Advanced Technology
Workshop on
Reliability of Advanced Electronic Packages and Devices in Extreme
Cold Environments
pdf of Program
Hilton Pasadena
168 South Los Robles Avenue
Pasadena, CA 91101
P: 626-577-1000
www.pasadena.hilton.com
February 21 - 23, 2005
Sponsored by:
International Microelectronics And Packaging Society (IMAPS)
Everything in electronics between the chip and the system!
General Chair:
Dr. Rajeshuni Ramesham
Jet Propulsion Laboratory/NASA, California Institute of Technology
Phone: 818-354-7190
E-mail: Rajeshuni.Ramesham@jpl.nasa.gov
Technical Chairs:
Dr. F. Patrick McCluskey
University of Maryland
Phone: 301-405-0279
E-mail: mcclupa@eng.umd.edu
&
Dr. R. Wayne Johnson
Auburn University
Phone: 334-844-1880
E-mail: johnson@eng.auburn.edu
&
Mr. Patrick Plancke
European Space Agency (ESA)
Phone: 31-71-565-3693
E-mail: patrick.plancke@esa.int
Workshop Overview:
The objective
of this Advanced Technology Workshop (ATW) is to have a unique forum that
brings together scientists, engineers, space agencies
and academia who have been working in the area of advanced
electronic package reliability and electronic device reliability in extreme
cold
temperature environments. Studies in extreme environments are
extended beyond nominal operating temperature regimes. Validation of the
electronic
packages assembled with various electronic parts over a wide
temperature range to infuse into the future space missions is of significant
value
for space applications. The other goal of this ATW is to expedite
the infusion of cutting-edge technology into present and future NASA projects,
missions, and science instruments. This ATW is partially providing
the
mechanism to create an international network of electronics
developers and systems designers by bringing together representatives from
academia
and the space agencies. This workshop covers active and passive
devices, circuits/systems, advanced packaging, and reliability under extreme
cold
temperature environments. This is the first time this workshop
is being organized in the USA since there is a significant interest for NASA
and
other space agencies in the missions to Mars, Moon, Jupiter
Icy Moons, and beyond.
Monday, February 21
Registration: Noon – 6:30 pm
Welcome Remarks: 1 pm – 1:30 pm
Workshop Chairs
SESSION 1: ACTIVE & PASSIVE
DEVICES
Session Chairs: Richard Patterson, NASA Glenn Research Center; Richard
Ulrich, University of Arkansas
1:30 pm – 5 pm
SiGe Semiconductor Devices for Cryogenic Power Electronics - III
R. R. Ward, W. J. Dawson, L. Zhu, R. K. Kirschman, G. Niu, R. M.
Nelms, O. Mueller, M. J. Hennessy, E. K. Mueller, R. L. Patterson, J.
E. Dickman, A. Hammoud, GPD Optoelectronics Corp.
Reverse-Bias Degradation of SiGe Transistors at Normal and Cryogenic Temperatures
Alexander Teverovsky, Ashok Sharma, Jeffrey Piepmeier, QSS Group,
Inc.
Reliability, Performance and Standardization Issues in Embedded Passives
in Extreme Temperature Conditions
Richard K. Ulrich, Leonard Schaper, University of Arkansas
Break: 3 pm – 3:30 pm
Issues and Experiences with Cold Temperature Testing of COTS PEM
Michael A. Sandor, Shri G. Agarwal, Jet Propulsion Laboratory
Performance of LTCC Resistors in Extreme Cold Environment
Michail Moroz, Ferro Electronic Material Systems
Package Qual and Reliability for Extreme Environment
Reza Ghaffarian, Jet Propulsion Laboratory-NASA-CIT
Lightweight Osprey CE Alloys for use in Cryogenic Packaging Applications
Andrew
J. W. Ogilvy, Alan G. Leatham, Sandvik Osprey; Stu Weinshanker, Advanced
Packaging Associates
Reception: 5:15 pm – 6
pm
Tuesday, February 22
Registration: 7 am – 6 pm
Continental Breakfast: 7 am – 8
am
KEYNOTE PRESENTATION:
8 AM – 8:45 AM
TITLE: RECONFIGURATION OF ANALOG ELECTRONICS FOR EXTREME ENVIRONMENTS:
PROBLEM OR SOLUTION?
SPEAKER: ADRIAN STOICA, JET PROPULSION LABORATORY
SESSION 2:
CIRCUITS/SYSTEMS
Session Chairs: Patrick Plancke, European Space Agency (ESA); Richard
Patterson, NASA Glenn Research Center
8:45 am – 12:15 pm
Operation of a Boost Converter in an Extreme Cold Environment
R. M. Nelms, Dake He, Calvin Cutshaw, Auburn University
Cryogenic Electronics for Space Applications
Richard L. Patterson, NASA Glenn Research Center; Ahmad Hammoud,
QSS Group Inc.; Malik Elbuluk, University of Akron
MCM ERC32SC Integrated SPARC Computer Core
Isaac Parrondo, Christian Boléat, Jean-François Coldefy,
EADS Astrium
Break: 10:15 am – 10:45 am
Asynchronous Logic for Cryogenic Applications
Rajit Manohar, Cornell University
Analog & Digital Electronics for Deep Space Cryogenic
Power Systems
V. J. Kapoor, A. J. Menezes, University of Toledo; R. L. Patterson,
J. E. Dickman, A. Hammoud, NASA Glenn Research Center
Power Electronic Components and Circuits for Deep Space Missions
Malik Elbuluk, University of Akron; Ahmad Hammoud, Richard Patterson,
NASA Glenn Research Center
Lunch: 12:15 pm – 1:30 pm
KEYNOTE PRESENTATION:
12:45 PM – 1:15
PM
TITLE: EXPLORING THE OUTER SOLAR SYSTEM
SPEAKER: DR. JAMES A. CUTTS, JET PROPULSION LABORATORY
SESSION 3: ADVANCED PACKAGING
Session Chairs: F. Patrick McCluskey, University of Maryland; Phillip
Zulueta, Jet Propulsion Laboratory/NASA
1:30 pm – 5:15 pm
KEYNOTE PRESENTATION:
1:30 PM – 2:15 PM
TITLE: USING SIGE HBTS FOR ELECTRONICS APPLICATIONS OPERATING AT
CRYOGENIC TEMPERATURES
SPEAKER: JOHN CRESSLER, GEORGIA INSTITUTE OF TECHNOLOGY
High Density High Speed Flex Interconnect System for Cryogenic Multi-GHz
Electronics
Thomas Tighe, G. Akerling, A. D. Smith, Northrop Grumman Corporation
Packaging Stress Characterization at Low Temperatures
Jeffrey C. Suhling, M. Kaysar Rahim, M. Saiful Islam, Richard C.
Jaeger, Pradeep Lall, Auburn University
Break: 3:15 pm – 3:45 pm
Packaging Development for Cryogenic Power Electronics
Hua Ye, Pradeep Haldar, Harry Efstathiadis, Rashi Garg, Albany NanoTech,
SUNY at Albany
Workmanship and Assembly Process Issues that Impact Reliability in Electronics
for Extreme Cold Environments
Don Schatzel, Jet Propulsion Laboratory
Reliability of High Density Electronics Hybridized through Interconnect
Bonding by Microwave Assembly Techniques
Nasser Budraa, Boon Ng, Daniel Wang, Syed Ahsan, Yu Zhang, John Mai,
Microwave Bonding Instruments
Dinner: 5:30 pm – 6:30 pm
Dinner Speaker:
6:15 pm – 7
pm
The Design of Mars Exploration Rovers
Dr. Gary R Burke, Jet Propulsion Laboratory
Wednesday, February 23
Registration: 7 am – noon
Continental Breakfast: 7 am – 8
am
SESSION 4: RELIABILITY
Session Chairs: R. Wayne Johnson, Auburn University; F. Patrick McCluskey,
University of Maryland
8 am - 12:30 pm
KEYNOTE PRESENTATION:
8 AM – 8:45
AM
TITLE: APPLICATIONS OF HIGH TEMPERATURE SUPERCONDUCTORS - A STATUS
REPORT
SPEAKER: STEINAR J. DALE, PhD, FLORIDA STATE UNIVERSITY
Integration and Qualification of the Cold Readout Electronics Flight Assemblies
for the Ge:Ga Detectors in the Herschel/PACS Instrument
Chris Van Hoof, Patrick Merken, Tim Souverijns, Jan Putzeys, Ybe
Creten, IMEC
Extreme Environment Testing for Miniaturized Systems
Patrick Plancke, Jean-Luc Josset , Stephabe Beauvivre, European Space
Agency (ESA)
Reliability Assessment of COB Technology for Mars Mission
Sharon Ling, Johns Hopkins University – APL
Passive Components for Lunar and Martian Exploration
R. Wayne Johnson, Julia Gornto, Tye Green, William Symon, Auburn
University
Break: 10:45 am – 11:00
am
Reliability Assessment of Advanced Flip-Chip Interconnect Electronic Package
Assemblies under Extreme Cold Temperatures (-190oC and -120oC)
Rajeshuni Ramesham, Reza Ghaffarian, Andrew Shapiro, Jet Propulsion
Laboratory; Phil A. Napala, Patrick A. Martin, NASA
Extreme Environment Tests on Micro-Cameras for the Rosetta Lander
Patrick Plancke, Jean-Luc Josset, Stephave Beauvivre, European Space
Agency (ESA)
Power Module Reliability at Extreme Cold
F. Patrick McCluskey, K. Meyyappan, K. Ghosh, L. Everhart, University
of Maryland
Closing Remarks: 12:30 pm
Workshop Chair
Hotel Information
Hotel Cutoff is January 21, 2005
Housing
accommodations must be made directly to:
Hilton Pasadena
168 South Los Robles Avenue
Pasadena, CA 91101
P: 626-577-1000
www.pasadena.hilton.com
When making reservations, please reference
IMAPS.
Single/Double: $139/night
Hilton Pasadena requires a deposit for the
first night's room and tax to hold your room. Deposit refunded
if reservation is cancelled fourteen (14) days prior to arrival;
afterwhich deposit is non-refundable.
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