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3rd Annual IMAPS
Advanced Technical Workshop

HIGH SPEED DIGITAL INTERCONNECTS

 January 14-16, 2001
Radisson Resort & Spa Scottsdale
7171 North Scottsdale Rd.
Scottsdale, A
rizona  85253-3639
Phone: (480) 991-3800

 

Call the hotel to check for availability. 

 

On-line registration is closed!!
Click the URL below to print a r
egistration form for in-person registration
http://www.imaps.org/forms/hispeed2001regist.htm


SESSION INFORMATION 

 

Sunday, January 14, 2001

 

Registration/ Reception/Dinner: 6:30 PM – 8:30 PM

 

8:30 PM

Opening Remarks

Richard Sigliano, VP Sales and Marketing, Zecal

Dr. Jeff Cain, Cisco

Dan Amey, DuPont

9:00 PM

 

Keynote Presentation

TBA

 

Monday, January 15, 2001

 

 


Continental Breakfast: 8 AM – 9 AM

  Session I: Optical Network/Router Level Issues

9 AM - Noon
Session Chairs:

Jeff Cain, Cisco Systems
Tim LeClair, Applied Micro Circuits Corp. 

Next Generation Router Packaging?

Jeff Cain- Cisco

Electrical and Thermal Issues OC-192 and OC-768 Packaging

Arne Knudsen, Paul Garland, Jerry Acquirre, Mark Eblen, Mark Patterson and Ben Velsher, Kyocera America

Packaging Issues for the High Speed Digital Optical Networks

Dr. Andrew A. Shapiro, Broadcom

 

TBA

Conexant/AMCC 

TBA

Vitesse

LUNCHEON: NOON – 1 P.M.

 Session II: GHz Microprocessor Packaging

1 P.M. – 2:30 P.M.
Session Chair:

Richard Sigliano, Zecal

TBA

TBA- Sun

Comparison of the Interconnected Mesh Power System (IMPS) and Buried Stripline Interconnect Topologies in Microprocessor Packages L. Schaper and M. Glover, University of Arkansas;
M. Kabumoto, Kyocera Corp.

Low Inductance Decoupling Solutions for Over 1 GHz Computing

Dr. Robert Heistand, Dr John Galvagni, Joe Rana, AVX

BREAK: 2:30 P.M. – 3 P.M.

 Session III: Thermal

3 P.M. – 4:30 P.M.
Session Chair:

Dan Amey, DuPont Photopolymer & Electronic Materials 

THERMAL PERFORMANCE OF MULTILAYER LTCC GREEN TAPE CERAMIC AND PWB MATERIALS

Dan Amey, DuPont Photopolymer & Electronic Materials

 

New Approaches to Thermal Management in LTCC: Ceramic MEMS

Dr. W. Kinsy Jones, Florida International University

High Thermal Conductivity Packaging

Chris Wolf, Cirqon Inc.

 

Tuesday, January 16, 2001

  

 

CONTINENTAL BREAKFAST: 8 A.M – 9 A.M.

 

 Session IV: Design, Test, Tools and Modeling

9 A.M. – NOON
Session Chair:

Dr. Eric Bogatin, BOGATIN ENTERPRISES 

Practical Modeling of Lossy Transmission Lines Using TDR

Steven D.Corey and Dima Smolyansky-

Time Domain Analysis Systems Inc. (TDA Systems)

Integrated Electromagnetic Field and Circuit Simulation for Signal Integrity Analysis

Jin Zhao-

Full Wave SPICE; Combining Frequency Domain Effects in Transient Simulation

Charles Grasso, Ansoft

Three Dimensional Modeling of a OC-48 Transeiver Package

Dr. John Huang, Broadcomn

Capturing On-Chip Inductance with Hierarchical SPICE Models Goetz Leonhardt, Stephan Mueller, Michael Beattie, SUN Microsystems; Larry Pileggi, Carnegie Mellon University

  

GigaBits to the Desktop  
Convergence of Millimeterwave
Radio and Opto-Electronics Packaging
at 10's of GigaBits per Second

Click URL below to view information about the "GigaBits to the Desktop" workshop
that will immediately follow the ATW described above 
http://www.iwpc.org/High_Speed_2001.htm

Call 215/491-2113 if you have questions regarding this GigaBits workshop
or visit http://www.iwpc.org

 



© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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