KESTER

11th International Conference and Exhibition on
Device Packaging
www.imaps.org/devicepackaging

WekoPa Resort and Casino
Fountain Hills, Arizona USA

IMAPS Device Packaging

Conference and Technical Workshops
March 17-19, 2015
Exhibition and Technology Showcase
March 17-18, 2015
Professional Development Courses
March 16, 2015
NEW** GBC Plenary
Session on IoT

March 18, 2015



Device Packaging (Amkor Image)
Courtesy of Amkor Technology
Device Packaging (RDEDCOM image)
Courtesy of US Army RDEDCOM AMRDEC

Device Packaging 2015 Technical Program


Amkor & GLOBALFOUNDRIES

Amkor: www.amkor.com/go/2-5D
GLOBALFOUNDRIES: www.globalfoundries.com/2-5D

MONDAY, MARCH 16

7:00 am -
7:00 pm

Registration

7:00 am -
8:00 am

Continental Breakfast

8:00 am - Noon

PDC1: Introduction to Microelectronics Packaging (8-hour)
Course Leader: Tom Green, TJ Green & Associates


FULL-DAY PDC – 8:00am-5:00pm

Morning Professional Development Courses (PDCs)
* Click on PDC title to see full description *

PDC2: MEMS and nanoMEMS: Devices and Applications
Course Leader: Slobodan Petrovic, Oregon Institute of Technology
PDC3: Interposers for High Performance Computing, Mobile and Emerging IoT Applications
Course Leader: Venky Sundaram, Georgia Tech. PRC
PDC4: IC Package Technology Selection and Cost Reduction Using Supply Chain Modeling
Course Leader: Chet Palesko, SavanSys Solutions LLC
PDC5: Adhesion Science & Technology
Course Leader: Kashmiri Mittal, Daetec

(Two-Part PDCs – Part 2 “Temp Bonding” in afternoon – Add. Fee)

10:00 am - 10:20 am

Break

12:00 pm - 1:00 pm

Lunch
Only provided for those attendees registered for both Morning and Afternoon PDCs OR Full-day Courses

1:00 pm - 5:00 pm

Afternoon Professional Development Courses (PDCs)
* Click on PDC title to see full description *

PDC6: Introduction to Fan-Out Wafer Level Packaging (FO-WLP)
Course Leaders: Beth Keser, Qualcomm Technologies, Inc.
PDC7: Polymers for Electronic Packaging
Course Leader: Jeffrey Gotro, InnoCentrix, LLC
PDC8: Basics of Conventional and Advanced Chip Packaging
Course Leader: Syed Sajid Ahmad, Center for Nanoscale Science and Engineering, NDSU
PDC9: Temporary Bonding of Electronic Devices
Course Leader: Jared Pettit, John Moore, Daetec

(Two-Part PDCs – Part 1 “Adhesion Science” in morning – Add. Fee)

3:00 pm - 3 20 pm

Break

5:00 pm - 7:00 pm

Welcome Reception (All Attendees Are Invited To Attend)

Thank you to the Device Packaging Reception Sponsors:
DPC/GBC Premier Sponsor: Solid State Equipment Corp. DPC/GBC Premier Sponsor: Amkor Technology DPC/GBC Premier Sponsor: ASE US, Inc.

7:00 pm - 10:00 pm

Microelectronics Foundation Texas Hold'Em Tournament
NO EXPERIENCE NECESSARY - Beginners Luck Actually Helps!!
(Separate Registration - Limited Seating)
To Benefit the IMAPS Microelectronics Foundation


Welcome Reception
All Attendees are Invited!

Monday, March 16th | 5:00 pm – 7:00 pm


Microelectronics Foundation Charity Texas Hold'Em Tournament

$50 Ticket for Charity | Lessons During Reception

Monday, March 16th | 7:00 pm – 10:00 pm


 

TUESDAY, MARCH 17   
Morning Technical Sessions

7:00 am -
7:00 pm

Registration

7:00 am -
8:00 am

Continental Breakfast

Sponsored by:
Breakfast Sponsor: ASE US, Inc.

8:00 am -
8:20 am

OPENING COMMENTS
General Chair-Elect:
Rozalia Beica, Yole Developpement

Keynote Sessions Sponsored by:

SPTS - Corporate Sponsor

8:20 am -
9:05 am

KEYNOTE – GRAPHICS PRODUCTS:
DIE STACKING IS FINALLY HAPPENING
Yuan Xie, Professor, University of California at Santa Barbara
(replacement for Bryan Black at AMD due to business conflict)

Yuan Xie is a Professor in the Electrical and Computer Engineering department at the University of California at Santa Barbara. He worked for IBM Microelectronic Division before joining Penn State in 2003, and moved from Penn State to UCSB in 2014. He also worked for AMD Research during 2012-2013. He has published more than 200 research papers in journals and refereed conference proceedings, in the area of EDA, computer architecture, VLSI circuit designs, and embedded systems. He received BS degree from Tsinghua University, and MS/PhD from Princeton University. He was elevated to IEEE Fellow recently due to his contributions to design automation and architecture for 3D ICs.

9:10 am -
9:55 am

KEYNOTE – GRAPHICS MARKET:
CURRENT AND FUTURE TECHNOLOGY DEVELOPMENTS FOR HIGH-END APPLICATIONS
Rozalia Beica, Chief Technology Officer
YOLE DEVELOPPEMENT

Abstract: Through Silicon Via (TSV) technology has been adopted in production, for several years already, for MEMS and CMOS Image Sensors. Driven by consumer applications, this market is expected to continue to grow in the coming years.

For high-end applications, FPGA packages using 2.5D integration were successfully introduced in 2011 by Xilinx, and new products with 3D stacked memories have recently been announced. There are no more doubts of 3DIC adoption for high end applications. 2015 is expected to be the key turning point for 3D adoption in high end memories for servers, networks and high performance computers.

Emerging applications, such as photonics, are also being developed for future products, targeting data centers and high performance computers. Photonics have the potential of providing faster digital signaling than it is currently possible with traditional electron based semiconductor devices. Today, photonics based devices and their packaging technologies are being actively researched, expected to enter the market around 2018-2020.

The presentation will provide an overview of the 2.5D & 3DIC industry activities, product announcements, commercialization roadmaps as well as market forecasts and applications. Insights into development of future technologies for high end applications, such as photonics and their packaging, including market trends, will be presented.

Rozalia G. Beica is Chief Technology Officer at Yole Developpement, where she leads the advanced packaging and semiconductor manufacturing activities. Rozalia is an international award winning scientist (2006 R&D 100), with over 60 publications (including 3 book chapters focused on 3D IC technologies) and four patents. For more than 16 years, she was involved in the research, application and strategic marketing of Advanced Packaging and 3D Interconnect, with global leading responsibilities at specialty materials (Rohm and Haas Electronic Materials), equipment (Semitool, Applied Materials, Lam Research) and device manufacturing (Maxim IC) organizations. On the volunteer front, she is currently co-chairing the Advanced Packaging committee within ECTC and supporting the IMAPS Device Packaging Conference as a general chair elect in 2015 with a transition to General Chair at DPC 2016.

Rozalia has a Global Executive MBA from Instituto de Empresa Business School (Spain), M. Sc. In Management of Technology from KW University (USA) and a M.Sc in Chemical Engineering from Polytechnic University “Traian Vuia” (Romania).

10:00 am -
6:30 pm

Exhibition and Technology Showcase

10:00 am -
10:30 am

Break in Exhibit Hall

Sponsored by:

MRSI - Break Sponsor

ASM Pacific - Refreshment Break Sponsor

 

 
3D IC & Packaging
Flip Chip & Wafer Level Packaging
Engineered Micro Systems & Devices

 

TA1
3D DEVICE INTEGRATION

Chair: Peter Ramm, Fraunhofer EMFT

TA2
FOWLP AND ALTERNATIVES

Chairs: Jon Aday, Qualcomm; Lars Boettcher, Fraunhofer IZM

TA3
3D PRINTING

Chairs: Russell Shumway, Amkor Technology; Aubrey Beal, Auburn University

10:30 am – 11:00 am

Development of 2.5D and 3D IC Fabrication and Assembly Technologies
Guilian Gao, Invensas (Hong Sheng, Sangil Lee, Bong-Sub Lee, Scott McGrath, Liang Wang, Charles Woychik, Cyprian Uzoh, Grant Villavicencio, Roseann Alatorre, Sitaram Arkalgud)

Embedded Solutions: Fan-out and Embedded Dies Packages Market and Technology Trends
Jerome Azemar, Yole Developpement (Rozalia Beica, Thibault Buisson, Andrej Ivancovic, Amandine Pizzagalli)

Multi3D Manufacturing: 3D Printing of Geometrically-Complex Aerospace Structures with Embedded Electronics
Eric MacDonald, University of Texas at El Paso (David Espalin, Slade Culp, Ryan Wicker)

11:00 am – 11:30 am

Advanced High Density Trench Capacitor Substrate Technology for 3D Heterogeneous Stacks with Outstanding Performances
Catherine Bunel, IPDiA (Franck Murray)

Silicon Wafer Integrated Fan-out Technology
Curtis Zwenger, Amkor Technology (Ron Huemoeller, Amkor Technology; JinHan Kim, DongJean Kim, WonChul Do, SeongMin Seo, Amkor Technology, Korea)

An In Situ Atmospheric Probe for Real Time Weather Monitoring
Mark Adams, Auburn University (Audrey Rose Shapland, Matthew Gutierrez, Evan Owen)

11:30 am – 12:00 pm

Development of TSV-ASICs for Near-Gapless Tiling of Imaging X-ray Detectors
Jaesub Hong, Harvard University (Branden Allen, Jonathan Grindlay, Jill Burnham, Hiromasa Miyasaka, Scott Barthelmy)

Comparison of FOWLP vs QFN Package from Thermal Aspect
Qun Wan, RF Micro Devices

3D Microsensor Imaging Arrays Networks
David Fries, Institute for Research in Art - University of South Florida (Geran Barton)

12:00 pm– 12:30 pm

SiPs in the Medical Domain and in the Defense and Industrial Domain Produced with WDoDTM Technology
Pascal Couderc, 3D PLUS (Jerome Noiray)

Low Cost Chip Last Fanout Package using Coreless Substrate
Scott Chen, ASE Group (Simon Wang, Coltrane Lee, John Hunt)

3D Printing for Product Development in Construction
Aubrey Beal, Auburn University (Darren Olsen)

12:30 pm –
2:00 pm

Lunch In The Exhibit Hall
(Food served from 12:30 pm - 1:30 pm)

Sponsored by:
DPC/GBC Premier Sponsor: Solid State Equipment Corp. Applied Materials - Event Sponsor Protavic - Event Sponsor

TUESDAY, MARCH 17   
Afternoon Technical Sessions
 
3D IC & Packaging
Flip Chip & Wafer Level Packaging
Engineered Micro Systems & Devices

 

TP1
3D PROCESS TECHNOLOGIES

Chairs: Tom Strothmann, Kulicke and Soffa; Franck Murray, IPDiA

TP2
BUMPING, PLATING PROCESSES, AND MATERIALS

Chairs: Ted Tessier, FlipChip International; Eric Huenger, Dow

TP3
FABRICATION, PACKAGING & ANALYSIS

Chairs: Eric MacDonald, University of Texas at El Paso; Li-Anne Liew, University of Colorado & National Institute of Standards and Technology

2:00 pm –
2:30 pm

A Cost and Yield Analysis of Wafer-to-wafer Bonding
Amy Palesko, SavanSys Solutions LLC (Chet Palesko)

Scanned Mask Imaging Ablative DPSS UV Laser Process for 2µm L/S RDL
David Myles, M-Solv Ltd & Heriot Watt University (David Milne, Jonathan D Shephard)

Technologies for Wafer Level MEMS Capping based on Permanent and Temporary Wafer Bonding
Kai Zoschke, Fraunhofer IZM (Klaus-Dieter Lang)

2:30 pm –
3:00 pm

Thin Wafer Handling Using Mechanical- or Laser-Debondable Temporary Adhesives
David Fleming, Dow Electronic Materials (Jong-Uk Kim, Janet Okada, Kevin Wang, Michael Gallagher, Bob Barr, Jeff Calvert, Dow Electronic Materials; Kai Zoschke, Matthias Wegner, Michael Toepper, Fraunhofer IZM; Thomas Rapps, Tim Griesbach, Stefan Lutter, Suss Microtec)

Electroplating with Dielectric Bridges
Gene Stout, Flipchip International (Doug Scott, Anthony Curtis, Guy Burgess, Theodore Tessier)

Anaerobic Adhesive Jetting for Micro-electronics Packaging Applications
Hanzhuang Liang, Nordson Asymtek (Floriana Suriawidjaja, Michael Szuch)

3:00 pm –
3:30 pm

Temporary Bonding of Wafers, Displays, and Components
John Moore, Daetec LLC (Jared Pettit, Alex Brewer, Alman Law)

Next-Generation Copper, Nickel and Lead-Free Metallization Products for Next-Generation Devices and Applications
Jonathan Prange, Dow Chemical Co. - Electronic Materials Division (Yi Qin, Matthew Thorseth, Inho Lee, Masaaki Imanari, Yil-Hak Lee, Julia Woertink, Mark Lefebvre, Wataru Tachikawa, Jianwei Dong, Jeffrey Calvert)

A Kinetic Monte Carlo Approach to Study Transport in Amorphous Silicon HIT Cells
Pradyumna Muralidharan, Arizona State University (Dragica Vasileska, Stephen Goodnick)

3:30 pm –
4:00 pm

Break in Exhibit Hall

Sponsored by:

MRSI - Break Sponsor

ASM Pacific - Refreshment Break Sponsor
4:00 pm –
4:30 pm

Cu Electroplating Chemistry and Process Enabling Rapid TSV Filling with Long Bath Life
Matthew Thorseth, Dow Chemical (Luis Gomez, Mark Scalisi, Bryan Lieb, Mark Lefebvre, Jeff Calvert, Dow Electronic Materials; Dave Erickson, Bob Mikkola, Bridger Hoerner, James Burnham, Applied Materials)

FEA Investigation of Package Structural Factors Affecting Bump Fatigue
Mingji Wang, Amkor (Wei Li)

Sapphire Micromachining: Promises and Challenges
Syed Sajid Ahmad, Center for Nanoscale Science and Engineering, NDSU (Fred Haring)

4:30 pm –
5:00 pm

Study of Chip Stack Process and Electrical Property for 3D-LSI
Toshiya Akamatsu, Fujitsu, Ltd.

Next Generation Thin Film Polymers for WLP Applications and their Mechanical Characterization
Markus Woehrmann, Fraunhofer IZM (M. Toepper; H. Walter; K.-D. Lang)

Flexible Hand-Free Microelectronics Assembly Line for the Chip and Wire industry
Will Bolinger, Natel EMS (Prakash Bhartia, Jim Angeloni)

5:00 pm –
5:30 pm

1uF/mm2 Integrated Capacitors: Path to Electronics Miniaturization
Arkadii Samoilov, Maxim Integrated

Self Priming Low Stress Aqueous Developable Benzocyclobutene (AD-BCB) Photodielectric Materials for Advanced Wafer Level Packaging
Hua Dong, Dow Electronic Materials (Greg Prokopowicz, Bob Barr, Joe Lachowski, Jeff Calvert, Mike Gallagher, Tina Aoude, Rosemary Bell, Sue McNamara, Masaki Kondoh, Joon-Seok Oh, David Louks, Jong-Uk Kim)

Bend Testing of Micro-scale Bulk Metal Specimens Using a Chip-scale Test Instrument
Li-Anne Liew, University of Colorado (David Read, Nicholas Barbosa III)

5:00 pm –
6:30 pm

Exhibit Hall Reception

Sponsored by:
Mentor Graphics - Corporate Sponsor

 

GBC Speaker Dinner | 6:30pm - 8:00 pm
(By Invitation Only)

Thank you to the GBC Speaker Dinner Sponsors:

DPC/GBC Premier Sponsor: Solid State Equipment Corp. DPC/GBC Premier Sponsor: Amkor Technology DPC/GBC Premier Sponsor: ASE US, Inc. GBC Speaker Dinner Sponsor: Kyocera America

 

 

** NEW THIS YEAR -- Evening Technical Sessions**

Evening Session Snacks and Beverages Sponsored by:

EV Group - Evening Sessions Sponsor

TUESDAY, MARCH 17   
Evening Technical Sessions
 
3D IC & Packaging
Flip Chip & Wafer Level Packaging
Engineered Micro Systems & Devices

 

TP4
APPLICATIONS & DESIGN

Chair: Phil Garrou, Microelectronic Consultants of NC

TP5
FLIP CHIP APPLICATIONS / RELIABILITY

Chairs: Paul Mescher, Microsoft; Steffen Kroehnert, Nanium

TP6
PCB & LAMINATE DEVICES

Chairs: David Fries, Institute for Research in Art - University of South Florida; Michael Kranz, EngeniusMicro

6:30 pm –
7:00 pm

Advanced Silicon Interposer for High Density and High Integration Electronic Packages
Satoru Kumochi, Dai Nippon Printing (Sumio Koiwa, Kosuke Suzuki, Yoshitaka Fukuoka)

BGA Board Level Reliability Analysis & Optimization
Betty Yeung, Freescale Semiconductor Inc. (Torsten Hauck, Burt Carpenter, Thomas Koschmieder)

Improved RF Metamaterial Band-Pass Filter Design Using CSRR Structures on LCP Substrate
Christopher James, Auburn University (Robert Dean)

7:00 pm –
7:30 pm

Embedded Power Modules – A New Approach Using Power Core and High Power PCB
Lars Boettcher, Fraunhofer IZM (S. Karaszkiewicz , D. Manessis, A. Ostmann)

Case Study for the use of SiP technology for a UAV Controller
James Meyer, i3 Electronics

A PCB Technology Electrical Conductivity Sensor for the Measurement of Saltwater Contamination
Robert Dean, Auburn University (Frank Werner, Mark Adams)

7:30 pm –
8:00 pm

2.5D and 3D Multi-Die Packages using Silicon-less Interposers
Mike Kelly, Amkor Technology (David Hiner, Ron Huemoeller, Rick Reed)

Enabling Requirements for High Volume Thermocompression Bonding
Tom Strothmann, Kulicke and Soffa

Design and Fabrication of a PCB MEMS Module With Integrated Switches and Sensor Suite
Li-Anne Liew, University of Colorado (D. Boteler, C.Y. Lin, N. Marsiglia, Y.C. Lee)

8:00 pm –
8:30 pm

Silicon-Embedded RF Micro-Inductors for Ultra-Compact RF Subsystems
Florian Herrault, HRL Laboratories (M. Yajima, M. Chen, C. McGuire, A. Margomenos)

CANCELLED: eContact - Resilient Area Contacts
Georg Meyer-Berg, Infineon Technologies AG (Klaus Pressel, Peter Fruehauf (speaker cancelled on march 13 due to conflict)

The Discrete Vacuum Packaging of IR-Microbolometers
Heather Florence, SAES Getters S.p.A. (Luca Mauri)

 

** NEW THIS YEAR -- Evening Technical Sessions**

Evening Session Snacks and Beverages Sponsored by:

EV Group - Evening Sessions Sponsor

 


Early Conference Registration & Hotel Reservations

Early Registration Rate & Hotel Availability Ends:
February 17, 2015

All registration fees increase after the deadline

IMAPS cannot guarantee hotel room availability/pricing after deadline

REGISTER ONLINE
Registration Information | Hotel Reservations



 

WEDNESDAY, MARCH 18   
**NEW** Morning GBC Plenary Session on INTERNET OF THINGS

7:00 am -
6:00 pm

Registration

7:00 am -
8:00 am

Continental Breakfast

Sponsored by:
Breakfast Sponsor: ASE US, Inc.

8:00 am -
8:15 am

GBC
Welcome to the NEW Global Business Council (GBC) Keynote & Plenary Session on
INTERNET OF THINGS (IoT)

OPENING COMMENTS: Lee Smith, (UTAC) United Test & Assembly Center; Rich Rich, ASE Group

8:15 am -
9:00 am

Keynote - Bill McCLean

Keynotes Sponsored by:

SPTS - Corporate Sponsor

GBC KEYNOTE –
IC MARKET OUTLOOK IN AN UNSTABLE ECONOMY
Bill McClean, President
IC INSIGHTS, INC.

Abstract: IC Insights forecasts that 2015 will continue the integrated circuit industry cyclical upturn that began in 2013. This cyclical upturn is expected to gain momentum over the next several years, resulting in a 6.4% IC market CAGR over the 2013-2018 time period, which would be more than 3x the 1.7% CAGR the IC market displayed from 2007-2012. Moreover, IC unit volume shipments are forecast to register a 2013-2018 CAGR of 7.1%, much better than the 4.0% CAGR shown in the 2007-2012 time period.

Although a high level of uncertainty still looms over the global economy, sales of smartphones and tablet PCs continue to soar and the Internet of Things looms on the horizon. IC Insights will present its forecast for the IC market and unit volume shipments in the context of the IC industry cycle model. In order to make sense out of the current turmoil, a top-down analysis of the IC market will be given and include trends in worldwide GDP growth, electronic system sales, and semiconductor industry capital spending and capacity.

Mr. McClean began his market research career in the integrated circuit industry in 1980 and founded IC Insights in 1997. During his 34 years of tracking the IC industry, Mr. McClean has specialized in market and technology trend forecasting and was responsible for developing the IC industry cycle model. At IC Insights, he serves as managing editor of the company’s market research studies and reports. In addition, he instructs for IC Insights’ seminars and has been a guest speaker at many important annual conferences held worldwide (e.g., SEMI’s ISS and Electronic Materials Conferences, The China Electronics Conference, and The European Microelectronics Summit). Mr. McClean received his Bachelor of Science degree in Marketing and an Associate degree in Aviation from the University of Illinois.

9:00 am -
9:30 am

Maximizing the Internet of Everything by Mobilizing the MEMS/sensors and Adjacent Ecosystems
Stephen Whalley, Chief Strategy Officer
MEMS INDUSTRY GROUP

MEMS and sensor markets have seen remarkable growth over the past half-decade as their use in consumer electronics has increased. As we rapidly move to an Internet of Everything (IoE), this growth will only continue; with MEMS and sensors also increasingly in wearables, health and other segments. Will it be plain sailing to create the billions and ultimately trillions of MEMS/sensors needed to feed these markets in the next decade? What are the challenges and opportunities to realizing this growth? What additional actions are needed to scale and build a thriving MEMS and sensor ecosystem for the future as well as adjacent and co-dependant semiconductor and flexible electronics industries? Now is the time to bring together these players in the value chain and co-create an exciting and profitable future. This presentation will discuss the risks and rewards and is a must-attend for anyone considering adding MEMS/sensors into their product line.

9:30 am -
10:00 am

Evolving Challenges for Sensor/MEMS Packaging
Mike Stanley, Manager, Systems/Algorithms, Sensor Solutions Division
FREESCALE SEMICONDUCTOR

IoT, Wearable, Industrial/Automotive and Medical sensor requirements continue to evolve, as are sensor technologies themselves. The convergence of these make for interesting engineering and design challenges. These include the need to operate in hostile environments, at extremely low power, while improving measurement precision. This presentation will present use cases from a variety of markets, and discuss the impacts from a packaging perspective for future generations of sensors.

10:00 am -
4:00 pm

Exhibition and Technology Showcase

10:00 am – 10:30 am

Break in Exhibit Hall

Sponsored by:

Break Sponsor: Amkor Technology

i3 Electronics - Refreshment Break Sponsor
10:30 am -
11:00 am

The Wearable Market and Packaging Requirements
E. Jan Vardaman, President
TECHSEARCH INTERNATIONAL, INC.

Wearable electronics products such as activity monitoring cameras, wrist products, and clothing are growing in popularity. Many wearable medical devices have been around for many years. The products typically collect and transmit data; therefore they use many MEMS, sensors, and processors. Products on the market today use many different packages including stacked packages (3D), BGAs, CSPs, WLPs, and leadframe packages such as QFNs. No single package dominates this category, but increased cost sensitivity will place greater demands on package and assembly decisions. With so many choices, the challenge is selecting the correct package to meet the needs of performance, form factor, and function. This presentation examines trends in packages for wearable electronics and discusses new packages and assembly methods being planned for future products.

11:00 am -
11:30 am

Market Trends and Evolution of IoT
Rozalia Beica, Chief Technology Officer
YOLE DEVELOPPEMENT

After the Internet revolution, broadband connectivity is becoming low cost and ubiquitous, leading to a second revolution phase which is approaching, the Internet of Things. The proliferation of connected devices is driven by an expansion of the Internet through the inclusion of physical objects combined with an ability to provide smarter services to the environment as more data becomes available.

Transform our environment to render it smart is the promise of IoT. Each object will potentially turn into an interactive and powerful information source. When that data comes in near real-time, decision-making can be faster, which could have saving implications. IoT could have a significant impact on how businesses operate, including unlocking new revenue from existing products and inspiring new processes.

It has a high potential, considering the wide range of industries it can be applied (healthcare, industry, retail, manufacturing, real estate, construction, IT and technology, etc.), however, also several factors to be considered and addressed. Transforming a factory into a smart factory will require large investments, standards, diversity and new (specific IoT focused) sensors, ecosystem to support it, ability to fast analyze the data, data security protection, and, very critical, a change in mindset, a new way of working.

IoT environment is currently structuring itself. A large expansion of IoT devices are expected to take place in the coming years which will impact on how these devices are being developed. Existing devices, however, with improved performance, are expected to be developed in the near future followed by development of new devices, strictly targeting and focused on IoT applications. New businesses will continue to appear and disappear around IoT chain, but the real value of IoT will strongly converge to data processing in the future.

The presentation will include description of the IoT value chain structure, highlighting the applications, technology trends and challenges expected in the future. Business and market trends will be included.

11:30 am -
12:00 pm

Internet of Things (IoT) Applications: Examples of Real World Value Propositions
Jim Walker, Research VP Semiconductor Manufacturing
GARTNER TECHNOLOGY AND SERVICE PROVIDER RESEARCH

Examples of applications can illustrate the real value behind the Internet of Things (IoT). Various scenarios are discussed that help understand and explain the key fundamental opportunities of the IoT, and what effect these innovations can have on silicon manufacturing and assembly process technologies in the future. The presentation will focus on the following areas:

1) What service providers really need to know about the IoT.
2) Which examples best illustrate the opportunities and advantages of IoT implementation.
3) Strategies to address the manufacturing challenges of implementing the IoT.

12:00 pm -
12:30 pm

Sensor Packages and Integration Trends to Accommodate IoT and Wearable Applications
Brandon Prior, Senior Consultant
PRISMARK PARTNERS LLC

The miniaturization and cost reduction of sensors has been a key part in the success of increased functionality in portable applications. While mobile phones may continue to represent the largest opportunity for Sensors, the emergence of IoT brings in a new set of challenges related to performance, cost, size and integration with other components. This paper will review some of the key issues and opportunities within IoT, and address how the device and package or module integration may play out to serve this emerging segment. Teardown Examples of sensor packages and modules will be used to highlight key assembly trends.

12:30 pm

GBC CLOSING REMARKS

12:30 pm –
1:30 pm

Lunch In The Exhibit Hall
(Food served from 12:00 pm - 1:00 pm)

Sponsored by:
DPC/GBC Premier Sponsor: Solid State Equipment Corp. Applied Materials - Event Sponsor Protavic - Event Sponsor

 

WEDNESDAY, MARCH 18   
Afternoon Technical Sessions
 
3D IC & Packaging
Flip Chip & Wafer Level Packaging
Engineered Micro Systems & Devices

 

WP1
GLASS INTERPOSERS (before break) and
METROLOGY & YIELD ANALYSIS (after break)

Chairs: Venky Sundaram, Georgia Tech PRC; Stevan Hunter, ON Semiconductor

WP2
FC ASSEMBLY MATERIALS / PROCESS

Chairs: Gilles Poupon, CEA LETI; Brian Ahmer Syed, Qualcomm

WP3
ENGINEERED MICRO DEVICES

Chairs: Mark Adams, Auburn University; Robert Weikle II, University of Virginia

1:30 pm –
2:00 pm

Advancements in Through Glass Via (TGV) Technology
Aric Shorey, Corning, Inc. (Rachel Lu, Scott Pollard, Ekatarina Kuksenkova, Gene Smith)

Multi Beam Full Cut Dicing of Thin Si IC Wafers
Jeroen van Borkulo, ASM Pacific Technology (Richard van der Stam, Guido Knippels)

A Microcontroller Approach to Measuring Transmissibility of MEMS Devices
Chong Li, Auburn University (Yixuan Wu, Haoyue Yang, Luke Jenkins, Robert Dean, George Flowers)

2:00 pm –
2:30 pm

Material and Process Developments for Robust and High Reliability Glass Wafers for 2.5D Packaging
Roupen Keusseyan, Triton Microtechnologies (Tim Mobley)

Ultralow Residue (ULR) Semiconductor Grade Fluxes for Flip-Chip and MEMs Applications
Maria Durham, Indium Corporation (SzePei Lim, Jason Chou, Andy Mackie)

A Random Stimulation Source for Evaluating MEMS Devices using an Exact Solvable Chaotic Oscillator
Aubrey Beal, Auburn University (Robert Dean)

2:30 pm –
3:00 pm

Characterization of a Semiconductor Packaging System utilizing Through Glass Via (TGV) Technology
Tim Mobley, Triton Microtechnologies (Roupen Keusseyan, Tim LeClair, Konstantin Yamnitskiy, Regi Nocon)

Design of Filled One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow Processing: Curing Kinetics and Solder Reflow Aspects
Daniel Duffy, Kester Inc. (Hemal Bhavsar, Lin Xin, Jean Liu, Bruno Tolla)

The Increasing Challenges in Testing MEMS
Richard Chrusciel, FocusTest, Inc.

3:00 pm –
4:00 pm

Break in Exhibit Hall

Sponsored by:

Break Sponsor: Amkor Technology

i3 Electronics - Refreshment Break Sponsor
4:00 pm –
4:30 pm

Magnetic Current Imaging of a TSV short in a 3D IC
Jan Gaudestad, Neocera (Antonio Orozco)

Routable aQFN with the Ball Mount Design
Chun Ting Lu, ASE Group Kaohsiung (Timmy Lin, Louie Huang)

Optical Cavity Interrogation for MEMS Accelerometers
Michael Kranz, EngeniusMicro (Tracy Hudson, Brian Grantham, Michael Whitley)

4:30 pm –
5:00 pm

A Module-on-module Manufacturing Process and the Study of its Warpage and Signal Integrity
Thomas Wang, ASE (James Lin, Tony Cheng, Ping-Chi Hong, Albert Lin, Harrison Chang)

Advances in Fine Pitch Off-Chip Interconnections Through the Use of a Novel Surface Finish
Rick Nichols, Atotech Deutschland GmbH (Arnd Kilian, Gustavo Ramos, Robin Taylor, Atotech Deutschland GmbH; Vanessa Smet, Ninad Shahane, Scott McCann, TingChia Huang, Rao Tummala, Georgia Tech PRC)

A MEMS Magnetometer Utilizing Neodymium Rare Earth Magnets
John Tatarchuk, Auburn University (Colin Stevens, Robert Dean)

5:00 pm –
5:30 pm

3DIC Yield Analysis Gaps and Possible Approaches
Jacob Orbon, Rudolph Technologies

 

Micro-Electro-Mechanical System for Measuring Mechanical Properties of Cell Aggregates
Negar Moghimi, Lehigh University (Sabrina Jedlicka, Svetlana Tatic-Lucic)

5:30 pm –
6:30 pm

Interactive Poster Session & "Happy Hour"
Outside On Patio Overlooking Desert: 5:30 pm - 6:30 pm
(Poster Presenter Setup - 4:00 pm - 5:00 pm)

Poster Session Sponsored by:
Sponsor: Lam Research

 

3D
Challenges and Solutions for Microbump Inspection
Hong Shen, Invensas Corp. (Xuan Li, Gabe Guevara and Sitaram Arkalgud)

3D
New Products and Emerging Laser Technology for the Packaging Industry
Dirk Mueller, Coherent Inc. (David Clark, Rainer Pätzel)

3D
Large Field 1.5-2 um L/S Patterning by Projection Lithography for Low Cost 2.5D Glass and Organic Interposers
Ryuta Furuya, Ushio Inc. (Hao Lu, Fuhan Liu)

3D
Magnetic Current Imaging of a TSV short in a 3D IC

Jan Gaudestad, Neocera (Antonio Orozco)

3D
Temporary Bonding of Wafers, Displays, and Components

John Moore, Daetec LLC (Jared Pettit, Alex Brewer, Alman Law)

Flip Chip & Wafer Level Packaging
The Reliability of High-lead Solder Joints in Flip-Chip Devices
Lingjuan Tian, Beijing MXTronics Corp.

Flip Chip & Wafer Level Packaging
Fabrication and Reliability Evaluation of a Wide I/O Package-on-package Structure
Edward Huang, ASE (Louie Huang)

Flip Chip & Wafer Level Packaging
Design of Filled One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow Processing: Curing Kinetics and Solder Reflow Aspects

Daniel Duffy, Kester Inc. (Hemal Bhavsar, Lin Xin, Jean Liu, Bruno Tolla)

Engineered Micro Systems & Devices
Micro-Electro-Mechanical System for Measuring Mechanical Properties of Cell Aggregates

Negar Moghimi, Lehigh University (Sabrina Jedlicka, Svetlana Tatic-Lucic)

Engineered Micro Systems & Devices
Sapphire Micromachining: Promises and Challenges

Syed Sajid Ahmad, Center for Nanoscale Science and Engineering, NDSU (Fred Haring)

Engineered Micro Systems & Devices
Bend Testing of Micro-scale Bulk Metal Specimens Using a Chip-scale Test Instrument

Li-Anne Liew, University of Colorado (David Read, Nicholas Barbosa III)

Emerging Technologies
Reliability of Cu Wirebonded ICs for Automotive Applications
Mike Howard, DfR Solutions (Jim McLeish, Greg Caswell, Randy Schueller)

Emerging Technologies
Automate 3D Modeling of Trace and Via Structures
Mike Howard, DfR Solutions (Greg Caswell, Craig Hillman, Nathan Blattau,Frank Pitelli; Paul Waters, Gil Sharon, Navius)

Photonics Packaging
Copper’s Migration and its Role in the Reliability of CdTe Solar Cells
Da Guo, Arizona State University (Tian Fang, Andrew Moore, Richard Akis, Daniel Brinkman, Dragica Vasileska, Igor Sankin, James Sites, Christian Ringhofer)

Photonics Packaging
High Temperature InGaN Solar Cell Modeling
Yi Fang, Arizona State University (Dragica Vasileska, C. Honsberg, S.M. Goodnick)

 

Poster Session "Happy Hour" Sponsored by:
Sponsor: Lam Research


Sunset Shuttle to Old Town Scottsdale Following Posters/Happy Hour -- Provided by IMAPS

 

Sunset Shuttle to Scottsdale
Wednesday, March 18th Following the Poster Session “Happy Hour”

Take yourself or your guests for an evening out on the town – Old Town Scottsdale! IMAPS will provide a courtesy shuttle to the vibrant Old Town and Waterfront Scottsdale districts after activities end on Wednesday, March 18th. The shuttle is tentatively scheduled to depart the We-Ko-Pa at 7pm, then from Scottsdale at 10pm. Contact blamm@imaps.org with questions

Dine, shop, and discover the energy of two of Scottsdale’s most popular districts. Enjoy the high-end shops and restaurants of the Waterfront district, or tip your hat to the Old West experience in the Old Town district. You’re sure to stumble across some of the best galleries and public art no matter which way you turn. Learn more about the 150+ restaurants, galleries and shops at www.experiencescottsdale.com.

The shuttle will be provided on a first-come, first-served basis. Finalized shuttle service times and departure sites will be provided upon arrival at DPC 2015. IMAPS is not responsible for transportation expenses if you are unable to meet the shuttle for transportation to or from Scottsdale.

 

 

THURSDAY, MARCH 19   
Technical Sessions

7:00 am –
11:30 am

Registration

7:00 am –
8:00 am

Continental Breakfast

Sponsored by:
Breakfast Sponsor: ASE US, Inc.

8:00 am -
8:45 am

Keynote Sessions Sponsored by:

SPTS - Corporate Sponsor

KEYNOTE – MOBILE PRODUCTS:
2.5D & 3D INTEGRATION : WHERE WE HAVE BEEN, WHERE WE ARE NOW, WHERE WE NEED TO GO
Riko Radojcic, Senior Director, 2.5D & 3D Integration
QUALCOMM TECHNOLOGIES

Abstract: Past learnings and the current State of the Art for application of 2.5D and 3D technologies targeting high performance and high density die-to-die interconnect for mobile application are reviewed. Key technology tradeoffs are highlighted, and the challenges for future product intersection of disruptive More-than-Moore class of technology options are anticipated. Key gaps in the industry infrastructure are discussed.

Riko Radojcic is currently a Senior Director of Technology at Qualcomm Technologies Inc. He is a leader of the 2.5D and 3D Technology Integration team, addressing all aspects of the 2.5D and 3D technology options, ranging from architecture down to manufacturability. During the past years with Qualcomm, Riko has led a number of Design-for-Technology initiatives; including Design-for-3D, Design-for-Thermal, Design-for-Stress, Design-for-Variability, Design-for-Manufacturability, etc.. Radojcic has more than thirty years of experience in the semiconductor industry, and has specialized in integration of process technology and design considerations. Before joining Qualcomm, he was an independent consultant to semiconductor and EDA companies providing engineering and business development services. Before that, he focused on design technology, process characterization and modeling integration, with PDF Solutions (director of marketing), Tality Corporation (Business Manager) and Cadence (architect). Radojcic has held a series of managerial and engineering positions with Unisys and Burroughs, in device engineering, failure analyses and reliability engineering areas. He began his career as a process engineer with Ferranti Electronics, UK. Radojcic received his BSc and PhD degrees from University of Salford (Manchester), UK.

8:45 am -
9:30 am

KEYNOTE – MOBILE MARKET:
PACKAGE TREND CHANGES AND CHALLENGES FOR MOBILE DEVICES: IS THIN STILL IN?
E. Jan Vardaman, President & Founder
TECHSEARCH INTERNATIONAL, INC.

Abstract: Mobile devices, including smartphones are driving package developments and unit volume growth in the semiconductor industry. Ever demanding requirements for thin packages have created challenges for semiconductor makers and the companies that assemble their packages. How thin is too thin? Will thin remain a requirement? While today’s WLPs, PoPs, and stacked die CSPs will remain popular—along with a number of others such as QFNs and FBGAs, new versions of advanced packages are expected to emerge. This presentation examines today’s package options and the growth for new package formats. Business conditions for the assembly of these packages and the challenges that they create for the supply chain are discussed.

E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. She is the co-author of How to Make IC Packages (published in Japanese by Nikkan Kogyo Shinbunsha), a columnist with Printed Circuit Design & Fab/Circuits Assembly, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She is a member of IEEE CPMT, SMTA, MEPTEC, IPC, IMAPS and SEMI. She was elected to two terms on the IEEE CPMT Board of Governors and is a CPMT Distinguished Lecturer.

9:30 am –
9:45 am

Break in Foyer

Sponsored by:
Breakfast Sponsor: ASE US, Inc.
DPC/GBC Premier Sponsor: Solid State Equipment Corp.
 
3D IC & Packaging
Emerging Technologies
Engineered Micro Systems & Devices

 

THA1
ADVANCED PROCESSES FOR 3D INTEGRATION

Chair: Rozalia Beica, Yole Développement

THA2
EMERGING PACKAGING TECHNOLOGIES

Chair: Susan Bagen, Micro Systems Technologies

THA3
RF MICRO SYSTEMS & DEVICES

Chairs: Syed Sajid Ahmad, Center for Nanoscale Science & Engineering,NDSU; John Tatarchuk, Auburn University

9:45 am –
10:15 am

The European 3D Heterogeneous Integration Platform (e-BRAINS) - a Particular Focus on Reliability and Low-Temperature Processes for 3D Integrated Sensor Systems
Peter Ramm, Fraunhofer EMFT (Armin Klumpp, Alan Mathewson, Kafil Razeeb, Reinhard Pufall)

SiP Technology for Wireless Module Miniaturization
Vincent K Liao, ASE (Benny Kuo)

Heterogeneous Integration and Micromachining Technologies for Terahertz Devices and Components
Robert Weikle II, University of Virginia (N. Scott Barker, Arthur Lichtenberger, Matthew Bauwens, Naser Alijabbari)

10:15 am –
10:45 am

High-Volume-Manufacturing (HVM) of BVA-Enabled Advanced Package-on-Package (PoP)
Guilian Gao, Invensas (Wael Zohni, Rey Co, Ashok Prabhu)

Shrinking Package Footprint by Embedding Top-Side Real Estate Using Core-to-Core Joining
Catherine Shearer, Ormet Circuits (Ken Holcomb, Jim Haley)

Design and Fabrication of MEMS-type Compliant Overhang Flip-chip Interconnect for RF Applications
Pingye Xu, Michael Hamilton, Auburn University & ON Semi.

10:45 am –
11:15 am

Development of TSV Reveal Process Using Very Fine Si/Cu Grinding and Metal Contamination Removal
Naoya Watanabe, National Institute of Advanced Industrial Science and Technology (Masahiro Aoyagi, Daisuke Katagawa, Tsubasa Bandoh, Takahiko Mitsui, Eiichi Yamamoto)

Advanced Electronic Packaging Options for Miniaturization of Complex Medical Devices
Susan Bagen, Micro Systems Technologies, Inc. (Ravi Subrahmanyan, Ruben Perrone, Daniel Schulze)

Highly Tunable Mn-doped PZT Thin Films for Integrated RF Devices
Warda Benhadjala, CEA, LETI, MINATEC (Florence Sonnerat, Jennifer Guillaume, Christel Dieppedale, Philippe Renaux, Gwenaël Le Rhun, Henri Sibuet, Christophe Billard)

11:15 am –
11:45 am

 

 

Integrated Localized MicroCooling Using High-Displacement Piezoelectric Actuators
Michael Kranz, EngeniusMicro (Janice Booth, Vicki LeFevre, Tracy Hudson, Brian English, Michael Whitley)

11:45 am

Closing Remarks

1:00 pm Start

2015 IMAPS Microelectronics Foundation Spring Golf Invitational
1:00pm Shotgun Start -- "Best Ball" Scramble

SunRidge Canyon Golf Club
Fountain Hills, AZ

Golf Sponsors

Premier - "Eagle" Sponsor:
DPC/GBC Premier Sponsor: Solid State Equipment Corp.
3 Holes Sponsor

Premier - "Eagle" Sponsor:
DPC/GBC Premier Sponsor: ASE US, Inc.
3 Holes Sponsor

Premier - "Birdie" Sponsor:

Golf Hole Sponsor: Amkor Technology
Hole Sponsor
Hole Sponsor: NAMICS
Hole Sponsor
Golf Hole Sponsor: Coining Inc/SPM
Hole Sponsor
Golf Hole Sponsor: AGC Electronics America
Hole Sponsor

Ubotic - Insert/Giveaway Sponsor
Hole Sponsor

ASM Pacific - Hole Sponsor
Hole Sponsor

Golf Hole Sponsor: Infinite Graphics
Hole Sponsor
5 Golf Holes Available  



Hotel Cut-off:
February 17, 2015
Rates and availability will not be guaranteed after the deadline

WeKoPa Resort & Casino | Fountain Hills, AZ 85264

IMAPS Discounted Single/Double Room Rate: $175/night + Taxes and Fees

On-Line Reservations

Phone Reservations: (480) 789-5300
Mention IMAPS or IMAPS Device Packaging when booking by phone

 

REGISTER ONLINE

Professional Development Courses (PDCs) | Exhibition Information

 


Housing

Hotel Reservation Deadline - February 17, 2015

Housing accommodations must be made directly to:

WeKoPa Resort & Casino
(The Fort McDowell Yavapai Nation re-launched the Radisson Fort McDowell Resort as the new We-Ko-Pa Resort & Conference Center effective October 1, 2014)
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

IMAPS ROOM BLOCK and the entire hotel is SOLD OUT
IMAPS Discounted Single/Double Room Rate: $175/night + Taxes and Fees

Feel free to continue to try: Phone Reservations: (480) 789-5300
Mention IMAPS or IMAPS Device Packaging when booking by phone

IMAPS recommends another area hotel for those unable to get a room at WeKoPa Resort:

Comfort Inn
http://www.comfortinn.com/hotel-fountain_hills-arizona-AZ014
It is 3 miles away down Shea Blvd.

Hotel Scams Alert!
All reservations should be made directly with the hotel and within the IMAPS room block. We are not using a housing company. If any person or firm contacts you and offers to handle your reservations, please beware. They are completely unauthorized and possibly fraudulent. The convention industry is currently plagued by such groups. If you use one of them and experience any problems, including lost deposits and no reservation when you arrive, IMAPS may not be able to assist you. Please be aware in particular of one of these unauthorized firms – Exhibition Housing Services – whose salespeople have falsely claimed to be calling from IMAPS.

The only way to book a room in the official IMAPS Housing Block using the reservations information above.



Speaker Dates/Information:

  • Abstracts Deadline Extended: December 5, 2014
  • Speaker Notification Emails: January 14, 2015
  • Extended Abstract or Abstract Book Materials due: February 13, 2015
  • Hotel Reservation Deadline: February 17, 2015
  • Early Registration Deadline: February 17, 2015
  • Speaker Bios Due: March 1, 2015
  • Powerpoint/Presentation file for CD-Rom due not later than: March 19, 2014 (Last day of Conference)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A) - Keynotes: 45 minutes (40 to present; 5 for Q&A)

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All session presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.


Device Packaging/GBC Sponsors

Premier Sponsor:
DPC/GBC Premier Sponsor: VEECO

Premier Sponsor:

Golf Hole Sponsor: Amkor Technology

Premier Sponsor:
DPC/GBC Premier Sponsor: ASE US, Inc.

Corporate Sponsors

SPTS - Corporate Sponsor

Mentor Graphics - Corporate Sponsor
Event Sponsors
Sponsor - Badge Lanyards:
Hole Sponsor: NAMICS
Sponsor - GBC Speaker Dinner:
Kyocera - GBC Speaker Dinner Sponsor
Poster Session "Happy Hour":
Sponsor: Lam Research

Sponsor - Lunches:
Applied Materials - Event Sponsor

Sponsor - Evening Sessions:
EV Group - Evening Sessions Sponsor
Sponsor - Lunches:
Protavic - Event Sponsor
Sponsor - Refreshment Breaks:
MRSI - Break Sponsor
Sponsor - Refreshment Breaks:
i3 Electronics - Refreshment Break Sponsor
Sponsor - Refreshment Breaks:
ASM Pacific - Refreshment Break Sponsor
Sponsor - Mobile Charging Station:
Technic - Sponsor - Mobile Charging Station
Sponsor - Bag Insert/Giveaway:
Ubotic - Insert/Giveaway Sponsor
Sponsor - Bag Insert/Giveaway:
ALLVIA - Insert/Giveaway Sponsor
Sponsor - Bag Insert/Giveaway:
STATSChipPAC - Bag Insert/Giveaway Sponsor
sponsorships
available
   
Golf/Foundation Sponsors

"Eagle" Sponsor (3 holes):
DPC/GBC Premier Sponsor: VEECO

"Eagle" Sponsor (3 holes):
DPC/GBC Premier Sponsor: ASE US, Inc.

"Birdie" Sponsor (1 hole):

Golf Hole Sponsor: Amkor Technology
Hole Sponsor:
Hole Sponsor: NAMICS
Hole Sponsor:
Ubotic - Insert/Giveaway Sponsor
Hole Sponsor:
Golf Hole Sponsor: Coining Inc/Ametek
Hole Sponsor:
Golf Hole Sponsor: AGC Electronics America
Hole Sponsor:
ASM Pacific - Hole Sponsor

Hole Sponsor:
Golf Hole Sponsor: Infinite Graphics

Hole Sponsor:
Golf Hole Sponsor: PUTTIST, 3-Putt Killer

Hole Sponsor:
Golf Hole Sponsor: Dixon Golf

2 hole sponsorships
available
Media Sponsors
Media Sponsor: MEMS Journal
Media Sponsor: Semiconductor Packaging News
Media Sponsor: Chip Scale Review
Media Sponsor: MEPTEC
Media Sponsor: Webcom - Antenna Systems & Technology
Media Sponsor: Webcom - Electronics Protection
Media Sponsor: Webcom - Thermal News
3D Incites - Media Sponsor


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • GaN Systems
  • Honeywell
  • Indium
  • Isola Group
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NEO Tech
  • NGK NTK
  • Palomar
  • Plexus
  • Qualcomm
  • Specialty Coating Systems