IMAPS Global Business Council
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IMAPS Global Business Council (GBC) - The Business Side of the Microelectronics Supply Chain

9th Annual GBC Spring Conference and Marketing Forum
Covering the Business Side of Microelectronics Assembly and Packaging

March 10-11, 2013
Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, AZ

(Precedes Device Packaging 2013)

GBC/DPC Premier Sponsors:
GPC/DBC Premier Sponsor: Solid State Equipment Corp.
GBC/DPC Premier Sponsor: Amkor Technology
GBC/DPC Premier Sponsor: ASE US, Inc.

Iris Labadie, Kyocera America
Steve Annas, nMode Solutions

The IMAPS GBC is pleased to announce its 2013 Spring Conference. Key industry leaders will provide important information on the critical role that supply chain management plays in our global industry. Presenters will address how business models, industry collaboration, and market dynamics can have profound impacts on the increasingly interconnected semiconductor supply chains. Participants will gain valuable industry insight to achieve a competitive advantage in product development, manufacturing, marketing, and sales. The conference will facilitate networking with key decision-makers across our broad industry supply chain.

Thank you to the GBC Speaker Dinner Sponsors:
GBC Speaker Dinner Sponsor: Solid State Equipment Corp.
GBC Speaker Dinner Sponsor: ASE US, Inc.
GBC Speaker Dinner Sponsor: Amkor Technology
GBC Speaker Dinner Sponsor: Kyocera America


Sunday, March 10, 2013

5:30 - 7:30: Registration and GBC Welcome Reception (Beverages and Appetizers)
7:30 - 9:00: Speaker Dinner (by Invitation)

Monday, March 11, 2013

7:00am - 5:00pm -- Registration
7:00am - 8:00am -- Continental Breakfast

8:00am - 8:15am -- Opening Remarks
Steve Annas, Vice President of Operations, nMode Solutions, Inc.
Chair of the IMAPS Global Business Council

8:15am - 11:30am -- Morning Session:
Medical Electronics Trends for Evolving Healthcare Ecosystems

Iris Labadie, Kyocera America; Peter Tortorici, Medtronic, Inc.

8:15am - 9:00am -- “Medical Electronics Crossroad – from Healthcare to Health”
Keith Lindor, Executive Vice Provost for Health Solutions & Dean of the College of Health Solutions, Arizona State University

9:00am - 9:30am -- “Implantable Electronics Technology Needs for Improved Cost Efficient Care and Emerging Markets”
Peter C. Tortorici, New Product Integration Manager, Medtronic, Inc.

9:30am - 10:00am -- “Supply Chain Issues With New Electronic Packaging Technologies”
John Dzarnoski, Director of Microelectronic Packaging, Starkey Hearing Technologies

10:00am - 10:30am -- Coffee Break

10:30am - 11:00am -- “Collaborating to Compete: Biomedical Sensor Failure Prediction”
Colin Drummond, Department Director, Case Western Reserve University

11:00am - 11:30am -- “Latest Trends in Advanced Packaging Technologies and Focus on Medical Applications”
Mike McLaughlin, Business Development Manager, Yole Développement

12:00pm - 1:00pm -- Lunch & Keynote Presentation

“The 'New' IC Industry Cycle Model”
Bill McClean, President, IC Insights

1:15pm - 4:40pm -- Afternoon Session:
Trends in Microelectronics & Factors Shaping Enabling Technologies

Moderator: Lee Smith, Plexus Corp.; David D’Ambra, DuPont Microcircuit Materials

1:15pm - 2:00pm -- “Saving Lives with MEMS and Sensors: Advancements in Packaging”
E. Jan Vardaman, President, TechSearch International

2:00pm - 2:30pm -- “Material Requirements for the Electronics Industry today and in the Next Decade”
Tim Mobley, Co-Founder and CEO, nMode Solutions

2:30pm - 3:15pm -- “Microelectronics: Driving Increased Energy Productivity”
Jeff Perkins, Senior Director of Business Development, Energy & Resource Solutions

3:15pm - 3:30pm -- Coffee Break

3:30pm - 4:10pm -- “Supply Chain Eco-systems for Next Generation 3D and High-density Flip Chip Interconnection”
Jean Trewhella, Director of Packaging Research and Development Center, IBM

4:10pm - 4:40pm -- “Virtual Factory: Cloud Based System for Global Manufacturing & Data Management”
Simon Gonzales, Executive Director of Operations, Murata - RF Monolithics, Inc.

4:40pm - 5:00pm -- Closing Remarks, Final Questions, and Conference Evaluation
Steve Annas, Vice President of Operations, nMode Solutions, Inc.
Chair of the IMAPS Global Business Council

Device Packaging Welcome Reception
5:15pm - 6:45pm (Beverages and Appetizers) GBC Participants Invited

Texas Hold'em Poker Tournament
7:00pm – 10:00pm -- To benefit the IMAPS Educational Foundation


Abstracts and Speaker Bios:

“Medical Electronics Crossroad – from Healthcare to Health”
Several emerging trends in Health Care which should be of interest to this group. One is the focus on health, not just specifically health care, the development of new care delivery models including a reliance on inter-professional teams, a move towards home based care and health promotion and a continuation of a move to an out-patient versus hospital based focus for health care itself. There is also an increasing focus on underserved populations. Some of our approach to affecting these changes relates to understanding the determinants of health in which lifestyle such as smoking, obesity and nutritional choices make up more than half of the determinants of the health of this society where as health care itself accounts for around 10%. Currently the United States ranks 29th in its life expectancy and its costs are considerable higher than the next most expensive country. There are a variety of reasons for this such as costs of providers, drugs, technology and hospitalizations; these costs will only worsen as the population ages and obesity increases. The emergence of accountable care organizations in which pre-payment for the maintenance of the health of a population is provided as long as expected outcomes are met which means that the changes noted above will only be accelerated. This will bring great opportunities for those involved in medical electronics as there will be a transition from a clinical setting to the home where more intensive monitoring will allow people to remain in their homes more readily as well as better manage chronic diseases out of the context of usual office or hospital practices. Not only will physiologic monitoring be popular, but also motivational devices to affect changes in behavior as it relates to lifestyle and improvement initially to increase health of the population will emerge. In conclusion, American medicine is expensive and not very effective. As our population grows in age as well as size, these costs will rise. It is predicted that the home will be increasingly the focus for health and work within your field to help with efforts to create greater health at lower cost for more people.

Keith Lindor, Executive Vice Provost for Health Solutions & Dean of the College of Health Solutions, Arizona State University
Dr. Keith Lindor is executive vice provost for Health Solutions and dean of the College of Health Solutions at Arizona State University (ASU). He joined ASU in January 2012. Before coming to ASU, Dr. Lindor served as dean of the Mayo Medical School and was a professor of medicine in the Division of Gastroenterology and Hepatology.

Dr. Lindor currently serves as editor-in-chief of Hepatology and has previously served as senior associate editor for Clinical Gastroenterology and Hepatology. He is on the editorial board of Gastroenterology and Journal of Clinical Gastroenterology.

Dr. Lindor’s interests include: cholestatic liver diseases in adults, particularly primary biliary cirrhosis and primary sclerosing cholangitis as well as nonalcoholic steatohepatitis. The primary focus of his research is on clinical trials and means of optimizing the medical management of patients with these disorders.

Additionally, he has served on numerous committees for the American Association for the Study of Liver Disease as well as the American Liver Foundation. He was also involved with the Indian Health Service in Southern Arizona.

Dr. Lindor received a bachelor’s of chemistry degree from the University of Minnesota and medical degree from Mayo Medical School. He completed his residency in internal medicine at Bowman Grey School of Medicine at Wake Forest University.

“Implantable Electronics Technology Needs for Improved Cost Efficient Care and Emerging Markets”
Implantable medical electronics have a unique niche of requirements for the electronics industry. These devices require low power consumption, continual decreasing size and shape challenges, increased functionality and a nominal service life of over 8-9 years in vivo, and increasing. The reliability requirements of these devices are also similar to the highest reliability applications in military and aerospace, but each device touches a unique patient requiring care. During the last several years, there have been some strong headwinds in the form of increasing government regulations and medical device tax as part of the Affordable Care Act, and the continued world-wide economic slowdown particularly in the Eurozone. The emerging markets (China, India, Russia) offer great opportunity for growth of the implantable medical device space. Conservative estimates are that over 300 million new patients could be served in these markets in the coming years. However, the cost pressures in these markets on the devices and continuum of care are very important, as is also the delivery of care. This talk will highlight these challenges and the needs through the supply chain as these devices are adopted in these key growth markets.

Peter C. Tortorici, New Product Integration Manager, Medtronic, Inc.
Peter C. Tortorici is currently a new product integration manager at the Medtronic Microelectronics Center in Tempe, AZ. He has been with Medtronic since 2001. His group of engineers is responsible for the integration of new microelectronic designs into volume manufacturing for implantable medical devices. These are primarily for the treatment and management of cardiac and neurological diseases. Prior to his current position, he was the corporate pwb substrate component engineer and a process development engineer in the microelectronics group at Medtronic.

Prior to his career at Medtronic, Peter was a metals component program manager for the lighting division of General Electric and a microelectronics packaging engineer at Hewlett-Packard. He was a visiting research scientist at the Forschungszentrum Jülich, Germany in 1996 and worked in the early development of Nd-Fe-B permanent magnets at General Motors from 1987 – 1989.

Dr. Tortorici holds B.S., M.S., and Ph.D. degrees in Metallurgical and Materials Engineering from Purdue University in West Lafayette, IN. His graduate work focused on the diffusional interactions of molybdenum disilicide with metallic reinforcements for high temperature applications, and the diffusional interaction of austentic and ferritic cladding steels with metallic nuclear fuel fission products. He is a member of ASM International, The Materials Society (TMS), The American Ceramic Society (ACerS), SMTA, IMAPS and IPC. He holds two US Patents.

“Supply Chain Issues With New Electronic Packaging Technologies”
Leveraging the global microelectronic packaging industry is complex. There are so many suppliers and many are not easily accessible. Miss information is the norm and reality is most often uncovered by visits to potential suppliers. In the case of flexible circuits almost everyone knows some company that can supply flex. Unfortunately, supplier’s capability documents are misleading and never account for the combination of possible design features. Starkey has scared away far more suppliers than were willing to move to the next step. Most suppliers are unfamiliar with HDI medical grade flex requirements. Many suppliers are so focused on cost and price that they cannot or will not understand the quality constraints. Conventional wisdom drives people, sometimes mistakenly, to China. The best solution for the combination of price and quality may come from surprising locations. Understanding cost drivers is essential.

Starkey has a long history of miniaturization because it is essential for hearing aids. Early on ceramic hybrids were developed to integrate die and passives into a single package. Later chip stacking was developed and combined with hybrid technology to get even higher densities. Eventually, limitations in routing in ceramic hybrids pushed the migration to flexible circuit based electronics. With the advent of current leading edge technologies like embedded die packages, through silicon vias, and various 3D modular designs, further size reductions are possible. There are lots of design choices. Many of these new technologies require the use of wafer based processing. Moving from die based technologies to wafer based technologies has a significant impact on cost, testing, timing, availability and potential packaging partners. This paper will discuss the trials and tribulations of leveraging the global supply chain to develop leading edge miniature flexible circuit and 3D modular products.

John Dzarnoski, Director of Microelectronic Packaging, Starkey Hearing Technologies
Dr. Dzarnoski received his PhD from the University of California at San Diego while researching ways to make more efficient solar cells. This work involved establishing the mechanisms and thermal kinetics of various CVD processes. John worked at Burroughs Corporation developing metal dielectric interconnect processes for bipolar, NMOS and CMOS integrated circuits. This work involved plasma etching of Aluminum metal and CVD oxides and nitrides as well as the deposition of CVD materials. Later he worked at Sperry/Univac and Unisys Corporation developing thin film multi-chip modules for main frame computers. This work involved polyimide coatings, co-fired ceramic substrates, plasma etching, electroplating, electroless plating and projection photolithography.

Dr. Dzarnoski used his semiconductor expertise to drive silicon wafer processing technology into the production of magnetoresistive recording heads. John held positions ranging from Director of Production Vacuum Engineering to Senior Director of Wafer Process Development at Seagate Technology. John is currently Director of Microelectronic Packaging at Starkey Hearing Technologies in Eden Prairie, Minnesota. He is responsible for all new electronic packaging technology for hearing aid applications including hybrid processes, SMT processes, flexible circuit technology, laser direct structuring, and 3D packaging technologies. John oversees the introduction of all new product designs into Starkey’s Suzhou, China manufacturing site.

“Collaborating to Compete: Biomedical Sensor Failure Prediction”
A critical path in the prediction of microsystems device failure is the absence of openly available time-dependent materials properties. This is not a technical problem but an economic one. Empirical rules-of-thumb underpin the failure analysis "bathtub curve" and preclude use of the rapidly emerging simulation technology to predict component life. In particular, the lack of time-dependent data warehouses impedes biomedical sensor deployment and subsequent market growth. The proposed presentation looks at implanted biomedical sensor and material failures and proposes the role of professional societies to lead the pathway forward on behalf of industry.

Colin Drummond, Department Director, Case Western Reserve University
Colin K. Drummond is the Director of the Coulter-Case Translational Research Partnership (CCTRP) in the Department of Biomedical Engineering at CWRU. He received his Ph.D. degree in Mechanical Engineering from Syracuse University in 1985 and an MBA in Technology Management from the Weatherhead School of Management in 1997. For over two decades Colin has worked in the application of science and technology to the creation of products and services and in the past 8 years has been a co-founder of two medical device start-up companies. Dr. Drummond holds an appointment in the Masters of Engineering and Management program, teaching several courses in the area of entrepreneurship, finance, and information technology.

“Latest Trends in Advanced Packaging Technologies and Focus on Medical Applications”
Even if the Middle-End is still an emerging and booming area, we now have a clear picture of every potential market targeted by all of the brand-new technological platforms involved in this industry. 3DIC and FOWLP will be first, driven respectively by logic SiP/SoC and mobile/wireless applications. However, medical is also considered as a very promising area for implementation of these new platforms, with for example more than 10 Munits of 3D-ICs expected to be shipped in 2017 for medical endoscopes, implantable CRM and many other applications.

This presentation will analyze the motivations, drivers and technological benefits offered by Advanced Packaging, and how it can be implemented in medical devices.

Mike McLaughlin, Business Development Manager, Yole Développement
Mike McLaughlin has been working with emerging technologies for over 12 years at IBM and Cisco and was a principal analyst at Gartner. He now leads all of Yole Développement's activities and business development for North America. Mike is a graduate of Stanford University in Palo Alto, CA.

“The 'New' IC Industry Cycle Model”
The IC industry is set to emerge from a difficult 5-year period of minimal growth. From 2007-2012, the IC market grew at an average annual rate of 2.1%. In IC Insights’ opinion, the “bottom” of the current cycle in the worldwide economy and IC industry was reached in 2012 and 2013 will mark the beginning of the next cyclical upturn—one in which the IC industry CAGR will more than triple to 7.4% in the next 5-year period.

Overall, semiconductor industry cycles are becoming increasingly tied to the health of the worldwide economy. While poor semiconductor industry growth has occurred during periods of strong worldwide economic growth, primarily due to semiconductor industry overcapacity and the resulting IC price declines, it is rare to have strong semiconductor industry growth without at least a “good” worldwide economy to support it. Thus, over the next five years, annual global semiconductor market growth rates are expected to gain significant momentum and closely mirror the performance of the worldwide economy.

Bill McClean, President, IC Insights
Prior to forming IC Insights, Mr. McClean worked at ICE Corporation for 17 years--the last 10 as Vice President of Market Research. With 33 years of experience tracking the IC industry, Mr. McClean has become a well-known authority on market and technology analysis and forecasting. He specializes in tracking global economic conditions, developing IC market forecasts, analyzing capital spending and fab capacity trends, researching ASIC markets and technologies, and following emerging markets for ICs such as cellular phones. Mr. McClean serves as contributor and managing editor of IC Insights' studies and other products. In addition, he instructs for IC Insights' seminars and has been a guest speaker at many important annual conferences held worldwide. Mr. McClean has a Bachelor of Science degree in Marketing and an Associate degree in Aviation from the University of Illinois. In February of 2011, Bill received an IMAPS GBC Partnership Award for key contributions to the Global Business Council’s mission.

“Saving Lives with MEMS and Sensors: Advancements in Packaging”
MEMS and sensors are playing an increasingly important role in our lives. Not only are they growing in unit volume and applications, but also in increased importance. From military to medical applications, MEMS and sensors make our lives more comfortable and safer. This presentation explores the packaging and assembly advances that make miniaturization possible at reduced cost.

E. Jan Vardaman, President, TechSearch International
E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided analysis on technology and market trends in semiconductor packaging since 1987. She is co-author of How to Make IC Packages (published in Japanese by Nikkan Kogyo Shinbunsha), a columnist with Circuits Assembly Magazine, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She served on the NSF-sponsored World Technology Evaluation Center study team involved in investigating electronics manufacturing in Asia and on the U.S. mission to study manufacturing in China. She is a member of IEEE CPMT, IMAPS, IPC, MEPTEC, and SEMI. She received the “Die Products Industry Achievement Award,” at the 14th Annual International KGD Packaging and Test Workshop in September 2007. She was elected to two terms on the IEEE CPMT Board of Governors. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.

“Material Requirements for the Electronics Industry today and in the Next Decade”
This presentation will address the packaging needs for emerging wireless devices such as cell phones, radar systems, GPS, Handheld Medical Diagnostic devices and those applications operating at greater than 2 GHz and the associated market forces that will drive the adoption of these new substrates. To interface between the IC and PWB, 2.5D and 3D packaging solutions are becoming more accepted as design techniques are becoming more mature and advanced materials are becoming available.

The needs for greater bandwidth and faster download speeds are given rise to devices that work at higher clockspeeds and when coupled with increasing IO’s, has driven the engineer to design smaller and smaller form factors. In addition, the substrate (Interposer) must possess electrical and mechanical properties over a range of temperatures and when exposed to humidity.

Any new technology has risk and associated start-up cost that will hinder adoption. What will be those risks both financial and engineering that will hinder the adoption of these new substrates? How fast will the market grow and what is the cost of producing high volume manufacturing.

Tim Mobley, Co-Founder and CEO, nMode Solutions
Tim Mobley is currently the co-founder and CEO of nMode Solutions, Inc and is responsible for business and engineering development and has 12 years of experience with RF module development and packaging. Prior to nMode Solutions, Inc., Tim worked at DuPont in LTCC and PWB materials development as a microwave design engineer and business development and worked at Raytheon Missile Systems on system level RF design and manufacturability. He is the author of over 25 published technical papers and has 4 patents, and has BS in Physics, MS in Electrical Engineering, and Exec MBA.

“Microelectronics: Driving Increased Energy Productivity”
From control electronics to power devices to LED lighting, from novel devices to novel packaging solutions, the micro electronics sector continues to contribute greatly to increasing energy productivity. In application after application, the move from analog to digital yields greater functionality and greater efficiency. New devices and improved designs open new inroads to markets with energy efficiency as the driver and energy efficiency is a huge business. From Utility efforts on the demand side of the meter to Corporate Sustainability Managers seeking to make improvements along the entire value chain, doing the same or more with less will both drive, and be driven by, the microelectronic sector for years to come.

Jeff Perkins, Senior Director of Business Development, Energy & Resource Solutions
Jeff Perkins is the Senior Director of Business Development at ERS and has more than 20 years of experience working in emerging technologies. He has led business development activities on 4 continents across a range of industries including semiconductor, precision mechanics, aerospace, automotive, medical, and energy. His experience in the energy field includes the startup of large scale audit implementation projects in the U.S. and Canada and involvement in thousands of commercial audits. As a key member of the development team for the groundbreaking audit software “XenCAP” in the 1980’s, he was among the early pioneers in quantification of “DSM” energy efficiency potential. Jeff holds an MBA from INSEAD and a BSc in Architectural Engineering – Building Energy from the University of Colorado, Boulder. You can contact Jeff at 978-521-2550, x207 or

“Supply Chain Eco-systems for Next Generation 3D and High-density Flip Chip Interconnection”
IBM Microelectronics has a long history of developing world class semiconductor and packaging technologies that raise the bar on product performance, power efficiency, and reliability. Our products are becoming increasingly intelligent, interconnected and integrated. Advances in semiconductor device performance and the transition to environmentally friendly interconnects drive complexity in the design and implementation of appropriate packaging solutions. Increased use of multi-core processors that drive larger die size, greater I/O counts, greater bandwidth, and enhanced cooling requirements have made the co-development and deep knowledge of silicon and packaging solutions essential to the successful implementation of both. Introduction of 3D TSV technology only makes this more critical.

In order to achieve these development goals, IBM Microelectronics has formed a Packaging Joint Development Ecosystem with leading assembly, materials, and equipment providers. This ecosystem leverages IBM’s research and development resources with synergistic skills from industry partner companies to solve shared challenges and drive industry leadership in semiconductor flip chip and stacked die (i.e. 3D) packaging; enhancements in technology development (design, performance and reliability); improvements in time to market; and definition of new industry standards.

Jean Trewhella, Director of Packaging Research and Development Center, IBM
Jean is the Director of Packaging Research and Development at IBM Microelectronics where she is responsible for all 1st level packaging. She has concentrated on emulating the successful Silicon Ecosystem Model into Packaging and bringing 3D technology into mainstream. Ms. Trewhella joined the T.J. Watson Research Center, IBM, in 1988. Her work has included optical and electrical package design of data communications components, signal integrity studies of high speed electrical links, advanced 1st and 2nd level packaging of IBM SiGe and CMOS IC chips. In 2006 she joined STG as the Electronic Packaging Integration Group Manager in Poughkeepsie where her team developed interconnects for z and p systems. She has authored numerous papers and holds 26 patents. She was the General Chair of the 60th IEEE Electronic Component Technology Conference and is currently IEEE CPMT Vice President of Conferences.

“Virtual Factory: Cloud Based System for Global Manufacturing & Data Management”
With a continued prevalence in offshore electronics manufacturing and globalization of product distribution, methods to control and ensure integrity of such management systems are a challenge for many organizations. In addition, with down-sizing of company resources an alternate approach to design and implement an economical solution is a desirable factor to in order emulate a large scale capability but within the boundaries of a smaller organization. A due diligence of options was analyzed based on multiple criteria of capabilities, security, functionality, and integration time for a virtual factory system that would span several global locations. In addition, a low budget system approach was defined using off the shelf products in order to further this implementation. Last but not least the entire process system was designed with independence of the engineering resources as a stand-alone system that would offer growth and allow alternate users to interface for further enhancements.

Simon Gonzales, Executive Director of Operations, Murata - RF Monolithics, Inc.
Simon Gonzales is currently the Executive Director of Operations at RF Monolithics in Dallas Texas, under the parent company of Murata Electronics. He has over 20 years in semiconductor experience working with companies including Motorola, Micron Technologies, and Silterra Malaysia. Simon has held senior leadership roles in manufacturing, operations, new product development and strategic marketing spanning global engagements including Asia, the Americas, and Europe. He has 14 technical publications to his credit including both seminar presentations and trade journals covering process development, assembly, and technology innovation. Simon has also engaged in consulting, including multiple startup business plans, company due diligences, strategic positioning, and most recently a DARPA project for MEMs base probes for neuro-modulation. Simon holds an MBA in Technology Management, MS Engineering from Colorado School of Mines and dual Bachelor’s in Science and Education from Colorado State University.



Register On-Line | Hotel Reservations
Device Packaging Conference 2013
Spring Golf Invitational | Texas Hold'em Tournament




Hotel Reservation Deadline - February 8, 2013

Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

$155 single/double

Online Reservations

Phone Reservations: (480) 789-5300
Mention IMAPS or IMAPS Device Packaging when booking by phone

Hotel Scams Alert!
Beware of Hotel Scams! Exhibition Housing Services has been soliciting several exhibitors indicating that they are the official housing vendor for IMAPS Device Packaging 2013 Please note that they are NOT affiliated with the show at all and are not working in your best interest. Booking rooms through companies such as Exhibition Housing Services could result in false reservations and a loss of deposit money.

The only way to book a room in the official IMAPS Housing Block using the reservations information above.



If you have questions about the Global Business Council or would like to get more involved, please contact:

Michael O'Donoghue
IMAPS Executive Director



IMAPS Global Business Council | 611 2nd St, NE | Washington, DC 20002 | 202-548-4001