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IMAPS Technical Program Index

Programs appear in chronological order, most recent first


IMAPS Annual Symposia | Conferences | Workshops | GBC/MMRC

IMAPS Annual Symposia

IMAPS 2016 - 49th International Symposium on Microelectronics
Meeting Date: October 10-13, 2016
Meeting Location: Pasadena Convention Center, Pasadena, California

IMAPS 2015 - 48th International Symposium on Microelectronics
Meeting Date: October 26-29, 2015
Meeting Location: Rosen Centre Hotel, Orlando, Florida

IMAPS 2014 - 47th International Symposium on Microelectronics
Meeting Date: October 13-16, 2014
Meeting Location: Town and Country Convention Center, San Diego, California

IMAPS 2013 - 46th International Symposium on Microelectronics
Meeting Date: September 30-October 3, 2013
Meeting Location: Rosen Centre Hotel, Orlando, Florida

IMAPS 2012 - 45th International Symposium on Microelectronics
Meeting Date: September 9-13, 2012
Meeting Location: Town and Country Convention Center, San Diego, California

IMAPS 2011 - 44th International Symposium on Microelectronics
Meeting Date: October 9-13, 2011
Meeting Location: Long Beach Convention Center, Long Beach, California

IMAPS 2010 - 43rd International Symposium on Microelectronics
Meeting Date: October 31 - November 4, 2010
Meeting Location: Raleigh Convention Center, Raleigh, North Carolina

IMAPS 2009 - 42nd International Symposium on Microelectronics
Meeting Date: November 1-5, 2009
Meeting Location: McEnery Convention Center, San Jose, California

IMAPS 2008 - 41st International Symposium on Microelectronics
Meeting Date: November 2-6, 2008
Meeting Location: Rhode Island Convention Center, Providence, Rhode Island

IMAPS 2007 - 40th International Symposium on Microelectronics
Meeting Date: November 11-15, 2007
Meeting Location: McEnery Convention Center, San Jose, California

IMAPS 2006 - 39th International Symposium on Microelectronics
Meeting Date: October 8-12, 2006
Meeting Location: San Diego Convention Center, San Diego, California

IMAPS 2005 - 38th International Symposium on Microelectronics
Meeting Date: September 25-29, 2005
Meeting Location: Pennsylvania Convention Center, Philadelphia, Pennsylvania

IMAPS 2004 - 37th International Symposium on Microelectronics
Meeting Date: November 14-18, 2004
Meeting Location: Long Beach Convention Center, Long Beach, California

IMAPS 2003 - 36th International Symposium on Microelectronics
Meeting Date: November 16-20, 2003
Meeting Location: Hynes Convention Center, Boston, Massachusetts

IMAPS 2002 - 35th International Symposium on Microelectronics
Meeting Date: September 4-6, 2002
Meeting Location: Colorado Convention Center, Denver, Colorado

IMAPS 2001 - 34th International Symposium on Microelectronics
Meeting Date: October 9-11, 2001
Meeting Location: Baltimore Convention Center, Baltimore, Maryland

Conferences

International Conference and Exhibition on Device Packaging
Meeting Date: March 6-9, 2017
Meeting Location: WeKoPa Resort and Casino, Fountain Hills, Arizona - USA

13th Annual Conference on 3D Architectures for Semiconductor Integration and Packaging
Meeting Date: December 13-15, 2016
Meeting Location: Marriott San Francisco Airport, San Francisco, CA - USA

International High Temperature Electronics Conference (HiTEC 2016)
Meeting Date: May 10-12, 2016
Meeting Location: Marriott Pyramid North, Albuquerque, New Mexico - USA

17th Symposium on Polymers for Microelectronics
Meeting Date: April 25-27, 2016
Meeting Location: Winterthur Museum, Winterthur, Delaware - USA

IMAPS/ACerS International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2016)
Meeting Date: April 19-21, 2016
Meeting Location: Sheraton Denver Downtown Hotel, Denver, Colorado - USA

International Conference and Exhibition on Device Packaging
Meeting Date: March 14-17, 2016
Meeting Location: WeKoPa Resort and Casino, Fountain Hills, Arizona - USA

International Conference and Exhibition on High Temperature Electronics Network (HiTEN 2015)
Meeting Date: July 6-8, 2015
Meeting Location: Churchill College, Cambridge, United Kingdom

International Conference and Exhibition on Device Packaging
Meeting Date: March 16-19, 2015
Meeting Location: WeKoPa Resort and Casino, Fountain Hills, Arizona - USA

International High Temperature Electronics Conference (HiTEC 2014)
Meeting Date: May 13-15, 2014
Meeting Location: Marriott Pyramid North, Albuquerque, New Mexico - USA

IMAPS/ACerS International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2014)
Meeting Date: April 14-16, 2014
Meeting Location: Hotel Hankyu Expo Park Osaka, Japan

International Conference and Exhibition on Device Packaging
Meeting Date: March 10-13, 2014
Meeting Location: Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, Arizona - USA
Immediately following and co-located with GBC Spring 2014.

International Conference and Exhibition on High Temperature Electronics Network (HiTEN 2013)
Meeting Date: July 8-10, 2013
Meeting Location: St. Catherine’s College, Oxford, United Kingdom

IMAPS/ACerS International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2013)
Meeting Date: April 23-25, 2013
Meeting Location: Buena Vista Palace Hotel & Spa, Orlando, Florida

International Conference and Exhibition on Device Packaging
Meeting Date: March 11-14, 2013
Meeting Location: Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, Arizona
Immediately following and co-located with GBC Spring 2013.

International High Temperature Electronics Conference (HiTEC 2012)
Meeting Date: May 8-10, 2012
Meeting Location: Marriott Pyramid North, Albuquerque, New Mexico

IMAPS/ACerS International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2012)
Meeting Date: April 16-19, 2012
Meeting Location: Radisson Blu Hotel, Erfurt, Germany

International Conference and Exhibition on Device Packaging
Meeting Date: March 5-8, 2012
Meeting Location: Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, Arizona
Immediately following and co-located with GBC Spring 2012.

Advanced Technology Conference on Non-Hermetic Packaging Technology for Reliable Microelectronics 2012
Meeting Date: January 18, 2012
Meeting Location: Rosen Centre Hotel, Orlando, Florida

Southeastern Microelectronics Packaging Conference 2012
Meeting Date: January 17, 2012
Meeting Location: Rosen Centre Hotel, Orlando, Florida

International Conference and Exhibition on High Temperature Electronics Network (HiTEN 2011)
Meeting Date: July 18-20, 2011
Meeting Location: St. Catherine’s College, Oxford, United Kingdom

Mid-Atlantic Microelectronics Conference 2011
Meeting Date: June 23-24, 2011
Meeting Location: Atlantic City Hilton, Atlantic City, New Jersey

IMAPS/ACerS International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2011)
Meeting Date: April 5-7, 2011
Meeting Location: The Westgate Hotel, San Diego, California

International Conference and Exhibition on Device Packaging
Meeting Date: March 7-10, 2011
Meeting Location: Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, Arizona
Immediately following and co-located with GBC Spring 2011.

Mid-Atlantic Microelectronics Conference 2010
Meeting Date: June 17-18, 2010
Meeting Location: Atlantic City Hilton, Atlantic City, New Jersey

International High Temperature Electronics Conference (HiTEC 2010)
Meeting Date: May 11-13, 2010
Meeting Location: Hyatt Regency, Albuquerque, New Mexico

IMAPS/ACerS International Conference on Ceramic Interconnect and
Ceramic Microsystems Technologies (CICMT 2010)

Meeting Date: April 19-21, 2010
Meeting Location: OTA, Chiba, Japan

International Conference and Exhibition on Device Packaging
Meeting Date: March 8-11, 2010
Meeting Location: Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, Arizona
Immediately following and co-located with GBC Spring 2010.

International Conference and Exhibition on High Temperature Electronics Network (HiTEN 2009)
Meeting Date: September 13-16, 2009
Meeting Location: St. Catherine’s College, Oxford, United Kingdom

IMAPS/ACerS International Conference on Ceramic Interconnect and
Ceramic Microsystems Technologies (CICMT 2009)

Meeting Date: April 21-23, 2009
Meeting Location: The Curtis Hotel, Denver, Colorado

International Conference and Exhibition on Device Packaging
Meeting Date: March 9-12, 2009
Meeting Location: Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, Arizona
Immediately following and co-located with GBC Spring 2009.

International High Temperature Electronics Conference (HiTEC 2008)
Meeting Date: May 12-15, 2008
Meeting Location: Hotel Albuquerque Old Town, Albuquerque, New Mexico

IMAPS/ACerS International Conference on Ceramic Interconnect and
Ceramic Microsystems Technologies (CICMT 2008)

Meeting Date: April 21-24, 2008
Meeting Location: Holiday Inn - City Centre, Munich, Germany

International Conference and Exhibition on Device Packaging
Meeting Date: March 17-20, 2008
Meeting Location: Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, Arizona
Immediately following and co-located with GBC Spring 2008.

IMAPS/ACerS International Conference on Ceramic Interconnect and
Ceramic Microsystems Technologies (CICMT 2007)

Meeting Date: April 23-26, 2007
Meeting Location: Grand Hyatt Hotel, Denver, Colorado

International Conference and Exhibition on Device Packaging
Meeting Date: March 19-22, 2007
Meeting Location: Doubletree Hotel, Scottsdale, Arizona
Immediately following and co-located with GBC Spring 2007.

International Conference on Alternative Energy
Meeting Date: January 16-18, 2007
Meeting Location: Albuquerque Embassy Suites Hotel & Spa, Albuquerque, New Mexico

International High Temperature Electronics Conference (HiTEC 2006)
Meeting Date: May 15-18, 2006
Meeting Location: Hilton of Santa Fe, Santa Fe, New Mexico

IMAPS/ACerS International Conference on Ceramic Interconnect and
Ceramic Microsystems Technologies (CICMT 2006)

Meeting Date: April 24-27, 2006
Meeting Location: Grand Hyatt Hotel, Denver, Colorado

International Conference and Exhibition on Device Packaging
Meeting Date: March 20-23, 2006
Meeting Location: Doubletree Hotel, Scottsdale, Arizona
Immediately following and co-located with GBC Spring 2006.

CICMT 2005: IMAPS/ACerS 1st International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
Meeting Date: April 10-13, 2005
Meeting Location: Baltimore Marriott Waterfront Hotel, Baltimore, Maryland

International Conference and Exhibition on Device Packaging 2005
Meeting Date: March 13-16, 2005
Meeting Location: Hilton Scottsdale Resort & Villas, Scottsdale, Arizona

International High Temperature Electronics Conference (HiTEC) 2004
Meeting Date: May 17-20, 2004
Meeting Location: Hilton of Santa Fe, Santa Fe, New Mexico

Ceramic Interconnect Technology: The Next Generation II
Meeting Date: April 27-28, 2004
Meeting Location: Hyatt Regency, Denver, Colorado

Ceramic Interconnect Technology: The Next Generation
Meeting Date: April 7-9, 2003
Meeting Location: The Westin Hotel, Denver, Colorado

Flip Chip Technology Workshop and Exhibition
Meeting Date: June 24-26, 2002
Meeting Location: Four Seasons Hotel, Austin, Texas

International Conference on Advanced Packaging and Systems & Tabletop Exhibition (ICAPS)
Meeting Date: March 10-13, 2002
Meeting Location: Reno Hilton Hotel, Reno, Nevada

Workshops

Advanced Technology Workshop on Advanced Packaging for Medical Microelectronics
Meeting Date: January 31-February 1, 2017
Meeting Location: Handlery Hotel, San Diego, California
- USA

Advanced Technology Workshop on Thermal Management
Meeting Date: October 25-27, 2016
Meeting Location: Toll House, Los Gatos, California
- USA

Advanced Technology Workshop & Tabletop Exhibition on Advances in Semiconductor Packaging
Meeting Date: September 22, 2016
Meeting Location: SUNY Polytechnic Institute, Marcy, New York - USA

Advanced Technology Workshop & Tabletop Exhibits on Additive Manufacturing & Printed Electronics
Meeting Date: June 28-29, 2016
Meeting Location: UMass Lowell Inn and Conference Center, Lowell, Massachusetts - USA

Advanced Technology Workshop on RaMP (RF/Microwave Packaging)
Meeting Date: April 5-6, 2016
Meeting Location: DoubleTree San Diego, San Diego, California - USA

Advanced Technology Workshop & Tabletop Exhibition on Wire Bonding
Meeting Date: February 9-10, 2016
Meeting Location: Toll House, Los Gatos, California
- USA

Advanced Technology Workshop on Advanced Packaging for Wireless Medical Devices
Meeting Date: January 26-27, 2016
Meeting Location: San Diego Marriott Mission Valley, San Diego, California
- USA

Advanced Technology Workshop on Thermal Management
Meeting Date: September 22-24, 2015
Meeting Location: Toll House, Los Gatos, California
- USA

Advanced Technology Workshop & Tabletop Exhibition on Advances in Semiconductor Packaging
Meeting Date: September 24, 2015
Meeting Location: SUNY Polytechnic Institute, Marcy, New York - USA

Advanced Technology Workshop on Electronic Packaging for Wearable Electronics
Meeting Date: June 15-16, 2015
Meeting Location: Doubletree Suites by Hilton Austin Austin, Texas - USA

Advanced Technology Workshop on Automotive Microelectronics and Packaging
Meeting Date: June 3-4, 2015
Meeting Location: Dearborn Inn, Dearborn, Michigan - USA

Advanced Technology Workshop on RaMP (RF/Microwave Packaging)
Meeting Date: April 16, 2015
Meeting Location: Weetwood Hall Conference Centre, Otley Road Leeds, LS16 5PS - United Kingdom

Advanced Technology Workshop on Thermal Management
Meeting Date: October 28-30, 2014
Meeting Location: Toll House, Los Gatos, California

Advanced Technology Workshop on Packaging the Next Generation of Nano Devices
Meeting Date: April 30, 2014
Meeting Location: CNSE, Albany, New York

Advanced Technology Workshop on RaMP (RF/Microwave Packaging)
Meeting Date: April 8-9, 2014
Meeting Location: The Crowne Plaza, San Diego, California

Topical Workshop on Wire Bonding
Meeting Date: January 21-22, 2014
Meeting Location: San Jose Airport Hotel, San Jose, California

Advanced Technology Workshop on Thermal Management
Meeting Date: November 5-7, 2013
Meeting Location: Toll House, Los Gatos, California

Advanced Technology Workshop on Microelectronic Packaging for Medical & Hi-Rel Devices
Meeting Date: May 13-14, 2013
Meeting Location: Crowne Plaza Minneapolis Northstar Downtown, Minneapolis, Minnesota

Advanced Technology Workshop on Packaging the Next Generation of Nano Devices
Meeting Date: April 30-May 1, 2013
Meeting Location: CNSE, Albany, New York

Topical Workshop on Wire Bonding
Meeting Date: January 22-23, 2013
Meeting Location: Radisson Hotel San Jose Airport, San Jose, California

Advanced Technology Workshop on Thermal Management
Meeting Date: November 12-14, 2012
Meeting Location: Toll House, Los Gatos, California

Advanced Technology Workshop on Packaging the Next Generation of Nano Devices
Meeting Date: June 14-15, 2012
Meeting Location: CNSE, Albany, New York

Advanced Technology Workshop on Automotive Microelectronics and Packaging
Meeting Date: May 22-24, 2012
Meeting Location: Dearborn Inn, Dearborn, Michigan

Advanced Technology Workshop on 3D and Conformable Printed Electronic Packaging Materials, Manufacturing & Applications
Meeting Date: February 22-23, 2012
Meeting Location: University of Texas, El Paso (UTEP), El Paso, Texas

Advanced Technology Workshop on RF/Microwave Packaging
Meeting Date: February 7-8, 2012
Meeting Location: The Crowne Plaza, San Diego, California

Advanced Technology Workshop on System Level Packaging
Meeting Date: November 10-11, 2011
Meeting Location: Dinah's Garden Hotel, Palo Alto, California

Advanced Technology Workshop on Thermal Management
Meeting Date: November 7-9, 2011
Meeting Location: Dinah's Garden Hotel, Palo Alto, California

Advanced Technology Workshop and Tabletop Exhibition on Think Thin: IC Packaging for the New Era of Mobile Devices
Meeting Date: August 23-24, 2011
Meeting Location: The Biltmore Hotel & Suites, Santa Clara, California

IMAPS & SEMI Topical Workshop on Wire Bonding
Meeting Date: July 14, 2011
Meeting Location: San Francisco Marriott Hotel, San Francisco, California
Co-Located with Advanced Interconnect Workshop & SEMICON West 2011.

IMAPS & SEMI Topical Workshop on Advanced Interconnect and Substrate Technologies
Meeting Date: July 13, 2011
Meeting Location: San Francisco Marriott Hotel, San Francisco, California
Co-Located with Wire Bonding Workshop & SEMICON West 2011.

IMAPS/IEEE-CPMT Advanced Technology Workshop on Optoelectronic Packaging
Meeting Date: June 29-30, 2011
Meeting Location: University of California-Irvine, Irvine, California

Advanced Technology Workshop on Microelectronic Packaging for Medical & Hi-Rel Devices
Meeting Date: June 14-15, 2011
Meeting Location: Crowne Plaza Minneapolis Northstar Downtown, Minneapolis, Minnesota

Advanced Technology Workshop on High Reliability Microelectronics for Military Applications
Meeting Date: May 17-19, 2011
Meeting Location: Doubletree BWI, Linthicum Heights, Maryland

Advanced Technology Workshop on Thermal Management
Meeting Date: September 28-30, 2010
Meeting Location: Dinah's Garden Hotel, Palo Alto, California

Advanced Technology Workshop on High Reliability Microelectronics for Military Applications
Meeting Date: August 31 - September 2, 2010
Meeting Location: Bethesda North Marriott Hotel & Conference Center, Bethesda, Maryland

IMAPS & SEMI Topical Workshop on Advanced Interconnect Technologies
Meeting Date: July 14, 2010
Meeting Location: San Francisco Marriott Hotel, San Francisco, California
Co-Located with Wire Bonding Workshop & SEMICON West 2010.

IMAPS & SEMI Topical Workshop on Wire Bonding
Meeting Date: July 15, 2010
Meeting Location: San Francisco Marriott Hotel, San Francisco, California
Co-Located with Advanced Interconnect Workshop & SEMICON West 2010.

Advanced Technology Workshop on Microelectronic Packaging and Materials
for Medical Devices

Meeting Date: June 9-10, 2010
Meeting Location: Crowne Plaza Minneapolis Northstar Downtown, Minneapolis, Minnesota

Advanced Technology Workshop on Printed Devices and Applications
Meeting Date: May 6-7, 2010
Meeting Location: Doubletree Resort International Drive, Orlando, Florida

Advanced Technology Workshop on Automotive Microelectronics and Packaging
Meeting Date: April 27-28, 2010
Meeting Location: Doubletree Hotel, Dearborn, Michigan

Advanced Technology Workshop on Thermal Management
Meeting Date: October 6-8, 2009
Meeting Location: Dinah's Garden Hotel, Palo Alto, California

Advanced Technology Workshop on RF/Microwave Packaging
Meeting Date: September 22-24, 2009
Meeting Location: The Crowne Plaza, San Diego, California

Advanced Technology Workshop on Wire Bonding
Meeting Date: July 13, 2009
Meeting Location: San Francisco Marriott Hotel, San Francisco, California

Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications
Meeting Date: February 25-27, 2009
Meeting Location: International Plaza Resort, Orlando, Florida

Advanced Technology Workshop on Thermal Management
Meeting Date: October 13-16, 2008
Meeting Location: The Cabaña Hotel & Resort (A Crowne Plaza Resort), Palo Alto, California

Advanced Technology Workshop on RF and Microwave Packaging
Meeting Date: September 16-18, 2008
Meeting Location: The Crowne Plaza, San Diego, California

Advanced Technology Workshop on Wire Bonding
Meeting Date: July 14, 2008
Meeting Location: Intercontinental Hotel, San Francisco, California

Advanced Technology Workshop on Advanced Substrates and Next Generation Semiconductors
Meeting Date: April 30-May 1, 2008
Meeting Location: The Conference Center at the Maritime Institute, Baltimore, Maryland

Topical Workshop on Military, Aerospace, Space and Homeland Security (MASH 2008)
Meeting Date: April 29-30, 2008
Meeting Location: The Conference Center at the Maritime Institute, Baltimore, Maryland

Advanced Technology Workshop on Integrated/Embedded Passives
Meeting Date: November 15-16, 2007
Meeting Location: San Jose Convention Center/Fairmont Hotel, San Jose, California

Advanced Technology Workshop on Thermal Management
Meeting Date: September 24-27, 2007
Meeting Location: Holiday Inn San Jose, San Jose, California

Topical Workshop on Military, Aerospace, Space and Homeland Security (MASH 2007)
Meeting Date: May 7-10, 2007
Meeting Location: Radisson Plaza Lord Hotel, Baltimore, Maryland

Advanced Technology Workshop on Automotive Microelectronics and Packaging
Meeting Date: April 9-12, 2007
Meeting Location: Hyatt Regency, Dearborn, Michigan

2nd ATW on Reliability of Advanced Electronic Packages and Devices in EXTREME COLD Environments
Meeting Date: February 27-March 1, 2007
Meeting Location: Embassy Suites, Arcadia, California

Emerging Technology Workshop on Nanotechnologies for Microelectronics
Meeting Date: December 5-7, 2006
Meeting Location: Flamingo Las Vegas, Las Vegas, Nevada

Advanced Technology Workshop on Packaging & Assembly of Power LEDs
Meeting Date: September 13-15, 2006
Meeting Location: Dinah's Garden Hotel, Palo Alto, California
(Colocated with the ATW on Thermal Management)

Advanced Technology Workshop on Thermal Management
Meeting Date: September 10-13, 2006
Meeting Location: Dinah's Garden Hotel, Palo Alto, California
(Colocated with the ATW on Power LEDs)

MASH 2006: Military, Aerospace, Space and Homeland Security: Packaging Issues and Applications
Meeting Date: June 6-8, 2006
Meeting Location: Doubletree Hotel, Washington DC

Advanced Technology Workshop on Fuel Cell Electronics Packaging
Meeting Date: January 24-26, 2006
Meeting Location: Chaparral Suites Resort, Scottsdale, Arizona

Advanced Technology Workshop on Packaging & Assembly of Power LEDs
Meeting Date: October 26-28, 2005
Meeting Location: Dinah's Garden Hotel, Palo Alto, California
(Colocated with the ATW on Thermal Management)

Advanced Technology Workshop on Thermal Management
Meeting Date: October 24-26, 2005
Meeting Location: Dinah's Garden Hotel, Palo Alto, California
(Colocated with the ATW on Power LEDs)

Topical Workshop and Tabletop Exhibiton on Flip Chip Technologies 2005
Meeting Date: June 20-23, 2005
Meeting Location: Austin Marriott at the Capitol, Austin, Texas

MASH 2005 - TW and Tabletop Exhibition on Military, Aerospace, Space and Homeland Security: Packaging Issues and Applications
Meeting Date: May 3-5, 2005
Meeting Location: Sacramento Marriott Rancho Cordova, Racho Cordova, California

ATW on Reliability of Advanced Electronic Packages and Devices in Extreme Cold Environments 2005
Meeting Date: February 21-23, 2005
Meeting Location: Hilton Pasadena, Pasadena, California

ATW on Passive Integration 2005
Meeting Date: January 24-26, 2005
Meeting Location: Hilton Marco Island Beach Resort, Marco Island, Florida

6th Topical Workshop on Packaging of MEMS and Related Micro- Nano-Bio Integrated Systems
Meeting Date: November 18-19, 2004
Meeting Location: Hyatt Regency Hotel, Long Beach, California
*Held in conjunction with IMAPS 2004*

ATW on High-Speed Interconnect, EMC and Power aspects of System Packaging for High Performance Computing, Telecom and Semiconductor Capital Equipment 2004
Meeting Date: October 27-29, 2004
Meeting Location: Sheraton Palo Alto, Palo Alto, California

ATW on Thermal Management 2004
Meeting Date: October 25-27, 2004
Meeting Location: Sheraton Palo Alto, Palo Alto, California

Optoelectronics Device Packaging TW and Exhibition 2004
Meeting Date: October 11-14, 2004
Meeting Location: Radisson Hotel Bethlehem, Bethlehem, Pennsylvania

Printing an Intelligent Future ATW 2004
Meeting Date: September 28-30, 2004
Meeting Location: Loews Hotel Annapolis, Annapolis, Maryland

Topical Workshop & Exhibition on Flip Chip Technologies
Meeting Date: June 21-24, 2004
Meeting Location: Austin Marriott at the Capitol, Austin, Texas

2nd Annual ATW on Military, Aerospace, Space and Homeland Security: Packaging Issues and Applications
Meeting Date: March 28-30, 2004
Meeting Location: Renaissance Harborplace Hotel, Baltimore, Maryland

Packaging Copper/Low-K Semiconductors
Meeting Date: December 15-17, 2003
Meeting Location: Red Lion Hanalei Hotel, San Diego, California

5th Topical Workshop on MEMS, Related Microsystems and Nanopackaging
Meeting Date: November 20-22, 2003
Meeting Location: Sheraton Boston Hotel, Boston, Massachusetts
(in conjunction with the IMAPS 2003 Symposium - November 16 - 20 ** visit www.imaps2003.org for details on IMAPS)

Optoelectronics Device Packaging and Materials
Meeting Date: October 7-10, 2003
Meeting Location: Radisson Hotel Bethlehem, Bethlehem, Pennsylvania

High-Speed Interconnect, EMC and Power Aspects of System Packaging for High Performance Computing, Telecom and Test Equipment
Meeting Date: October 19-22, 2003
Meeting Location: Sheraton Palo Alto Hotel, Palo Alto, California

Thermal Management for High-Performance Computing and Wireless Applications
Meeting Date: October 22-24, 2003
Meeting Location: Sheraton Palo Alto Hotel, Palo Alto, California

Topical Workshop and Exhibition on Flip Chip Technology
Meeting Date: June 15-18, 2003
Meeting Location: Four Season Hotel, Austin, Texas

*Advanced 3D Packaging
Meeting Date: March 11-13, 2003
Meeting Location: Renaissance Harbor Place Hotel, Baltimore, Maryland

*Military, Aerospace, Space and Homeland Security: Packaging Issues and Applications
Meeting Date: March 12-14, 2003
Meeting Location: Renaissance Harbor Place Hotel, Baltimore, Maryland \

Printing an Intelligent Future
Meeting Date: March 16-19, 2003
Meeting Location: Sheraton Boston Hotel and Towers, Boston, Massachusetts

Thermal Management for High-Performance Computing and Wireless Applications
Meeting Date: October 24-26, 2002
Meeting Location: Sheraton Palo Alto Hotel, Palo Alto, California

Optoelectronics Packaging and Micro-Optoelectromechanical Systems (MOEMS)
Meeting Date: October 8-11, 2002
Meeting Location: Hotel Bethlehem, Bethlehem, Pennsylvania

Packaging of MEMS and Related Micro Integrated Nano Systems
Meeting Date: September 6-8, 2002
Meeting Location: The Adam's Mark Hotel, Denver, Colorado

Passive Integration 2002
Meeting Date: June 19-21, 2002
Meeting Location: The Cliff House, Ogunquit, Maine

Ceramic Applications for Microwave and Photonic Packaging
Meeting Date: May 2-3, 2002
Meeting Location: The Westin Providence, Providence, Rhode Island

Printing an Intelligent Future
Meeting Date: March 8-10, 2002
Meeting Location: Hyatt Regency Lake Tahoe, Incline Village, Nevada

Packaging of MEMS and Related Micro Integrated Nano Systems
Meeting Date: November 8-10, 2001
Meeting Location: Hilton San Jose South/Scotts Valley, Scotts Valley, California

Optoelectronics Packaging
Meeting Date: October 11-14, 2001
Meeting Location: Radisson Hotel Bethlehem, Bethlehem, Pennsylvania

Thermal Management for High Performance Computing and Telecom/Wireless Applications
Meeting Date: April 20-21, 2001
Meeting Location: Sheraton Palo Alto, Palo Alto, California

Ceramic Technologies for Microwave: Handsets, Bluetooth, Broadband, LMDS
Meeting Date: March 26-27, 2001
Meeting Location: The Adam's Mark Hotel, Denver, Colorado

High Speeds Digital Interconnects
Meeting Date: January 14-16, 2001
Meeting Location: Radisson Resort & Spa Scottsdale, Scottsdale, Arizona

Global Business Council (GBC - formerly MMRC) Meetings

GBC Spring Conference 2013
Meeting Date: March 10-11, 2013
Meeting Location: Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, Arizona
Immediately preceding and co-located with Device Packaging 2013.

GBC Spring Conference 2012
Meeting Date: March 4-5, 2012
Meeting Location: Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, Arizona
Immediately preceding and co-located with Device Packaging 2012.

GBC Spring Conference 2011
Meeting Date: March 6-7, 2011
Meeting Location: Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, Arizona
Immediately preceding and co-located with Device Packaging 2011.

GBC Spring Conference 2010
Meeting Date: March 7-8, 2010
Meeting Location: Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, Arizona
Immediately preceding and co-located with Device Packaging 2010.

GBC Spring Conference 2009
Meeting Date: March 8-9, 2009
Meeting Location: Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, Arizona
Immediately preceding and co-located with Device Packaging 2009.

GBC Spring Conference 2008
Meeting Date: March 16-17, 2008
Meeting Location: Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, Arizona
Immediately preceding and co-located with Device Packaging 2008.

GBC Spring Conference 2007
Meeting Date: March 18-19, 2007
Meeting Location: Doubletree Hotel, Scottsdale, Arizona
Immediately preceding and co-located with Device Packaging 2007.

GBC Spring Conference 2006: The Business Side of Device Packaging
Meeting Date: March 19-20, 2006
Meeting Location: Doubletree Hotel, Scottsdale, Arizona
Immediately preceding and co-located with Device Packaging 2006.

GBC Winter Conference 2005
Meeting Date: March 16-17, 2005
Meeting Location: Hilton Scottsdale Resort & Villas, Scottsdale, Arizona

GBC Summer Conference 2004
Meeting Date: June 21, 2004
Meeting Location: Austin Marriott at the Capitol, Austin, Texas

MMRC Winter Meeting: Military and Aerospace Electronics
Meeting Date: December 8-10, 2002
Meeting Location: U.S. Grant Hotel, San Diego, California

MMRC Fall Meeting
Meeting Date: October 5-7, 2001
Meeting Location: Westin Fairfax Hotel, Washington, DC

 

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