KESTER

International Conference and Exhibition on
High Temperature Electronics Network (HiTEN)

July 6-8, 2015
*NEW LOCATION*
Churchill College
Cambridge, United Kingdom

Proceedings Papers Now Linked to IMAPSource below!

Conference Chairs:

Colin Johnston
Oxford University
colin.johnston@materials.ox.ac.uk

R. Wayne Johnson
Tennessee Tech University
wjohnson@tntech.edu

Organizing Committee:

Alison Crossley, University of Oxford (UK)
Andy Longford, Panda Europe IMAPS UK (UK)
Patrick McCluskey, CALCE (US)
Denis Flandre, UCL (B)
Bernd Michel (D)
Randy Norman, Perma Works (US)
Bernard Parmentier, Schlumberger (F)
Ovidiu Vermessan, SINTEF (N)
Matthias Werner, NMTC (D)
Wolfgang Wondrak, Daimler Chrysler (D)

 

Premier Sponsors:
HiTEN Premier Sponsor - Presidio Components
HiTEN Premier Sponsor - M.S. KENNEDY Corp.
HiTEN Premier Sponsor - Trendsetter Electronics
HiTEN Premier Sponsor - CISSOID

 


HiTEN Conference Focus:

The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HITEN is silicon and silicon on insulator (SOI).  Although, HITEN is not simply a semiconductor focused network. HITEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.

Sunday, July 5, 2015

English Breakfast (for those staying over previous night): 7:30 am – 8:45 am (DINING HALL)

Formal 3-Course Dinner: 7:30 pm - 9:30 pm (DINING HALL)

Monday, July 6, 2015

Registration: 7:30 am – 6:30 pm

English Breakfast (for those staying over previous night): 7:30 am – 8:45 am (DINING HALL)

Exhibition and Technology Showcase: 10:30 am - 7:30 pm

Opening Remarks: 8:50 am – 9:00 am
Conference Chairs

Session 1: Devices
Chair: Colin Johnston, Oxford University
9:00 am - 12:30 pm

SiC Lateral Didoes for ESD Protection of High Temperature Integrated Circuits
Reza Ghandi, GE Global Research (Cheng-Po "Paul" Chen, Avinash Kashyap, Emad Andarawis)

Experimental Reliability Studies and SPICE Simulation for EEPROM at Temperatures up to 450°C
Andreas Kelberer, Fraunhofer Institute for Microelectronic Circuits and Systems IMS (Stefan Dreiner, Holger Kappert, Katharina Grella, Dirk Dittrich, Holger Vogt, Uwe Paschen)

High-Temperature Component Evaluation of Commercial Flash Memory for Enhancement of Geothermal Tool Development
Avery Cashion, Sandia National Laboratories (Grzegorz Cieslewski)

Networking/Break In Exhibit Area - Tea, Coffee & Biscuits: 10:30 am – 11:00 am

Enhancing Bulk Silicon CMOS Technology for Reliability and Extended Lifetimes at 250°C
Kevin Atkinson, Silicon Space Technology (Rex Lowther, David Gifford, Wesley Morris, Jim Jensen, Scott Peterson, Brad Ostman)

The Design and Characterization of an 8-bit ADC for 250C Operation
Lynn Reed, Tekmos, Inc. (Vema Reddy)

Gate Stack Engineering for High Temperature Silicon Carbide CMOS ICs
M.H. Weng, Raytheon UK (A.D. Murphy, D.T. Clark, D.A. Smith, R.F. Thompson, R.A.R. Young, E.P. Ramsay, Raytheon UK; H.K. Chan, A.B. Horsfall, Newcastle University )

Buffet Lunch: 1:00 pm – 1:45 pm (DINING HALL)

Session 2: Die Attach
Chairs: TBD
2:00 pm - 6:00 pm

Test Results of Sintered Nano-Paste Silver Die Attach for High Temperature Applications
Paul Croteau, United Technologies Research Center (Shashank Krishnamurthy, Ryan Witherell, UTRC; Alan Mantooth, Michael Glover, Sayan Seal, University of Arkansas)

Factors Influencing Microstructural Evolution in Nanoparticle Sintered Ag Die Attach at Elevated Temperatures
Seyed Amir Paknejad, King's College London University (Ali Mansourian, Khalid Khtatba, Samjid H. Mannan)

Electromigration Phenomena In Nanoparticle Sintered Ag Under High Current Density
Ali Mansourian, King's College London (Seyed Amir Paknejad, Qiannan Wen, Samjid H. Mannan)

Networking/Break In Exhibit Area - Tea, Coffee & Biscuits: 3:30 pm – 4:00 pm

Semiconductor-to-metal Attachment with Silver-filled TPI Bondfoil
Jim Fraivillig, Fraivillig Technologies (Richard Koba, Materion Corporation)

Bonding Strength of Cu/Cu Joints Using Micro-sized Ag Particle Paste for High-temperature Application
Hiroshi Nishikawa, Joining and Weldin Research Institute, Osaka University (Xiangdong Liu, Xianfan Wang, Akira Fujita, Nobuo Kamada, Mutsuo Saito)

Investigation Into the Role of Different Substrate Ni Compositions and Plating Methods on Die Attach Reliability
R. Wayne Johnson, Tennessee Tech University (Jinzi Cui, Michael Hamilton, Auburn University)

Session 3a: Packaging Materials
Chairs: TBD
5:30 pm - 7:00 pm

A High Temperature Nano/micro Vapor Phase Conformal Coating for Electronics Applications
Rakesh Kumar, Specialty Coating Systems

Novel PCM-based Coating for Thermal Management of High Temperature Electronic Assemblies
Andrey Novikov, University of Rostock (Mathias Nowottnick)

High Temperature Dielectric Properties of Polyimide/Boron Nitride Nanocomposites: Nanoparticle Size and Loading Content Effects
François Saysouk, LAPLACE (Sombel Diaham, Marie-Laure Locatelli)

Wine Reception in Exhibit Area: 7:00 pm - 7:30 pm

Formal 3-Course Dinner: 7:30 pm - 9:30 pm (DINING HALL)


Tuesday, July 7, 2015

Registration: 7:30 am – 6:30 pm

English Breakfast (for those staying over previous night): 7:30 am – 8:45 am (DINING HALL)

Exhibition and Technology Showcase: 10:30 am - 7:30 pm

Session 3b: Packaging Materials
Chairs: TBD
9:00 am - 11:30 am

Reliability of High Temperature Laminates
David Shaddock, General Electric Global Research (Liang Yin)

"Turning Ceramic on its Head" - a Polymer Based Packaging System for Operation Over 175C
Piers Tremlett, Microsemi Semiconductor Ltd.

High Temperature Protection Against Unwanted Species within Hermetic Packaging
Jennifer Williams, Johnson Matthey (Richard Rockley)

Networking/Break In Exhibit Area - Tea, Coffee & Biscuits: 10:30 am – 11:00 am

Increased High-Temperature Reliability and Package Hardening of Commercial Integrated Circuits (Through Die Extraction, Electroless Nickel/Gold Pad Reconditioning, and Ceramic Re-Assembly)
Erick Spory, Global Circuit Innovations, Inc.

Session 4: Passives
Chair: TBD
11:30 am - 3:30 pm

Design and Testing of a Reusable High Temperature Compatible Electrochemical Cell
Michael Fleischauer, National Institute for Nanotechnology (Nicolas Moore)

High-temperature Trench Capacitros, Using Thin-film ALD Dielectrics
Dorothee Dietz, Fraunhofer Institute for Microelectronic Circuits and Systems (Yusuf Celik, Andreas Goehlich, Holger Vogt)

Session Breaks at 12:30pm to allow Networking with Exhibitors Before 1pm Lunch

Buffet Lunch: 1:00 pm – 1:45 pm (DINING HALL)

SESSION 4 CONTINUED FOLLOWING LUNCH - 2:00 pm

Advances in Ceramic Capacitors for High Temperature Applications
Reggie Phillips, KEMET Electronics Corp. (Abhijit Gurav, Xilin Xu, Jim Magee, Travis Ashburn)

Solid Electrolytic Capacitors Designed for High Temperature Applications
Kristin Tempel, KEMET Electronics Corp. (Randy Hahn)

Conduction Mechanisms and Structural Analysis of 3D Slicon Capacitors
Catherine Bunel, IPDiA (Franck Murray, Frederic Voiron, Laurent Lengignon)

Networking/Break In Exhibit Area - Tea, Coffee & Biscuits: 3:30 pm – 4:00 pm

Session 5: Power
Chairs: TBD
4:00 pm - 6:30 pm

Investigation of Automotive Power Semiconductor Module Operates at Elevated Cooling Temperature
Yangang Wang, Dynex Seniconductor Ltd. (Yibo Wu, Xiaoping Dai, Steve Jones, Guoyou Liu)

High Temperature DC to DC Converter Operates in +215C Environment, Meeting Demands of Down-hole Oil Exploration Market
Abhijit Pathak, International Rectifier, An Infineon Company

More than Drivers in Motor Drives: Closing the Loop
Gonzalo Picun, X-REL Semiconductor (Khalil El-Falahi, Christophe Pautrel, Yoann Duse, Nicolas Joubert, Anaud Anotta, Georget Lemoyne, Simon Ribeyron, Olivier Guille, Gregory Thepaut, Fabien Laplace)

Towards High Temperature Intelligent Power Modules
Pierre Delatte, CISSOID S.A. (Jan Beranek, Dries Hauspies, Thomas François, David Baldwin, Pierre Blondeau, Etienne Vanzieleghem)

Simulation of a New Nybrid Si/SiC Power Device for Harsh Environment Applications
Peter Gammon, University of Warwick (Chun Wa Chan, Phil Mawby, School of Engineering, University of Warwick)

Wine Reception in Exhibit Area: 6:30 pm - 7:30 pm

Formal 3-Course Dinner: 7:30 pm - 9:30 pm (DINING HALL)

Wednesday, July 8, 2015

Registration: 7:30 am – 4:30 pm

English Breakfast (for those staying over previous night): 7:30 am – 8:45 am (DINING HALL)

Session 6: Power Packaging
Chair: TBD
9:00 am - 12:30 pm

Optimized Packages for High Power GaN Transistors
John Roberts, GaN Systems Inc. (Ahmad Mizan, Lyubov Yushyna)

Lifetime and Failure Modes of Important Power Module Package Materials Capable of Operation Above 300C
Dean Hamilton, University of Warwick (Steve Riches, GE Aviation Systems; Liam Mills, TT Electronics Semelab; Philip Mawby, University of Warwick)

A High Temperature, Small Footprint Power Package for SiC and GaN Power Devices
Zach Cole, APEI (Brad McGee, Jennifer Stabach, Stephen Minden, John Fraley, Chad O'Neal, Brandon Passmore)

Networking/Break In Registration/Buttery - Tea, Coffee & Biscuits: 10:30 am – 11:00 am

Silver Thick Film Based Insulated Metal Substrates for High Temperature Power Applications
Steve Riches, GE Aviation Systems (J. Whitmarsh, ESL Ltd.; D. Hamilton, University of Warwick)

Inorganic Insulated Metal Substrates
Giles Humpston, Cambridge Nanotherm Ltd. (Pavel Shashkov, Steven Curtis)

Study of the Electrical and Thermal Properties of a Silicone Elastomer Filled with Silica for High Temperature Power Device Encapsulation
Sombel Diaham, Université de Toulouse (Elyse Sili, M.L. Locatelli, M. Bechara, S. Dinculescu)

Session 7: Sensors
Chair: TBD
12:30 pm - 5:00 pm

High Temperature Anisotropic Magnetorsistive (AMR) Sensors
Bharat Pant, Honeywell International Inc. (Lucky Withanawasam, Mike Bohlinger, Mark Larson, Bruce Ohme)

Buffet Lunch: 1:00 pm – 1:45 pm (DINING HALL)

Wireless Sensor Nodes for Hostile Environment Applications
Alton Horsfall, Newcastle University (Neal Wood, Hua-Khee Chan, Konstantin Vassilevski, Nick Wright)

High Temperature (225°C) SiC-based Wireless Power Demonstrator
Lauren Kegley, APEI (John Fraley, John Garrett)

A Low Power Data Acquisition Solution for High Temperature Applications
Jeff Watson, Analog Devices (Maithil Pachchigar)

Networking/Break In Registration/Buttery - Tea, Coffee & Biscuits: 3:30 pm – 4:00 pm

Assessment of MEMS Vibration Energy Harvesting for High Temperature Sensing Applications
Steve Riches, GE Aviation Systems (Y. Jia, A. Seshia, University of Cambridge; K. Doyle, GE Aviation Systems)

Parametric Models of Ultrasonic Piezoelectric Transducers Over a Wide Temperature Range
Steven Morris, Bakers Hughes Inc. (Jeremy Townsend)

Closing Remarks: 5:00 pm

 

Thursday, July 9, 2015

English Breakfast (for those staying over previous night): 7:30 am – 8:45 am (DINING HALL)

Check-out

 

 

Premier Sponsors:
HiTEN Premier Sponsor - Presidio Components
HiTEN Premier Sponsor - M.S. KENNEDY Corp.
HiTEN Premier Sponsor - Trendsetter Electronics
HiTEN Premier Sponsor - CISSOID

 


Corporate Sponsors:

HiTEN Corporate Sponsor - Tekmos

HiTEN Corporate Sponsor - TT Semiconductor
Featuring High Temp Flash

HiTEN Corporate Sponsor - XREL Semiconductor HiTEN Corporate Sponsor - JOULE
HiTEN Corporate Sponsor - IRF

HiTEN Corporate Sponsor - Silicon Space Technology (SST)

HiTEN Corporate Sponsor - Analog Devices HiTEN Corporate Sponsor - Data Device Corp.
  HiTEN Corporate Sponsor - Criteria Labs HiTEN Corporate Sponsor -  Eltek Semiconductors  



 

CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems