icaps
International Conference on 
Advanced Packaging and Systems &
Tabletop Exhibition

Sponsored by:
International Microelectronics And Packaging Society (IMAPS)

PROFESSIONAL DEVELOPMENT COURSES
SUNDAY, MARCH 10, 2002
9 AM - 5 PM

EXHIBITION HOURS
MONDAY, MARCH 11, 2002
10 AM - 6:30 PM
EXHIBIT HALL RECEPTION 5 PM - 6:30 PM

TUESDAY, MARCH 12, 2002
10 AM - 4 PM
EXHIBIT HALL LUNCH NOON - 2 PM

TECHNICAL WORKSHOPS
WEDNESDAY, MARCH 13, 2002
9 AM - NOON

Register On-Line and $ave http://www.imaps.org/registration/ICAPS2002.htm 

Professional Development Courses

Sunday, March 10, 2002

PDC1:
IC PACKAGING TRENDS AND ASSEMBLY OPTIONS - TECHNICAL ISSUES AND CONCERNS
9 AM - 5 PM

BILL GREIG, GREIG ASSOCIATES

DESCRIPTION: 
This course addresses the impact of both the Integrated Circuit, and End Product requirements, in particular, "smaller, better, cheaper", on packaging, assembly, and substrate interconnects. It focuses on packaging trends, namely, the Ball Grid Array, (BGA) and the Chip Scale Package, (CSP), and alternative formats, multichip modules, (MCM), chip on board, (COB) and 3-D initiatives at both the chip and package levels. Assembly options available for attachment of the IC in each case will be discussed with major emphasis on Flip Chip. The course also covers High Density Interconnect substrates (HDIs). The various substrate technologies (Thick Film, Co-fired Ceramic, and Thin Film) that are employed in the manufacture of Single Chip and Multichip Packages will be reviewed. And finally, the latest developments in PWBs, with high density, fine lines, and micro vias employing sequential processing (Build Up Technology - BUT) will be reviewed. Through out the course the technical issues will be emphasized and reliability concerns addressed where appropriate.

WHO SHOULD ATTEND?
The course provides a comprehensive overview of microelectronic packaging and assembly and is intended for individuals in any way involved with electronics manufacturing. Discussing current and future trends, it is directed towards both the experienced or inexperienced engineer and technician and management personnel with the "need to know". It should also be of particular interest to those in support activities such as procurement, quality assurance, marketing, sales, and program office will greatly benefit from this course.

SPECIAL COURSE MATERIAL:
All attendees will receive a complimentary copy of the book, "Hybrid Microcircuit Technology Handbook", J. Licari, L. Enlow, 2nd Edition, Noyes Publications, 1998.

INSTRUCTOR BIO:
Bill Greig is currently an independent consultant specializing in microelectronic packaging and assembly. His previous work experiences include RCA Semiconductor, General Electric Co., Lockheed Electronics, and NASA. His areas of expertise covers semiconductor wafer processing, hybrid circuit manufacture, printed wiring board fabrication and assembly technologies such as chip & wire and flip chip. He has presented numerous courses at national symposia and has participated in CEE programs at U. of Wisconsin, Lehigh University and Rutgers University. He is a member of SMTA and IMAPS and is currently President of the Garden State Chapter.


PDC2:
CANCELLED


PDC3:
CANCELLED


PDC4:
CANCELLED


Sunday, March 10

REGISTRATION
8 AM - 5 PM

PROFESSIONAL DEVELOPMENT COURSES
9 AM - 5 PM

WELCOME RECEPTION
5 PM - 6 PM 

Monday, March 11

CONTINENTAL BREAKFAST: 7 AM - 8 AM

EXHIBIT OPENS: 10 AM - 6:30 PM

SESSION 1: DESIGN AND TEST
8 AM - 9:40 AM
SESSION CHAIRS: MARY MASSEY, TRW

SUBSTRATE TECHNOLOGY TRADE-OFFS TO ACHIEVE REDUCED PACKAGE SIZE
David Patten, Trent A. Thompson, Motorola Semiconductor Products Sector

COMPARISON OF VARIATIONS IN ORGANIC LAMINATE CROSS-SECTIONS AND ROUTING CONSTRAINTS AS RELATED TO SIMULTANEOUS SWITCHING OUTPUT NOISE
C. Fox, D. Hanson, 3M; C. Wyland, Philips Semiconductor

ON-BOARD FAULT DETECTOR FOR MONITORING COMPONENT ATTACHMENT
Ryan S. Berkely, TRW Electronics and Technology Division

EFFECTS OF PLATING STUBS ON THE ELECTRICAL PERFORMANCE OF WIREBOND PBGA PACKAGES
Wendemagegnehu Beyene, Chuck Yuan, Rob Dhat, Dave Secker, Rambus Inc.

SESSION 2: 3D PACKAGING
8 AM - 9:15 AM
SESSION CHAIRS: AJAY MALSHE, UNIVERSITY OF ARKANSAS

THE REALIZATION OF A MULTI-LAYER BAND PASS FILTER USING LASER DIRECT-WRITE TECHNIQUES
Chengping Zhang, David Liu, Todd Kegresse, Scott A. Mathews, Michael T. Duignan, Potomac Photonics, Inc.; Timothy M. Schaefer, Mayo Foundation; Rohit Modi, Huey-Daw Wu, Douglas B. Chrisey, Naval Research Laboratory

RF T/R MODULE: FROM 'MCM-D' TECHNOLOGY TO 3D PACKAGING
I. Favier, F. Mazel, R. May, A. Deschamps, M. Kavass, Thales Microwave

SYSTEM ARCHITECTURE IMPLICATIONS OF 3-D INTERCONNECT TECHNOLOGIES
Silke A. Spiesshoefer, Leonard W. Schaper, University of Arkansas (HiDEC)

BREAK: 9:40 AM - 10 AM

SESSION 3: PLENARY SESSION - PART 1
FOLDABLE FLEX AND THINNED SILICON MULTICHIP PACKAGING
10:00 AM - Noon
SESSION CHAIR: JOHN "JACK" BALDE, IDC

This is the first conference presentation of the rapidly developing folded flex technology with thinned silicon chips that is being pursued in Europe. These talks have been mentioned only in workshop presentations - and never consolidated into one session.

This innovative technology promises to make System-In-A-Package with low manufacturing costs and high performance, not requiring tested die.
This is an early view of a forthcoming IMAPS textbook on this exciting subject.

Leading the technology are three independent Fraunhofer companies, you will hear from two of the three companies in this session and the third in tomorrow's Plenary Session.

FOLDABLE FLEX AND THINNED SILICON CHIPS
John Balde, IDC

LOW-PROFILE AND FLEXIBLE ELECTRONIC ASSEMBLIES USING ULTRA-THIN SILICON - THE EUROPEAN FLEX-SI PROJECT
Thomas Harder, Wolfgang Reinert, Fraunhofer ISIT

PACKAGING TECHNOLOGIES FOR FLEXIBLE SYSTEMS
Christine Kallmayer, Karlheinz Bock, Rolf Aschenbrenner, Herbert Reichl, Fraunhofer IZM

LUNCH: NOON - 2 PM

SESSION 4: SYSTEM APPLICATION
2 PM - 5:40 PM
SESSION CHAIRS: PHILLIP ZULUETA, JPL; KENT STEEVES, GORE

COST AND MANUFACTURING OPTIMIZATION OF HIGH PERFORMANCE COMMUNICATION HARDWARE USING A DAUGHTER MODULE
Sergio Camerlo, Scott Priore, Mark Brillhart, Wheling Cheng, Lekhanh Dang, Jeremy Chen, Cisco Systems Inc.

LTCC FUEL CELL SYSTEM FOR PORTABLE WIRELESS ELECTRONICS
Jeanne Pavio, Joseph Bostaph, Allison Fisher, Jerry Hallmark, Billy-Joe Mylan, Chenggang Xie, Motorola Labs, Energy Technologies Laboratory

LTCC-BASED SYSTEM-IN-A-PACKAGE ADVANCEMENTS AND MARKET POTENTIAL
James W. Lawson, Janet A. Kingston, C-MAC MicroSystems - a Solectron Company

AIR CAVITY PKG 1) FOR UP TO 5GHZ APPLICATION
Makoto Aoki, Satoshi Ikeda, Kunio Tochi, Noriyuki Tanagi, Tsutomu Fujita, Kouichi Kongou, Nikko

BREAK: 3:40 PM - 4 PM

HIGH TEMPERATURE AUTOMOTIVE ELECTRONICS
R. Wayne Johnson, John L. Evans, Auburn University; Peter Jacobsen, Eaton Corporation; Rick Thompson, DaimlerChrysler Corporation

OPTIMIZATION OF A PHASE LOCKED LOOP (PLL) POWER SUPPLY DESIGN
Quan Qi, Tim Michalka, Mark Frank, Hewlett Packard Company

AN IMPLEMENTATION OF THE GEOMAT DESIGN METHODOLOGY: DESIGNING A LOW-COST METAL LAMINATE INTEGRATED DUPLEXER/ANTENNA SYSTEM
Ron Barnett, GeoMat Insights; Lou Manzione, Bell Labs, Lucent Technologies; Hui Wu, Big Bear Networks

DEVELOPMENT OF NEW PRINTED WIRING BOARD WITH COAXIAL WIRINGS
Yuichiro Sato, Naoji Tanaka, Akihiko Kawashima, Yoshiaki Kawamata, Kenichi Kobayashi, Shinwa Corp., Ltd.; Katsuya Kikuchi, Hiroshi Nakagawa, Kazuhiko Tokoro, Masahiro Aoyagi, National Institute of Advanced Industrial Science and Technology (AIST)

SESSION 5: HIGH DENSITY PACKAGING MATERIALS
2 PM - 5:40 PM
SESSION CHAIRS: MARK SYLVESTER, 3M

DIODE LASER SOLDERING OF METALLIZED FIBERS USING GOLD-TIN PRE-FORMS
A. P. Hoult, R. S. Ong, Coherent Laser Processing Center

DEVELOPMENT OF A SIMULTANEOUS CURING MULTI-LAYERED SUBSTRATE
Katsura Hayashi, Kenji Kume, Shigeru Kamoi, Masahiro Fukui, Kyocera Corporation

COMPATIBILITY OF LEAD-FREE ALLOYS WITH CURRENT PCB MATERIALS
Milos Dusek, Jaspal Nottay, Christopher Hunt, National Physical Laboratory

NEW LIQUID CRYSTAL POLYMER (LCP) FLEX CIRCUITS TO MEET DEMANDING RELIABILITY AND END-USE APPLICATIONS REQUIREMENTS
Terry F. Hayden, 3M Microelectronics Systems Division

BREAK: 3:40 PM - 4 PM

A STUDY OF POLYMERIC PROTECTIVE COATINGS ON CASINGS OF FRAGILE ELECTRONIC EQUIPMENT
Ying Wang, Katerina Papoulia, Subrata Mukherjee, Cornell University; Suresh Goyal, Lucent Technologies Bell Laboratories

A PROJECTION MOIR SYSTEM FOR MEASURING WARPAGE WITH CASE STUDIES
Hai Ding, Reinhard E. Powell, I. Charles Ume, Georgia Institute of Technology

DEVELOPMENT OF AN ADVANCED SYSTEM FOR INSPECTION OF FLIP CHIP AND CHIP SCALE PACKAGE INTERCONNECTS USING LASER ULTRASOUND AND INTERFEROMETRIC TECHNIQUES
Turner Howard, Dathan Erdahl, I. Charles Ume, Georgia Institute of Technology; Juergen Gamalski, Siemens AG; Achyuta Achari, Visteon Corp.

HERALOCK™ 2000 SELF-CONSTRAINED LTCC TAPE
Frans Lautzenhiser, Edmar Amaya, Heraeus CMD

Tuesday, March 12

CONTINENTAL BREAKFAST: 7 AM - 8 AM

EXHIBIT OPENS: 10 AM - 4 PM

SESSION 6: MEMS PACKAGING
8 AM - 9:40 AM
SESSION CHAIRS: PETER BARNWELL, HERAEUS

FLIP CHIP PACKAGING OF A MEMS NEURO-PROSTHETIC SYSTEM
L. Del Castillo, R. Graber, S. D'Agostino, M. Mojarradi, A. Mottiwala, Jet Propulsion Laboratory

MEMS PACKAGING TECHNIQUE USING HF VAPOR RELEASE
R. C. Cole, R. Robertson, J. Swenson, J.V. Osborn, The Aerospace Corporation

CERAMIC PACKAGES FOR MEMS
Susheel Dharia, Kyocera America, Inc.

VIBRATION ISOLATION OF MEMS SENSORS FOR AEROSPACE APPLICATIONS
Robert Dean, George Flowers, Scotte Hodel, Ken MacAllister, Roland Horvath, Alex Matras, Auburn University; Rob Glover, U. S. Army Aviation & Missile Command

SESSION 7: HIGH DENSITY PACKAGING
8 AM - 9:40 AM
SESSION CHAIRS: LEONARD SCHAPER, UNIVERSITY OF ARKANSAS

ADVANTAGES OF HIGH DENSITY SURFACE MOUNT BACKPLANE CONNECTORS FOR SPACE
Zoltan A. Szalontai, Ryan S. Berkely, Doug Cockfield, TRW Electronics and Technology Division

PLASTIC BALL GRID ARRAYS, A QUALIFIED PACKAGING TECHNOLOGY FOR HIGH RELIABILITY SPACE APPLICATIONS
Mary C. Massey, Brian E. Parrish, William E. McMullen, Thomas J. Estes, TRW Electronic Systems and Technology Division

DEVELOPMENT OF MOLDED ARRAY SMCSP PACKAGE WITH HIGH DENSITY TYPED LEAD FRAME
Sang-kyun Lee, Bong-hui Lee, Kwang-suk Park, Han-gyu Kim, Samsung Techwin Co., Ltd.

Wafer Applied Underfills for Flip Chip Assembly
R. Wayne Johnson, Qing Wang, Fei Ding, Renzha Zhao, Auburn University; Larry Crane, Mark Konarski, Erin Yaeger, Afranio Torres, Rebecca Tishkoff, Paul Krug, Steve Bauman, Loctite Corporation; Marc Chason, Jan Danvir, Nadia Yala, Jing Qi, Prasanna Kulkanari, Motorola Advanced Technology Center

BREAK: 9:40 AM - 10 AM

SESSION 8: PLENARY SESSION - PART 2
FOLDABLE FLEX AND THINNED SILICON MULTICHIP PACKAGING
10:00 AM - Noon
SESSION CHAIR: JOHN "JACK" BALDE, IDC

MEDICAL IMPLANTS AND OTHER BIOMEDICAL DEVICES USING MICROFLEX INTERCONNECTION TECHNOLOGIES
J-Uwe Meyer, M. Schuttler, W. Haberer, T. Dorgen, T. Stieglitz, FhG-IBMT

FOLDED FLEX AND OTHER STRUCTURES FOR SYSTEM-IN-A-PACKAGE
Mike Warner, Tessera, Inc.

OVERVIEW AND FUTURE OF FOLDABLE FLEX TECHNOLOGY
Leonard Schaper, University of Arkansas

LUNCH: NOON - 2 PM

SESSION 9: THERMAL MANAGEMENT
2 PM - 4:25 PM
SESSION CHAIRS: BILL PETEFISH, 3M; JEFF KENNEDY, MANUFACTURERS SERVICES

TRANSIENT 3D HEAT FLOW ANALYSIS FOR HIGH POWER INSULATED GATE BIPOLAR TRANSISTORS USING THE TRANSMISSION LINE MATRIX
R. Hocine, M.A. Boudghene Stambouli, University of Sciences and Technology of Oran; A. Saidane, ENSET

THERMAL MANAGEMENT IN LOW TEMPERATURE COFIRE CERAMIC (LTCC) USING HIGH DENSITY THERMAL VIAS AND MICRO HEAT PIPES / SPREADERS
W. Kinzy Jones, Yanquin Liu, Florida International University

DEVELOPMENT OF DIMENSIONLESS CORRELATION FOR NATURAL CONVECTION COOLING BOARD
Koki Shimohashi, Tohru Nakanishi, IBM Japan

BREAK: 3:15 PM - 3:35 PM

THERMAL MODEL FOR OVER HANG AND THERMAL RESISTANCE OF C-MOUNT LASER DIODES
Chunlin Xia, Serrena Carter, Coherent Semiconductor

A REPORT ON A QUICK DISCONNECT DESIGNED EXPERIMENT
James Robles, The Boeing Company

SESSION 10: RELIABILITY
2 PM - 4:25 PM
SESSION CHAIRS: R. WAYNE JOHNSON, AUBURN UNIVERSITY; JON ADAY, AMKOR

EXPERIMENT STUDY ON RELIABILITY OF SOLDER JOINTS UNDER ELECTRICAL STRESSING - NANO-INDENTATION, ATOMIC FLUX MEASUREMENT
Hua Ye, Cemal Basaran, Douglas Hopkins, University at Buffalo, SUNY

ON THE EFFECT OF USING PROTECTIVE THIN LAYERS ON DEVICE RELIABILITY
Abdolreza Langari, Winfred Morris, Hassan Hashemi, Mindspeed Technologies Inc.

IMPROVING THE PIN GRID ARRAY RELIABILITIES WITH NOVEL NEW PIN DESIGN
Quan Qi, Dave Quint, Karl Bois, Hewlett Packard Company

BREAK: 3:15 PM - 3:35 PM

RELIABILITY EVALUATION OF HIGH DENSITY MICROVIA STRUCTURES
Jaydutt Joshi, Conexant Systems, Inc.; Ursula Marquez, K. Srihari, State University of New York; Anthony Primavera, Universal Instruments Corporation

Processing and Reliability of CSPs with Underfill
Jing Liu, R. Wayne Johnson, Auburn University; Erin Yaeger, Mark Konarski, Larry Crane, Loctite Corporation

SESSION 11: POWER PACKAGING
4:25 PM - 5:15 PM
SESSION CHAIR: DAVE HANSON, 3M

THINK HIGH DENSITY AND POWER ELECTRONIC BY SELECTING PACKAGING TECHNOLOGY AND BE PREPARED FOR HIGH VOLUME PRODUCTION
Flemming Nielsen, Grundfos Management A/S

THE RESEARCH OF AI/AIN AND AI/AI2O3 SUBSTRATE
Rong Peng, Heping Zhou, Xiaoshan Ning, Xu Wei, Tsinghua University

Wednesday, March 13

The Technical Committee of ICAPS is pleased to present four in-depth technical workshops to provide detailed information on topics of immediate interest to the Advanced Packaging and Systems community. These workshops are included as part of the Conference registration, so please be sure to select the workshop you would like to attend on the registration form. The four workshop topics selected are:

1. Fundamentals of Fabrication and Packaging of MEMS and Related Micro Systems
2. Flexible Circuit Applications, Materials and Manufacturing Processes
3. Advanced Organic Substrate Package Design & Manufacturing for RF Applications
4. Flip Chip Technology

Packaging is the major cost driver in MEMS technology today. For the future growth of this market, packaging must be addressed. The first workshop will discuss these challenges and opportunities. In the Plenary Sessions, 3-D system packaging using thinned silicon and foldable flex technology will be discussed. The goal of the second workshop is to provide greater insight into the design and manufacture of flex circuitry. Wireless systems and products are one of the fastest growing segments in the industry. The third workshop focuses on the design and manufacture of packages to meet the demands of this market. Utilization of flip chip technology for flip chip-in-package is growing dramatically and is the topic of the fourth workshop. This workshop will address issues of bumping, design, assembly and reliability. 

Additional information about each workshop is given below.

WORKSHOP 1:
FUNDAMENTALS OF FABRICATION AND PACKAGING OF MEMS AND RELATED MICRO SYSTEMS
9 AM - NOON

Instructor: Ajay P. Malshe, University of Arkansas

Workshop Description:
This introductory course will cover packaging and integration of micro-electro mechanical systems (MEMS). Unlike integrated circuit (IC) packaging, MEMS packaging is highly application specific. MEMS and related micro systems are designed, fabricated and packaged for various applications, for example accelerometers, gyros, RF switches, optical switches, micro fluidic drug delivery systems, etc. Moreover, growing trend demands multifunctional systems where integration of these diverse signals results into true "mixed signal systems". Hence, growing number of products need application specific design, materials, fabrication and assembly processes for building reliable MEMS systems.


WORKSHOP 2:
AN OVERVIEW OF FLEXIBLE CIRCUIT APPLICATIONS, MATERIALS AND MANUFACTURING PROCESSES
9 AM - NOON

Instructor: Joe Fjelstad, JC Fjelstad and Associates

Workshop Description:
Flexible circuits are arguably the world's most versatile electronic interconnection technology. Today products enabled by flex circuit technology abound as they are used in every imaginable way. This workshop will examine this rapidly expanding and evolving technology, pausing first to review some of the many applications for flex and then moving on to examine the different materials employed and processing methods used in their manufacture. Included in the discussions will be a brief review of some of the more important design considerations that should be addressed to assure a successful flex circuit enabled product.


WORKSHOP 3:
ADVANCED ORGANIC SUBSTRATE PACKAGE DESIGN & MANUFACTURING FOR RF APPLICATIONS
9 AM - NOON

Instructor: Hassan Hashemi, Conexant Systems, Inc.

Workshop Description:
The objectives of this course are to review design and manufacturing practices and tradeoffs affecting current and next generation Wireless Packaging using laminate substrate technologies in single or multiple die packaging format. The course material is based upon the instructor's experience on current practices used for Wireless & GHz IC packaging for wireless (e.g. Power Amplifier modules) and internet infrastructure applications. The course is designed for engineers or engineering managers who want to understand more about laminate single or multi chip modules, and the unique requirements for assuring that packages can be manufactured in a high volume commercial application and meet stringent electrical and thermal performance requirements.


WORKSHOP 4:
FLIP CHIP TECHNOLOGY
9 AM - NOON

Instructor: R. Wayne Johnson, Auburn University

Workshop Description:
This workshop provides insight into the design and assembly of electronics using flip chip devices. The workshop will cover the practical issues of implementing flip chip technology from wafer bumping to reliability characterization. This workshop will begin with an examination of bumping options and corresponding design rules. Redistribution will also be discussed. Substrate requirements for flip chip will then be presented including a discussion of high density interconnect options and substrate design. Assembly of flip chip devices adds materials and processes to the standard assembly process and the integration of these into the process flow is examined. Materials and processes to be discussed include fluxes, underfills (capillary flow, fluxing no-flow, and wafer applied), substrate dehydration, flux and underfill application, underfill curing, inspection and underfill characterization techniques. The workshop will conclude with a discussion of flip chip assembly reliability testing.

Register On-Line and $ave http://www.imaps.org/registration/ICAPS2002.htm 

*************

Look to the registration form for the Pre-Publication Offer for the new Emerging Technologies book by IMAPS with Kluwer Publications:
"Foldable Flex and Thinned Silicon Multichip Packaging"

This complete book is a follow up to the previews at the Plenary sessions and publishes for the first time the System-In-A-Package work at Fraunhofer IZM, Medical and ISIT, and technology by Tessera and Valtronic. It also includes system and electrical analysis by Evan Davidson, Ted Tessier and Len Schaper, thermal analysis from Carl Zweben and high density flex availability information from Jan Vardaman of Techsearch.

This is a pre-publication price in advance of the printing scheduled for July 2002.

*************

THINGS TO DO IN RENO!

Brookside Golf Gourse:
This nine-hole course is adjacent to the Reno/Tahoe International Airport and was originally designed by a group of doctors in 1956. This is great place to go during lunch hour, play nine holes, and be back in the office before anyone notices you're gone. The par-35 course with 2,882 yards makes for an easy round. Green fees are $18, carts $20. Fees may go up $1 during the summer months. No reservations necessary for tee times.

Addi Galleries Reno:
You will not find a better place to shop for fine art in Reno. Gallery director Winifred Addi knows her stuff. She has extensive art education at Ecole de Louvre and Sotheby's American Arts. You will find works of more than 200-artists including Salvador Dali, Marc Chagall, Fredric Remington and Red Skelton. One could easily spend hours browsing in this fine gallery conveniently located at the Reno Hilton Hotel Casino.

Ultimate Rush:
Just imagine yourself being harnessed securely to a thick wire cord and slowly raised 180 feet in the air, then released. ZOOM!! You go flying through the air at an incredible speed and swing back and forth until you finally slow down and stop. What an incredible rush you will feel! This cool thrill ride is a combination of skydiving, bungee jumping and hang gliding. Take this thrill-of-a-lifetime ride, and your trip to Reno will indeed be memorable. The cost is $25 per daredevil.

Reno Hilton Bowling Center:
This neat bowling facility offers you 50-championship synthetic lanes with state-of-the-art automatic scoring. This is a great place for the entire family to come spend a day of fun that should be right up your alley. Bumper bowling is available upon request. There is also a snack bar, video game room and a full service lounge with your favorite cocktails. Prices are $2.40 per game 8am-6pm, $2.95 per game 6pm-midnight, and $1.80 per game for graveyard bowling. Shoe rental is $2 per person.

Snowind Sports:
Located pool-side at the Reno Hilton Hotel, this convenient store rents bikes, skates, snowboards and skis. You'll get personalized service and the best boot fitting in town. Bauer in-line skates are featured. Rental rate for bikes start at $8 per hour, $15 half-day, and $25 all day. In-line skate rentals start at $5 per hour, $10 half-day and $15 all day. Ski rentals range from $20-$28 and snowboard rentals $30 per day.

Hilton Bay Aqua Driving Range:
This is a great place to bring the whole family. During the summer months, the natural bay is a cool place to hang out and people-watch, bird-watch or coach your loved ones while they practice. Even in winter, die-hard enthusiasts will practice their golf swing until the lake freezes over. Club rentals are available at $5 per club, and a basket of balls starts at $3.

Fun Quest:
Never-ending fun is what you will find at this incredible 40,000 square foot fun center, whichfeatures a wide array of activities and games for the entire family, including more than 200 of the latest most exciting video and redemption games.

For those of you who like to get a little physical, the place offers magnetic bumper car rides for $2, as well as Reno's first interactive laser tag arena, which houses a dynamic live action, high-tech game of hide-and-seek for a cost of $6. This 5,000-square foot futuristic arena comes complete with music and special effects to make it both physically and mentally challenging. A batting cage and power pitcher for baseball simulation is also featured. For children ages one through eight, there is The Galaxian Theater and Tumble Town. Your tots can play here safely for $2.

There is a $2 charge for admission on Friday, Saturday and holidays. You will be given the value of admission in tokens for the arcade. There is also a charge for individual attractions and games. All-day wristband passes are available for purchase.

For more information on Reno, visit info@cityofreno.com