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IMAPS Global Business Council (GBC) - The Business Side of the Microelectronics Supply Chain


2009 Spring Conference
Supply Chain Development for 3D Packaging

March 8-9, 2009
Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, AZ

(in conjunction with Device Packaging 2009)

Co-Chairs:
Lee Smith, Vice President of Business Development, Amkor Technology, Inc.
Dr. Jie Xue, Director Technology and Quality, Cisco Systems, Inc.



Sunday March 8, 2009
12:00 Noon -- GBC Golf Outing.
We-ko-pa Golf Course at the Ft. McDowell Radisson - www.wekopa.com 
Tee-time of optional golf outing - Cost is $200 and includes green fees, shuttle from hotel, and lunch.

6:00 - 7:00 PM -- Registration Opens and GBC Welcome Reception (Beverages and Appetizers)

Monday, March 9, 2009

7:00 AM - 5:00 PM -- Registration
7:00 AM - 8:00 AM -- Continental breakfast

8:00 AM - 9:00 AM -- Opening Remarks and Keynote Address:

Opening Remarks:
Lee Smith, VP of Business Development, Amkor Technology, Inc.

Keynote address:
Market Demand, Applications and Requirements for 3D Packaging and 3D ICs
Jan Vardaman, President, TechSearch International

Session 1: 9:00 AM - 12:00 PM
Supply Chain Collaboration - From Research and Development to Commercialization of 3D ICs with through Si Via (TSV) Interconnects

Role of Consortia: 9:00 AM - 10:00 AM

9:00 AM
Benefits of Supply Chain Collaboration: TSV Integrated Solutions and Advancements with EMC3D Consortium for Achieving Cost Effective 3D Integration
Rozalia Beica, Applications Director for 3D Interconnect, Semitool

9:30 AM
3D Integration Technology and the Microelectronics Supply Chain: Barriers and Solutions

Eric Beyne, Director, Advanced Packaging, IMEC

10:00 - 10:15 AM - Break

Perspectives from IC Suppliers: 10:15 AM - 11:45 AM

10:15 AM
TSS/TSV Process Partitioning to Leverage Supplier Capability and to Provide Maximum Sourcing Flexibility
Tom Gregorich, Vice President of Packaging, Qualcomm

10:45 AM
3D Integration – Packaging Innovation through Common Platform Ecosystem
Jean Trewhella, Director of Packaging Research and Development, IBM

11:15 AM
Lessons Learned in Quest to be First/Early Commercial Supplier of 3D IC Product. (Obstacles Faced from Lack of 3D IC / TSV Supply Chain Infrastructure.)
Bob Patti, CTO, Tezzaron Semiconductor

11:50 AM - 12:55 PM - Lunch and Keynote on IC Market

Keynote address:
Poised for Quick Rebound
Bill McClean, President, IC Insights

Session 2: 1:00 PM - 3:00 PM
3D Packaging, TSV, Roadmap, and Supply Chain/Technology Development

1:00 PM
3D Electronics and System in Package Integration: Where it’s at? Where it’s going?
W. R. “Bill” Bottoms, Chair of the ITRS Working Group for Assembly & Packaging

1:30 PM
Key Requirements for 3D Packaging using TSVs and TMV Technologies
Robert Lanzone, Vice President of Advanced Packaging, Amkor Technology, Inc.

2:00 PM
Material Requirements and Development Challenges for 3D Packaging and TSV
Leo Linehan, Global Advanced Packaging Business Development, Rohm & Haas

2:30 PM
Front End/Back End: Morphing the Manufacturing Model for Tough Times
Jim Walker, Research Vice President, Gartner Dataquest

3:00 PM - 3:15 PM - Break

Session 3: 3:15 PM - 4:45 PM
Multi Sources of Supply and Lessons Learned from 3D Packaging-Based Products

3:15 PM
3D Packaging Trends in Mobile Multimedia Based on Teardown Analysis
David Carey, President, Portelligent

3:45 PM
Role of TSVs in Future Packaging
Suresh Golwalkar, Principal Engineer of Materials, Intel

4:15 PM
Rolling Out a New Packaging Technology; Maximizing Supply Chain Opportunities
Marc Robinson, CTO, Vertical Circuits, Inc.

4:45 PM - Closing Remarks

Greg Caswell, VP of Engineering, Reactive Nano Technologies

5:00 PM - 7:00 PM - Device Packaging Welcome Reception
(GBC Attendees Invited - Beverages and Appetizers)

Purchase CD-Rom


Housing

Hotel Reservation Deadline - February 6, 2009

Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

On-line Reservations - Promotional Code: IMAPS9

 


If you have questions about the Global Business Council or would like to get more involved, please contact:

Steve Greene
IMAPS Membership Manager
611 2nd St, Ne
Washington, DC 20002
202-548-8711
sgreene@imaps.org

 

 


IMAPS Global Business Council | 611 2nd St, NE | Washington, DC 20002 | 202-548-4001