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International Conference and Exhibition on
High Temperature Electronics Network (HiTEN)

July 8-10, 2013
St. Catherine’s College Oxford
Oxford, United Kingdom

Early Registration & Lodging Deadlines: June 14, 2013

You must book other hotel/lodging separately at other venues

Conference Chairs:

Colin Johnston
Oxford University

R. Wayne Johnson
Tennessee Tech University

Organizing Committee:

Alison Crossley, University of Oxford (UK)
Andy Longford, Panda Europe IMAPS UK (UK)
Patrick McCluskey, CALCE (US)
Denis Flandre, UCL (B)
Bernd Michel, FHG-IZM (D)
Randy Normann, Perma Works (US)
Ovidiu Vermessan, SINTEF (N)
Matthias Werner, NMTC (D)
Wolfgang Wondrak, Daimler Chrysler (D)

Tabletop Exhibits and Sponsorships are SOLD OUT

HiTEN Conference Focus:

The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HITEN is silicon and silicon on insulator (SOI).  Although, HITEN is not simply a semiconductor focused network. HITEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.

Sunday, July 7, 2013

Check-in: 2:00 pm (Porters Lodge)

Dinner: 7:00 pm - 8:00 pm

Monday, July 8, 2013

Registration: 7:30 am – 6:30 pm

Breakfast: 8:00 am – 8:45 am

Exhibition and Technology Showcase: 10:30 am - 5:00 pm

Opening Remarks: 8:50 am – 9:00 am
Conference Chairs

Session 1: Passives
Chair: Colin Johnston, Oxford University
9:00 am – 12:30 pm

230C Hermetically Sealed SMD Tantalum Capacitors
Radovan Faltus, AVX Czech Republic s.r.o. (Jan Petrzilek, Martin Biler, Tomas Zednicek)

Silicon Capacitors with extremely high stability and reliability ideal for high temperature applications
Laurent Lengignon, IPDIA (Catherine Bunel)

KEMET SMD Film Capacitors for high Temperature applications
Luca Caliari, KEMET Electronics Corporation (Paola Bettacchi, Evangelista Boni, Davide Montanari, Arrigo Gamberini, Francesco Bergamaschi, Luigi Barbieri)

Networking/Break In Exhibit Hall: 10:30 am – 11:00 am

Advanced Ceramic Capacitor Solutions for High Temperature Applications
Paul Staubli, KEMET Electronics Corporation (Abhijit Gurav, Xilin Xu, Jim Magee, John Bultitude, Reggie Phillips, Travis Ashburn)

Long-Term Demonstrated Reliability of Improved High Temperature Ceramic Chip Capacitors for Use in Extreme, Harsh Environments
Mustafa Syammach, ECLIPSE NANOMED, LLC (Fauzi Syammach, Mustapha Habibi)

Reliability of Au-Ti for High Temperature Termination on Ferrite LTCC Inductors
James Galipeau, NASCENTechnology (Matt Gerlach)

Advanced Applications of High Temperature Magnetics
John Fraley, Arkansas Power Electronics Intl. (Bryon Western, Edgar Cilio)

Lunch: 1:00 pm – 1:50 pm

Session 2: Power
Chairs: Gonzalo Picun, X-REL Semiconductor; Patrick McCluskey, University of Maryland/CALCE
2:00 pm – 6:30 pm

A High Temperature, Fast Switching SiC Multi-chip Power Module (MCPM) for High Frequency (> 500 kHz) Power Conversion Applications
Zach Cole, Arkansas Power Electronics International (Brandon Passmore, Bret Whitaker, Adam Barkley, Ty McNutt, Alex Lostetter)

Integrated GaN Power Modules
John Roberts, GaN Systems Inc. (Tom MacElwee, Lyubov Yushyna)

High temperature, Smart Power Module for aircraft actuators
Cyril Buttay, Laboratoire Ampere (Khalil El Falahi, Stanislas Hascoat, Bruno Allard, Luong-Viet Phung, Dominique Tournier, Dominique Planson, Pascal Bevilacqua)

Networking/Break in Exhibit Hall: 3:30 pm – 4:30 pm

POL and LDO for Harsh Environment Applications
Ramesh Khanna, Texas Instruments

High-Temperature Characterization and Comparison of 1.2 kV SiC Power Semiconductors
Christina DiMarino, CPES at Virginia Tech (Henry Chen, Rolando Burgos, Dushan Boroyevich, Paolo Mattavelli)

High Temperature Characterization and Reliability Data of Key Semiconductor Technologies for Power and Control Devices
Brian Wilkinson, Microsemi (Paul Ellerman)

Robust True Low-dropout Linear Voltage Regulator and Digitally Tunable Buffered Precision Voltage Reference for High-Temperature, Low-Voltage Applications
Gonzalo Picun, Yoann Duse, X-REL Semiconductor (Fabien Laplace, Nicolas Joubert, Xavier Montmayeur, Noureddine Zitouni, Sebastien Vieusses)

Dinner: 7:00 pm – 8:00 pm

Tuesday, July 9, 2013

Registration: 8:30 am – 6:00 pm

Breakfast: 8:00 am – 8:45 am

Exhibition and Technology Showcase: 10:30 am - 5:00 pm

Session 3: Si Devices
Chairs: Alexander Schmidt, Fraunhofer IMS; Shane Rose, Quartzdyne; Jeff Watson, Analog Devices
9:00 am – 2:30 pm

Sensor Interface Applications for High Temperature Precision Amplifiers
Pierre Delatte, CISSOID S.A. (Christian Mourad, David Baldwin, Etienne Vanzieleghem, Jean-Chistophe Doucet)

High Temperature 256Kbit (32Kbit x 8) HTEEPROM Reliability Testing
Joe G. Guimont, Honeywell International (Bruce W. Ohme)

High Temperature Reliability Investigations up to 350C of Gate Oxide Capacitors Realized in a Silicon-on-Insulator CMOS-Technology
Katharina Grella, Fraunhofer Institute for Microelectronic Circuits and Systems IMS (Stefan Dreiner, Holger Vogt, Uwe Paschen)

Networking/Break in Exhibit Hall: 10:30 am – 11:00 am

Enhanced High Temperature Performance of PD-SOI MOSFET in Analog Circuits Using Reverse Body Biasing
Alexander Schmidt, Fraunhofer Institute for Microelectronic Circuits and Systems IMS (Holger Kappert, Rainer Kokozinski)

A 250C ASIC technology
Lynn Reed, Tekmos

Performance Considerations for Precision Analog Signal Conditioning Semiconductors in Very High Temperature Environments
Michael Arkin, Analog Devices (Jeff Watson, Michael Siu, Michael Cusack)

Multi-bit memory cell using long-range non-anchored actuation for high temperature applications
Mehrdad Elyasi, Institute of Microelectronics (IME)(A*STAR) (Chengkuo Lee, Cheng-Yu Hsieh, Dim-Lee Kwong)

Lunch: 1:00 pm – 1:50 pm

Session 3 Continued...
2:00 pm – 2:30 pm

A High Temperature, Frequency Output Silicon Temperature Sensor
Shane Rose, Quartzdyne Inc. (Mark Hahn)

Session 4: Applications
Chair: Randy Normann, Perma Works
2:30 pm – 6:00 pm

Uprating in the Development of a 250C Avionics Control System
Diganta Das, University of Maryland, College Park (F. Patrick McCluskey)

Status Update: Geothermal 300C MWD Tool for US-DOE
Robert Estes, Baker Hughes (Jochen Schnitger)

Networking/Break in Exhibit Hall: 3:30 pm - 4:00 pm

Demonstration of a 300C Capable Directional Drilling Steering Tool (DM300)
Douglas MacGugan, Honeywell Aerospace (Bruce Ohme)

Communication system for down-hole measurement tools based on real-time SNR characterization in coaxial cable used as communication channel
Rito Mijarez, Instituto de Investigaciones Electricas (David Pascacio, Ricardo Guevara, Olimpia Pacheco, Joaquin Rodriguez)

Packaging technologies for high temperature control electronics
Conor Slater, Laboratoire de Production Microtechnique (Radisav Cojbasic, Thomas Maeder, Yusuf Leblebici, Peter Ryser)

The European SEEL (Solutions for energy efficient lighting) project: High temperature electronics for LED-lighting architectures
Soenke Habenicht, NXP Semiconductors Germany (Sven Walczyk, Hans-Juergen Funke, Detlef Oelgeschlaeger, Olrik Schumacher, Daniel Gruber, Roland Gehn, Amar Mavinkurve, Wilhelm Niessen)

Dinner: 7:00 pm – 8:00 pm

Wednesday, July 10, 2013

Registration: 8:30 am – 6:00 pm

Breakfast: 8:00 am – 8:50 am

Session 5: Interconnect and Materials
Chairs: Steve Riches, GE Aviation Systems; Dave Shaddock, GE Global Research; Colin Johnston, Oxford University
9:00 am – 3:00 pm

Evaluation of Refractory Metals for Package Level Interconnection in a Harsh Environment
I Made Riko, Nanyang Technological University (Eric Phua Jian Rong, Tan Key Wen, Ong Wei Chuan, Clare Huang Guanqi, Ong Hock Guan, Vivek Chidambaram Nachiappan, Wong Chee Cheong, Chen Zhong, Gan Chee Lip)

DIP Test Socket Characterization for 300C
David Shaddock, General Electric Global Research (Liang Yin, Wayne Johnson, Zhenzhen Shen)

Reliability of wire-bonded electronic devices in combined high temperature and vibrational environments
Maria Mirgkizoudi, Loughborough University (C. Liu, P. Conway, S. Riches)

Networking/Break: 10:30 am – 11:00 am

Effectiveness of barrier layer metallisations in long term high temperature endurance tests on wire bond interconnections
Steve Riches, GE Aviation Systems - Newmarket (Colin Johnston, Andrew Lui, Oxford University Materials)

Evaluation of pressure free nanoparticle sintered Ag die attach on Ag and Au surfaces
Graham Lewis, Eltek Semiconductors Ltd (G. Dumas, Eltek Semiconductors Ltd; S. H. Mannan, King's College London)

Solder and Die Attach for High Temperature Electronic Packaging
Patrick McCluskey, University of Maryland (C. Patel, H. Greve)

Precise chip joint method with sub-micron Au particle for high-density SiC power module operating at high temperature
Fumiki Kato, National Institute of Advanced Industrial Science and Technology (Fengqun Lang, Simanjorang Rejeki, Hiroshi Nakagawa, Hiroshi Yamaguchi, Hiroshi Sato)

Lunch: 1:00 pm – 1:50 pm

Session 5 Continued...
2:00 pm – 3:00 pm

Lead-free Solder Attach for 200C Applications
Wayne Johnson, Tennessee Technological University (Zhenzhen Shen, Michael Hamilton, Auburn University)

Novel encapsulation materials for High Pressure-High Temperature (HPHT) applications
Eric Phua Jian Rong Nanyang Technological University, Singapore (Liu Ming ,I Made Riko, Wong Chee Cheong, Chen Zhong, Daniel Rhee Min Woo, Gan Chee Lip)

Session 6: SiC
Chair: R. Wayne Johnson, Tennessee Tech University
3:00 pm – 6:30 pm

Performance and Reliability Characterization of 1200 V Silicon Carbide Power MOSFETs at High Temperatures
Robert Kaplar, Sandia National Laboratories (David Hughart, Stanley Atcitty, Jack Flicker, Sandeepan DasGupta, Matthew Marinella)

Break: 3:30 pm – 4:00 pm

Complementary 4H-SiC JFET for High Temperature Operational Amplifier Applications
Wei-Cheng Lien, University of California at Berkeley (Albert Pisano)

A 4H-SiC bipolar technology for high-temperature integrated circuits
Luigia Lanni, KTH Royal Institute of Technology (B. Gunnar Malm, Carl-Mikael Zetterling , Mikael Östling)

Experimental investigation of electro-thermal stress impact on SiC-BJTs electrical characteristics
Thibaut Chailloux, Ampere Lab. (Cyril Calvez, Pascal Bevilacqua, Dominique Planson, Dominique Tournier)

1200 V SiC Schottky Rectifiers optimized for 250C operation with low junction capacitance
Ranbir Singh, GeneSiC Semiconductor Inc. (Siddarth Sundaresan)

Reliability of SiC Digital Telemetry Circuit on AlN Substrate
Cheng-Po Chen, GE Global Research (Reza Ghandi, Liang Yin)

Closing Remarks: 6:30 pm


Thursday, July 11, 2013

Breakfast: 8:00 am - 9:00 am
(for those staying at the University Wednesday evening)

Check-out: (Porters Lodge)

Speaker Dates/Information:

HiTEN Speaker Information:

  • Abstracts Due - Extended Deadline: February 15, 2013
  • Abstract Notification Emails Sent: March 8, 2013
  • Final Manuscript (Proceedings) due: June 7, 2013
  • Early Registration Deadline: June 14, 2013
  • Room/Food Reservation Deadline: June 14, 2013
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Final Manuscripts for the HiTEN Proceedings CD-ROM are due June 7, 2013.
Send Your Final Manuscript Via E-Mail to, in PDF format only (PDF can be in color).

PowerPoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop, cd-rom, or memory stick). Laptops will be provided by IMAPS in each session room.

Selected Manuscripts from HiTEN will be considered for publishing in the Journal of Microelectronics and Electronic Packaging. Invitations will be made separately. Inquiries can be sent to

Speakers must register for this conference at the reduced speaker rates. Early registration deadline is June 2013; and Room/Food reservation deadline is June 2013. See registration form for detailed information.

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All session presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.

Registration Information: (Early Registration Deadline: June 14, 2013)

Delegate, Speaker/Chair, and Student registration fees include: access to all technical sessions, exhibits, meals, refreshment breaks, and one (1) Proceedings CD-ROM. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Early Fee
Through 6/14/13
Advance/Onsite Fee
After 6/14/13
Retired Delegate
Tabletop Exhibit
Corporate Sponsorship (Includes Tabletop - Limit 6)
Premier Sponsorship (Includes Tabletop - Limit 3)

Cancellation Policy
Registration cancellations will be refunded (less a $100 processing fee) only if written notice is postmarked on or before June 14, 2013. No refunds will be issued after that date. No-shows will not be eligible for refunds.


Housing Reservations: (Room/Food Reservation Deadline: June 14, 2013)

Conference Location:
St. Catherine’s College Oxford
Manor Road
United Kingdom

Room/Food reservations will be taken by IMAPS. The room/food reservations can be found on the SESSIONS page of the on-line registration form. You will select the number of nights lodging and food needed and IMAPS will follow-up with you regarding your check-in and check-out dates.

Delegates Arrival/Check-in:
Delegates are to report to the Porters Lodge upon arrival. Check-in is from 2:00 pm onwards on the day of arrival. If you arrive before this time you can leave your luggage in the safe room at the lodge. The lodge will assign you a room and give you the keys.

The hall will be open at all meal times and delegates can just arrive and be seated. Lunch is served promptly at 1.00 pm and Dinner at 7.00 pm; they are both served meals. Breakfast is more informal, served buffet style from 8.00 am - 9.00 am.




Premier Sponsors:

HiTEN Premier Sponsor - CISSOID

HiTEN Premier Sponsor - Fairchild Semiconductor

HiTEN Premier Sponsor - Trendsetter Electronics

Corporate Sponsors:

HiTEN Corporate Sponsor - XREL Semiconductor

HiTEN Corporate Sponsor -  Eltek Semiconductors

HiTEN Corporate Sponsor - Texas Instruments

HiTEN Corporate Sponsor - Analog Devices

HiTEN Corporate Sponsor -  Honeywell

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Phone: 202-548-4001