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IMAPS Empire Chapter

Summer Technical Symposium

Wednesday, June 3, 2009
Begins at 10:00am
Holiday Inn, Syracuse – Liverpool (Turnpike Exit 37)

Please join us for lunch and technical presentations

Registration closed Monday, June 1 at 5pm EDT


Program:

Program Chair - Mike Laing of Avid Associates

10:00 Registration and Sign-in

10:30 Welcome, Self-introductions, and Opening Remarks

10:45 Don Hazelmyer, President of Dynamic Hybrids, Inc.
“High reliability and high power packaging.”

11:15 Frank Egitto, Senior Advisory Technologist at Endicott Interconnect
“Thin Film, Flexible Intravascular Ultrasound Catheter Device with Fine-Pitch Soldered Flip Chip Interconnect ”

11:45 Lunch

12:30 Patrick O’Gorman, Senior Director at MRI Network
“Market Overview and Employment Trends.”

1:00 Charles Woychik, Senior Scientist at GE Global Research
“An Update of Packaging Cd-Zn-Te (CZT) Detectors.”

1:30 Closing Remarks
Event wrap-up, Next event in Buffalo, Chapter leadership. . .


Registration:

RSVP before Monday, June 1 at 5pm EDT

Cost:
IMAPS members - $ 20.00.  Non-members - $ 25.00.  Students – $ 5.00
Includes lunch, refreshments and meeting.

Tabletop space is available for four organizations for $50.00.
Please reserve on-line or contact Steve Greene at 202-548-8711 to reserve a spot -- first-paid is first served.

Event Location:

Holiday Inn, Syracuse – Liverpool (Turnpike Exit 37)
441 Electronics Parkway, Liverpool, NY 13088





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IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001