IMAPS Global Business Council
GBC Homepage About the GBC GBC Events Industry News GBC Articles/Downloads GBC Steering Commitee Contact Us IMAPS Homepage -
IMAPS Global Business Council (GBC) - The Business Side of the Microelectronics Supply Chain

2011 Spring Conference
The Business of Semiconductor Packaging
in the Era of 3D and Energy Efficiency

March 6-7, 2011
Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, AZ

(Precedes Device Packaging 2011)

Iris Labadie, Kyocera America
Rich Rice, ASE, Inc.

GBC Speaker Dinner Sponsors:
GBC Speaker Dinner Sponsor: Amkor Technology
GBC Speaker Dinner Sponsor: ASE US, Inc.
GBC Speaker Dinner Sponsor: Kyocera America


The IMAPS GBC is pleased to announce its 2011 Spring Conference. Presentations by industry leaders will provide valuable content on supply chains, market analysis, and technology node shifts. Participants will gain industry and technical insight to achieve a competitive advantage for product development, marketing, and sales. Participants can network in two receptions, meals, and other opportunities.

Sunday March 6, 2011

5:30pm - 7:30pm -- Registration
6:00pm - 7:30pm -- GBC Opening Industry Reception (Beverages and Appetizers)

Monday, March 7, 2011

8:00am - 8:15am -- Opening Remarks

Steve Annas, Business Development Manager, Anaren Ceramics, Inc.
Chair of the GBC Steering Committee 

Richard Rice, Sr. Vice President of Sales, ASE US, Inc.  Co-Chair of the GBC Spring Conference

8:15am - 12:00pm -- Session 1:
“Business of Semiconductor Packaging in the Era of 3D”

Market Outlook Panel:   Applications Driving 3D IC Adoption.  Industry trends and forecasts.
8:15am – 9:15am
Moderator Lee Smith, Vice President, Marketing & Business Development, Amkor Technology, Inc.
Panelists: Jan Vardaman, President and Founder, TechSearch International
Brandon Prior, Senior Consultant, Prismark Partners, LLC

“The Role Road Maps Play in 3D Packaging and 3D IC Technologies.”
9:15am – 9:45am
Dr. Bill Bottoms, Chairman, 3MTS; Chair of the ITRS Assembly and Packaging Technical Working Group.

Status Update and the Role Consortia Has Played in Development of TSV Technologies.
9:45am – 10:45am
“EMC3D Consortia Status to Cost of Ownership Objectives.”
Rozalia Beica, Global 3D Interconnect Director, Applied Materials, Inc.

“Emerging Standards and Summary of SEMATECH’s Programs in 3D IC Technology Development.”
Sitaram Arkalgud, Director of 3D Interconnect Program, SEMATECH

10:45am – 11:00am -- Brief Break  

Status in Development of 3D IC Interface and Package Standards.
11:00am – 11:30am
“The Evolution of Standardization for 3D Package Technology”
 James Malatesta, Sr. Applications Engineer, Micron Technology Inc.
Chair of JEDEC JC-63 Committee on Multichip Packaging

Key Role Supply Chain Collaboration Plays in 3D IC Product Development.
11:30am – 12:00pm
“A case study on a fabless model of collaboration in developing highly anticipated new FPGA 3D architecture using Si interposers with TSV and micro-bump technologies.”
Suresh Ramalingan, Sr. Director of Package Design and Advanced Package Development, Xilinx, Inc.

12:00pm – 1:30pm -- Lunch Presentation
Moderator is Laurie Roth, President, Laurie Roth Marketing
"Reasons for Optimism in 2011 and 2012."   
Brian Matas, Vice President, Market Research, IC Insights

1:30 PM - 4:45 PM -- Session 2:
“Market Drivers for Semiconductors & Packaging in the era of Energy Efficiency.”

“Increasing Energy Efficiency Through Power Semiconductors”.
1:30pm – 2:15pm
Oleg Khaykin, CEO, International Rectifier

"Emerging Technologies to Enable Utility Scale Solar Power Growth."
2:15pm - 2:45pm
Eelco Bergman, Senior Vice President of Business Development, Cyrium Technologies Inc.

"Power Packaging Challenges and Market Drivers for Next Generation Energy Efficiency."
2:45pm – 3:15pm
Chris Bull, Marketing Manager - Power Stage Business Unit, Texas Instruments

3:15pm – 3:30pm -- Brief Break  

“The HEVs Are Coming! The Change of the Automotive Electronics Market With the Rise of the Hybrid/
Electric Power Train.”
3:30pm – 4:15pm
Tom Deitrich, Senior Vice President of RF and Sensor Products, Freescale Semiconductor

“Efficiency as the Next Automotive Value Proposition.”
4:15pm – 4:45pm
Marques McCammon, Chief Marketing Officer, Aptera Motors

4:45pm – 5:00pm -- Closing Remarks, Final Questions and Conference Evaluation

Device Packaging Welcome Reception
5:00pm - 6:30pm (Beverages and Appetizers) GBC Participants Invited

Texas Hold'em Poker Tournament
7:00pm – 10:00pm -- To benefit the IMAPS Educational Foundation


Interested in participating? Need details on registration, and other program areas?
Contact Steve Greene - or 202-548-8711.

On-line Registration | Device Packaging Conference 2011
Spring Golf Invitational | Texas Hold'em Tournament


Hotel Reservation Deadline - February 3, 2011

NOTE: There is a company by the name of Convention Housing Service attempting to contact our past attendees to book rooms through them. This is not a group IMAPS has authorized and we are looking into legal matters around this company. Please DO NOT provide them any personal or credit card information.

Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

$149 single/double

Phone Reservations: (480) 789-5300

Online Reservations:

Or use Promotional Code: IMAP11 from the hotel’s direct website:

**Working on special reservation process for government rate.



If you have questions about the Global Business Council or would like to get more involved, please contact:

Steve Greene
IMAPS Membership Manager
611 2nd St, Ne
Washington, DC 20002



IMAPS Global Business Council | 611 2nd St, NE | Washington, DC 20002 | 202-548-4001