Monday, June 20, 2005
Registration Hours: 11:30 am – 5 pm
Professional Development
Course (1/2 Day) – PDC1
Flip Chip and CSP Technologies – Constructions, Materials, Assembly
and Reliability
1 pm – 5 pm
Instructor: R. Wayne Johnson, Auburn University
Course Description:
Flip chip use is growing in both flip chip-in-package and flip chip-on-laminate
applications. This course will provide insight into the design and assembly
of electronics using flip chip devices. The practical issues of implementing
flip chip technology from wafer bumping to reliability characterization
are covered. This course will begin with an examination of bumping options
and corresponding design rules. Redistribution will also be discussed.
Substrate requirements for flip chip will then be presented including
a discussion of high density interconnect options and substrate design.
Assembly of flip chip devices adds materials and processes to the standard
SMT assembly process and the integration of these into the SMT process
flow is examined. Materials and processes to be discussed include lead
free alloys, fluxes, underfills (capillary flow, fluxing no-flow, and
wafer applied), substrate dehydration, flux and underfill application,
underfill curing, inspection, and underfill characterization techniques.
The presentation will conclude with a discussion of flip chip assembly
reliability testing, test vehicle design and failure analysis.
Lecture Syllabus:
1. Introduction to Flip Chip
2. Flip Chip Bumping
3. Substrates and Substrate Design
4. Assembly
a. Flux Application
b. Placement
c. Reflow
5. Underfill
a. Capillary
b. Fluxing
i. Placement Optimization
c. Wafer Applied
d. Transfer Molded
6. Reliability and Failure Analysis
Who should attend?
This Workshop is intended for those individuals soon to be responsible
for implementing flip chip assembly, suppliers of materials and equipment
for flip chip assembly and others interested in flip chip implementation.
The Instructor:
Dr. Wayne Johnson is a Professor of Electrical Engineering
at Auburn University and Director of the Laboratory for Electronics Assembly
and
Packaging (LEAP). At Auburn, he has established teaching and
research laboratories for advanced packaging and electronics assembly.
Research
efforts are focused on materials, processing, and reliability
for advanced SMT, wire bond and flip chip assembly. He has published
and presented
numerous papers at workshops and conferences and in technical
journals on flip chip assembly. He received the 1997 Auburn Alumni Engineering
Council Senior Faculty Research Award for his work in electronics
packaging
and assembly.
Dr. Johnson is currently the Technical
Vice President of the International Microelectronics and Packaging
Society. He was the 1991 President of the
International Society for Hybrid Microelectronics (ISHM). He
received the 1993 John A. Wagnon,
Jr. Technical Achievement Award from ISHM, was named a Fellow of the Society
in 1994 and received the Daniel C. Hughes Memorial Award in 1997. He is
also a member SMTA and IPC and a Fellow of IEEE.
Dr. Johnson received
the B.E. and M.Sc. degrees in 1979 and 1982 from Vanderbilt
University, Nashville, TN, and the Ph.D. degree in 1987 from Auburn
University,
Auburn, AL, all in electrical engineering. He has worked in the microelectronics
industry for DuPont, Eaton, and Amperex.
Professional Development
Course (1/2 Day) – PDC2
Introduction to Microelectronics Packaging Technology
1 pm – 5 pm
Instructor: Phil Creter, Creter & Associates
Course Description:
This course will provide an introduction to microelectronics packaging
technology for engineers, technicians and others involved in
manufacturing, processing, development, quality, sales and marketing.
Emphasis will
be on visual aids including actual samples and a variety of photos
and figures to provide the attendee with not only a solid base in how
various
microcircuits are made by various materials, processes and equipment
but also what they look like. The attendee will learn classic
hybrid definitions as well as current state of the art terminology
of materials,
processes and equipment, including: thick film technology, thin
film technology and monolithic semiconductor technology; substrates
(ceramic,
conductors, dielectrics, co-fired, LTCC); components (passives,
actives, chips vs. discrete, SMT components and flip chip); assembly
including
details of die attach, wire bonding and micro soldering, rework & repair;
final assembly including details of visual inspection techniques,
test, and failure analysis. Also covered is design, documentation standards,
acronyms, list of symbols, clean rooms and handling techniques.
Video
clips highlight various microcircuit assembly processes. Included
in the course handout is an updated glossary and list of references
the
attendee will find invaluable.
Who should attend?
This course is designed for the attendee who has little initial familiarity
with Microelectronics Packaging engineering terminology but would like
to relate it to real life, everyday applications. Ideal for, entry level
technicians and engineers but also for people in quality assurance, sales,
marketing, purchasing, safety, administration and program management.
Emphasis will be on visual aids.
The Instructor:
Phil Creter is a long-time member of IMAPS, having joined
the New England Chapter of ISHM in 1974. He is a Fellow of the Society,
and has been elected National Treasurer and President of the
New England
Chapter
(twice). He received a BS in Chemistry from Suffolk University
and has published numerous papers, holds a U.S. patent, has made
many technical
presentations (received Best Paper of Session award IMAPS 1998)
and has chaired several technical sessions. He is currently a
consultant (Creter & Associates)
and has over 30 years of microelectronics packaging experience
at Polymer Flip Chip Corporation, Mini-Systems, GTE and Itek
Corporation. His past
positions include GTE Microelectronics Center Manager, Process
Engineering Manager, Process Development Manager, Materials Engineering
Manager and
Manufacturing Engineer. He currently teaches professional development
courses at microelectronics events and is a certified instructor
for the Department of Homeland Security.
Tuesday, June 21
Registration Hours: 8 am – 6:30 pm
Exhibit Hours: 10 am – 6:30 pm
Welcome Reception in the Exhibit Hall: 5 pm – 6:30
pm
Session 1: Plenary Marketing
8:30 am – 11:30 am
Chair: Andrew J.G. Strandjord, FlipChip International
Market Expectations for Flip Chip and Wafer Level Packages: High Growth
Prospects
E. Jan Vardaman, TechSearch International, Inc.
Emerging Wafer Level Technologies, Looking Beyond WLCSPs
Ted Tessier, STATSChipPAC Inc.
Alpha Particle Concerns in Wafer Level Packages
Glenn A. Rinne, P. Chilikuri, Unitive Electronics, Inc.
Break in Exhibit Hall: 10 am – 10:30
am
The Worldwide IC Packaging Market
Sandra Winkler, Electronic Trend Publications
Tensile Deformation of WLCSP and Flip Chip Solder Joints
Robert Darveaux, Amkor Technology / Arizona State University - East
Lunch in Exhibit Hall: Noon – 1 pm
Session 2: Fabrication Processes and Systems Integration
1 pm – 4:30 pm
Chairs: Thorsten Teutsch, PacTech USA - Packaging Technologies, Inc.;
Haluk Balkan, FlipChip International, LLC
Design Guidelines for Fine Pitch Flip Chip Production
Haluk Balkan, Jacinta Aman Lim, Dan Berry, Guy Burgess, FlipChip
International, LLC
Lead Free SiP Wireless Modules Fabricated with Flip Chips on Silicon Integrated
Passive Device Substrate
Yinon Degani, SyChip Inc.
Chemical Resistance of Polyimide Passivations in Wafer-Level Photoresist
Stripping Processes
Raymond Chan, Diane Scheele, Dynaloy, LLC; Thomas Goodman, E&G Technical
Partners
Break in Exhibit Hall: 2:30 – 3 pm
Fine Pitch Solder Stencil Printing using Low Cost Electroless Ni/Au UBM
for Memory Devices
Thorsten Teutsch, A. Scheffler, E. Zakel, PacTech USA - Packaging
Technologies, Inc.; Carlo Gamboa, Bo Chang, Cypress Semiconductor
Standards for the Procurement and use of Die Devices
Mike Roughton, Donald Radley, Ken Ball, Alun Jones, MGR Consultants/ENCAST
C4NP: New Solder Bumping Technology - Low Cost & Lead Free
Klaus Ruhmer, SUSS MicroTec, Inc.; Dietrich Toennies, SUSS MicroTec – Germany;
Emmett Hughlett, Peter Gruber, IBM TJ Watson Research Center; Patrick
O'Leary, IBM Microelectronics Division
Welcome Reception in the Exhibit Hall: 5 pm – 6:30
pm
Wednesday, June 22
Registration Hours: 7:30 am – 4:30 pm
Session 3: Gold Bumping Technologies
8 am – 11:30 am
Chairs: Daniel D. Evans, Jr. Palomar Technologies Inc.; Jamin Ling,
Kulicke & Soffa Industries Inc.
Flip Chip Type Camera Module Package for Mobile Phones with Low Cost Electro-Less
Nickel/Gold Bump
J. K. Lyu, J.-D. Kim, Samsung Techwin Co., Ltd.
An Innovative Approach to Low Cost, High Performance, Lead-Free DCA
Elwyn Wakefield, Micro-Design; George A. Riley, FlipChips Dot Com
Low Profile Flat Top Ball Bumps for Next Generation 1st Level Interconnect
Daniel D. Evans, Jr., Palomar Technologies, Inc.
Break: 9:30 am – 10 am
Gold Bump Formation by High Speed Noncyanide Gold Electroplating
Bill Wu, Zhen Liu, Arthur Keigler, NEXX Systems
The Theken Disc - A Medical Marvel Description of the Theken Disc as Manufactured
by Valtronic USA, Inc.
Donald Styblo, Valtronic USA; Rich Remer, Theken Disc
Stud Bumping – An Alternative Bumping Strategy
Jamin Ling, Matt Meyer, Matt Osborne, Vincent McTaggart, Kulicke & Soffa
Industries Inc.
Lunch: 11:30 am – 12:30 pm
Session 4: New Developments in Lead Free Solders
1 pm – 4:30 pm
Chairs: Glenn A. Rinne, Unitive Electronics, Inc.; Robert Darveaux,
Amkor Technology
Local Creep and Fatigue in SnAg3.8Cu0.7 Solder
Pascal P. Jud, Guenter Grossmann, Urs Sennhauser, EMPA
Electroplating Tin-Silver Solder Bumps for Wafer Level Packaging
Jim (Zhongqin) Zhang, Zhen Liu, Arthur Keigler, NEXX Systems
Development of Lead-Free Flip Chip Packages with Sn-Cu Bumps
Don Son Jiang, L. J. Chen, Y. P. Wang, C. S. Hsiao, Siliconware Precision
Industries Co., Ltd.
Break: 2:30 pm – 3 pm
Total Packaging Solution for Low K Device/Pd Free Bump
Mitsuo Sugino, Sumitomo Bakelite Co., Ltd.
Electrodeposition of Eutectic Gold-Tin Alloy for Microelectronic Applications
George Hradil, Edward Hradil, Hana Hradil, Technic Inc.
Tin Pest in Pb-Free Solders
Glenn A. Rinne, Unitive Electronics, Inc.
Thursday, June 23
Registration Hours: 7:30 am – 3:30 pm
Session 5: Reliability (Design, Testing, and Modeling)
8 am – 11:30 am
Chairs: Daniel F. Baldwin, Engent Inc.; Theodore G. Tessier, STATSChipPAC
Inc.
Thermal Design for Power CSP Packages
Dennis Lang, Fairchild Semiconductor
Land Grid Array (LGA) as a Pb-Free Approach for Ceramic Ball Grid Array
Packages
Joachim Rayos, Linda Bal, Thomas Koschmieder, Terry Burnette, Freescale
Semiconductor, Inc.
Intermetallic Compound Formation in Flip Chip Solder Bump and Its Impact
to Product Reliability
Hong Yang, Joe Patterson, Francois Guindon, Applied Micro Circuits
Corporation
Break: 9:30 am – 10 am
Thermo-Mechanical Modeling for DOE Analysis of Over-Molded Flip-Chip Packages
Yu Gu, Mohsen Haji-Rahim, Daniel Jin, RF Micro Devices
FlipChip BGA Bump & Board Level Reliability: Power & Thermal Cycling
Compared
Abu Eghan, Hoa Do, Leilei Zheng, Lan Hoang, Stephen Pan, Xilinx Inc.
In Situ Stress Analysis and Reliability Assessment of Flip Chip on Organic
Board using Power Cycling Techniques
Daniel F. Baldwin, Engent, Inc.; Jian Zhang, GE Global Research
Lunch: 11:30 am – 12:30 pm
Session 6: Under Fill Materials and Processes
1 pm – 3:30 pm
Chairs: Guy Burgess, Flip Chip International, LLC; R. Wayne Johnson,
Auburn University
Plasma Treatment of Pre-Underfill Flip Chip Devices
Jack Zhao, March Plasma Systems
Near Void Free Hybrid No-Flow Underfill Flip Chip Process Technology
Daniel F. Baldwin, Engent, Inc.; Michael Colella, Intel Corp.
Assembly and Reliability of Lead-free Flip Chip Devices with a Nanofilled
No-flow Underfill Material
Ananth Prabhakumar, Donald Buckley, Arun Chaudhuri, Frank Stepniak,
Paul Gillespie, Ryan Mills, Slawomir Rubinsztajn, Sandeep Tonapi, General
Electric Global Research Center
Low Void Solder Paste for Flip Chip Applications
Guy Burgess, Joan K. Vrtis, FlipChip International, LLC
Flux Compatibility Study on Flip Chip Underfills
Renzhe Zhao, Qing Ji,
George Carson, Michael Todd, Gary Shi, Henkel Corporation
