KemLab

International Conference and Exhibition on
High Temperature Electronics Network (HiTEN 2019)

July 8-10, 2019
St. Anne’s College in the University of Oxford
Oxford, United Kingdom

Conference Chairs:

Colin Johnston
Oxford University
colin.johnston@materials.ox.ac.uk

F. Patrick McCluskey
University of Maryland
mcclupa@umd.edu

Organizing Committee:

John Fraley, University of Arkansas | Holger Kappert, Fraunhofer IMS |
Andy Longford, Panda Europe IMAPS UK | Samjid Mannan, King's College London |
Randy Normann, Perma Works | Maithil Pachchigar, Analog Devices | Steve Riches, Tribus-D Ltd |
David Sarraf, TE Connectivity | Jeff Watson, Analog Devices

 


Premier Sponsor:
HiTEN Premier Sponsor - Presidio Components
     

Corporate Sponsors:

HiTEN Corporate Sponsor - API Technologies
HiTEN Corporate Sponsor - TEKMOS
HiTEN Corporate Sponsor - XREL Semiconductor

 

PLUS THESE EXHIBITORS:

AdTech Ceramics
Frequency Management International
Hermetic Solutions Group
IMAPS United Kingdom Chapter
Indium Corporation
National Physical Laboratory
Q-Tech Corp.
TT Semiconductor, Inc
Ultra Electronics

 

HiTEN Conference Focus:

The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HITEN is silicon and silicon on insulator (SOI). Although, HITEN is not simply a semiconductor focused network. HITEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.



 

MONDAY, 8 JULY


7:30am-6:00pm

Registration Open

8:00am-8:45am

Breakfast
Breakfast - provided by the College for those staying overnight only.

10:00am-5:00pm

Exhibits Open (when not in session)


 

9:00am-9:15am

Opening Remarks: Conference Chairs –
Colin Johnston, Oxford University; F. Patrick McCluskey University of Maryland


SESSION 1

APPLICATIONS & DEVICES
Session Chair: Colin Johnston, Oxford University

 

9:15am-9:45am

An Advanced Extreme Environment Wireless Telemetry System for Turbine Blade Instrumentation
John Fraley, University of Arkansas (Alan Mantooth, Sajib Roy, Robert Murphree, Affan Abassi, The University of Arkansas; Anand Kulkarni, Siemens Corporate Technology; Joshua McConkey, Siemens Energy)

9:45am-10:15am

Miniature Power Sources for High Temperature Industrial Sensors
Denis Pasero, Ilika Technologies


10:15am-11:15am

Morning Coffee/Tea Break in the Exhibit Area


11:15am-11:45am

High Temperature Memory Design, Implementation, and Characterization in SiC 1µm CMOS Technology
Affan Abbasi, University of Arkansas (Robert Murphree, Sajib Roy, Marvin Suggs, John Fraley, University of Arkansas; Alan Mantooth, Jia Di, Tobias Erlbacher, Wolfspeed, A Cree Company)

 

**WITHDRAWN BY AUTHOR**
Extreme Temperature Data Processing Components and their Utility in Downhole Data Link Communications
Avery "Zack" Cashion, Sandia National Laboratories Geothermal Research Department (Grzegorz Cieslewski, Lockheed Martin Corporation)


11:45am-1:00pm

Lunch Break


SESSION 2

PACKAGING
Session Chair: Affan Abassi, University of Arkansas; Samjid Mannan, King's College London

 

1:00pm-
1:30pm

Parametric Study of Electronics Components Joining Using Reactive Films for High Temperature Applications
Donatien Martineau, Safran SA, Safran Tech, Department of electrical and electronic systems (Rabih Khazaka, Toni Youssef, Thanh Long Le, Stéphane Azzopardi)

1:30pm-
2:00pm

Moisture-Resistant Sealing Materials for Downhole HPHT Electrical Feedthrough Package
Hua Xia, Hermetic Solutions Group, LLC (USA) (Nelson Settles, David DeWire)

2:00pm-
2:30pm

Stackable SiC Embedded Ceramic Packages for High Voltage and High Temperature Power Electronics Applications
Hoang Linh Bach, Fraunhofer Institute for Integrated Systems and Device Technology IISB (Daniel Dirksen, Tobias Maximilian Endres, Christoph Friedrich Bayer, Andreas Schletz, Martin März)


2:30pm-3:30pm

Afternoon Coffee/Tea Break in the Exhibit Area


3:30pm- 4:00pm

Origami for Tight Spaces - 3D 250C PCB Assemblies for Control Systems
Piers Tremlett, Microchip

4:00pm-4:30pm

Understanding and Measuring Copper Oxidation in Organic Printed Circuit Boards Operating at High Temperatures
Martin Wickham, National Physical Laboratory (Kate Clayton, Christine Thorogood)

4:30pm-5:00pm

Effect of Bond Pad Thickness on Reliability of Copper Wire Bonds under Extreme Thermal Conditions
Patrick McCluskey, University of Maryland (Subramani Manoharan)

 

SESSION 3

THERMAL MANAGEMENT
Session Chair: Colin Johnston, Oxford University

 

5:00pm-5:30pm

Characteristics of Organic-Based Thermal Interface Materials Suitable for High Temperature Operation
Baron Wang, Siliconware USA, Inc. (Andrea Chen, Randy H.Y. Lo)

5:30pm-6:00pm

Investigation of Phase Change Materials for Efficient Thermal Management of Electronic Modules
Andrey Novikov, University of Rostock (Jacob Maxa, Mathias Nowottnick, University of Rostock; Matthias Heimann, K. Jarchoff, Siemens AG Corporate Technology)

 

**WITHDRAWN BY AUTHOR**
A Novel Class of Multiscale Nanomaterials based Thermal Interface Materials for High Temperature, High Power Density Electronics
Timothy Lin, Aegis Technology (Chuck Tan, Jessica Lin, Chao Yi, Kevin Zanjani)


 

Dinner not provided - Opportunity to visit Oxford for Dinner & Networking!


 

 



 

TUESDAY, 9 JULY


7:30am-5:00pm

Registration Open

8:00am-8:45am

Breakfast
Breakfast - provided by the College for those staying overnight only.

10:30am-4:00pm

Exhibits Open (when not in session)


SESSION 4

DIE ATTACH & SOLDERS
Session Chairs: Andy Longford, Panda Europe & IMAPS UK; Steve Riches, Tribus-D Ltd

 

9:00am-9:30am

Study of Thermal Stress in Nano Silver Bonded Silicon Substrates for High Temperature Applications
G.D. Liu, C.H. Wang, Heriot-Watt University

9:30am-10:00am

The Impact of AuSn Preforms thickness on the Solder Joint Reliability
Bernard Leavitt, Jr., Indium Corporation (Jeff Anweiler)

10:00am-10:30am

Comparative Study of How Additives Affect Sintered Silver Microstructure in Die-Attach Applications
Ming Lo, King's College London (Seyed Amir Paknejad, Harry Borrill, Wan K. Kong, Addo Addo-Kwabena, Mohamed Saidoune, Chris Powley, Naim Kapadia, Yang Zuo, Samjid H. Mannan)


10:30am-11:15am

Morning Coffee/Tea Break in the Exhibit Area


11:15am-11:45am

Improved Sinterability of Particles to Substrates by Surface Modifications on Substrate Metallization
Omid Mokhtari, Institute of Innovative Mobility - Technische Hochschule Ingolstadt (Sri Krishna Bhogaraju, Jacopo Pascucci, Gordon Elger, Technische Hochschule Ingolstadt; Fosca Conti, University of Padova; Hiren R Kotadia, The University of Warwick)

11:45am-12:15pm

Considerations for Sintering in High Temperature Electronics
Thomas Krebs, PINK GmbH Thermosysteme

12:15pm-12:45pm

Simulating the Effect of Elastic Particle Inclusion on the Mechanical Properties of Transient Liquid Phase Sintered (TLPS) Alloys
Patrick McCluskey, University of Maryland (Gilad Nave, Erick Gutierrez)


1:00pm-2:00pm

Lunch Break


 

2:00pm-2:30pm

Fabrication of Highly Reliable Joint based on Cu@Ni@Sn Double Layer Powder for High Temperature Applicationn
Hongyan Xu, Ju Xu, Institute of Electrical Engineering, Chinese Academy of Sciences (Yaochun Shen, Yihua Hu, University of Liverpool; Jianqiang Li, Ju Xu, Chinese Academy of Sciences)

2:30pm-3:00pm

Bonding Strength of Cu/Cu Joints Using Sintering Process of Micro-Sized Cu Particles for High-Temperature Application
Hiroshi Nishikawa, Osaka University (Xiangdong Liu)


3:00pm-4:00pm

Afternoon Coffee/Tea Break in the Exhibit area


"RUMP SESSION"

FUTURE OF EXTREME TEMPERATURE ELECTRONICS

MODERATORS: Colin Johnston, Oxford University; F. Patrick McCluskey, University of Maryland

 

4:00pm-5:00pm

The goal of the "Future of Extreme Temperature Electronics" rump session will be to discuss both the critical technical push and market pull drivers for Extreme Temperature Electronics in the next decade. Topics to be covered will be:

1) Applications requiring high temperature electronics and their temperature ranges

2) Critical areas requiring further research to address these applications (e.g. interconnects, substrates, encapsulants)

3) Developments in Ultra-WBG device development (e.g. diamond)

4) Overlaps and Synergies with Cold Temperature Electronics (e.g. cryocomputing, cryocooling)


 

Dinner not provided - Opportunity to visit Oxford for Dinner & Networking!


 

 



 

WEDNESDAY, 10 JULY


7:30am-12:00pm

Registration Open

8:00am-8:45am

Breakfast
Breakfast - provided by the College for those staying overnight only.

 

No Exhibits Today


SESSION 5

PASSIVES
Session Chair: Holger Kappert, Fraunhofer IMS

 

9:00am-9:30am

High Temperature - High Voltage Solid Electrolytic Capacitors
Yuri Freeman, KEMET Electronics Corporation (Philip Lessner)

9:30am-10:00am

Resistors for High Temperature Applications
Tom Morris, TT Electronics


10:00am-10:30am

Morning Coffee/Tea Break


SESSION 6

SENSORS
Session Chair: Holger Kappert, Fraunhofer IMS

 

10:30am-11:00am

On-Turbine Multisensors based on Hybrid Ceramic Manufacturing Technology
Steffen Ziesche, Fraunhofer IKTS (Adrian Goldberg, Andreas Olowinsky, Heidrun Kind, Holger Kappert)

11:00am-11:30am

Fully Integrated Sensor Electronics for Inductive Proximity Switches Operating up to 250C
Sebastian Braun, Fraunhofer Institute for Microelectronic Circuits and Systems IMS (Norbert Kordas, Alexander Utz, Holger Kappert, Rainer Kokozinski)

SESSION 7

TESTING
Session Chair: F. Patrick McCluskey, University of Maryland

 

11:30am-12:00pm

Modular Desktop Platform for High-Temperature Characterization and Test up to 300C
Tom Reinhold, IMMS Institut for Mikroelektronik- und Mechatronik-Systeme (Bjorn Bieske, Georg Glaser, Michael Meister, IMMS)

12:00pm-12:30pm

A Modular Application Specific Active Test Environment for High-Temperature Wafertest up to 300 °C
Michael Meister, IMMS GmbH (Marco Reinhard)


12:30pm

CLOSING REMARKS


 

 



Speaker Dates/Information:

HiTEN Speaker Information:

  • Abstracts Deadline Extended to: February 22, 2019
  • Abstract Notification Emails Sent: April 9, 2019
  • Final Manuscript (Proceedings Full Paper) due: May 24, 2019
  • Speaker Registration Deadline: June 14, 2019
  • Early Registration/Room/Food Reservation Deadline: June 14, 2019
  • Speaker BIO Submission Deadline: June 28, 2019
  • Slides/Presentations Prepared on/before: July 7, 2019
    • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop, cloud, or email to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Final Manuscripts for the HiTEN Proceedings are due May 24, 2019.
Send Your Final Manuscript Via E-Mail to bschieman@imaps.org, in PDF format only (PDF can be in color).

Selected Manuscripts from HiTEN will be considered for publishing in the Journal of Microelectronics and Electronic Packaging. Invitations will be made separately. Inquiries can be sent to jmep@imaps.org.

Speakers must register for this conference at the reduced speaker rates. Early registration deadline is June 14, 2019; and Room/Food reservation deadline is June 14, 2019. See registration form for detailed information.

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no official "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All session presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.


Registration Information: (Early Registration Deadline: June 14, 2019)

Delegate, Speaker/Chair, and Student registration fees include: access to all technical sessions, exhibits, meals, refreshment breaks, and one (1) Proceedings CD-ROM. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 6/14/2019
Advance/Onsite Fee
After 6/14/2019
Delegate (Member/Non-Member)
$700 USD
$800 USD
Speaker / Chair
$500 USD
$600 USD
Student
$225 USD
$350 USD
Tabletop Exhibit (IMAPS Member)
16 Tabletop Spots Available - ONLY 2 REMAIN!
$800 USD
$900 USD
Tabletop Exhibit (Non-Member)
16 Tabletop Spots Available - ONLY 2 REMAIN!
$900 USD
$975 USD
Premier Sponsorship (Includes Tabletop - Limit 4)
Includes 1 tabletop, 2 session badges, 4 exhibit personnel badges with meals, and advertisements
$3500 USD
$3500 USD
Corporate Sponsorship (Includes Tabletop - Limit 8)
Includes 1 tabletop, 1 session badge, and 2 exhibit personnel badges with meals
$2000 USD
$2000 USD

 


Housing Reservations:(Room Reservation Deadline: June 14, 2019)

Accommodations

Conference and Official Housing Location:
St. Anne's College
Oxford, UK

 

 

CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic