

Exhibition and Technology Showcase

10:00 am -
10:30 am

Break in Exhibit Hall

Sponsored by:
Applied Materials - Coffee Break Sponsor

DPC Sponsor: Applied Materials

 
Advanced 3D Packaging
Flip Chip & Wafer Level Packaging
Packaging Innovations &
System Challenges for:

MEMS, Microsystems & Devices

 

TA1
ADVANCED PACKAGING OVERVIEW (MARKET TRENDS, TECHNOLOGIES, INTELLECTUAL PROPERTY and COST)

Chairs: Peter Ramm, Fraunhofer EMFT; Kathy Cook, Ziptronix

TA2
FLIP CHIP INTERCONNECT and ELECTRICAL PERFORMANCE

Chairs: Lars Boettcher, Fraunhofer Institute; Kevin Martin, Atotech USA

TA3
NANOTECHNOLOGY

Chair: Robert Dean, Auburn University

10:30 am – 11:00 am

3D Technology Applications Market Trends & Key Challenges
Thibault Buisson, Yole Développement (Amandine Pizzagalli, Eric Mounier, Rozalia Beica)

Damage Induced In Interconnect Structures Mimicking Stresses During Flip Chip Packaging
Ibon Ocaña, CEIT and Tecnun

NEW PRESENTATION ADDED
Assembly Standardization For The Diverse Packaging Requirements of MEMS & Sensors

Russell Shumway, Amkor Technology

11:00 am – 11:30 am

2.5D and 3D Integration Technology Update
Robert Patti, Tezzaron Semiconductor Corp.

Advance Organic Substrate Technologies for High Performance, High Reliability Electronics Miniaturization
Kim Blackwell, i3 Electronics (formerly Endicott Interconnect Technologies) (Dave Alcoe, Frank Egitto)

NEW PRESENTATION ADDED
A Current-Controlled PCB Integrated MEMS Tilt Mirror

Robert Dean, Auburn University

11:30 am – 12:00 pm

Reverse Engineering for the Purpose of Intellectual Property Protection and Accelerated Product Development in SOC and SIP Structures
Lajos "Louis" Burgyan, Ltec Corporation (Yuji Kakizaki)

Electrical Performance Comparison Between fcBGA and eWLB Packages
Kai Liu, STATS ChipPAC (YongTaek Lee, HyunTai Kim, MaPhooPwint Hlaing, Gwang. Kim, Susan Park, Billy Ahn)

A ZnO nanowire-based Sensing Platform for Carbon Dioxide Detection
Bruce Kim, City University of New York (Anurag Gupta)

12:00 pm– 12:30 pm

Cost Comparison of Temporary Bond and Debond Methods For Thin Wafer Handling
Amy Palesko, SavanSys Solutions, LLC (Chet Palesko)

Evaluation of Polymer Core Solderballs for Wafer Level Reliability Improvements
John Hunt, ASE US Inc. (Adren Hsieh, Eddie Tsai, Chienfan Chen, Tsaiying Wang)

Fatigue Testing of Bulk Materials Using a Microsystems Based Approach
Li-Anne Liew, University of Colorado & National Institute of Standards and Technology (David Read, Nicholas Barbosa III)

12:30 pm –
2:00 pm

Lunch In The Exhibit Hall
(Food served from 12:30 pm - 1:30 pm)

Sponsored by:
DPC/GBC Premier Sponsor: Solid State Equipment Corp. Applied Materials - Event Sponsor

TUESDAY, MARCH 11   
Afternoon Technical Sessions
 
Advanced 3D Packaging
Flip Chip & Wafer Level Packaging
Packaging Innovations &
System Challenges for:

MEMS, Microsystems & Devices

 

TP1
3D PACKAGING APPLICATIONS

Chairs: Scott M. Hayes, Freescale; Rozalia Beica, Yole Developpement

TP2
WAFER LEVEL PACKAGING PROCESSES and PERFORMANCE

Chairs: Jon Aday, Qualcomm; Michael Vincent, Freescale

TP3
SENSORS and THERMAL DEVICES

Chairs: Michael Kranz, EngeniusMicro; Russell Shumway, Amkor Technology

2:00 pm –
2:30 pm

ARM Dual Core Product Demonstration with 2.5D Through-Silicon-Via (TSV)
Michael Kelly, Amkor Technology (Rick Reed, Amkor Technology; Steve Eplett, Open Silicon; Jon Greenwood, GLOBALFOUNDRIES)

A Flexible Manufacturing Method for Wafer Level Packages
Tom Strothmann, STATS ChipPAC (Damien Pricolo, Seung Wook Yoon, Yaojian Lin)

All-silicon Multi-chip Modules Based on Ultra-thin Active Pixel Radiation Sensors
Ladislav Andricek, MPG Semiconductor Lab

2:30 pm –
3:00 pm

Next Generation High Power Electronic Modules Based on Embedded Power Semiconductors
Lars Boettcher, Fraunhofer IZM (S. Karaszkiewicz, D. Manessis, Eckart Hoene, A. Ostmann)

Enabling Resist Processing Technologies for Advanced Packaging
Antun Peic, EV Group (Thorsten Matthias, Johanna Bartl, Paul Lindner)

A PCB Technology Moisture Content and Electrical Conductivity Sensor Probe for Agricultural and Horticultural Applications
Robert Dean, Auburn University (Elizabeth Guertal, Adam Newby, Glenn Fain)

3:00 pm –
3:30 pm

How to Bring 3D IC to Maturity - Example of a Pacemaker
Renzo Dal Molin, SORIN GROUP

Dielectric Laser Via Drilling for Next Generation Wafer Level Processing
Jim Zaccardi, FlipChip International (Guy Burgess, Theodore Tessier, FlipChip International; Ken Lafenhagen, Matt Souter, SUSS MicroTec Photonic Systems Inc.)

2D PCB with 3D Print Fabrications for Rigid-conformal Packaging of Microsensor Imaging Arrays Based on Bioinspired Architectures
David Fries, University of South Florida (Chase Starr, Geran Barton)

3:30 pm –
4:15 pm

Break in Exhibit Hall

Sponsored by:
Applied Materials - Coffee Break Sponsor
4:15 pm –
4:45 pm

Optimized TSV Module for High Performance 2.5D Device Packaging
Cyprian Uzoh, Invensas Corporation (Liang Wang, Zhuowen Sun, Andrew Cao, Bong-Sub Lee, Guilian Gao, Hong Shen, Sitaram Arkalgud

Patterned Permanent Bonding of Benzocyclobutene Based Dielectric Materials for Advanced Wafer Level Packaging Solutions
Jong-Uk Kim, Dow Electronic Materials (Anupam Choubey, Rosemary Bell, Hua Dong, Michael Gallagher, Joe Lachowski, Masaki Kondo, Corey O'Connor, Greg Prokopowicz, Bob Barr, Dow Electronic Materials; Kai Zoschke, Matthias Wegner, Christina Lopper, Michael Toepper, Fraunhofer IZM)

A MEMS DC Current Sensor Utilizing Neodymium Rare Earth Magnets
John Tatarchuk, Auburn University (Colin Stevens, Robert Dean)

4:45 pm –
5:15 pm

A Cost Effective PoP Structure for High I/O Density
Hongjie Wang, National Center for Advanced Packaging (NCAP China) (Weidong Huang, Fei Geng, Yuan Lu, Bo Zhang, Wen Yin, Haidong Wang)

Solderability Challenges in Emerging BGA Packages
Maria Durham, Indium Corporation (Yan Liu, Andy Mackie)

Integrated Localized Cooling using Piezoelectrically-Driven Synthetic Jets
Michael Kranz, EngeniusMicro, LLC (Tracy Hudson, Michael Whitley, Brian English)

5:15 pm –
5:45 pm

Embedding Active and Passive Devices in Medical Electronics
Susie Johansson, Starkey Hearing Technologies (John Dzarnoski)

Manufacturing Readiness of BVA(TM) Technology for Fine-Pitch Package-on-Package
Rajesh Katkar, Invensas Corporation (Wael Zohni, Rey Co, Rizza Cizek)

MEMS-enabled Cryogenic Coolers
Yunda Wang, PARC, a Xerox Company (YC Lee, University of Colorado)

5:45 pm –
7:00 pm

Exhibit Hall Reception

Sponsored by:
Sikama - Coffee Break Sponsor

7:00 pm - 8:30 pm


3D Panel Discussion:
What's Driving the Next Technology Revolution in Packaging?
Industry leaders representing technology, equipment and research to tackle the questions on what is driving
the next technology revolution in Packaging.

Panel Food/Beverage Sponsored by:
3D Panel Sponsor: Invensas

Moderator:
E. Jan Vardaman, TechSearch International
President

Panelists:
Sitaram Arkalgud, Invensas Corporation
Vice President, 3D Technology

John Dzarnoski, Starkey Hearing Technologies
Director of Microelectronic Packaging

Ron Huemoeller, Amkor Technology
Senior Vice President, Advanced 3DIC

Ravi Mahajan, Intel Corporation
Senior Principal Engineer, High Density Interconnect Pathfinding, Assembly Technology

Robert Patti, Tezzaron Semiconductor Corp.
CTO

3D Panel Sponsor: Invensas

 



 


Conference Registration

Early Rate Ends:
February 7, 2014

All registration fees increase after the deadline

On-line Registration Now Closed


 

WEDNESDAY, MARCH 12   
Morning Technical Sessions

7:00 am -
6:00 pm

Registration

7:00 am -
8:00 am

Continental Breakfast

Sponsored by:
Breakfast Sponsor: ASE US, Inc.

8:00 am -
8:45 am

KEYNOTE – GRAPHICS PRODUCTS
DIE STACKING IS HAPPENING IN MAINSTREAM COMPUTING
Bryan Black, Senior Fellow
AMD

Abstract: Die stacking has proven effective in MEMs and FPGA solutions but has yet to impact mainstream computing CPUs and GPUs. This talk will walk through how die stacking will enter mainstream computing and how it will change the industry in the future.

Bryan Black received his Ph.D. from Carnegie Mellon. With over 20 years of experience Black has had the honor of working at Motorola, Intel, and AMD. He has done a little of everything from devices to circuits to microarchitecture to DRAM to test to packaging. Black is currently a Senior AMD Fellow and runs the AMD die stacking program.

8:45 am -
9:30 am

Keynote - John Peddie

KEYNOTE – GRAPHICS MARKET
THE MARKET TRENDS IN GRAPHIC PRODUCTS:
FROM HANDHELDS TO SUPERCOMPUTERS
THERE'S A GPU IN YOUR FUTURE

John Peddie, Founder
JPR (JOHN PEDDIE RESEARCH)

Abstract: The market for graphics chips in PCs and mobile devices is soaring. Although the PC market growth has slowed, the mobile market has more than offset that. The net result is we are seeing shipment levels approaching 2 billion units.

Dr. Jon Peddie is one of the pioneers of the graphics industry, and formed Jon Peddie Research (JPR) to provide customer intimate consulting and market forecasting services. Peddie lectures at numerous conferences on topics pertaining to graphics technology and the emerging trends in digital media technology. Recently named one of the most influential analysts, regularly advises investors in the GLG network, he is frequently quoted in trade and business publications, was the former president of Siggraph Pioneers, and he is also the author of several books his most recent, The History of Visual Magic in Computers.

 
Advanced 3D Packaging
Flip Chip & Wafer Level Packaging
Packaging Innovations &
System Challenges for:

MEMS, Microsystems & Devices

 

WA1
INTERPOSER TECHNOLOGIES

Chairs: Dingyou Zhang, GlobalFoundries; Diane Scheele, Dynaloy - A subsidiary of Eastman Chemical Company

WA2
FLIP CHIP MATERIALS and PROCESSES

Chairs: Curtis Zwenger, Amkor; Ahmer Syed, Qualcomm

WA3
PROCESSING and PASSIVE DEVICES

Chairs: Li-Anne Liew, University of Colorado & National Institute of Standards and Technology; Aubrey Beal, Auburn University

9:30 am -
10:00 am

TSV Technology Embedding High Density Capacitors for Advanced 3D Packaging Solutions
Catherine Bunel, IPDiA (Florent Lallemand)

Precise Solder Dispensing in High-Throughput Micro-Device Packaging Applications
Hanzhuang Liang, Nordson ASYMTEK (Linh Rolland, Floriana Suriawidjaja, Mani Ahmadi, Heakyoung Park)

Sapphire Surface Protection During Sapphire Micromachining and Through-Sapphire Via Formation for Device Densification, Backside Interconnect and Chip Stacking
Syed Sajid Ahmad, Center for Nanoscale Science and Engineering, NDSU (Greg Strommen, Kevin Mattson, Fred Haring, Aaron Reinholz)

10:00 am -
4:00 pm

Exhibition and Technology Showcase

10:00 am – 10:30 am

Break in Exhibit Hall

Sponsored by:
DPC/GBC Premier Sponsor: Solid State Equipment Corp. Break Sponsor: Amkor Technology
10:30 am – 11:00 am

Interposer Based Solution for WideIO Processor Integration
Venky Sundaram, Georgia Tech

Underfill Design Using FEM for FC-BGA, FC-CSP, and Moving Towards 2.5/3D
Brian Schmaltz, NAMICS Technologies (Yukinari Abe, Kazuyuki Kohara, NAMICS Corp.)

Design Considerations and Ring-down Characteristics of Micromachined, High Current Density Capacitors
Aubrey Beal, Auburn University (John Tatarchuk, Colin Stevens, Thomas Baginski, Michael Hamilton, Robert Dean)

11:00 am – 11:30 am

Fabrication and Initial Assessment of Reliability of Glass Interposers
Aric Shorey, Corning, Incorporated (Scott Pollard)

Direct EP/EPAG - Ultrathin Surface Finish for Soldering and Wire Bonding
Mustafa Oezkoek, Atotech (Gustavo Ramos, Arnd Kilian, Jens Wegricht)

Wire Bond Reliability Challenges Across Electronic Packaging Platforms
Vijay Sarihan, Freescale Semiconductor (Steve Safai, Boon Yew Low, Darrel Frear)

11:30 am – 12:00 pm

New Lithography Requirements driven by 2.5D Interposer Manufacturing
Elvino Da Silveira, Rudolph Technologies, Inc. (Klaus Ruhmer, Joe Battaglia, Philippe Cochet)

Fault Detection and Classification in Advanced Packaging
Richard Beaver, Rudolph Technologies

Development of Passives on Sapphire Backside
Syed Sajid Ahmad, Center for Nanoscale Science and Engineering, NDSU (Cherish Bauer-Reich, Fred Haring, Greg Strommen, Kevin Mattson, Aaron Reinholz)

12:00 pm –
1:30 pm

Lunch In The Exhibit Hall
(Food served from 12:00 pm - 1:00 pm)

Sponsored by:
SPTS - Corporate Sponsor Lunch Sponsor: Amkor Technology

 

WEDNESDAY, MARCH 12   
Afternoon Technical Sessions
 
Advanced 3D Packaging
Flip Chip & Wafer Level Packaging
Packaging Innovations &
System Challenges for:

Photonics Packaging

 

WP1
PROCESS INTEGRATION (1st HALF) and MANUFACTURABILITY (2nd HALF)

Chairs: Jeff Calvert, Dow Electronic Materials; Scott M. Hayes, Freescale

WP2
BUMPING and PLATING PROCESSES and MATERIALS

Chairs: Eric Huenger, DOW; Linda Bal, Freescale

WP3
PHOTONIC PACKAGING AND TEST TECHNOLOGY

Chairs: Bob Kuo, Amkor; John Mazurowski, Penn State University

1:30 pm –
2:00 pm

Through-Sapphire Via Filling Process Development for Backside Interconnect and Chip Stacking and Front-to-Back Interconnect Demonstration With a Front-to-Back Daisy Chain Chip
Syed Sajid Ahmad, Center for Nanoscale Science and Engineering, NDSU (Fre Haring, Greg Strommen, Kevin Mattson, Aaron Reinholz)

Optimization of Lead Free Plating for Flip Chip Applications
Charles L. Arvin, IBM Corp. (Jurg Stahl, Wolfgang Sauter, Harry cox, Eric Perfecto, Valerie Oberson, Nathalie Normand)

Photonic Device Package Design, Assembly and Packaging
Eef Boschman, Advanced Packaging Center (Arnold Bos)

2:00 pm –
2:30 pm

Efficient TSV Resist and Residue Removal in 3DIC
Kimberly Pollard, Dynaloy LLC a subsidiary of Eastman Chemical Company (Meng Guo, Richie Peters, Mike Phenis, Dynaloy, LLC; Laura Mauer, John Taddei, Ramey Youssef, John Clark, SSEC)

Versatile Lead-Free Solder Electroplating Products for Advanced Bumping Technologies
Inho Lee, Dow Chemical Company (Regina Cho, Lou Grippo, Yen-Lin Taylor, Wayne Baldelli, Ryan Farrell, Julia Woertink, Yi Qin, Jonathan Prange, Yil-Hak Lee, Masaaki Imanari, Jianwei Dong, Jeff Calvert)

Alignment Process for Fabrication of Mirror-based Optical Via using Maskless Lithography Tool with Buffer Coat Materials
Sunglin Wang, University of Arizona, College of Optical Sciences (Chris Summitt, Tao Ge, Lee Johnson, Melissa Zaverton, Tom Milster, Yuzuru Takashima)

2:30 pm –
3:00 pm

High Throughput Thin Wafer Support Technology for 3DIC
John Moore, Daetec, LLC (Jared Pettit, David Young, Alman Law)

CupraEtch DE - Recyclable anisotropic Etchant for Advanced Flip Chip Manufacturing
Kevin Martin, Atotech USA (Stephan Hotz, Rami Haidar, Sven Lamprecht, Norbert Luetzow)

A Decade of High Accuracy Die Attach Equipment and Process Developments (Addressing Photonics Device Packaging Challenges)
David Halk, AMICRA MICROTECHNOLOGIES GmbH (Johann Weinhaendler, Rudolf Kaiser, Hardy Kellermann)

3:00 pm –
4:00 pm

Break in Exhibit Hall

Sponsored by:
DPC/GBC Premier Sponsor: Solid State Equipment Corp. Break Sponsor: Amkor Technology
4:00 pm –
4:30 pm

A New Type of TSV Defect Caused by BMD in Silicon Substrate
Dingyou Zhang, GlobalFoundries (Sarasvathi Thangaraju, Daniel Smith, Himani Kamineni, Christian Klewer, Mark Scholefield, Ming Lei, Tong Qing Chen, Kumarapuram Gopalakrishnan, Abhishek Vikram, Victor Lim, Wonwoo Kim, Ramakanth Alapati)

Control of Bump Morphology in Lead Free Solder Plating for Higher Density Packaging
Koji Tatsumi, Mitsubishi Materials Corporation (Kyouhei Mineo, Takeshi Hatta, Takuma Katase, Masayuki Ishikawa, Akihiro Masuda)

A New Method for Testing Electrolytic Capacitors to Compare Life Expectancy
Stephani Gulbrandsen, DfR Solutions (Joelle Arnold, Nick Kirsch, Greg Caswell)

4:30 pm –
5:00 pm

Next Generation TSV Filling by Electrochemical Deposition
Cristina Chu, TEL NEXX, Inc. (Bioh Kim,Stephen Golovato, Tyler Barbera, Keiichi Fujita, Takashi Tanaka)

Adhesive Enabling Technology for Directly Plating Metal on Molding Resin
Kenichiroh Mukai, Atotech USA Inc. (Kwonil Kim, Brian Eastep, Lee Gaherty, Anirudh Kashyap, Lutz Brandt)

Wafer Level Packaging for High-Brightness LED Lighting with Optimized Thermal Dissipation and Optical Performance
Liang Wang, Invensas Corporation (Gabe Guevara, Rey Co, Ron Zhang, Roseann Alatorre)

5:00 pm –
5:30 pm

Metrology and Inspection for New Interconnects in Advanced Packaging
Russ Dudley, Rudolph Technologies (Matt Wilson, Rajiv Roy)

Use of Darkfield Laser Technology in Monitoring Particles Generated by Process Tools in Cu Pillar Bumping
Reza Asgari, Rudolph Technologies

5:30 pm –
6:30 pm

Interactive Poster Session & "Happy Hour"
NEW FORMAT THIS YEAR
In The Foyer: 5:30 pm - 6:30 pm
(Poster Presenter Setup - 4:00 pm - 5:00 pm)

Poster Session Sponsored by:
Sponsor: Lam Research

 

3D:
Cost Comparison of Temporary Bond and Debond Methods For Thin Wafer Handling

Amy Palesko, SavanSys Solutions, LLC (Chet Palesko)

3D:
Optical and Acoustic Metrology Techniques for 2.5 And 3D Advanced Packaging

Priya Mukundhan, Rudolph Technologies (Parker Huang, Bruce Chiu, Jay Chao, Chun Hung Lu, Stephen Chen, Jay Chen, Fei Shen, Jian Ding, Johnny Dai, Timothy Kryman)

3D:
A Comparison of Through Sapphire Via Process Development at Laser Services Suppliers

Syed Sajid Ahmad, Center for Nanoscale Science and Engineering, NDSU (Fred Haring, Aaron Reinholz)

3D:
High Throughput Thin Wafer Support Technology for 3DIC

John Moore, Daetec, LLC (Jared Pettit, David Young, Alman Law)

3D:
Direct EP/EPAG - Ultrathin Surface Finish for Soldering and Wire Bonding

Mustafa Oezkoek, Atotech (Gustavo Ramos, Arnd Kilian, Jens Wegricht)

3D:
Manufacturing Readiness of BVA(TM) Technology for Fine-Pitch Package-on-Package

Rajesh Katkar, Invensas Corporation (Wael Zohni, Rey Co, Rizza Cizek)

3D:
Magnetic Field Imaging for 3D Applications

Jan Gaudestad, Neocera (Antonio Orozco)

3D:
Temporary Bonding Cost Of Ownership:
The Link Between Low Total Thickness Variation and Chip Yield

Thomas Uhrmann, EV Group (Jorgen Burggraf, Harald Wiesbauer, Julian Bravin, Thorsten Matthias, Markus Wimplinger, Paul Lindner, EV Group GmbH; Herman Meynen, Yann Civale, Dow Corning Europe S.A.; Ranjith John, Sheng Wang, Peng-Fei Fu, Craig Yeakle, Gary Aw, Down Corning Corporation)

Flip Chip/WLP:
Fault Detection and Classification in Advanced Packaging

Richard Beaver, Rudolph Technologies

Flip Chip/WLP:
Impact of Reprocessing Technique on First Level Interconnects of Pb-Free to SnPb Reballed Area Array Flip Chip Devices

Joelle Arnold, DfR Solutions (Melissa Keener, Steph Gulbrandsen, Nathan Blattau, DfR Solutions; David Kayser, NAWCAD)

Flip Chip/WLP:
Electrical Performance Comparison Between fcBGA and eWLB Packages

Kai Liu, STATS ChipPAC (YongTaek Lee, HyunTai Kim, MaPhooPwint Hlaing, Gwang. Kim, Susan Park, Billy Ahn)

Flip Chip/WLP:
Cracking of Interconnect Structures Mimicking Stresses During Flip Chip Packaging

Ibon Ocaña, CEIT and Tecnun

MEMS:
Fatigue Testing of Bulk Materials Using a Microsystems Based Approach

Li-Anne Liew, University of Colorado & National Institute of Standards and Technology (David Read, Nicholas Barbosa III)

Cu Migration in Polycrystalline CdTe Solar Cells
D. Guo, Arizona State University (R. Akis, D. Brinkman, D. Vasileska, Arizona State University; I. Sankin, T. Fang, First Solar)

Electrical and Thermal Transport in Alternative Device Technologies
S. Qazi, Arizona State University (K. Raleva, University Sts Cyril and Methodius; D. Vasileska, Arizona State University)

 

Poster Session "Happy Hour" Sponsored by:
Sponsor: Lam Research

 

Post-Conference Presentations USB Flash Drive

This year the Conference technical & exhibitor presentations will be published and distributed to all "full conference" attendees & exhibitors on USB Flash Drives. These drives will be mailed to attendees and exhibitors following the Conference.

Sponsored by:

ALLVIA - Event Sponsor

 

THURSDAY, MARCH 13   
Technical Sessions

7:00 am –
11:30 am

Registration

7:00 am –
8:00 am

Continental Breakfast

Sponsored by:
Breakfast Sponsor: ASE US, Inc.

8:00 am -
8:45 am
Keynote - Glenn Daves

KEYNOTE – AUTOMOTIVE PRODUCTS
TRENDS IN AUTOMOTIVE PACKAGING
Glenn G. Daves, Director of Packaging Solutions Development
FREESCALE SEMICONDUCTOR, INC.

Abstract: The long-term trend in automobiles has been increasing electronics content over time. This trend is expected to continue and drives diverse functional, form factor, and reliability requirements. These requirements, in turn, are leading to changes in the package types selected and the performance specifications of the packages used for automotive electronics. Several examples will be given.

Glenn G. Daves is the Director of Packaging Solutions Development at Freescale Semiconductor, Inc. Freescale's packaging portfolio spans the range from low pin count molded wirebond packages, to high pin count flip chip, to specialty MEMS sensor and analog power packages. It also spans diverse markets: consumer, industrial, automotive, medical, and military. Prior to joining Freescale, Glenn led global packaging product and technology development at the IBM Corporation. He has also held leadership positions in project management, test and burn-in engineering, and assembly manufacturing engineering. Glenn holds twenty-one U.S. patents and has degrees from Brown University, the University of Illinois at Urbana-Champaign, and Alliance Theological Seminary.

8:45 am -
9:30 am
Keynote - Thibault Buisson

KEYNOTE – AUTOMOTIVE MARKET
PRESENT AND FUTURE APPLICATIONS OF MEMS
FOR AUTOMOTIVE INDUSTRY
Thibault Buisson, Technology & Market Analyst
YOLE DÉVELOPPEMENT

Abstract: MEMS are found in many applications, ranging from large volume consumer applications such as mobile phones to specific high end devices for defense or space. MEMS market will continue to see steady, sustainable double digit growth for the next six years, with 20% compound average annual growth in units and 13% growth in revenues, to become a $21 billion market by 2017.

Automotive applications represent today around 20% of the MEMS market in revenue and are expected to see a 5.4 % growth in the next five years, which means that the penetration of MEMS devices in this market will remain limited. Today, MEMS family in cars is mainly represented by pressure sensors for Tire Pressure Monitoring and Manifold Air Pressure sensing, and accelerometers in ABS and stabilization systems. These applications are reaching maturity, which mean that their growth gets directly related to the car sales. To find new growth opportunities, system integrators have been trying to develop new MEMS based systems to enhance safety, comfort and reduce pollution and energy consumption.

The presentation will show emerging applications and the challenges they face from a technical and a market point of view.

Thibault Buisson is a member of the Advanced Packaging team at Yole Développement. He graduated from INPG with a Master of Research in Micro and Nano electronics and from Polytech’ Grenoble with an engineering degree in Material Sciences. He then joined NXP Semiconductors as R&D process engineer in the thermal treatment area to develop CMOS technology node devices from 65 to 45nm. Afterwards, he joined IMEC Leuven and worked for more than 5 years as process integration engineer in the field of 3D technology. During this time, he has worked on several topics from TSV to micro-bumping and stacking. He has authored or co-authored fifteen international publications in the semiconductor field.

9:30 am –
9:45 am

Break in Foyer

Sponsored by:
Breakfast Sponsor: ASE US, Inc.
Applied Materials - Coffee Break Sponsor
 
Advanced 3D Packaging 1
Advanced 3D Packaging 2
Packaging Innovations &
System Challenges for:

Photonics Packaging

 

THA1
PROCESSING and MATERIAL ADVANCEMENTS

Chairs: Cristina Chu, TEL NEXX; Kimberly Pollard, Dynaloy - A subsidiary of Eastman Chemical Company

THA2
3D DESIGN, MODELING and RELIABILITY

Chairs: Keith Cooper, SETNA; Venky Sundaram, Georgia Tech University

THA3
PHOTONIC DEVICES AND MATERIALS

Chairs:Bob Kuo, Amkor; John Mazurowski, Penn State University

9:45 am –
10:15 am

Temporary Bonding Cost Of Ownership: The Link Between Low Total Thickness Variation and Chip Yield
Thomas Uhrmann, EV Group (Jorgen Burggraf, Harald Wiesbauer, Julian Bravin, Thorsten Matthias, Markus Wimplinger, Paul Lindner, EV Group GmbH; Herman Meynen, Yann Civale, Dow Corning Europe S.A.; Ranjith John, Sheng Wang, Peng-Fei Fu, Craig Yeakle, Gary Aw, Down Corning Corporation)

Non-Conductive Film (NCF) with No Voiding and High Reliability
Edgardo Anzures, Dow Electronic Materials, Advanced Packaging Technologies (Anupam Choubey, Avin Dhoble, David Fleming, Robert Barr, Jeffrey Calvert, Joon-Seok Oh)

Heterogeneous Integration of Photonic Integrated Circuits Using 3D Assembly Techniques: Silicon Technology and Packaging
Yann Lamy, CEA LETI (Haykel Ben Jamaa, Hughes Metras, Stephane Bernabe, Sylvie Menezo, Laurent Fulbert)

10:15 am –
10:45 am

Adhesive Enabling Technology for Directly Plating Copper onto Glass
Lutz Brandt, Atotech USA (Zhiming Liu, Hailuo Fu, Sara Hunegnaw, Tafadzwa Magaya)

Applying System Modeling to Define 2.5D and 3D Packaging Roadmaps
Dev Gupta, APSTL

Thermal Aging of Optically Silicone Encapsulants
Michelle Velderrain, NuSil Silicone Technology (Michelle Poliskie)

10:45 am –
11:15 am

Magnetic Field Imaging for 3D Applications
Jan Gaudestad, Neocera (Antonio Orozco)

Pathfinding and Design Optimization of 2.5D/3D Devices in the Context of Multiple PCBs
Farhang Yazdani, BroadPak Corporation (John Park, Mentor Graphics)

Pulsed 2 Micron Wavelength Fiber Lasers for Packaging
Shibin Jiang, AdValue Photonics Inc.

11:15 am –
11:45 am

Wet Chemical Processing with Megasonics Assist for the Removal of Bumping Process Photomasks
John Tracy, Akrion Systems (Hongseong Sohn)

Path Finding for Multiple Platforms
John Park, Mentor Graphics

UV-C LEDs for Sterilization Applications
Joe Grzyb, HexaTech, Inc.

11:45 am

Closing Remarks

1:00 pm Start

2014 IMAPS Microelectronics Foundation Spring Golf Invitational
1:00pm Shotgun Start -- "Best Ball" Scramble

SunRidge Canyon Golf Club
Fountain Hills, AZ

Golf Sponsors

Premier - "Eagle" Sponsor:
DPC/GBC Premier Sponsor: Solid State Equipment Corp.
3 Holes Sponsor

Premier - "Eagle" Sponsor:
DPC/GBC Premier Sponsor: ASE US, Inc.
3 Holes Sponsor

Premier - "Birdie" Sponsor:

Golf Hole Sponsor: Amkor Technology
Hole Sponsor
Hole Sponsor: NAMICS
Hole Sponsor
Golf Hole Sponsor: Infinite Graphics
Hole Sponsor
Golf Hole Sponsor: AGC Electronics America
Hole Sponsor
Golf Hole Sponsor: Coining Inc/SPM
Hole Sponsor

 

DPC/GBC Premier Sponsors:

DPC/GBC Premier Sponsor: Solid State Equipment Corp.

DPC/GBC Premier Sponsor: Amkor Technology

DPC/GBC Premier Sponsor: ASE US, Inc.


Corporate Sponsor:

SPTS - Corporate Sponsor

 


Event Sponsors:

Post-Conference Presentations USB Drives:

ALLVIA - Event Sponsor

Exhibit Hall Reception Sponsor:
Sikama - Coffee Break Sponsor

Keynote Sessions &
Lunch Sponsor:

Applied Materials - Corporate Sponsor

Sponsor - Conference Lanyards:
Hole Sponsor: NAMICS

Sponsor - 3D Panel:
3D Panel Sponsor: Invensas

Poster Session "Happy Hour" & Conference Pens Sponsor:
Sponsor: Lam Research

Event Sponsor:
STATSChipPAC - Coffee Break Sponsor

Supporting Sponsor: GA Tech 3D PRC

 


Golf Sponsors:

"Eagle" Sponsors:
DPC/GBC Premier Sponsor: Solid State Equipment Corp.

DPC/GBC Premier Sponsor: ASE US, Inc.

"Birdie" Sponsor:
"Birdie" Golf Sponsor: Amkor Technology


Golf Hole Sponsors:

Golf Hole Sponsor: NAMICS

Golf Hole Sponsor: Infinite Graphics

Golf Hole Sponsor: Coining Inc/SPM

Golf Hole Sponsor: AGC Electronics America

Golf Hole Sponsor: PUTTIST, 3-Putt Killer

Golf Hole Sponsor: Dixon Golf


Student Paper Competition
Sponsor:


Student Paper Competition Sponsor - The Microelectronics Foundation


Official Media Sponsors:

Chip Scale Review - Media Sponsor

3D InCites - Media Sponsor

MEPTEC - Media Sponsor


© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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