
GBC Spring 2007 Conference
(download
program as pdf)
March
18-19, 2007
Doubletree Paradise Valley Resort
Scottsdale, AZ
(immediately preceding and co-located with Device
Packaging 2007
$100 discount if attending both GBC and Device Packaging)
The Global
Business Council (GBC) is holding its Spring 2007 Conference in
sunny Scottsdale, AZ, on March 18 & 19, 2007. This GBC Conference
immediately precedes the IMAPS Device Packaging Conference, at the same
location. Invited speakers from
industry leaders and well-known market research companies, will share
with you where they see the opportunities and challenges in the microelectronics markets.
Several networking events are planned to allow
full interaction with your industry peers.
Sunday,
March 18, 2007
12:00 Noon – GBC Golf Tournament
(Bus leaves at 11:00 AM returns at 5:00 PM)
McCormick Ranch Golf Club -- Scottsdale, AZ
$150 per golfer
3:00
PM – Registration Opens
5:00
PM – Welcome
Reception and Dinner co-sponsored by The Microelectronics Foundation
6:30 PM - Keynote Address
Wall Street’s Perspective of the Growth in Semiconductors
Satya Chillara,
Senior Research Analyst, Pacific Growth Equities
Monday,
March 19, 2007
7:00
AM – Registration Opens
7:30
AM – Continental Breakfast
8:00
AM – Opening
Remarks
Laurie Roth, GBC Co-Chair |
8:15 AM
State-of-the-art Technology Integration
Trends and 3-D Wafer-Level Integration
Brandon Prior,
Prismark Partners
9:00 AM
iNEMI Roadmaps - A Blueprint for Industry Collaboration
Chuck Richardson, iNEMI
9:45 AM - Break
10:15 AM
DuPont’s Advanced Materials Pipeline for
the Device Packaging Industry
Phil Thomas, Global
Technology, DuPont Electronic Technologies
11:00 AM
Application Specific Packaging Trends and
Business Implications
Lee Smith, Amkor Technologies
12:00 noon - 1:00 PM - Lunch |
1:00 PM
Semiconductor Industry Update
Brian Matas, Vice President, IC Insights
1:45 PM
RF Devices
Mike Shields, Consultant
2:30 PM
Automotive Electronics: Do you have any business being there?
Randy Frank, Randy Frank & Associates
3:15 PM - Break
3:45
Current and Future Microelectronics Packaging for
Implantable Medical Devices
Peter C. Tortorici, Ph.D.,
Medtronic Microelectronics Center
4:30 - Closing Remarks & Adjourn |
GBC Attendees are invited to attend the Device
Packaging Welcome Reception
and Keynote Address.
Housing (Hotel
Cut-off is February 16, 2007)
Housing
Accommodations must be made directly to:
Doubletree
Paradise Valley Resort
5401 North Scottsdale Road
Scottsdale, AZ 85250
Ph: 877-445-6677
Single/Double - $199
Register On-line: http://doubletree.hilton.com/en/dt/groups/personalized/phxsjdt_ima/index.jhtml
Please reference IMAPS when making reservations by Phone.
Register
On-Line
|