Members Only
Events Calendar
Online Store
Global Business Council
Industry News
IMAPS Microelectronics Foundation
Contact Us

International Conference on
High Temperature Electronics
(HiTEC 2012)

May 8-10, 2012
Albuquerque Marriott Pyramid North
5151 San Francisco Rd NE
Albuquerque, New Mexico 87109 USA

Conference Events and Technical Program
May 8-10, 2012
Tabletop Exhibition
May 8-9, 2012

General Co-Chairs:
Wayne Johnson, Auburn University -
Colin Johnston, Oxford Applied Technology – UK -

Technical Co-Chairs:
Susan L. Heidger, Air Force Research Laboratory -
F. Patrick McCluskey, University of Maryland -
Randy Normann, Perma Works, LLC -

Purchase HiTEC 2012 Proceedings CD-Rom | Download PDF Program
Tabletop Exhibit Information | 2012 Exhibitors

Technical Program

Tuesday, May 8

Registration: 7:00 am - 6:30 pm

Breakfast: 7:00 am - 7:45 am

Opening Remarks: 7:45 am - 8:00 am
Conference Chairs

Exhibit Hours: 11:30 am - 6:30 pm
(Afternoon Refreshment Break, Lunch & Reception will be held in the Exhibit Area.)

Plenary Talk: 8:00 am - 8:40 am
Title: Air Force Basic Research in Materials for Extreme Environments

Speaker: Ali Sayir, Air Force Office of Scientific Research

Session TA1: Silicon Devices
Chair: Dave Ganesan,VLSIP Technologies, Inc.
9:00 am - 11:20 am

High-Temperature, Bulk-CMOS Integrated Circuits for a Distributed Control System-Performance Results
Dan Howe, Scientific Monitoring, Inc. (Steve Majerus, Walt Merrill; Steve Garverick, Case Western Reserve University; Ken Semega, Air Force Research Laboratory)

A Design Paradigm to Facilitate Multiple Parts from a Single Silicon Design
Richard N. Rea, Jr., RelChip (Rajesh Gopalakrishnan, Marshall Soares)

Characterization and Reliability of Custom Digital ASIC Designs using a 0.8µm Bulk CMOS Process for High Temperature Applications 
Mark Watts, Quartzdyne Inc. (Shane Rose)

Session TA2: Joining and Bonding - 1
Chair: Colin Johnston, Oxford Applied Technology - UK
9:00 am - 11:50 am

Transient Liquid Phase Soldering for Lead-Free Joining of Power Electronic Modules in High Temperature Applications
Christian Ehrhardt, Fraunhofer IZM (Matthias Hutter, Hermann Oppermann, Klaus-Dieter Lang)

Microstructural Evolution and Thermal Stability Characterization of a High Temperature Die Attach Lead-Free System
Rogie I. Rodriguez, University of Puerto Rico - Mayaguez (Pedro Quintero, Dimeji Ibitayo)

Highly Reliable Double-Sided Bonding used in Double-sided Cooling for High Temperature Power Electronics
Sang Won Yoon, Toyota Research Institute of North America (Koji Shiozaki; Michael D. Glover, University of Arkansas - HiDEC; H. Alan Mantooth, University of Arkansas - NCREPT)

Break: 10:30 am – 10:50 am

Low Power, Latch-Up Immune High Temperature Digital Components Fabricated with HardSILTM Technology on Bulk Silicon
David Duff, Silicon Space Technology (Wes Morris, Kevin Atkinson, J. W. Smith, Paul Torgerson, Rex Lowther, David Gifford)

Reliability of Electronics Assembled using SAC+Zn Solder Pastes
Samjid Mannan, King's College London (Hiren Kotadia, Arun Panneerselvam, Mark Green, M.P. Clode, S.H. Mannan; H. Steen, Henkel, Ltd.)

A Drop-in Die-Attach Solution for the High Temperature Lead-Free BiAgX Solder Paste System
HongWen Zhang, Indium Corporation of America (Ning-Cheng Lee)

Lunch in Exhibit Area: 11:50 am - 1:00 pm

Session TP1: Devices
Chair: Bruce Ohme, Honeywell
1:00 pm - 4:20 pm

A High Temp Standalone 4MByte Flash Memory with SPI Interface for 210°C Applications
Wade VonBergen, Texas Instruments (Madhu Basude)

Characterization of Vectron PX-570 Crystal Oscillator for Use in Harsh Environments
Jacob Li, Vectron International (Richard L.Patterson, Ahmad Hammoud)

An Ultra-Low Noise Instrumentation Amplifier Designed for High Temperature Applications
Jeff Watson, Analog Devices (Gustavo Castro)

High Temperature Anti Short Circuit Function for Normally-on SiC JFET in an Inverter Leg Configuration 
Khalil El-Falahi, Universite de Lyon, Ampere, INSA Lyon (Fabien Dubois, Dominique Bergogne, Luong-Viet Phung, Cyril Buttay, Bruno Allard)

Session TP2: Joining and Bonding - 2
Chair: Govindarajan Muralidharan, Oak Ridge National Laboratory
1:00 pm - 4:20 pm

SLID Bonding for Energy Dense Applications - Thermo-Mechanics
Andreas Larsson, SINTEF (Torleif Andre Tollefsen)

Eutectic Zn-Al Die Attachment for Higher Tj SiC Power Applications: Fabrication Method and Die Shear Strength Reliability
Satoshi Tanimoto, R&D Partnership FUPET (Kohei Matsui, Yusuke Zushi, Shinji Sato, Yoshinori Murakami, Masato Takamori, Takashi Iseki)

Determination of the Creep Properties of Pb-Free Solders for Harsh Environments Using Meso-Scale Testing
Sophie Godard Desmarest, University of Oxford (C. Johnston, P. S. Grant)

Durability of Microalloyed Lead-Free Solder under Combined Thermal Cycling and Vibration
F. Patrick McCluskey, University of Maryland (Michael Crandall)

Break in Exhibit Area: 3:00 pm - 3:20 pm

VEGA & RIGEL: New Tiny High Temperature Adjustable Voltage Regulators for Reduced PCB Footprint and Extended Reliability of Medium and High Temperature Systems 
Pierre Delatte, CISSOID S.A. (Etienne Vanzieleghem, Thomas Francois, Jean-Christophe Doucet)

Suppressing Temperature Induced Voltage Offset Drifts in Silicon Carbide Pressure Sensors
Robert Okojie, NASA Glenn Research Center (Dorothy Lukco, Vu Nguyen, Ender Savrun)

Improved Process for High Temperature Large-Area Sintered Nanosilver Device Attachment
Kewei Xiao, Virginia Tech (Jesus Calata, Hanguang Zheng, Khai Ngo, Guo-Quan Lu)

Pressureless Sintering Progression of a Silver Nanoparticle Attach Material Via Micrographic Analysis
Manuel Molina, University of Puerto Rico - Mayaguez (Pedro O. Quintero, Andres Velasco)

Reception in Exhibit Area: 5:00 pm - 6:30 pm

Wednesday, May 9

Registration: 7:00 am - 5:00 pm

Breakfast: 7:00 am - 7:45 am

Exhibit Hours: 10:00 am - 4:00 pm
(Refreshment Break & Lunch will be held in the Exhibit Area.)

Complimentary Shuttle To Old Town
6:00 pm (first departure) - 10:30 pm (last return)

Plenary Talk: 8:00 am – 8:40 am
Title: USDRIVE Partnership towards Higher Temperature Operation

Speaker: Laura Marlino, Oak Ridge National Laboratory


Student Paper Competition Award
Sponsored by:

Session WA1: SiC Power Electronics
Chair: Laura Marlino, Oak Ridge National Laboratory
9:00 am - 11:20 am

High-Temperature Characterization of a 1200 V, 450 A Power Module with 36 mm2 of SiC VJFET Area
Kevin M. Speer, SemiSouth Laboratories, Inc. (Robin Schrader, David C. Sheridan, Andrew Lemmon, Jim Gafford, Chris Parker, Michael S. Mazzola, Jeffrey B. Casady)

Development of Low RON,Diff, 12 kV, 4H-SiC GTOs for High-Power and High-Temperature Applications
Lin Cheng, Cree, Inc. (Anant K. Agarwal, Craig Capell, Khiem Lam, John W. Palmour, Victor Temple, Aderinto A. Ogunniyi, Heather K. O'Brien, Charles J. Scozzie)

Modeling of the Punch-Through Effect in Normally-On SiC JFET used in High Temperature Inverter for Aerospace Application
Fabien Dubois, Universite de Lyon, Ampere Laboratory/Hispano Suiza SAFRAN Group (Herve Morel, Dominique Bergogne, Regis Meuret)

Session WA2: Substrates
Chair: Patrick McCluskey, University of Maryland
9:00 am - 11:50 am

Investigation of Photo-Imageable Thick Film Metallization on Low Temperature Cofired Ceramics (LTCC) for Improved Packaging Density
Tan Zhang, General Electric Global Research Center (David Shaddock, Alexey Vert; Zhenzhen Shen, R. Wayne Johnson, Auburn University)

Electrical Performance of Co-Fired Alumina Substrates at High Temperatures
Liang-Yu Chen, Ohio Aerospace Institute/NASA Glenn Research Center

Effect of Sealing Material on the Reliability of Direct-Bond-Copper Substrates
Yiying Yao, Virginia Tech (Zheng Chen, Dushan Boroyevich, Khai D. T. Ngo)

Break in Exhibit Area: 10:30 am - 10:50 am

Silicon Carbide "Super" Junction Transistors Operating at 500°C 
Siddarth Sundaresan, GeneSiC Semiconductor (Ranbir Singh; R. Wayne Johnson, Auburn University)

Investigation of Thick Film Technology for High Temperature Applications
R. Wayne Johnson, Auburn University (Zhangming Zhou, Jinzi Cui, Fang Yu, Kun Fang, Zhenzhen Shen; Alexey Vert, David Shaddock, Tan Zhang, General Electric Global Research)

High Temperature Performance of Coiled Glass Capacitors
Eugene Furman, Pennsylvania State University (Amanda Baker, Steve Perini, Mohan Monoharan, Michael Lanagan, Pennsylvania State University; Douglas Kushner, Nanyan Zhang, Chen Zou, Charles Mi, Shihai Zhang, Strategic Polymers; Takashi Murata, NEG Corporation)

Lunch Break in Exhibit Area: 11:50 pm - 1:20 pm

Interactive Session with Premier Sponsors in Exhibit Hall: 1:00 pm - 1:20 pm

Premier Sponsors:

HiTEN Premier Sponsor - CISSOID
HiTEC Premier Sponsor - Fairchild Semiconductor

Session WP1: Silicon-on-Insulator
Chair: Susan Heidger, Air Force Research Laboratory

1:20 pm - 5:20 pm

Analog Component Development for 300°C Sensor Interface Applications
Bruce W. Ohme, Honeywell International, Inc. (Mark R. Larson)

SOI Based Voltage Regulator for High-Temperature Applications
Benjamin McCue, University of Tennessee (R.L. Greenwell, M.I. Laurence, B.J. Blalock, S.K. Islam; L.M. Tolbert, Oak Ridge National Laboratory)

A Cyclic RSD Analog-Digital-Converter for Application Specific High Temperature Integrated Circuits up to 250°C
Alexander Schmidt, Fraunhofer Institute for Microelectronic Circuits and Systems (Holger Kappert, Wolfgang Heiermann, Rainer Kokozinski)

High-Temperature Versatile Voltage-Mode PWM Controller
Fabien Laplace, X-REL Semiconductor (Xavier Montmayeur, Gonzalo Picun)

Session WP2: Passive Components and Batteries
Chair: Dave Shaddock, GE Global Research Center
1:20 pm - 5:20 pm

Updated Analysis of Circuit Reliability Test Results
Milton Watts, Quartzdyne, Inc. (Mark Hahn)

High Temperature Ageing of Fe-based Nanocrystalline Ribbons 
Christian Martin, Universite de Lyon, Ampere Laboratory - UMR5005 (Remi Robutel, Cyril Buttay, Fabien Sixdenier, Pascal Bevilacqua, Herve Morel, Regis Meuret)

High Power Lithium Primary Cells for High Temperature Downhole Applications
Arden P. Johnson, Electrochem Solutions, Inc. (John S. Miller, Yufei Wang)

High-Temperature Ceramic Capacitors for Power Inverters in Electric Drive Vehicles
U. Balachandran, Argonne National Laboratory (M. Narayanan, S. Liu, B. Ma)

Break: 3:20 pm - 3:50 pm

High Temperature Characterization up to 450°C of MOSFETs and Basic Circuits Realized in a Silicon-on-Insulator (SOI) CMOS-Technology
Katharina Grella, Fraunhofer Institute for Microelectronic Circuits and Systems IMS (Stefan Dreiner, Alexander Schmidt, Wolfgang Heiermann, Holger Kappert, Holger Vogt, Uwe Paschen)

SOI-Based Integrated Gate Driver Circuit for High-Temperature Applications
Robert L. Greenwell, University of Tennessee (B. M. McCue, M. I. Laurence, C. L. Fandrich, B. J. Blalock, L. M. Tolbert, S. K. Islam)

High Temperature Analog-to-Digital Converter Reliability Testing
Bruce W. Ohme, Honeywell (Mark R. Larson)

Silicon Capacitors with Extremely High Stability and Reliability Ideal for High Temperature Applications
Catherine Bunel, IPDIA (Laurent Lengignon)

Nanocomposite Film Dielectrics for High Temperature Power Conditioning Capacitors
Kirk Slenes, TPL Inc. (Lew Bragg)

SMD and Leaded Ceramic Capacitors for High Temperature Applications
Abhijit Gurav, KEMET Electronics Corporation (Xilin Xu, Jim Magee, John Bultitude, Travis Ashburn)

Complimentary Shuttle To Old Town
6:00 pm (first departure) - 10:30 pm (last return)
Attendees can spend the evening in old visiting shops, restaurants, etc.
Attendees ON OWN for all meals/purchases in Old Town

Thursday, May 10

Registration: 7:00 am - 3:00 pm

Breakfast: 7:00 am - 7:45 am

Plenary Talk: 8:00 am – 8:40 am
Title: Geothermal Applications for High Temperature Electronics

Speaker: Randy Normann, Perma Works LLC


Session THA1: Modules and Systems
Chair: Harold L. Snyder, Jr., Physical Solutions
9:00 am - 11:50 am

DM300 - A 300°C Geothermal Directional Module Development
Douglas C. MacGugan, Honeywell Aerospace

Multiple System Configurations in a 32-bit Extreme Environment
Michael C. Brown, RelChip

Characteristics of High Temperature Switch Mode Power Supplies
Harold L. Snyder, Jr., Physical Solutions

Session THA2: Reliability and Test
Chair: Robert Estes, Baker-Hughes
9:00 am - 11:50 am

End of Life Failure Modes for Packaged SOI Devices for Signal Conditioning and Processing Applications
Steve Riches, GE Aviation Systems - Newmarket (Colin Johnston, Alison Crossley, Patrick Grant, Oxford University)

Combined Temperature and Vibration Testing for Wire Bond Interconnections in Harsh Environment Electronics
Maria Mirgkizoudi, Loughborough University (Changqing Liu, Paul Conway; Steve Riches, E Aviation Systems - Newmarket)

Thermal Stress Reliability Study on Substrates for High Temperature, Silicon Carbide Power Electronic Modules
Robert Shaw, APEI, Inc. (P. Doyle, J. Hornberger, A. Lostetter, B. McPherson, H. Procell, R. Schupbach)

Break: 10:30 am - 10:50 am

The Challenges of Developing a Geothermal Ultrasonic Borehole Imager
Kamalesh Chatterjee, Baker Hughes (Roger Steinsiek, James V. Leggett III, Douglas Patterson)

Communications System Using a KM2 Cable For Down-Hole Measurement Tools
Rito Mijarez, Instituto De Investigaciones Electricas (David Pascacio, Ricardo Guevara, Joaquen Rodreguez, Olimpia Pacheco)

Characterization and Reliability Testing on an LTCC Transformer Operable to 250°C
James Galipeau, NASCENTechnology (George Slama, Rojan Kamacharia)

Extreme Thermal Transient Stress Analysis with Pre-Stress in a Metal Matrix Composite Power Package
Douglas C. Hopkins, North Carolina State University (Theodore Baltis, James M. Pitaressi, Donald R. Hazelmyer)

Lunch: 11:50 pm - 1:00 pm

Session THP1: SiC Devices and Circuits
Chair: Ben Blalock, University of Tennessee
1:00 pm - 3:00 pm

Digital and Analogue Integrated Circuits in Silicon Carbide for High Temperature Applications
Ewan P. Ramsay, Raytheon UK (D.T. Clark , J.D. Cormack, A.E. Murphy, D.A Smith, R.F. Thompson , R.A.R. Young , S. Finney)

SiC High Temperature Operational Amplifier
Alexey Vert, General Electric Global Research (Cheng-Po Chen, Amita Patil, Rich Saia, Emad Andarawis, Avinash Kashyap, Tan Zhang, Dave Shaddock; Wayne Johnson, Auburn University; Randy Normann, Perma Works LLC)

Characterization of a Large Area Silicon Carbide PiN Diode at Temperatures up to 900°C 
Jim Richmond, Cree Inc. (Lin Cheng, Anant Agarwal, John Palmour)

An Airborne High Temperature SiC Inverter for Medium Power Smart Electro Mechanical Actuators
Dominique Bergogne, Universite de Lyon, Laboratoire Ampere (Fabien Dubois, Christian Martin, Cyril Butay, Sonia Dhokkar, Bruno Allard, Regis Meuret, Herve Morel)

Session THP2: Packaging
Chair: Liangyu Chen, Ohio Aerospace Institute
1:00 pm - 2:30 pm

Optimization of a Ceramic Circuit Board Clamp
Dave Glowka, PermaWorks, LLC (Randy Normann)

A High Current (>1500A) Power Module for High Temperature, High Performance Applications Using SiC TMOS Power Switches 
Brandon Passmore, Arkansas Power Electronics International, Inc. (J. Hornberger, B. McPherson, J. Bourne, R. Shaw, E. Cilio, W. Cilio, B. Reese, T. McNutt, M. Schupbach, and A.B. Lostetter)

Recent Progress in Thin Film Multichip Packaging for High Temperature Digital Electronics
Kun Fang, Wayne Johnson, Auburn University (Alexey Vert, General Electric )

Closing Remarks From Chairs: 3:00 pm - 3:15 pm


Purchase HiTEC 2012 Proceedings CD-Rom



Premier Sponsors:

HiTEN Premier Sponsor - CISSOID

HiTEC Premier Sponsor - Fairchild Semiconductor


Corporate Sponsors:

HiTEN Corporate Sponsor - XREL Semiconductor

HiTEC Corporate Sponsor - Trendsetter Electronics

HiTEC Corporate Sponsor - Analog Devices

HiTEC Corporate Sponsor - Texas Instruments

HiTEC Corporate Sponsor -  PAINE

HiTEC Corporate Sponsor -  Eltek Semiconductors

© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

<% rsCategory.Close() Set rsCategory = Nothing %>