IMAPS Global Business Council
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IMAPS Global Business Council (GBC) - The Business Side of the Microelectronics Supply Chain

2012 Spring Conference:
Global Supply Chain Management:
Increased Collaboration, Business Models, and Dynamic Market Implications

March 4-5, 2012
Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, AZ

(Precedes Device Packaging 2012)

GBC/DPC Premier Sponsors:
GPC/DBC Premier Sponsor: Solid State Equipment Corp.
GBC/DPC Premier Sponsor: Amkor Technology
GBC/DPC Premier Sponsor: ASE US, Inc.


Iris Labadie, Kyocera America
Lee Smith, Amkor Technology

The IMAPS GBC is pleased to announce its 2012 Spring Conference. Key industry leaders will provide important information on the critical role that supply chain management plays in our global industry. Presenters will address how business models, industry collaboration, and market dynamics can have profound impacts on the increasingly interconnected semiconductor supply chains. Participants will gain valuable industry insight to achieve a competitive advantage in product development, manufacturing, marketing, and sales. The conference will facilitate networking with key decision-makers across our broad industry supply chain.

Thank you to the GBC Speaker Dinner Sponsors:
GBC Speaker Dinner Sponsor: Solid State Equipment Corp.
GBC Speaker Dinner Sponsor: ASE US, Inc.
GBC Speaker Dinner Sponsor: Amkor Technology
GBC Speaker Dinner Sponsor: Kyocera America


Sunday, March 4, 2012

5:30 - 7:30: Registration and GBC Welcome Reception (Beverages and Appetizers)
7:30 - 9:00: Speaker Dinner (by Invitation)

Monday, March 5, 2012

7:00am - 8:00am -- Continental Breakfast and Registration

8:00am - 8:15am -- Opening Remarks
Steve Annas, National Sales Manager, Natel Engineering Co., Inc.

8:15am - 12:15pm -- Morning Presentations
Peter Tortorici, Process Development Manager of Medtronic, Inc.

8:15am - 9:00am -- “State of the Global Semiconductor Industry.”
Ron Steger, Partner from KPMG LLC

9:00am - 9:45am -- “Supply Chain Implications from the Growing Overlap between Wafer Foundry and Semiconductor Assembly and Test Suppliers (SATS) in Wafer-level Interconnection and Package Processing.”
E. Jan Vardaman, President of TechSearch International

9:45am - 10:00am -- Coffee Break

10:00am - 10:45am -- “Packaging Materials Markets and Supply Chain– Recent SEMI Report. Evolution of the Materials Supply Chain and Emergence of New Entrants.”
Daniel Tracy, Senior Director of Industry Research and Statistics of SEMI

10:45am - 11:30am -- “China's impact on the Semiconductor Industry - 2011 Update.”
Clememts “Ed” Pausa, Director Emeritus at PricewaterhouseCoopers

11:30am - 12:15pm -- “Global Supply Chain Compliance Security Management and Best Practices.”
Rennie Alston, Chief Operating Officer of American River International

12:15pm - 1:30pm -- Lunch Presentation
Moderator: Lee Smith, VP of Business Development at Amkor Technology, Inc.

“2012 and 5-year Electronics and Semiconductor Market Outlook; Facing Macro-economic Headwinds.”
Bill McClean, President of IC Insights

1:30pm - 4:45pm -- Afternoon Presentations
Moderator: Richard Rice, Senior Vice President of Sales & Engineering of ASE US, Inc.

1:30pm - 2:15pm -- “iNEMI Roadmap Process & Industry Collaboration Projects to Close Roadmap Gaps.”
Bill Bader, Chief Executive Officer of iNEMI

2:15pm - 3:00pm -- “Wafer Scale Packaging Supply Chain Evolution: Increased Collaboration, Competition, and Urgency.”
Jeff Perkins, President of Yole Developpement

3:00pm - 3:15pm -- Coffee Break

3:15pm - 4:00pm -- “Global Supply Chain Sourcing for Minor Metals for High Volume Manufacturing for Electronics: Risks and Opportunities.”
Robert Ploessl, Product Manager of Chemicals and Technology Assessment at Indium Corporation

4:00pm - 4:45pm -- “The No-Package Package: Are We Virtually There Yet?”
Jim Walker, Research Vice President of Semiconductor Manufacturing at Gartner-Dataquest

4:45pm - 5:00pm -- Closing Remarks, Final Questions, and Conference Evaluation
Iris Labadie, Market Development Specialist at Kyocera America, Inc.

Device Packaging Welcome Reception
5:00pm - 7:00pm (Beverages and Appetizers) GBC Participants Invited

Texas Hold'em Poker Tournament
7:00pm – 10:00pm -- To benefit the IMAPS Educational Foundation


Device Packaging Conference 2012
Spring Golf Invitational | Texas Hold'em Tournament




Hotel Reservation Deadline - February 10, 2012

Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264



If you have questions about the Global Business Council or would like to get more involved, please contact:

Steve Greene
IMAPS Membership Manager
611 2nd St, Ne
Washington, DC 20002



IMAPS Global Business Council | 611 2nd St, NE | Washington, DC 20002 | 202-548-4001