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International Conference and Exhibition on
High Temperature Electronics Network (HiTEN)

July 18-20, 2011
St. Catherine’s College Oxford
Oxford, United Kingdom

Early Registration Deadline: June 23, 2011
Room/Food Reservation Deadline: June 23, 2011

Conference Chairs:

Colin Johnston
Oxford Applied Technology – UK
colin.johnston@materials.ox.ac.uk

R. Wayne Johnson
Auburn University
johnsr7@auburn.edu

Organizing Committee:

Alison Crossley, University of Oxford (UK)
Andy Longford, Panda Europe IMAPS UK (UK)
Patrick McCluskey, CALCE (US)
Denis Flandre, UCL (B)
Bernd Michel, FHG-IZM (D)
Randy Norman, Perma Works (US)
Bernard Parmentier, Schlumberger (F)
Sascha  Schwarze, Baker Hughes INTEQ (D)
Ovidiu Vermessan, SINTEF (N)
Matthias Werner, NMTC (D)
Wolfgang Wondrak, Daimler Chrysler (D)

HiTEN Technical Program



Sunday, July 17th

Check-in: 2:00 pm (Porters Lodge)

Dinner: 7:00 pm - 8:00 pm

Monday, July 18th

Registration: 7:30 am – 7:00 pm

Breakfast: 8:00 am – 8:50 am

Exhibition and Technology Showcase: 10:30 am - 5:00 pm

Opening Remarks: 8:50 am – 9:00 am
Conference Chairs

Session 1: Passives
Chair: Steve Riches, GE Aviation Systems - Newmarket; Liang-Yu Chen, Ohio Aerospace Institute/NASA Glenn Research Center
9:00 am – 12:30 pm

Reliability Assessment of Passives for 300C and 350C
David Shaddock, Vinayak Tilak, Tan Zhang, General Electric Global Research

285°C Resistor Drift and Failure Analysis
Milton Watts, Chris Hahn, Quartzdyne, Inc.

Reliability Testing on a Multilayer Chip Inductor Fabricated from a Ferrite with a 350ºC Curie Point
James Galipeau, George Slama, Rick Tomcavage, NASCEN Technology

Networking/Break In Exhibit Hall: 10:30 am – 11:00 am

High Temperature Performance of Oxide Film Capacitors
Keith D. Jamison, Bill Balliette, Faradox Energy Storage, Inc.

High-Temperature, High-Power Performance of Ceramic Filter Capacitors
Keith Bridger, A. Cooke, D. Kohlhafer, R. Strite, Active Signal Technologies, Inc.; W. Schulze, S. Arrasmith, New York State College of Ceramics at Alfred University; J. Weigner, Lockheed Martin MS2; F. Duva, Novacap

Ceramic Capacitors and Stacks for High Temperature Applications
Abhijit Gurav, Xilin Xu, Jim Magee, John Bultitude, Travis Ashburn, KEMET Electronics Corporation

Lunch: 1:00 pm – 2:00 pm

Keynote Presentation
2:00 pm – 2:40 pm
Synopsis: Report on High Temperature Tools Technology Needs from the International Partnership for Geothermal Technology
Randy Normann, Perma Works LLC

Session 2: Packaging
Chairs: Joseph A. Henfling, Sandia National Laboratories; Robert Estes, Baker Hughes
2:40 pm – 7:00 pm

Thin Film Multichip Packaging for High Temperature Digital Electronics
R. Wayne Johnson, Keyon Fang, Rui Zhang, Auburn University; Emad Andarawis, Alexey Vert, GE Global Research Center

Characterization of LTCC-Thick Film Technology for 300°C Packaging
Tan Zhang, David Shaddock, Alexey Vert, GE Global Research Center; Rui Zhang, R. Wayne Johnson, Auburn University

Improvement of Dielectric Performance of a Prototype AlN High Temperature Chip-Level Package
Liang-Yu Chen, Ohio Aerospace Institute/NASA Glenn Research Center

Networking/Break in Exhibit Hall: 4:10 pm – 5:00 pm

Au-Sn SLID Bonding for High Temperature Applications
Torleif A. Tollefsen Seip, Andreas Larsson, Knut Aasmundtveit, SINTEF ICT, Instrumentation

Optimizing the Performance of the Au-Si System for High Temperature Die Attach Applications
Micaela. F. Sousa, S. Riches, C. Johnston, P. S. Grant, Oxford University

Comparison of Au-In Transient Liquid Phase Bonding Designs for SiC Power Semiconductor Device Packaging
Brian Grummel, Habib A. Mustain, Z. John Shen, University of Central Florida; Allen R. Hefner, National Institute of Standards and Technology

Die Attach of Power Devices Using Silver Sintering - Bonding Process Optimisation and Characterization
Cyril Buttay, Amandine Masson, Jianfeng Li, Mark Johnson, Mihai Lazar, Christophe Raynaud, Hervé Morel, University of Nottingham, Laboratoire Ampere

Dinner: 7:00 pm – 8:00 pm

Tuesday, July 19th

Registration: 7:30 am – 7:00 pm

Breakfast: 8:00 am – 8:50 am

Exhibition and Technology Showcase: 10:30 am - 5:00 pm

Session 3: SiC
Chair: F. Patrick McCluskey, University of Maryland - CALCE; David Shaddock, General Electric Global Research
9:00 am – 12:30 pm

1200V 20A SiC BJTs Operating at 250C
Tomas Hjort, Anders Lindgren, Martin Domeij, Fairchild Semiconductor

A Performance Comparison of Normally-off and Normally-on SiC VJFETs for High Temperature Modules
R. Schrader, K. Speer, J. Casady, V. Bondarenko, D. Sheridan, SemiSouth Laboratories, Inc.

>1200 V, >50A Silicon Carbide Super Junction Transistor
Ranbir Singh, Siddarth Sundaresan, Stoyan Jeliazkov, Deepak Vereddy, Eric Lieser, GeneSiC Semiconductor Inc.

Networking/Break in Exhibit Hall: 10:30 am – 11:00 am

Electrical Characterization of Lateral 4H-SiC MOSFETs in the Temperature Range of 25 to 600 °C for Harsh Environment Applications
W. Daves, A. Krauss, Robert Bosch GmbH; V. Häublein, A. J. Bauer, L. Frey, Fraunhofer IISB

High Temperature Silicon Carbide CMOS Integrated Circuits
David Clark, Raytheon Systems Limited; R. F. Thompson, A. E. Murphy, E. P Ramsay, D. A Smith, R. A. R. Young, J. D. Cormack, J. McGonigal, Raytheon UK; J. Fletcher, C. Zhu, S. Finney, University of Strathclyde

A Fully Functional Extreme Environment SiC Wireless Temperature Sensing System
Jie Yang, John R. Fraley, Bryon Western, David J. Mitchell, Cora Schillig, Roberto M. Schupbach, Arkansas Power Electronics International, Inc.

Lunch: 1:00 pm – 2:00 pm

Keynote Presentation
2:00 pm – 2:40 pm
High Temperature System Design for Electric and Hybrid Electric Vehicles
Speaker: Ovidiu Vermesan, SINTEF
Co-Authors: Lars-Cyril Blystad, SINTEF ICT; Reiner John, Infineon AG; Marco Ottella, Centro Ricerche Fiat; Egil Mollestad, Think Global AS

Session 4: Power
Chair: Randy Normann, Perma Works LLC; Milton Watts, Quartzdyne, Inc.
2:40 pm – 7:00 pm

Enhanced High Temperature Power Controller
Joseph A. Henfling, Stan Atcitty, Frank Maldonado, Sandia National Laboratories

Package Reliability of the SiC Power Modules in Harsh Environments
Fengqun Lang, Hiroshi Yamaguchi, Hiroshi Sato, National Institute of Advanced Industrial Science and Technology (AIST)

HADES: A High Temperature Gate Driver Solution for SiC-Based Multi-KW Converters
Jean-Christophe Doucet, Aimad Saib, Christian Mourad, François Piette, Etienne Vanzieleghem, Pierre Delatte, CISSOID S.A.

Break in Exhibit Hall: 4:10 pm - 5:00 pm

High Temperature Silicon-on-Insulator Gate Driver for SiC-FET Power Modules
Javier A. Valle Mayorga, Phan Khoa, Ivonne Escorcia, Caleb Gutshall, Alan Mantooth, Brad Reese, Marcelo Schupbach, Alex Lostetter, University of Arkansas

High Temperature Silicon Carbide Power Modules for High Performance Systems
Jared Hornberger, B. McPherson, J. Bourne, R. Shaw, E. Cilio, W. Cilio, B. Reese, E. Heinrichs, T. McNutt, M. Schupbach, A.B. Lostetter, APEI, Inc.

STROMBOLI: A New Platform for Isolated DC-DC Converters with Reliable Operation from -55°C up to 225°C
Pierre Delatte, Aimad Saib, Etienne Vanzieleghem, Jean-Chistophe Doucet, CISSOID S.A.

Development of a Silicon Nitride High Temperature Power Module
R. Wayne Johnson, Michael J. Palmer, Jeff Suhling, Auburn University; James D. Scofield,
AFRL/PRPE

Dinner: 7:00 pm – 8:00 pm

Wednesday, July 20th

Registration: 7:30 am – 6:30 pm

Breakfast: 8:00 am – 8:50 am

Session 5: Test & Characterization
Chairs: Hector Torres, Texas Instruments, Inc.
9:00 am – 10:30 am

ESEM as a Tool for Studying High Temperature Electronics
Stefan Svensson, Fredric Ericson, Klas Hjort, Lena Klintberg, Uppsala University

Universal High-Temperature (250C) Test Fixture
Randy A. Normann, Alastair Black, Charles Normann, James Parker, Forever Testing Company

Comparative Reliability Prediction Using Physics of Failure Models
Milton Watts, K. Robert Harker, Quartzdyne, Inc.

Break: 10:30 am – 11:00 am

Session 6: Packaging Materials
Chair: R. Wayne Johnson, Auburn University
11:00 am – 12:30 pm

Nanocomposite Epoxy Resin for SiC Module
Kenji Okamoto, Yuji Takematsu, Miyako Hitomi, Fuji Electric

250°C Operating Temperature Dielectric Film Capacitors
Mark Donhowe, Jeff Lawlwer, Sean Souffie, W. L. Gore & Associates, Inc.

A High Temperature and UV Stable Vapor Phase Polymer for Electronics Applications
Rakesh Kumar, Specialty Coating Systems Inc.

Lunch: 1:00 pm – 2:00 pm

Session 7: Si Devices
Chairs: Laurent Martinez, CISSOID, S.A.; Ovidiu Vermesan, SINTEF
2:00 pm – 7:30 pm

High Temperature Latch-Up Immunity and Low Leakage Current Performance of High Density SRAMs Manufactured on Bulk Silicon
David Duff, David Gifford, Robert Fuller, Rex Lowther, Wes Morris, Silicon Space Technology

High Temperature Reliability Investigations of EEPROM Memory Cells Realised in Silicon-on-Insulator (SOI) Technology
Katharina Grella, Holger Vogt, Uwe Paschen, Fraunhofer Institute for Microelectronic Circuits and Systems IMS

An Analysis of OTP ROM Programmable Devices in 1.0um SOI CMOS
Marshall Soares, Paul Moody, Novatek

Design and Evaluation of a 200°C COTS Data Collection System for the Drilling Industry
Hector Torres, Texas Instruments, Inc.; Randy A. Norman, Perma Works LLC

Break: 4:00 pm – 4:30 pm

Implementation of Silicon-on-Insulator (SOI) Control Electronics to Accelerometers for High Temperature Applications
Steve Riches, Ian White, Geoff Rickard, GE Aviation Systems - Newmarket; Gary Chadwick, DJB Instruments

A Robust SOI Gain-Boosted Operational Amplifier Targeting High Temperature Precision Applications up to 300°C
Alexander Schmidt, Abdel Moneim Marzouk, Rainer Kokozinski, Fraunhofer Institute for Microelectronic Circuits and Systems

Ultra Low Power CMOS Circuits Working in Subthreshold Regime for High Temperature and Radiation Environments
El Hafed Boufouss, L. A. Francis, P. Gérard, D. Flandre; Université Catholique de Louvain (UCL)

High Temperature Endurance of Packaged SOI Devices for Signal Conditioning and Processing Applications
Steve T. Riches, GE Aviation Systems - Newmarket; Colin Johnston, Materials KTN; Patrick Grant, Mica Sousa, Oxford University

Closing Remarks: 6:30 pm




Speaker Dates/Information:

HiTEN Speaker Information:

  • Abstracts Due: January 28, 2011
  • Final Manuscript (Proceedings) due: June 3, 2011
  • Early Registration Deadline: June 23, 2011
  • Room/Food Reservation Deadline: June 23, 2011
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)


Final Manuscripts for the HiTEN Proceedings CD-ROM are due June 3, 2011.
Send Your Final Manuscript Via E-Mail to jmorris@imaps.org, in PDF format only (PDF can be in color).

PowerPoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop, cd-rom, or memory stick). Laptops will be provided by IMAPS in each session room.

Selected Manuscripts from HiTEN will be considered for publishing in the Journal of Microelectronics and Electronic Packaging. Invitations will be made separately. Inquiries can be sent to jmep@imaps.org.

Speakers must register for this conference at the reduced speaker rates. Early registration deadline is June 23, 2011; and Room/Food reservation deadline is June 23, 2011. See registration form for detailed information.


Housing Reservations: (Room/Food Reservation Deadline: June 23, 2011)

Conference Location:
St. Catherine’s College Oxford
Manor Road
Oxford
OX1 3UJ
United Kingdom

Delegates Arrival/Check-in:
Delegates are to report to the Porters Lodge upon arrival. Check-in is from 2:00 pm onwards on the day of arrival. If you arrive before this time you can leave your luggage in the safe room at the lodge. The lodge will assign you a room and give you the keys.

The hall will be open at all meal times and delegates can just arrive and be seated. Lunch is served promptly at 1.00 pm and Dinner at 7.00 pm; they are both served meals. Breakfast is more informal, served buffet style from 8.00 am - 9.00 am.


Directions:

http://www.stcatz.ox.ac.uk/the_college_pages/map_and_directions.htm

The closest train station is Oxford. This is a 20 minute walk to Catz and a 10 minute taxi ride depending on traffic.

 


Corporate Sponsors:

HiTEN Corporate Sponsor - CISSOID

HiTEN Corporate Sponsor - Texas Instruments

HiTEN Corporate Sponsor - Trendsetter Electronics

HiTEN Corporate Sponsor - XREL Semiconductor

HiTEN Corporate Sponsor -  Honeywell

HiTEN Corporate Sponsor - Fairchild Semiconductor



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