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IMAPS Global Business Council (GBC) - The Business Side of the Microelectronics Supply Chain

10th Annual GBC Spring Conference and Marketing Forum
Addressing the Economic Challenges of Technology Transitions
in a Wafer Level Process Environment

March 9-10, 2014
Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, AZ

(Precedes Device Packaging 2014)

GBC/DPC Premier Sponsors:
GPC/DBC Premier Sponsor: Solid State Equipment Corp.
GBC/DPC Premier Sponsor: Amkor Technology
GBC/DPC Premier Sponsor: ASE US, Inc.

Conference Chair:
Lee Smith, Plexus Corp.

The IMAPS GBC is pleased to announce its 2014 Spring Conference: Addressing the Economic Challenges of Technology Transitions in a Wafer Level Process Environment. The 2014 Conference will feature panels, a lunch keynote, and sessions on: "450mm Transition: Why, When, Who, How – Are Mid to Backend Supply Chain Implications and Constraints Being Addressed?" and "The Economics of the Technology Transitions Required for 2.5 and 3D Packaging – Can these Technologies meet the cost and densities required by Handheld Devices?". Key industry leaders will provide important information on the critical role that supply chain management plays in our global industry. The conference will facilitate networking with key decision-makers across our broad industry supply chain.

Thank you to the GBC Speaker Dinner Sponsors:
GBC Speaker Dinner Sponsor: Solid State Equipment Corp.
GBC Speaker Dinner Sponsor: ASE US, Inc.
GBC Speaker Dinner Sponsor: Amkor Technology


Sunday, March 9, 2014

5:30 pm - 7:30 pm: Registration and GBC Welcome Reception (Beverages and Appetizers)
7:30 pm - 9:00 pm: Presenter's Dinner (by Invitation ONLY)

Monday, March 10, 2014

7:00 am - 5:00 pm -- Registration
7:00 am - 8:00 am -- Continental Breakfast

8:00 am - 8:15 am -- Opening Remarks
Lee Smith, Plexus Corp.

8:15am - 10:00am -- Session 1:
450mm Transition: Why, When, Who, How –
Are Mid to Backend Supply Chain Implications and Constraints Being Addressed?

Session Chairs: Lee Smith, Plexus Corp.; Rich Rice, ASE Group

This session will:

  • Provide the status of the Global 450mm Consortium (G450C), current roadmap and address the economic challenges for new process equipment and materials technologies required for mid and back end (wafer support, RDL, bump, probe, thin, dice die attach etc...) wafer level package processing of 450mm wafers.
  • Address the economic challenges associated with developing new 450mm format process and materials technologies by a back end supply chain already under tremendous economic stress from the investment levels and resources required as the packaging industry transitions to broader use of wafer level processing.
  • Define approaches to ensure the packaging industry has participation in consortium plans for the transition to 450mm wafers.

Confirmed Presentations Include:

8:15 am - 9:00 am -- Transition to the Internet of Things as the Industry’s Technology Driver
Dr. Bill Bottoms, Chairman, 3MTS and Chair of ITRS Packaging Roadmap Working Group

9:00 am - 9:30 am -- Challenges and Opportunities in a Consolidating Market
Dan Tracy, SEMI, Sr. Director, Industry Research & Statistics

9:30 am - 10:00 am -- 450 mm: It’s All About Economics
Jim Walker Research, V.P. Research, Semiconductor Manufacturing, Gartner

10:00 am - 10:30 am -- Networking & Coffee Break

10:30 am - 2:30 pm -- Session 2:
The Economics of the Technology Transitions Required for 2.5 and 3D Packaging –
Can these Technologies meet the cost and densities required by Handheld Devices?

Session Chairs: Rich Rice, ASE Group; Steve Annas, Triton Micro Tech

This session will:

  • Summarize the status of current wafer level package process and interposer technologies required by 2.5 and 3DIC architectures.
  • Address what interposer technologies (silicon, glass or organic) are being developed to meet handheld cost targets of 1¢ / sq mm at a density of at least 5 vias / sq mm.
  • Explore the collaboration models being pursued across the supply chain and how competitive overlap and multi-sources of supply are being addressed in these cross functional development programs.

Confirmed Presentations Include:

10:30 am - 11:00 am -- Drivers for Advanced Packaging: From 2.5D to Embedded Die, Selecting the Best Option
E. Jan Vardaman, President of TechSearch International

11:00 am - 11:30 am -- Glass Platform for Electronic Applications: Opportunities and Challenges
Gene Smith, Program Manager, Corning

11:30 am - 12:00 pm -- Transition From TSV Prototyping to High Volume Manufacturing
Sergey Savastiouk, Ph.D., CEO, ALLVIA

12:15 pm - 1:15 pm -- Back by Popular Demand our Lunch & Keynote Presentation

KEYNOTE: Major Trends Impacting the Future IC Industry
Bill McClean, President, IC Insights
Prior to forming IC Insights, Mr. McClean worked at ICE Corporation for 17 years--the last 10 as Vice President of Market Research. With 33 years of experience tracking the IC industry, Mr. McClean has become a well-known authority on market and technology analysis and forecasting. He specializes in tracking global economic conditions, developing IC market forecasts, analyzing capital spending and fab capacity trends, researching ASIC markets and technologies, and following emerging markets for ICs such as cellular phones. Mr. McClean serves as contributor and managing editor of IC Insights' studies and other products. In addition, he instructs for IC Insights' seminars and has been a guest speaker at many important annual conferences held worldwide. Mr. McClean has a Bachelor of Science degree in Marketing and an Associate degree in Aviation from the University of Illinois. In February of 2011, Bill received an IMAPS GBC Partnership Award for key contributions to the Global Business Council’s mission.


Session 2 - Continued:
The Economics of the Technology Transitions Required for 2.5 and 3D Packaging –
Can these Technologies meet the cost and densities required by Handheld Devices?

Session Chairs: Rich Rice, ASE Group; Steve Annas, Triton Micro Tech

1:30 pm - 2:00 pm -- Large Panel Core Technology for 2.5D and 3D Packaging Designs
Tim Mobley, CEO, Triton MicroTechnologies, Inc.; Shintaro Takahashi, Manager at Business Planning Office, Asahi Glass Co.

2:00 pm - 2:30 pm -- Market Drivers, R&D Progress & Manufacturing Infrastructure Readiness for Glass Interposers & Packages
Venky Sundaram, Georgia Tech.

2:30 pm - 3:00 pm -- Networking & Coffee Break

3:00 pm - 4:30 pm -- Industry Panel Discussion:
Economics of the Packaging Technology Transitions – 450mm, 2.5 / 3D and WLP...

Moderator: Rich Rice, ASE Group
A panel discussion is planned to follow the presentations to initiate debate where required to highlight key issues and actions.

Panelists will include key opinion leaders within the semiconductor industry, equipment and material suppliers:

Ron Huemoeller, Senior Vice President, Advanced 3DIC, Amkor Technology
Shintaro Takahashi, Manager at Business Planning Office, Asahi Glass Co.

Other Panelists Soon

4:30 pm - 4:45 pm -- Closing Remarks, Final Questions, and Conference Evaluation
Steve Annas, Triton Micro Tech
Chair of the IMAPS Global Business Council

4:45 pm - 5:00 pm -- GBC Planning Discussion: open to anyone interested in helping lead GBC
Steve Annas, Triton Micro Tech (Chair of the GBC) & Lee Smith, Plexus Corp. (GBC Conference Chair)
* Discussion about IMAPS 2014 GBC Lunch/Forum/Panel (Roadmapping, "Future of Packaging"

* GBC 2015 Spring Conference
* Overall GBC mission, meetings and more

Device Packaging Welcome Reception
5:00 pm - 6:30 pm (Beverages and Appetizers) GBC Participants Invited

Texas Hold'em Poker Tournament
7:00 pm – 10:00 pm -- To benefit the IMAPS Educational Foundation


Abstracts and Speaker Bios:

Session 1: 450mm Transition: Why, When, Who, How – Are Mid to Backend Supply Chain Implications and Constraints Being Addressed?

Transition to the Internet of Things as the Industry’s Technology Driver
The electronics industry is still reacting to the rapid change from personal computers to mobile products as the technology driver. The market for PCs has already fallen below that for mobile devices; evidence of fundamental changes in our industry. RF components, low power processors, power management ICs have all gained share relative to traditional PC components. With that transition still underway the next transition has already started. This coming transition is driven by two connected changes in the interaction of society with technology; transition to the cloud and rise of the internet of things. Both demand a revolution in our data networks that will change the data center, the computer center, network architecture and virtually all electronic components they contain. The current solutions for these elements cannot satisfy the future requirements for lower latency, reduced power and increased physical density of bandwidth. At the same time new circuit types such as photonics, MEMS, and a plethora of new sensors expand the network requirements. Some of the difficult challenges and potential solutions will be discussed.

Dr. Bill Bottoms, Chairman, 3MTS and Chair of ITRS Packaging Roadmap Working Group
Dr. Bottoms received a B.S. degree in Physics from Huntington College in Montgomery, Alabama in 1965, and a Ph.D in Solid State from Tulane University in New Orleans in 1969 and is currently Chairman of Third Millennium Test Solutions. He has worked as a faculty member in the department of electrical engineering at Princeton University, manager of Research and Development at Varian Associates, founding President of the Semiconductor Equipment Group of Varian Associates and general Partner of Patricof & Co. Ventures.

Dr. Bottoms has participated in the start up and growth of many companies through his venture capital activity and through his own work as an entrepreneur. These include companies both directly and indirectly related to semiconductor. Among these companies are:

  • Microelectronics Packaging Inc.
  • Credence Systems
  • Third Millennium Test Solutions
  • Tessera
  • SBA Materials
  • APMT
  • Southwest NanoTechnologies

He currently serves as:

  • Member of the Board of Tulane University
  • Chairman of the Technical Working Group for Assembly and Packaging for the International Technology Roadmap for Semiconductors
  • Chairman of the Technical Working Group for Packaging and Component Substrates for the International Electronics Manufacturing Institute
  • Chairman of the Semiconductor Equipment and Materials International’s SEMI Awards Committee

Challenges and Opportunities in a Consolidating Market
While some sectors of the semiconductor industry have experience strong growth, in total overall sales of devices, manufacturing equipment, and materials have slowed down since the strong recovery in 2010. And as connectivity becomes more pervasive and critical to commerce and to our lifestyles, the semiconductor industry will need to deliver new technologies for this to happen. With these new performance and integration needs, however, process technologies and materials requirements are becoming more complex and costly as new device architectures and materials are needed to advance device performance.

450mm wafers, EUV, and 3D/TSV packaging are key levers for advancing device performance, though development costs and timing of implementation in both pilot and high volume manufacturing remain unsettled. The technology challenges are complex and beyond the capability of a single company to solve, so companies across the industry supply chain will need to collaborate and to improve communication in order to prioritize investments in addressing the key challenges. The good news for companies in our consolidating industry is that demand for innovation remains strong.

Daniel P. Tracy, Sr. Director, Industry Research & Statistics, SEMI
Dr. Dan Tracy, a Senior Director at SEMI Industry Research, is responsible for developing and executing the global strategy for SEMI industry research and statistics products and services. Prior to joining SEMI in 2000, Dan was a Research Associate with Rose Associates, a prominent market research and consulting firm specializing in electronic materials. Prior to this, he was employed at National Semiconductor’s Package Technology Group. Dan has a Ph.D. in Materials Engineering from Rensselaer Polytechnic Institute and a M.S. in Materials Science & Engineering from Rochester Institute of Technology.

450 mm: It’s All About Economics
Historically, moving to the next wafer size provided approximately a 30% reduction in processing cost. This assumes that the process equipment is capable of maintaining the same number of wafers per hour and similar yields. It will mean more devices per wafer, but at an increased factory cost. This could possibly imply building fewer manufacturing facilities and hiring fewer engineers to support the manufacturing efforts. The key will be whether the semiconductor equipment manufacturers can make a profit and get a reasonable return on their investment with fewer fabs.

Jim Walker Research, V.P. Research, Semiconductor Manufacturing, Gartner
Jim Walker is a vice president of research for Gartner, where he is part of the Worldwide Semiconductor Manufacturing group within the Semiconductor Division. Mr. Walker's areas of focus are semiconductor packaging, assembly and test; printed circuit board assembly; semiconductor outsourcing services; and MEMS. He was a founding member and past national president of the Surface Mount Technology Association (SMTA), and has held memberships in the Society for the Advancement of Materials and Process Engineering (SAMPE), MicroElectronic Packaging and Test Engineering Council (MEPTEC), and the American Society for Quality Control (ASQC).

Prior to joining Gartner, Mr. Walker was the co-founder and vice president of marketing for Hana USA, an outsource semiconductor assembly and test services (OSAT) company. Before that, at National Semiconductor, Mr. Walker served in various roles including surface mount (SMT) packaging, marketing and strategy manager. Early on in his career, while at Dexter Electronic Materials and E.I. DuPont, he performed research, development, quality assurance and technical service, using polymeric materials for adhesive, composite, aerospace, electronic, and semiconductor applications.. Mr. Walker also serves or has served on the advisory boards of Advanced Packaging Magazine, MEPTEC and Surfect Technologies, a MEMS and nanotech materials/equipment company.

Mr. Walker holds a Bachelor of Science degree in chemistry from California State Polytechnic University with postgraduate work at California State University Los Angeles


Session 2: The Economics of the Technology Transitions Required for 2.5 and 3D Packaging – Can these Technologies meet the cost and densities required by Handheld Devices?

Drivers for Advanced Packaging: From 2.5D to Embedded Die, Selecting the Best Option
Semiconductor packaging and assembly is critical to the success of new designs for both high-performance packages as well as mobile devices. For high-performance devices, improved performance with lower power is important. Managing CPI have become increasingly challenging. Companies have adopted a variety of strategies, including the use of silicon interposers. Mobile devices continue to be driven by form factor. Z-height reduction is considered one of the greatest challenges. How can these goals be achieved and which package provides the best solution? This presentation examines new developments in advanced packages, focusing the merits of various packaging options ranging from 2.5D to embedded die solutions (including fan-out WLP) for each area.

E. Jan Vardaman, President, TechSearch International
E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided analysis on technology and market trends in semiconductor packaging since 1987. She is co-author of How to Make IC Packages (published in Japanese by Nikkan Kogyo Shinbunsha), a columnist with Circuits Assembly Magazine, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She served on the NSF-sponsored World Technology Evaluation Center study team involved in investigating electronics manufacturing in Asia and on the U.S. mission to study manufacturing in China. She is a member of IEEE CPMT, IMAPS, IPC, MEPTEC, and SEMI. She received the “Die Products Industry Achievement Award,” at the 14th Annual International KGD Packaging and Test Workshop in September 2007. She was elected to two terms on the IEEE CPMT Board of Governors. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.

Glass Platform for Electronic Applications: Opportunities and Challenges
Interest in glass for widespread use as carrier wafers and electronic substrates has undergone a recent revival due to advances in glass composition and processing technology, technical and cost limitations of traditional (ceramic, Silicon, and organic) materials, and potential cost benefits from economies of scale and fusion forming. As technical and reliability issues continue to be addressed, the economics of glass-based products and processes should be considered through analysis of market, product, and conversion/changeover costs. This presentation will overview applicable glass carrier and substrate markets, example products, trade-offs for existing infrastructures, supply chain challenges, and commonly accepted metallized substrate price bogeys.

Gene Smith, Program Manager - Semiconductor Glass Products, Corning
Gene joined Corning Incorporated in 2001 as a Sales Engineer with Corning Cable Systems and in 2012, was named Commercial Director for the Willow Glass® Program (ultra-thin, flexible glass delivered in roll format) at Corning Incorporated. In 2013, Gene assumed his current role as Program Manager of the Semiconductor Glass Program developing and introducing glass solutions to the semiconductor industry. Gene received his Bachelor of Science degree in Industrial Engineering from Clemson University, and his Master of Business Administration degree from the University of Georgia.

Transition From TSV Prototyping to High Volume Manufacturing
Topic overview:

  • a brief history of through silicon via (TSV) development
  • prototyping stage of TSVs
  • cost-reduction stage of TSVs
  • high-volume manufacturing of TSVs

Sergey Savastiouk, Ph.D., CEO, ALLVIA
Sergey Savastiouk, Ph.D. is the founder and CEO of ALLVIA, Inc., the first TSV foundry which has been commercializing its TSV capabilities for the semiconductor, RF and MEMS industries. He received his Ph.D. in EE from Moscow University and began his carrier as a Professor at Santa Clara University in 1993. In 1996 in his business plan Dr. Savastiouk introduced the term - Through Silicon Vias (TSV) which is now widely used in the semiconductor and MEMS industries. He also published the term - TSV in Solid State Magazine in January 2000. Dr. Savastiouk is an author of numerous articles and patents on TSV processes, equipment and applications.

Large Panel Core Technology for 2.5D and 3D Packaging Designs
A new generation of packaging designs is being developed to meet demands for higher performance and integration of heterogeneous integrated circuits (ICs) with electrical and optical interconnects. Major recent breakthroughs have been in the areas of borosilicate glass for superior optical transparency, dielectric properties, and thermal expansion matching with silicon. The borosilicate glass utilized in the recent breakthroughs is used extensively in LCD front panels, as well as backing for large silicon thinning, thus providing the availability of a large size, consistent high quality wafer with competitive pricing, which provides a highly reliable source of high quality glass as a foundation for the technology. 300mm to 500mm diameter wafer level packaging solutions can be met today with the Core Technology platform that has been developed.

Large glass panel processing has several benefits: (1) it provides a path to scalability offering a low cost process, (2) it allows options for multiple types of foundry applications – wafer level and die level, and (3) for die level foundry infrastructure, the die are maximized onto a large panel rather than wafer level processing. Keys to success for large glass panel implementation in next generation electronic packaging are related to both business and technical. From a technical perspective, drilling small holes (similar in diameter as the silicon via in the active IC region), mechanically strengthening the glass for handling, and creating hermetic vias in the glass. From a business perspective, supply chain integration of a large glass interposer poses the largest challenge. The presentation will primarily focus on supply chain integration methods and options and which can be scaled to large panel processing. Trade-offs to other materials technologies will also be discussed as they relate to the pros/cons of glass and competitive solutions.

Tim Mobley, CEO, Triton MicroTechnologies, Inc.
Tim Mobley is currently the co-founder and CEO of Triton MicroTechnologies, Inc. and is responsible for business and engineering development and has 12 years of experience with RF module development and packaging. Prior to Triton, Tim worked at DuPont in LTCC and PWB materials development as a microwave design engineer and business development and worked at Raytheon Missile Systems on system level RF design and manufacturability. He is the author of over 25 published technical papers and has 4 patents, and has BS in Physics, MS in Electrical Engineering, and Exec MBA.

Shintaro Takahashi, Manager at Business Planning Office, Asahi Glass Co.
*Current Title/Job Responsibilities - Manager at Business Planning Office, Electronics Company, Asahi Glass Co., Ltd.. - Responsible for Business Planning especially for semiconductor and packaging industry. *Previous Work History (names of companies and number of years - I have 9 years experience of LCD packaging technology such as Chip on Glass, Chip on Flex, Lead-free soldering, etc, at former OPTREX Co., LTd. (AGC’s group company). - I have 5 years experience of business planning, incubation, marketing for electronics industry at AGC. *Education (degrees and schools)- Master of Quantum Science and Energy Engineering

Market Drivers, R&D Progress & Manufacturing Infrastructure Readiness for Glass Interposers & Packages
Glass interposers started in a big way as a promising technology for 2.5D and 3D integration, combining organic packaging benefits of low electrical loss and low cost from large panel processing with the high interconnect density of silicon interposers. However, there is a growing belief that glass could be a pervasive packaging platform, continuing the tradition of ceramic and organic packaging. However, the adoption of such a new paradigm in packaging of ICs and systems requires a perfect storm of three different factors, namely, (a) compelling applications drivers and market pull, (b) collaborative and timely R&D investment to overcome the inevitable technical challenges, and (c) a complete supply chain willing to invest in scale up from prototypes to low and high volume manufacturing. This talk will start by establishing compelling value propositions for glass in a number of applications, followed by a brief summary of pre-competitive R&D from the global industry consortium on glass at Georgia Tech, and end with an outlook for potential paths to volume manufacturing of glass interposers and packages, as well as highlight some of the prototyping efforts already underway in wafer and large panel formats.

Venky Sundaram, Georgia Tech. PRC.
Dr. Venky Sundaram is the Associate Director of Industry Programs at the 3D Systems Packaging Research Center, Georgia Tech, one of the largest packaging R&D centers in the world. He has more than sixteen years of experience in semiconductor and systems packaging technology. He currently directs the largest Low Cost Glass Interposers & Packages (LGIP) industry R&D consortium in the world, with more than 30 active industry members, spanning material and tool suppliers to packaging companies and end users. He is a globally recognized expert in 3D systems packaging, and has pioneered major technologies including embedded RF passives in organic substrates, chip-last die embedding and glass interposers. He earlier co-founded Jacket Micro Devices, an RF/wireless module technology start-up, acquired by AVX. Dr. Sundaram has more than fifteen US and international patents issued, and several more patents pending, with several licensed to leading corporations around the world. He currently serves on the Executive Council of IMAPS, the Advanced Packaging Committee of SEMI, the Editorial Advisory Board of Chip Scale Review, and is the co-chair of the IEEE CPMT Technical Committee on High Density Substrates & Interposers.


Register On-Line | Hotel Reservations
Device Packaging Conference 2014
Spring Golf Invitational | Texas Hold'em Tournament

Early Registration & Hotel Deadlines: February 7, 2014




Hotel Reservation Deadline - February 7, 2014

Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

IMAPS Discounted Single/Double Room Rate: $162 + Taxes

On-Line Reservations

Phone Reservations: (480) 789-5300
Mention IMAPS or IMAPS Device Packaging when booking by phone

Hotel Scams Alert!
All reservations should be made directly with the hotel and within the IMAPS room block. We are not using a housing company. If any person or firm contacts you and offers to handle your reservations, please beware. They are completely unauthorized and possibly fraudulent. The convention industry is currently plagued by such groups. If you use one of them and experience any problems, including lost deposits and no reservation when you arrive, IMAPS may not be able to assist you. Please be aware in particular of one of these unauthorized firms – Exhibition Housing Services – whose salespeople have falsely claimed to be calling from IMAPS.

The only way to book a room in the official IMAPS Housing Block using the reservations information above.



If you have questions about the Global Business Council or would like to get more involved, please contact:

Michael O'Donoghue
IMAPS Executive Director



IMAPS Global Business Council | 611 2nd St, NE | Washington, DC 20002 | 202-548-4001