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IMAPS Global Business Council (GBC) - The Business Side of the Microelectronics Supply Chain

2009 Spring Conference
Supply Chain Development for 3D Packaging

March 8-9, 2009
Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, AZ

(in conjunction with Device Packaging 2009)

Lee Smith, Vice President of Business Development, Amkor Technology, Inc.
Dr. Jie Xue, Director Technology and Quality, Cisco Systems, Inc.

Sunday March 8, 2009
12:00 Noon -- GBC Golf Outing.
We-ko-pa Golf Course at the Ft. McDowell Radisson - 
Tee-time of optional golf outing - Cost is $200 and includes green fees, shuttle from hotel, and lunch.

6:00 - 7:00 PM -- Registration Opens and GBC Welcome Reception (Beverages and Appetizers)

Monday, March 9, 2009

7:00 AM - 5:00 PM -- Registration
7:00 AM - 8:00 AM -- Continental breakfast

8:00 AM - 9:00 AM -- Opening Remarks and Keynote Address:

Opening Remarks:
Lee Smith, VP of Business Development, Amkor Technology, Inc.

Keynote address:
Market Demand, Applications and Requirements for 3D Packaging and 3D ICs
Jan Vardaman, President, TechSearch International

Session 1: 9:00 AM - 12:00 PM
Supply Chain Collaboration - From Research and Development to Commercialization of 3D ICs with through Si Via (TSV) Interconnects

Role of Consortia: 9:00 AM - 10:00 AM

9:00 AM
Benefits of Supply Chain Collaboration: TSV Integrated Solutions and Advancements with EMC3D Consortium for Achieving Cost Effective 3D Integration
Rozalia Beica, Applications Director for 3D Interconnect, Semitool

9:30 AM
3D Integration Technology and the Microelectronics Supply Chain: Barriers and Solutions

Eric Beyne, Director, Advanced Packaging, IMEC

10:00 - 10:15 AM - Break

Perspectives from IC Suppliers: 10:15 AM - 11:45 AM

10:15 AM
TSS/TSV Process Partitioning to Leverage Supplier Capability and to Provide Maximum Sourcing Flexibility
Tom Gregorich, Vice President of Packaging, Qualcomm

10:45 AM
3D Integration – Packaging Innovation through Common Platform Ecosystem
Jean Trewhella, Director of Packaging Research and Development, IBM

11:15 AM
Lessons Learned in Quest to be First/Early Commercial Supplier of 3D IC Product. (Obstacles Faced from Lack of 3D IC / TSV Supply Chain Infrastructure.)
Bob Patti, CTO, Tezzaron Semiconductor

11:50 AM - 12:55 PM - Lunch and Keynote on IC Market

Keynote address:
Poised for Quick Rebound
Bill McClean, President, IC Insights

Session 2: 1:00 PM - 3:00 PM
3D Packaging, TSV, Roadmap, and Supply Chain/Technology Development

1:00 PM
3D Electronics and System in Package Integration: Where it’s at? Where it’s going?
W. R. “Bill” Bottoms, Chair of the ITRS Working Group for Assembly & Packaging

1:30 PM
Key Requirements for 3D Packaging using TSVs and TMV Technologies
Robert Lanzone, Vice President of Advanced Packaging, Amkor Technology, Inc.

2:00 PM
Material Requirements and Development Challenges for 3D Packaging and TSV
Leo Linehan, Global Advanced Packaging Business Development, Rohm & Haas

2:30 PM
Front End/Back End: Morphing the Manufacturing Model for Tough Times
Jim Walker, Research Vice President, Gartner Dataquest

3:00 PM - 3:15 PM - Break

Session 3: 3:15 PM - 4:45 PM
Multi Sources of Supply and Lessons Learned from 3D Packaging-Based Products

3:15 PM
3D Packaging Trends in Mobile Multimedia Based on Teardown Analysis
David Carey, President, Portelligent

3:45 PM
Role of TSVs in Future Packaging
Suresh Golwalkar, Principal Engineer of Materials, Intel

4:15 PM
Rolling Out a New Packaging Technology; Maximizing Supply Chain Opportunities
Marc Robinson, CTO, Vertical Circuits, Inc.

4:45 PM - Closing Remarks

Greg Caswell, VP of Engineering, Reactive Nano Technologies

5:00 PM - 7:00 PM - Device Packaging Welcome Reception
(GBC Attendees Invited - Beverages and Appetizers)

Purchase CD-Rom


Hotel Reservation Deadline - February 6, 2009

Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

On-line Reservations - Promotional Code: IMAPS9


If you have questions about the Global Business Council or would like to get more involved, please contact:

Steve Greene
IMAPS Membership Manager
611 2nd St, Ne
Washington, DC 20002



IMAPS Global Business Council | 611 2nd St, NE | Washington, DC 20002 | 202-548-4001