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International Conference and Exhibition on
High Temperature Electronics Network (HiTEN)

September 13-16, 2009
St. Catherine’s College Oxford
Oxford, United Kingdom

Early Registration Deadline: August 28, 2009
Room/Food Reservation Deadline: September 4, 2009

Conference Chairs:

Colin Johnston
Oxford Applied Technology – UK
colin.johnston@materials.ox.ac.uk

R. Wayne Johnson
Auburn University
johnsr7@auburn.edu

Organizing Committee:

Alison Crossley, University of Oxford (UK)
Andy Longford, Panda Europe IMAPS UK (UK)
Patrick McCluskey, CALCE (US)
Denis Flandre, UCL (B)
Bernd Michel, FHG-IZM (D)
Randy Norman, Perma Works (US)
Bernard Parmentier, Schlumberger (F)
Sascha  Schwarze, Baker Hughes INTEQ (D)
Ovidiu Vermessan, SINTEF (N)
Matthias Werner, NMTC (D)
Wolfgang Wondrak, Daimler Chrysler (D)



HiTEN Conference Focus:
The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HITEN is silicon and silicon on insulator (SOI). Although, HITEN is not simply a semiconductor focused network. HITEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.

Sunday, September 13th

Dinner: 7:00 pm – 8:00 pm

Monday, September 14th

Registration: 7:00 am – 5:30 pm

Breakfast: 8:00 am – 8:50 am

Opening Remarks: 8:50 am – 9:00 am
Conference Chairs

Session 1: Capacitors and Connectors
Chair: Colin Johnston, Oxford Applied Technology - UK
9:00 am – 1:00 pm

Architecture Analysis of High Performance Capacitors
Jeffery T. Stricker, Hiroyuki Kosai, Tyler W. Bixel, Seana A. McNeal, James D. Scofield, Jennifer DeCerbo, Biswajit Ray, US Air Force Research Laboratory

Robust BME Class-I Ceramic Capacitors for High Temperature Applications
Xilin Xu, Bill Buchanan, Paul Staubli, Philip Lessner, Abhijit Gurav, KEMET Electronics Corporation

Thermally Robust Polymer Dielectric Systems for Air Force Wide-Temperature Power Electronics Applications
Narayanan Venkat, Victor K. McNier, Zongwu Bai, Marlene D. Houtz, Thuy D. Dang, University of Dayton Research Institute; Jennifer N. DeCerbo, Jeffery T. Stricker, US Air Force Research Laboratory

Break: 10:30 am – 11:00 am

Fabrication and Characterization of High Temperature Film Capacitors
Keith D. Jamison, R. D. Wood, B. G. Zollars, P. Le, Nanohmics, Inc.

Novel Solid Tantalum Capacitor for Demanding Applications up to 200°C
Radovan Faltus, Tomas Zednicek, AVX Czech Republic S.R.O.

Adapting Press-Fit Connection Technology for Electronic Modules in Harsh Environments
Andy Longford, PandA Europe; Joseph Lynch, Interplex Industries Inc., USA

High-Dielectric-Constant Capacitors for High-Temperature Power Inverters in Hybrid Electric Vehicles
U. Balachandran, B. Ma, M. Narayanan, Argonne National Laboratory

Lunch: 1:00 pm – 2:00 pm

Session 2A: Devices
Chairs: Thomas Krebs, CISSOID; Joe Henfling, Sandia National Laboratory
2:00 pm – 5:30 pm

Product Test Results of the HTADC12 12 Bit Analog to Digital Converter at 250°C
Thomas B. Romanko, Mark Larson, Honeywell International Inc.

Performance and Reliability of SiGe Devices and Circuits For High Temperature Applications
Dylan B. Thomas, John D. Cressler, Laleh Najafizadeh, Leora Peltz, Stan Phillips, Ted Wilcox, Georgia Institute of Technology; R. Wayne Johnson, Auburn University

Introduction of Texas Instruments High Temperature Semiconductors
Mont Taylor, Brad Little, Texas Instruments

Break: 3:30 pm – 4:00 pm

SOI Lateral PIN Diodes for Temperature and UV Sensing in Very Harsh Environments
Bertrand Rue, Olivier Bulteel, Denis Flandre, University Catholique de Louvain-la-Neuve; Michelly de Souza,  A. Pavanello, FEI

Quartzdyne ASIC Developments
Shane Rose, Mark Watts, Quartzdyne

Operational and Performance Test Results of the Reconfigurable Processor for Data Acquisition (RPDA) at 250°C
Thomas B. Romanko, Mike Johnson, Honeywell International Inc.

Dinner: 7:00 pm – 8:00 pm

Tuesday, September 15th

Registration: 7:00 am – 5:30 pm

Breakfast: 8:00 am – 8:50 am

Session 2B: Devices continued
Chair: Rene Lerch, Fraunhofer IMS
9:00 am – 11:00 am

Development of the First Commercialised Integrated Circuit Process Operating in the Range of 300°C to 450°C
James A. McGonigal, David T. Clark, Robin F. Thompson, Raytheon Systems Limited

Evaluation of an SOI Operational Amplifier with High Temperature Packaging
Liang-Yu Chen, Richard L. Patterson, Ahmad Hammoud, Michael J. Krasowski, Joseph M. Flatico, Dennis E. Culley, OAI / NASA Glenn Research Center

Performance of a Diode-Based Bandgap Reference Circuit
Paul Moody, Marshall Soares, Monte Johnson, NOV/Intelliserv

Break: 10:30 am – 11:00 am

Development of an Integrated Power Controller Based on HT SOI and SiC
Joseph A. Henfling, Stan Atcitty, Frank Maldonado, Sandia National Laboratories; Trevor Thornton, ASU, Randy Normann, PermaWorks

Session 3: Packaging Materials
Chair: Wayne Johnson, Auburn University
11:30 am – 1:00 pm

Dielectric, Thermal and Structural Characterization of Fluorinated Parylene Films for High Temperature Power Device Surface Insulation
Mireille Bechara, S. Diaham, M. L. Locatelli, S. Zelmat, C. Tenailleau, Université Paul Sabatier

Investigation of Polyimide/Carbon Nanotube Nanocomposites for High Temperature Electronic Packaging Applications
Qing-Yuan Tang, Y. C. Chan, N. B. Wong, City University of Hong Kong

Nanoparticle Enhanced Solders for High Temperature Reliability
Omid Mokhtari, Roya Ashayer, Samjid H. Mannan, Michael P. Clode, Kings College of London

Lunch: 1:00 pm – 2:00 pm

Session 4: Sensors and MEMS
Chairs: Randy Normann, Perma Works; Alison Crossley, University of Oxford
2:00 pm – 5:30 pm

HTNFET Junction Capacitance Measurements, Theoretical Model and Validation for Development of High-Temperature Wireless Sensor Networks
Jonathan Gagnon, François Gagnon, École de Technologie Supérieure

High Temperature SOI CMOS Ultra Low Power Circuits for MEMS Co-Integrated Interfaces
Bertrand Rue, Nicolas Andre, Benoit Olbrechts, Jean-Pierre Raskin, Denis Flandre, University Catholique de Louvain-la-Neuve

High-Temperature SOI CMOS Compatible MEMS Pressure Sensors
Reneé Lerch, Robert Klieber, Norbert Kordas, Holger Kappert, Fraunhofer IMS

Break: 3:30 pm – 4:00 pm

Explosion Metrology: A better bang for your buck?
Greg D. Horler, David McGorman, Instrumentel Ltd.

A Non Volatile MEMS Switch for Harsh Environment Memory Applications
Vikram Joshi, Richard Knipe, Rob VanKampen, Damian Lacey, Toshi Nagata, Dennis Yost, Charles Smith, Cavendish Kinetics, Inc.

High Temperature SiC Wireless Telemetry Systems
John Fraley, Bryon Western, Roberto M. Schupbach, Alexander B. Lostetter, Brice McPherson, Jared Hornberger, Jie Yang, Arkansas Power Electronics International, Inc.

Dinner: 7:00 pm – 8:00 pm

Wednesday, September 16th

Registration: 7:00 am – 6:00 pm

Breakfast: 8:00 am – 8:50 am

Session 5: Packaging
Chairs: Ovidiu Vermesan, SINTEF; Shane Rose, Quartzdyne
9:00 am – 1:00 pm

Nano-Mechanical Analysis of Pb-Free Solders for Reliability Optimisation in High Performance Microelectronics Systems
V.M.F. Marques, C. Johnston, P.S. Grant, University of Oxford

Development of High Temperature Electronics Packaging Technologies for Long Term Operation at 250°C
S. T. Riches, Kevin Cannon, GE Aviation Systems; Colin Johnston, Mica Sousa, Patrick Grant, Oxford University; Jim Gulliver, Sondex Wireline Ltd.; Mark Langley, Vibro-meter UK Ltd.; Robin Pittson, Simona Serban, Denley Baghurst, Gwent Electronics Materials; Mike Firmstone, Thermastrat

Packaging Technology for High Temperature Silicon-on-Insulator Electronics
R. Wayne Johnson, Ping Zheng, Phillip Henson, Auburn University

Break: 10:30 am – 11:00 am

Thermomechanical Reliability Evaluation of Direct Bonded Aluminum (DBA) as a Substrate for High-Temperature Electronics Packaging
Thomas G. Lei, Jesus N. Calata, Khai D. Ngo, Guo-Quan Lu, Virginia Tech

The Development and Application of 225°C Hybrid Microcircuit Technology
Robert Hunt, Chris Andrews, C-MAC MicroTechnology

Hermetic Micro-Packaging with Heat Sinks
Marie Evrard, Nathan Foster, Pacific Aerospace & Electronics, Member of SOURIAU Group

Plastic Packaging for High Temperature Applications
Tanja Braun, K.-F. Becker, J. Bauer, M. Koch, V. Bader, R. Aschenbrenner, H. Reichl, Fraunhofer IZM

Lunch: 1:00 pm – 2:00 pm

Session 6: Power Electronics
Chairs: Sascha Schwarze, Baker Hughes INTEQ; Steve Riches, GE Aviation
2:00 pm – 6:00 pm

250°C Voltage Compliant SOI MESFETs for High Power PWM Drive Circuits
Nicholas Summers, William Lepkowski, Seth Wilk, Trevor Thornton, Randy Normann, Joseph Henfling, Arizona State University

High Temperature DC-DC Buck Converters for Point-of-Load (POL) Applications
Pierre Delatte, V. Dessard, A. Saib, E. Boufous, N. Pequignot, G. Picún, CISSOID S.A.

High Temperature Power Electronics IGBT Modules for Electrical and Hybrid Vehicles
Reiner John, Infineon Technologies; Ovidiu Vermesan, SINTEF

Break: 3:30 pm – 4:00 pm

High Temperature Power Electronic Packaging for Oil Well Applications
Rolf Johannessen, Andreas Larsson, Frøydis Oldervoll, Truls Fallet, SINTEF Information and Communication Technology

High Temperature Nanoelectronics for Electrical and Hybrid Vehicles
Ovidiu Vermesan, SINTEF; Reiner John, Infineon Technologies

A High Temperature 2Amps Power Driver for SMPS and Motor Drive Applications
Pierre Delatte, E. Boufous, V. Dessard, A. Saib, N. Pequignot, G. Picún, CISSOID S.A.

High-Power and High Temperature SiC Power Module Development
Gavin Mitchell, Edgar Cilio, John Garrett, Marcelo Schupbach, Alex Lostetter, Arkansas Power Electronics International

Closing Remarks: 6:00 pm

Register On-line



Speaker Dates/Information:

HiTEN Speaker Information:
Final Manuscripts for the HiTEN Proceedings CD-ROM are due July 24, 2009.
Send Your Final Manuscript Via E-Mail to jmorris@imaps.org, in PDF format only (PDF can be in color).

PowerPoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop, cd-rom, or memory stick). Laptops will be provided by IMAPS in each session room.

Selected Manuscripts from HiTEN will be considered for publishing in the Journal of Microelectronics and Electronic Packaging. Invitations will be made separately. Inquiries can be sent to jmep@imaps.org.

Speakers must register for this conference at the reduced speaker rates. Early registration deadline is August 28, 2009; and Room/Food reservation deadline is September 4, 2009. See registration form for detailed information.

  • Final Manuscript (Proceedings) due: July 24, 2009
  • Early Registration Deadline: August 28, 2009
  • Room/Food Reservation Deadline: September 4, 2009
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Housing Reservations: (Room/Food Reservation Deadline: September 4, 2009)

Conference Location:
St. Catherine’s College Oxford
Manor Road
Oxford
OX1 3UJ
United Kingdom

Delegates Arrival/Check-in:
Delegates are to report to the Porters Lodge upon arrival. Check-in is from 2:00 pm onwards on the day of arrival. If you arrive before this time you can leave your luggage in the safe room at the lodge. The lodge will assign you a room and give you the keys.

The hall will be open at all meal times and delegates can just arrive and be seated. Lunch is served promptly at 1.00 pm and Dinner at 7.00 pm; they are both served meals. Breakfast is more informal, served buffet style from 8.00 am - 9.00 am.


Corporate Sponsors:


HiTEN Corporate Sponsor - CISSOID

HiTEN Corporate Sponsor - Honeywell

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