GBC Spring 2008 Conference
Addressing Cost and Performance Driven Semiconductor Packaging
Challenges through the Supply Chain
program as pdf)
Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, AZ
(in conjunction with Device
Howard Imhof, Metalor Technologies USA, Director of Sales and Marketing
Greg Caswell, Vice President, Sales and Marketing, D2M Technologies
Gary Nicholls, OEM Marketing Manager, Cookson Electronics
Lee Smith, Senior Director of Business Development, Amkor Technology, Inc.
The GBC Spring 2008 Conference will address:
- What are the specific areas where assembly and packing cost needs to be addressed to enable the growth of the industry?
- Where are the applications where performance rather than cost is the absolute driver?
- What and where are the opportunities within the supply chain to meet these challenges and how many companies benefit from providing solutions?
Sunday March 16, 2008
12:00 Noon -- GBC Golf Outing. We-ko-pa Golf Course at the Ft. McDowell Radisson.
6:00 PM -- Registration Opens and Welcome Reception
Monday, March 17, 2008
All listed times are approximate.
7:00 AM -- Registration opens
7:00 AM - 8:00 AM -- Continental breakfast
8:00 AM - 5:00 PM -- Program
12:00 Noon -- Lunch
8:00 AM -- Opening Remarks and Keynote Address:
Opening Remarks by
Howard Imhof, Chair of the IMAPS Global Business Council
Director of Sales and Marketing, Metalor Technologies USA
Keynote address by
Bill Bottoms, Chief Executive Officer, NanoNexus
“The 10th Anniversary Edition of the International Technology Roadmap for Semiconductors.”
9:00 AM – 10:30 am -- Microelectronics Industry Overview:
Jim Walker, Vice President Research, Gartner/Dataquest
“Packaging the Supply Chain."
9:40 AM - Break
Dr. Conor Dullaghan
Vice President, Sales & Marketing, Metalor Technologies USA Advanced Coatings Division
"The Role of Precious Metals in Electronics & the Semiconductor Supply Chain - Past, Present, & Future."
Loren Lancaster, Managing Director, Core Capital, Electronics and Semiconductor Group,
“How M&A Activities Are Affecting the Supply Chain in the Electronic Packaging Industry.”
11:10 AM – 1:40 PM -- Cost Driven Challenges:
Steven J. Corbett, Chief Executive Officer, Cookson Electronics.
“How Do Materials and Process Suppliers Enable Next-generation Semiconductor Packaging While Addressing Ever Increasing Cost Pressures?”
12:00 Noon - Lunch
Lee Smith, Sr. Director, Business Development, Amkor Technology, Inc.
"Package Optimization for Cost Driven Applications."
1:40 PM – 3:50 PM -- Performance Driven Challenges:
Scottie Ginn, Vice President of Design Enablement and Packaging, IBM Systems and Technology Group
"Common Platform Alliance for Semiconductor Packaging Technology."
Robert Erich, Component Development Engineer, Medtronic Microelectronics Center
“Challenges for Adopting Standard IC Packaging Solutions for High Reliability Medical
3:00 PM - Break
Mark Dimke, Engineering Manager, Microelectronics Packaging, Sensor Systems, Rockwell Collins.
“Future Packaging Needs for High Reliability Microelectronics.”
3:50 PM – 4:50 PM -- Electronics Packaging in China:
Prof. Bi Keyun, President, China Electronics Packaging Society
"The Development of Semiconductor Packaging and Testing Industry of China”
4:50 Closing Remarks and Adjourn
5:00 – 7:00 Device Packaging Welcome Reception (beverages and light appetizers)
GBC Attendees are invited to attend the Device
Packaging Welcome Reception
and Keynote Address.
Cut-off is February 12, 2008)
Housing accommodations must be made directly to:
Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264
Rooms on hold March 15 – 20, 2008
For on-line reservations: www.radisson.com/ftmcdowellaz - promotional code - IMAPS1
For phone reservations: call (480) 789-5300 or (800) 333-3333 and mention IMAPS – Device Packaging Conference
Hotel availability and rates will not be guaranteed after February 12, 2008.