GBC Spring 2007 Conference
(download program as pdf)

March 18-19, 2007
Doubletree Paradise Valley Resort
Scottsdale, AZ

(immediately preceding and co-located with Device Packaging 2007
$100 discount if attending both GBC and Device Packaging)


Register On-Line | Hotel

The Global Business Council (GBC) is holding its Spring 2007 Conference in sunny Scottsdale, AZ, on March 18 & 19, 2007. This GBC Conference immediately precedes the IMAPS Device Packaging Conference, at the same location. Invited speakers from industry leaders and well-known market research companies, will share with you where they see the opportunities and challenges in the microelectronics markets. Several networking events are planned to allow full interaction with your industry peers.

Sunday, March 18, 2007
12:00 Noon – GBC Golf Tournament
(Bus leaves at 11:00 AM returns at 5:00 PM)
McCormick Ranch Golf Club -- Scottsdale, AZ

$150 per golfer

3:00 PM – Registration Opens

5:00 PM – Welcome Reception and Dinner co-sponsored by The Microelectronics Foundation

6:30 PM - Keynote Address
Wall Street’s Perspective of the Growth in Semiconductors
Satya Chillara,
Senior Research Analyst, Pacific Growth Equities

Monday, March 19, 2007
7:00 AM – Registration Opens

7:30 AM – Continental Breakfast

8:00 AM – Opening Remarks
Laurie Roth, GBC Co-Chair

8:15 AM
State-of-the-art Technology Integration
Trends and 3-D Wafer-Level Integration

Brandon Prior, Prismark Partners

9:00 AM
iNEMI Roadmaps - A Blueprint for Industry Collaboration

Chuck Richardson, iNEMI

9:45 AM - Break

10:15 AM
DuPont’s Advanced Materials Pipeline for
the Device Packaging Industry

Phil Thomas, Global Technology, DuPont Electronic Technologies

11:00 AM
Application Specific Packaging Trends and
Business Implications

Lee Smith, Amkor Technologies

12:00 noon - 1:00 PM - Lunch

1:00 PM
Semiconductor Industry Update

Brian Matas, Vice President, IC Insights

1:45 PM
RF Devices

Mike Shields, Consultant

2:30 PM
Automotive Electronics: Do you have any business being there?

Randy Frank, Randy Frank & Associates

3:15 PM - Break

3:45
Current and Future Microelectronics Packaging for Implantable Medical Devices

Peter C. Tortorici, Ph.D., Medtronic Microelectronics Center

4:30 - Closing Remarks & Adjourn


GBC Attendees are invited to attend the Device Packaging Welcome Reception and Keynote Address.


Housing (Hotel Cut-off is February 16, 2007)
Housing Accommodations must be made directly to:

Doubletree Paradise Valley Resort
5401 North Scottsdale Road
Scottsdale, AZ 85250
Ph: 877-445-6677

Single/Double - $199

Register On-line: http://doubletree.hilton.com/en/dt/groups/personalized/phxsjdt_ima/index.jhtml
Please reference IMAPS when making reservations by Phone.

 

Register On-Line