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3rd
Annual IMAPS
Advanced Technical Workshop
HIGH
SPEED DIGITAL INTERCONNECTS
January
14-16, 2001
Radisson Resort & Spa Scottsdale
7171 North Scottsdale Rd.
Scottsdale, Arizona
85253-3639
Phone:
(480)
991-3800
Call
the hotel
to check for availability.
On-line
registration is closed!!
Click the URL below to print a registration
form for in-person registration
http://www.imaps.org/forms/hispeed2001regist.htm
SESSION INFORMATION
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Sunday,
January 14, 2001
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Registration/
Reception/Dinner: 6:30
PM – 8:30 PM
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8:30
PM
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Opening
Remarks
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Richard
Sigliano, VP Sales and Marketing, Zecal
Dr.
Jeff Cain, Cisco
Dan
Amey, DuPont
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9:00
PM
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Keynote
Presentation
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TBA
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Monday,
January 15, 2001
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Continental Breakfast: 8
AM – 9 AM
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Session
I: Optical Network/Router Level Issues
9
AM - Noon
Session
Chairs:
Jeff
Cain, Cisco Systems
Tim
LeClair, Applied Micro Circuits Corp.
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Next
Generation Router Packaging?
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Jeff
Cain- Cisco
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Electrical
and Thermal Issues OC-192 and OC-768 Packaging
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Arne
Knudsen, Paul Garland, Jerry Acquirre, Mark
Eblen, Mark Patterson and Ben Velsher, Kyocera
America
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Packaging
Issues for the High Speed Digital Optical Networks
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Dr.
Andrew A. Shapiro, Broadcom
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TBA
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Conexant/AMCC
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TBA
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Vitesse
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LUNCHEON:
NOON – 1 P.M.
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Session II: GHz Microprocessor
Packaging
1 P.M. – 2:30 P.M.
Session
Chair:
Richard Sigliano, Zecal
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TBA
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TBA-
Sun
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Comparison of the Interconnected Mesh Power System
(IMPS) and Buried Stripline Interconnect Topologies
in Microprocessor Packages |
L. Schaper and M. Glover, University of Arkansas;
M. Kabumoto, Kyocera Corp. |
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Low
Inductance Decoupling Solutions for Over 1 GHz
Computing
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Dr.
Robert Heistand, Dr John Galvagni, Joe Rana,
AVX
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BREAK:
2:30 P.M. – 3 P.M.
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Session III: Thermal
3 P.M. – 4:30 P.M.
Session
Chair:
Dan
Amey, DuPont Photopolymer & Electronic Materials
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THERMAL
PERFORMANCE OF MULTILAYER LTCC GREEN TAPE CERAMIC
AND PWB MATERIALS
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Dan
Amey, DuPont Photopolymer & Electronic Materials
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New
Approaches to Thermal Management in LTCC: Ceramic
MEMS
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Dr.
W. Kinsy Jones, Florida International University
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High
Thermal Conductivity Packaging
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Chris
Wolf, Cirqon Inc.
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Tuesday,
January 16, 2001
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CONTINENTAL
BREAKFAST: 8 A.M – 9 A.M.
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Session IV: Design, Test,
Tools and Modeling
9
A.M. – NOON
Session Chair:
Dr.
Eric Bogatin, BOGATIN ENTERPRISES
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Practical
Modeling of Lossy Transmission Lines Using TDR
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Steven
D.Corey and Dima Smolyansky-
Time
Domain Analysis Systems Inc. (TDA Systems)
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Integrated
Electromagnetic Field and Circuit Simulation
for Signal Integrity Analysis
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Jin
Zhao-
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Full
Wave SPICE; Combining Frequency Domain Effects
in Transient Simulation
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Charles
Grasso, Ansoft
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Three
Dimensional Modeling of a OC-48 Transeiver Package
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Dr.
John Huang, Broadcomn
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Capturing On-Chip Inductance with Hierarchical
SPICE Models |
Goetz Leonhardt, Stephan Mueller, Michael Beattie,
SUN Microsystems; Larry Pileggi, Carnegie Mellon
University |
GigaBits to
the Desktop
Convergence
of Millimeterwave
Radio and Opto-Electronics Packaging
at 10's of GigaBits per Second
Click URL below to view information
about the "GigaBits to the Desktop" workshop
that will immediately follow the ATW described above
http://www.iwpc.org/High_Speed_2001.htm
Call 215/491-2113 if you have questions
regarding this GigaBits workshop
or visit http://www.iwpc.org
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