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Advanced Technology Workshop on
Reliability of Advanced Electronic Packages and Devices in Extreme Cold Environments
pdf of Program

Hilton Pasadena
168 South Los Robles Avenue
Pasadena, CA 91101
P: 626-577-1000
www.pasadena.hilton.com
February 21 - 23, 2005

Sponsored by:
International Microelectronics And Packaging Society (IMAPS)
Everything in electronics between the chip and the system!

General Chair:
Dr. Rajeshuni Ramesham
Jet Propulsion Laboratory/NASA, California Institute of Technology
Phone: 818-354-7190
E-mail: Rajeshuni.Ramesham@jpl.nasa.gov

Technical Chairs:
Dr. F. Patrick McCluskey
University of Maryland
Phone: 301-405-0279
E-mail: mcclupa@eng.umd.edu
&
Dr. R. Wayne Johnson
Auburn University
Phone: 334-844-1880
E-mail: johnson@eng.auburn.edu
&
Mr. Patrick Plancke
European Space Agency (ESA)
Phone: 31-71-565-3693
E-mail: patrick.plancke@esa.int



Workshop Overview:

The objective of this Advanced Technology Workshop (ATW) is to have a unique forum that brings together scientists, engineers, space agencies and academia who have been working in the area of advanced electronic package reliability and electronic device reliability in extreme cold temperature environments. Studies in extreme environments are extended beyond nominal operating temperature regimes. Validation of the electronic packages assembled with various electronic parts over a wide temperature range to infuse into the future space missions is of significant value for space applications. The other goal of this ATW is to expedite the infusion of cutting-edge technology into present and future NASA projects, missions, and science instruments. This ATW is partially providing the mechanism to create an international network of electronics developers and systems designers by bringing together representatives from academia and the space agencies. This workshop covers active and passive devices, circuits/systems, advanced packaging, and reliability under extreme cold temperature environments. This is the first time this workshop is being organized in the USA since there is a significant interest for NASA and other space agencies in the missions to Mars, Moon, Jupiter Icy Moons, and beyond.


Monday, February 21

Registration: Noon – 6:30 pm

Welcome Remarks: 1 pm – 1:30 pm
Workshop Chairs

SESSION 1: ACTIVE & PASSIVE DEVICES
Session Chairs: Richard Patterson, NASA Glenn Research Center; Richard Ulrich, University of Arkansas
1:30 pm – 5 pm

SiGe Semiconductor Devices for Cryogenic Power Electronics - III
R. R. Ward, W. J. Dawson, L. Zhu, R. K. Kirschman, G. Niu, R. M. Nelms, O. Mueller, M. J. Hennessy, E. K. Mueller, R. L. Patterson, J. E. Dickman, A. Hammoud, GPD Optoelectronics Corp.

Reverse-Bias Degradation of SiGe Transistors at Normal and Cryogenic Temperatures
Alexander Teverovsky, Ashok Sharma, Jeffrey Piepmeier, QSS Group, Inc.

Reliability, Performance and Standardization Issues in Embedded Passives in Extreme Temperature Conditions
Richard K. Ulrich, Leonard Schaper, University of Arkansas

Break: 3 pm – 3:30 pm

Issues and Experiences with Cold Temperature Testing of COTS PEM
Michael A. Sandor, Shri G. Agarwal, Jet Propulsion Laboratory

Performance of LTCC Resistors in Extreme Cold Environment
Michail Moroz, Ferro Electronic Material Systems

Package Qual and Reliability for Extreme Environment
Reza Ghaffarian, Jet Propulsion Laboratory-NASA-CIT

Lightweight Osprey CE Alloys for use in Cryogenic Packaging Applications
Andrew J. W. Ogilvy, Alan G. Leatham, Sandvik Osprey; Stu Weinshanker, Advanced Packaging Associates

Reception: 5:15 pm – 6 pm


Tuesday, February 22

Registration: 7 am – 6 pm

Continental Breakfast: 7 am – 8 am

KEYNOTE PRESENTATION: 8 AM – 8:45 AM
TITLE: RECONFIGURATION OF ANALOG ELECTRONICS FOR EXTREME ENVIRONMENTS: PROBLEM OR SOLUTION?
SPEAKER: ADRIAN STOICA, JET PROPULSION LABORATORY

SESSION 2: CIRCUITS/SYSTEMS
Session Chairs: Patrick Plancke, European Space Agency (ESA); Richard Patterson, NASA Glenn Research Center
8:45 am – 12:15 pm

Operation of a Boost Converter in an Extreme Cold Environment
R. M. Nelms, Dake He, Calvin Cutshaw, Auburn University

Cryogenic Electronics for Space Applications
Richard L. Patterson, NASA Glenn Research Center; Ahmad Hammoud, QSS Group Inc.; Malik Elbuluk, University of Akron

MCM ERC32SC Integrated SPARC Computer Core
Isaac Parrondo, Christian Boléat, Jean-François Coldefy, EADS Astrium

Break: 10:15 am – 10:45 am

Asynchronous Logic for Cryogenic Applications
Rajit Manohar, Cornell University

Analog & Digital Electronics for Deep Space Cryogenic Power Systems
V. J. Kapoor, A. J. Menezes, University of Toledo; R. L. Patterson, J. E. Dickman, A. Hammoud, NASA Glenn Research Center

Power Electronic Components and Circuits for Deep Space Missions
Malik Elbuluk, University of Akron; Ahmad Hammoud, Richard Patterson, NASA Glenn Research Center

Lunch: 12:15 pm – 1:30 pm

KEYNOTE PRESENTATION: 12:45 PM – 1:15 PM
TITLE: EXPLORING THE OUTER SOLAR SYSTEM

SPEAKER: DR. JAMES A. CUTTS, JET PROPULSION LABORATORY

SESSION 3: ADVANCED PACKAGING
Session Chairs: F. Patrick McCluskey, University of Maryland; Phillip Zulueta, Jet Propulsion Laboratory/NASA
1:30 pm – 5:15 pm

KEYNOTE PRESENTATION: 1:30 PM – 2:15 PM
TITLE: USING SIGE HBTS FOR ELECTRONICS APPLICATIONS OPERATING AT CRYOGENIC TEMPERATURES
SPEAKER: JOHN CRESSLER, GEORGIA INSTITUTE OF TECHNOLOGY

High Density High Speed Flex Interconnect System for Cryogenic Multi-GHz Electronics
Thomas Tighe, G. Akerling, A. D. Smith, Northrop Grumman Corporation

Packaging Stress Characterization at Low Temperatures
Jeffrey C. Suhling, M. Kaysar Rahim, M. Saiful Islam, Richard C. Jaeger, Pradeep Lall, Auburn University

Break: 3:15 pm – 3:45 pm

Packaging Development for Cryogenic Power Electronics
Hua Ye, Pradeep Haldar, Harry Efstathiadis, Rashi Garg, Albany NanoTech, SUNY at Albany

Workmanship and Assembly Process Issues that Impact Reliability in Electronics for Extreme Cold Environments
Don Schatzel, Jet Propulsion Laboratory

Reliability of High Density Electronics Hybridized through Interconnect Bonding by Microwave Assembly Techniques
Nasser Budraa, Boon Ng, Daniel Wang, Syed Ahsan, Yu Zhang, John Mai, Microwave Bonding Instruments

Dinner: 5:30 pm – 6:30 pm

Dinner Speaker: 6:15 pm – 7 pm
The Design of Mars Exploration Rovers
Dr. Gary R Burke, Jet Propulsion Laboratory

Wednesday, February 23

Registration: 7 am – noon

Continental Breakfast: 7 am – 8 am

SESSION 4: RELIABILITY
Session Chairs: R. Wayne Johnson, Auburn University; F. Patrick McCluskey, University of Maryland
8 am - 12:30 pm

KEYNOTE PRESENTATION: 8 AM – 8:45 AM
TITLE: APPLICATIONS OF HIGH TEMPERATURE SUPERCONDUCTORS - A STATUS REPORT

SPEAKER: STEINAR J. DALE, PhD, FLORIDA STATE UNIVERSITY

Integration and Qualification of the Cold Readout Electronics Flight Assemblies for the Ge:Ga Detectors in the Herschel/PACS Instrument
Chris Van Hoof, Patrick Merken, Tim Souverijns, Jan Putzeys, Ybe Creten, IMEC

Extreme Environment Testing for Miniaturized Systems
Patrick Plancke, Jean-Luc Josset , Stephabe Beauvivre, European Space Agency (ESA)

Reliability Assessment of COB Technology for Mars Mission
Sharon Ling, Johns Hopkins University – APL

Passive Components for Lunar and Martian Exploration
R. Wayne Johnson, Julia Gornto, Tye Green, William Symon, Auburn University

Break: 10:45 am – 11:00 am

Reliability Assessment of Advanced Flip-Chip Interconnect Electronic Package Assemblies under Extreme Cold Temperatures (-190oC and -120oC)
Rajeshuni Ramesham, Reza Ghaffarian, Andrew Shapiro, Jet Propulsion Laboratory; Phil A. Napala, Patrick A. Martin, NASA

Extreme Environment Tests on Micro-Cameras for the Rosetta Lander
Patrick Plancke, Jean-Luc Josset, Stephave Beauvivre, European Space Agency (ESA)

Power Module Reliability at Extreme Cold
F. Patrick McCluskey, K. Meyyappan, K. Ghosh, L. Everhart, University of Maryland

Closing Remarks: 12:30 pm
Workshop Chair


Hotel Information

Hotel Cutoff is January 21, 2005
Housing accommodations must be made directly to:

Hilton Pasadena
168 South Los Robles Avenue
Pasadena, CA 91101
P: 626-577-1000
www.pasadena.hilton.com

When making reservations, please reference IMAPS.

Single/Double: $139/night

Hilton Pasadena requires a deposit for the first night's room and tax to hold your room. Deposit refunded if reservation is cancelled fourteen (14) days prior to arrival; afterwhich deposit is non-refundable.


 




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