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International Conference on
High Temperature Electronics (HiTEC 2006)

download program pdf


Hilton of Santa Fe
Santa Fe, NM
May 15 - 18, 2006

Conference Events and Technical Program
May 15-18, 2006
Tabletop Exhibition
May 16-17, 12006


Early Registration Cut-off and Hotel Deadline: April 14, 2006

Sponsored by:
International Microelectronics And Packaging Society (IMAPS)
The Air Force Research Laboratory, WPAFB
Sandia National Laboratories
Jet Propulsion Laboratory

General Chair: R. Wayne Johnson, Auburn University
General Co-Chair: Randy Normann, Sandia National Laboratories

Technical Chair: Patrick McCluskey, University of Maryland
Technical Co-Chair: Susan L. Heidger, Air Force Research Laboratory


Register On-Line | Hotel | PDF of Program


Message from the Chairs:
The members of the Conference Committee are pleased to invite you to the IMAPS High Temperature Electronics Conference (HiTEC 2006).

This is the premier event addressing the needs of the high temperature electronics community. Applications for high temperature electronics include underhood automotive, oil well logging, geothermal, more electric aircraft, space, industrial sensors, etc.

HiTEC 2006 provides a comprehensive technical program addressing the applications, and the latest development in devices, circuits, MEMS, sensors, packaging, power sources, and materials to address the challenges of these applications.

Tabletop exhibits will complement the technical program by providing you an opportunity to view the latest products for high temperature electronics.

This is a truly unique opportunity for suppliers, fabricators, and users to meet and talk about the needs, issues and opportunities in this exciting and important area.

Please join us in wonderful Santa Fe, New Mexico for HiTEC 2006.

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Monday, May 15

Registration: 4 pm – 6:30 pm

Opening Reception: 5:15 pm – 6:30 pm

Tuesday, May 16

Registration: 7:00 am – 7:30 pm

Continental Breakfast: 7:00 am – 8:00 am

Exhibit Hours: 10:00 am – 7:30 pm
Refreshment Breaks, Lunch and Reception in the Exhibit Hall

Reception in the Exhibit Hall: 5:30 pm – 7:30 pm

Opening Remarks: 8:00 am – 8:10 am
Conference Chairs

Plenary Session
Chair: Clarence Severt, USAF, AFRL/PRPE

8:10 am – 12:40 pm

Deep Drilling Frontiers Drive Key Technology Advancements
Mike Payne, BP America Inc.

Applications of High Temperature Electronics in Space Exploration
Elizabeth Kolawa, Jet Propulsion Laboratory

A Case for High Temperature Electronics for Aerospace
Ishaque Mehdi, Kamiar Karimi, Arthur Brockschmidt, The Boeing Company

Break in Exhibit Hall: 10:10 am – 10:40 am

High Temperature & Thermal Management Needs for the FreedomCar Program
Laura Marlino, Oak Ridge National Laboratory

HTHV for the Electric Power Grid
Stan Atcitty, Sandia National Laboratories

Development of the Smart Field
Larry Lake, University of Texas

Lunch in Exhibit Hall: 12:40 pm – 2:00 pm

TP1 - Sensors I
Chair: Ali Sayir, NASA Glen Research Center

2:00 pm – 5:00 pm

Sensor Amplifier for the Venus Ground Ambient
Linda Del Castillo, Travis Johnson, Toshiro Hatake, Mohammad Mojarradi, Elizabeth Kolawa, Jet Propulsion Laboratory

Performance of MEMS-DCA SiC Pressure Transducers under Dynamic Conditions
Robert S.Okojie, E.L.Benavage, S.M. Page, Jonathan Smith, Mitch Wolff, NASA Glen Research Center

A Novel Designed Thermal Vacuum / Pressure Sensor
Xiaojuan Wang, Laurence P. Sadwick, Jing-Yi Huang, The University of Utah

TP2 - Packaging I
Chair: Joseph Weimer, Air Force Research Laboratory

2:00 pm – 5:00 pm

An Advanced Packaging Approach of SiC High Temperature Power Electronics Modules by Embedding Chip Interconnection
Zhenxian Liang, Jian Yin, Jacobus Daniel van Wyk, Virginia Tech

High Temperaure Considerations in SiC Power Converter Design - Package Design & Results
Leo F. Casey, Gregg Davis, Jim Connell, SatCon Technology Corp.

Si3N4 Based Thick Film Modules for 300C Applications
R. Wayne Johnson, Michael Palmer, Auburn University

Break in the Exhibit Hall: 3:15 pm – 3:45 pm

Parametric Stability and Failure Mechanisms of Silicon Carbide Pressure Sensors
Robert S.Okojie, P.Nguyen, V.Nguyen, E.Savrun, E.L.Benavage, D.Lukco, J.Buehler, T.McCue, NASA Glen Research Center

Layered Structured La2Ti2O7 as a High Temperature Piezoelectric
Ali Sayir, Serene C. Farmer, Fred Dynys, NASA Glen Research Center

A 300ºC Silicon Carbide Light-Off Detector for Aircraft Engines
Vijayaraghavan Madhuravasal, Chriswell Hutchens, Chia Ming Liu, Steven Morris, Harmik Der Sahakian, John Klaser, Herb Swanson, Oklahoma State University

Reliability of High Temperature Solder Alternatives
F. Patrick McCluskey, Z. Wang, M. Dash, University of Maryland; D. Huff, Virginia Tech.

High-Temperature Bonding of Power Semiconductor Devices
Bryan E. Koene, Stephane Evoy, Andrew Murray, Luna Innovations; F. Patrick McCluskey, University of Maryland

Low-Temperature Sintering of Nanoscale Silver Paste: A Lead-free Die-Attach Solution for High Performance and High Temperature Electronic Packaging
John G. Bai, Z. Zhang, J. Calata, G. Lei, G. Q. Lu, Virginia Tech

Interactive Forum (Poster Session) – Exhibit Hall
Chair: F. Patrick McCluskey, University of Maryland

5:30 pm – 7:30 pm

High Temperature SOS Varactor Modeling
Jianning Wang, Yumin Zhang, Steven A. Morris, Srinivasan Venkataraman, Chris Hutchens, Oklahoma State University

High Temperature Silicon on Insulator (SOI) Deep Submicron Device Performance
Vijayaraghavan Madhuravasal, Jianning Wang, Xyunu Zhu, Yumin Zhang, Chriswell Hutchens,Jeremy D. Popp, Bruce W. Offord, Oklahoma State University

Low Power Two-Path Decimation Filter Design and Implementation on Silicon-On-Sapphire (SOS) Process for High Temperature Application
Chia-Ming Liu, Chriswell Hutchens, Oklahoma State University

High Temperature Silicon On Sapphire (SOS) Analog Circuit Design Techniques and Building Blocks
Chia-Ming Liu, Chriswell Hutchens, Oklahoma State University

High Temperature Delta-Sigma Analog-to-Digital Converter Implemented on Silicon-On-Sapphire (SOS) Process for Measurement while Drilling Application
Chia-Ming Liu, Chriswell Hutchens, Roger Schultz, Oklahoma State University

High Temperature SOS Cell Library
Usha Badam, Chia-Ming Liu, Vinay Chitturi, Chris Hutchens, Roger Schultz, Oklahoma State University

Design of a High Temperature Switched Mode Power Supply Employing a V2 Control Mechanism
Bharath Rayakota, Steven Morris, Chris Hutchens, Roger Schultz, Oklahoma State University

Kirchoff’s Law Analysis of GaAs MESFETs and Related Devices at High Temperatures
Xiaojuan Wang, Laurence P. Sadwick, The University of Utah

A Room Temperature to 300°C Enhanced Curtice Model with General Applicability to Field Effect Transistors
Xiaojuan Wang, Laurence P. Sadwick, The University of Utah

Design of a High-Temperature, Small Area Digital Filter on a FPGA
Bijan Houle, Vishu Gupta, Herbert L. Hess, University of Idaho; Randy Normann, Sandia National Laboratories

High Temperature Characterization of a Low Power HT SOI 80C51
Philippe Manet, Bavid Bol, Renaud Ambroise, Marc Baltus, Laurent Demeus, Jean-Didier Legat, Université Catholique de Louvain

A High Temperature RFID Device with 8 Kbyte Memory using COTS Parts
Steven A. Morris, Chris Hutchens, Oklahoma State University

Hermetically Packaged Fiber Optic Fabry-Perot Interferometric Sensor and Time-Domain Coherence Switching Interrogation Technique for High Temperature Applications
Hai Xiao, Junhang Dong, Ming Luo, New Mexico Institute of Mining and Technology; Randy A. Normann, Sandia National Laboratories

Development of Silicon Spacer DDP
Shin Kim, Dong Gil Shin, Ho Gyu Yoon, Samsung Electronics Co., Ltd.

Composite Die-Attach Materials for High-Temperature Packaging Applications
Gorindarajan Muralidharan, Terry N. Tiegs, Oak Ridge National Laboratory; R. Wayne Johnson, Auburn University

 

Wednesday, May 17

Registration: 7:00 am – 5:00 pm

Continental Breakfast: 7:00 am – 8:00 am

Exhibit Hours: 10:00 am – 3:00 pm
Refreshment Breaks and Lunch in the Exhibit Hall

Opening Remarks: 8:00 am – 8:05 am
Conference Chairs

Keynote Presentation: 8:05 am – 8:45 am
JIP - Deep Trek Update
Bruce Ohme, Honeywell Defense & Space Electronics Systems

WA1 - HT Integrated Circuits I
Chair: Harold Snyder, Physical Solutions

8:45 am – 10:00 am

Development of a HT Diagnostics-While-Drilling (DWD) Tool
Joseph A. Henfling, Randy Normann, David Chavira, Doug Blankenship, Sandia National Laboratories

A Proposed 68HC11 Chip Set for 275 Degrees C
Chriswell Hutchens, Steven A. Morris, Chia-Ming Liu, Oklahoma State University

A Quadruple Output 225C 7.3 Watt Isolated Switch Power Supply
Harold L. Snyder, Jr., Physical Solutions

Keynote Presentation: 8:05 am – 8:45 am
Extreme Environment Electronics
Thomas Hertel, Pratt & Whittney, Rocketdyne

WA2 - Emerging Technologies I
Chair: Don Shiffler, AFRL/DEHP

8:45 am – 10:00 am

Investigation of Diamond Films at High Power & High Temperatures
Susan Heidger, Jacob K. Matthews, Howard E. Smith, Air Force Research Laboratory

High Temperature Operation of Nanodiamond Lateral Vacuum Field Emission Device
J. L. Davidson, K.Subramanian, W.P. Kang, B.K. Choi, M. Howell, Vanderbilt University

Thermal Properties of Freestanding Diamond Resistors
Puteri S.M. Hamari, P. Taylor, J. L. Davidson, W. P. Kang, Vanderbilt University

Break in the Exhibit Hall: 10:00 am – 10:25 am

WA3 - HT Integrated Circuits II
Chair: Chris Hutchens, Oklahoma State University

10:25 am – 12:30 pm

A High Temperature Silicon Carbide (SiC) Multichip Power Module (MCPM) Inverter for Down-hole Applications
J.Hornberger, B. McPherson, E. Cilio, R. Schupbach, A. Lostetter, A. Mantooth, APEI, Inc.

An SOI Precision Voltage Reference & Bias Cicuitry for Operation to 250C
Bruce Ohme, Mark R. Larson, Honeywell Defense & Space Electronics Systems

A Silicon Carbide based 350C Voltage Reference
Harold L. Snyder, Jr., Physical Solutions

A Comparison of High Temperature Performance of SiC MOSFETs and JFETs
Sei-Hyung Ryu, Sumi Krishnaswami, Husna Fatima, Bradley Heath, James Richmond, Anant Agarwal, John Palmour, Cree, Inc.; James Scofield, Air Force Research Laboratory

Performance Analysis of SOI Based Power Converter for Offline Application at >200°C
Sunny Liu, Carsten Deppe, Ulrich Boeke, Georg Sauerlaender, Philips Research

WA4 - Emerging Technologies II
Chair: Jim Scofield, AFRL/PRPE

10:25 am – 12:30 pm

Internal CVD Diamond Thermal Vias for High Heat Flux Spreading in CTE-Compatible Semiconductor Package Components
David L. Saums, DS&A LLC; Brian Edward, Pete Ruzicka, Sensis Corporation; Kevin P. Fennessy, CPS Technologies Inc.; Glenn J. Sundberg, University of Massachusetts - Lowell; Jerry Zimmer, sp3 Diamond Technologies Inc.

Atmospheric Pressure Growth of Bulk GaN for Substrates for High Temperature
Karen Waldrip, Sandia National Laboratories

GaN and ZnO Based Electronic & Optoelectronic Devices for Very High Temperatures
Amir M. Dabiran, Andrei Osinsky, Andrew Wowchak, Peter Chow, Steve Pearton, Rohit Khanna, Fan Ren I.I. Kravchenko, SVT Associates, Inc.

AlGaN/GaN MODFET Device for High Temperature Applications
Hasina F. Huq, Syed K. Islam, Leon M. Tolbert, University of Tennessee

High Temperature Simulation of and Comparison with Experimental Data of the Thermally Electrically Enhanced Substrate Leakage in GaAs MESFETs
Xiaojuan Wang, The University of Utah

Lunch in the Exhibit Hall: 12:30 pm – 2:00 pm

Keynote Presentation: 2:00 pm – 2:40 pm
European HT Activities

Colin Johnston, HITEN

Break in the Exhibit Hall: 2:40 pm – 3:00 pm

WP1 - HT Integrated Circuits III
Chair: Bruce Ohme, Honeywell Defense & Space Electronics Systems

3:00 pm – 4:40 pm

Building Robust 350C Test Fixtures
Randy Normann, Don Davis, Paul Vianco, Sandia National Laboratory

Conduction Heat for Lead-Free Soldering - SIMPLE, EFFICIENT, ECONOMICAL
Sigurd R. Wathne, Sikama International, Inc.

Ultra Low-Power 9-bit A/D Converter for Harsh Environments
Laurent Demeus, V. Dessard, L. Vancaillie, G. Picun, Cissoid s.a.

Development of a Non-Volatile Memory Meeting Automotive Temperature & Reliability Requirements and Results
Mammen Thomas, Jagdish Pathak, Jim Payne, Friedrich Leisenberger, Ewald Wachmann, Andreas Wiesner, MEMTEK, LLC

WP2 - Packaging II
Chair: R. Wayne Johnson, Auburn University

3:00 pm – 5:30 pm

Reusable Packaging for High Temperature (800C) and High Pressure MEMS
Alois Friedberger, S.Fricke, T.Ziemann, E.Rose, G.Muller, D.Telitschkin, S.Ziegenhagen, H.Seidel, U.Schmid, EADS (European Aeronautic, Defense and Space Company)

Lean Process for High Temperature Hybrid Assemblies
Milton Watts, Quartzdyne, Inc.

A 500C Electronic Package Technology for Continuous Operation in Extreme Environments
Larry P. Sadwick, J. H. Chern, R. Nelson, R. J. Hwu, InnoSys, Inc.

Managing the Heat
Ed Greenwood, Alchemetal Corp.

Lead-free Assemblies in High Temperature Applications
Anupam Choubey, J. Wu, S. Ganesan, M. Pecht, A. Leal, J. G. Labanda, L. Beneteau, University of Maryland

Reliability & Failure Analysis of Dummy IGBT Assemblies using Liquid Solder Joints under Thermal Cycling
Jianfeng Li, Samjid H.Mannan, Mike P. Clode, David N. Fenner, David C. Whalley, Keming Chen, King's College – London

Thursday, May 18

Registration: 7:00 am – 5:00 pm

Continental Breakfast: 7:00 am – 8:00 am

Opening Remarks: 8:00 am – 8:05 am
Conference Chairs

Keynote Presentation: 8:05 am – 8:45 am
A Review of High Power, High Temperature SiC Devices
Anant Agarwal, Jim Richmond, Cree, Inc.

THA1 - Silicon Carbide Discrete Devices I
Chair: Bruce Geil, Army Research Laboratory

8:45 am – 10:00 am

High Temperature Power Electronics - SiC Devices Based Applications & Issues
Leon Tolbert, Madhu Chinthavali, Burak Ozpineci, Hui Zhang, The University of Tennessee

Thermal Aging of Ti/AlNi/Au Ohmic Contacts to P-type SiC
Bang-Hung Tsao, Jacob Lawson, James Scofield, UDRI

Properties of Unipolar SiC Power Devices for Operation Beyond 200C Junction Temperature
Peter Friedrichs, SICED Electronics Development GmbH & Co.KG

Keynote Presentation: 8:05 am – 8:45 am
High Temperature Power Electronics for Future Aircraft
Joseph Weimer, Air Force Research Laboratory

THA2 - High Temperature Batteries
Chair: David Ryan, Air Force Research Laboratory

8:45 am – 10:00 am

High Temperature Power Sources for the Drilling Industry
V. R. Koch, D. M. Ryan, Covalent Associates, Inc.

Intrinsically Safe High Temperature Battery for Borehole Applications
Za W. Johnson, Brian Burns, Ron Guidotti, Electro Energy Mobile Products, Inc.

High Temperature Battery for Drilling and Logging Industry
Josip Caja, T. Don, J. Dunstan, Electrochemical Systems, Inc.

Break: 10:00 am – 10:20 am

THA3 - Silicon Carbide Discrete Devices II
Chair: Anant Agarwal, Cree, Inc.

10:20 am – 12:00 pm

High Temperature Reliability of 4H-SiC Vertical Channel Junction Field-Effect Transistors (VJFETs) for Power Conditioning System Applications
L. Cheng, P. Martin, M. S. Mazzola, V. Bondarenko, H. Causey, J. R. B. Casady, J. B. Casady, SemiSouth Laboratories, Inc.

Characterization & Packaging of SiC JFET Half Bridge Modules for Extreme Environment Motor Drives
R. Wayne Johnson, Volodymyr Bondarenko & Paul Martin, Michael S. Mazzola, Robin Kelley, Janna Casady, Auburn University

Inductive Switching of SiC Bipolar Junction Transistors for High Temperature Power Conversion
Steven Kaplan, Dimos Katsis, Timothy Griffin, US Army Research Laboratory

Switching Characteristics of a SiC-based BJT to 200C
Janis M. Niedra, Gene E. Schwarze, QSS Group, Inc.

THA4 - Capacitors I
Chair: John Witham, Sandia National Laboratories

10:20 am – 12:00 pm

High Temperature Ceramic Capacitors
Edward F. Alberta, W. S. Hackenberger, C. J. Stringer, C. A. Randall, T. R. Shrout, S. Mounce, G. Schwarze, TRS Technologies, Inc.

High Temperature Capacitor-Sodium Bismuth Titanate - Idea to Application
Walter Schulze, Conor Walsh, Gerald Wynick, Keith Bridger, Arthur Cooke, James Weigner, New York State College of Ceramics at Alfred University

Life Time Study of Two Types of Capacitors for High Temperature Applications
Oystein Dugstad, Oddbjorn Vagle, Bernt Pedersen, Roxar Flow Measurements AS

MicroPelt®: Leading Edge Thermoelectric Micro Devices Technology and Application
Bernhard Loibl, Inheco GmbH

Lunch: 12:00 pm – 1:30 pm

Keynote Presentation: 1:00 pm – 1:40 pm
High Temperature Power Electronics at ARL
Bruce Geil, Army Research Laboratory

THP1 - Passives & Packaging
Chair: Randy Normann, Sandia National Laboratories

1:40 pm – 2:30 pm

High Temperature Dielectric Properties of Aluminum Nitride
Ender Savrun, Di Wu, Sienna Technologies, Inc.

Temperature Dependent Dielectric Properties of Polycrystalline AlN Substrate with Yttria Additive
Liang-Yu Chen, Gary W. Hunter, OAI/NASA Glenn Research Center

Keynote Presentation: 1:00 pm – 1:40 pm
NSF - Earth Monitoring
Harold Tobin, New Mexico Tech

THP2 - Capacitors II
Chair: Tom Shrout, The Pennsylvania State University/TRS Technologies Inc.

1:40 pm – 2:30 pm

Passive Components and Interconnect-Pressure Cycling at High Temperature
Rolf Johannessen, Froydis Oldervoll, Truls Fallet, Stefan Schutte, SINTEF Information and Communication Technology

Microstructure & Morphology of Carbon Nitride (CNx) Thin Films for use as a High Temperature Dielectric
William Lanter, David C. Ingram, B. Allen Tolson, Charles A. DeJoseph, ISSI

Break: 2:30 pm – 2:50 pm

THP1 continued - Passives & Packaging
Chair: Randy Normann, Sandia National Laboratories

2:50 pm – 4:05 pm

300ºC Magnetics - From Development to Practical Aspects
Arthur Brockschmidt, Ishaque Medhi, The Boeing Company; Russ Spyker, AFRL/PRPE; Joe Huth, Spang Corporation

High Temperature Conformal Coatings
Steven D. Knudsen, Sandia National Laboratories

High Temperature Polyimide Cure Optimization & Study of its Potentialities for High Voltage 4H SiC Device Passivation
Sombel Diaham, Marie-Laure Locatelli, Samir Zelmat, Thierry Lebey, Vincent Bley, Laboratoire de Genie Electrique de Toulouse

THP3 - Emerging Technologies III
Chair: Susan Heidger, Air Force Research Laboratory

2:50 pm – 4:30 pm

SSVDs: 500 C Electronics for Extreme Environmental Applications
Larry P. Sadwick, J. H. Chern, R. J. Hwu, L. Del Castillo, T. W. Johnson, M. M. Mojarradi, InnoSys, Inc.

Active Cooling Technology for Aerospace Controls & High Power Density Electronics
Kenneth Semega, Air Force Research Laboratory

High Temperature Water Heat Pipes
David B. Sarraf, William G. Anderson, Advanced Cooling Technologies, Inc.

An Effectual Approach to Substantial Cost Savings...The Utilization of Advanced Commercially available Polymers in Military Fiber Optic Applications
Gregory T. Daly, Lockheed Martin Maritime Systems & Sensors


HOUSING (Hotel Cut-off is April 14, 2006)
Housing Accommodations must be made directly to:

Hilton of Santa Fe
100 Sandoval Street
Santa Fe, NM 87501-2131
Ph: 505-988-2811 or 800-336-3676
www.santafe.hilton.com

Single/Double - $159

To reserve room on-line, go to
www.santafe.hilton.com
Enter your arrival & departure dates, click Go.
Enter “IMA” in the field for Group/Convention Code and
continue through making your reservation.

To reserve room by Phone:
Please reference IMAPS when making reservation by phone.



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IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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