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IMAPS Advanced Technology Workshop on
Passive Integration

The Cliff House
June 19-21, 2002

General Chair:
Dr. Robert Heistand, II
AVX Corporation
P: 843-444-2886; F: 843-448-2106
Email: heistand@avxus.com 


Register on-line now and $ave


Housing (Hotel Cut-off is May 10, 2002)

Housing Accommodations must be made directly to
The Cliff House
via the internet or by fax.
PO Box 2274
Ogunquit, ME 03907
P: 207-361-1000; F: 207-361-2122
Please go to:
www.cliffhousemaine.com/attendees
Username is IMAPS; Password is im692D.

The Cliff House does not accept reservations over the phone.




Wednesday, June 19


Registration: 2 pm – 7 pm

Reception/Dinner: 4 pm – 6 pm

Opening Remarks: Bob Heistand

Session 1:
Opportunities and Solutions for the Cellular Phone Applications
6:30 pm – 9:30 pm

A discussion of the requirements, trends, infrastructures and new solutions for integrated passives in cellular phone & wireless applications.

Technology and Infrastructure Requirements for Integral Discrete Devices
Minja Penttila, Pasi Nummila, Tero Krkkinen, Ilkka Kartio, Nokia Mobile Phones

Bluetooth Bandpass Filter in Organic Substrate
Philip Bowles, Li Li, Motorola

Break: 7:50 pm – 8:05 pm

Unique Front End Module Packaging Design using Integrated Passives
Rob Olney, Telephus Tessera, Flextronics

Evolution of Modules & Integrated Passive Devices in Cellular-Phone Technology
George Korony, John Galvagni, Robert Heistand II, AVX Corporation


Thursday, June 20

Continental Breakfast: 7:45 am – 8:30 am

Session 2:
Novel IPD Processes
8:30 am - 12:30 pm

Presentation of fabrication processes that include: inkjet printing; laser direct write passives; embedding fired discrete capacitors; embedding screen printed, fired on Cu foil, thick film hybrid passives; embedding solution coated, fired on Cu foil capacitors; polymer/ceramic nanocomposites & metal-organic chemical vapor deposition.

Fabrication of Passive Elements using Ink-jet Technology
Virang G. Shah, Donald J. Hayes, MicroFab Technologies, Inc.

RF Devices with Integrated and Embedded Passives in Laminated Organic Substrates: A Novel Low Temperature, Laser Direct-Write Approach
David Liu, Chengping Zhang, Todd Kegresse, Scott Mathews, Michael Duignan, Potomac Photonics, Inc.; Timothy Schaefer, Mayo Foundation; Rohit Modi, Huey-Daw Wu, Doug Chrisey, Naval Research Laboratory

Preparation of Chip Capacitors for use in Ultra-Dense Multi-Chip Modules
Thomas Marinis, D. Pryputniewicz, C. Kondoleon, J. Haley, Draper Laboratory

Break: 10:15 am – 10:35 am

Embedded Singulated Ceramic Passives in Printed Wiring Boards
William Borland , John J. Felten, Saul Ferguson, Alton B. Jones, Angela A. Lawrence, E.I. Du Pont de Nemours and Company

Integration of Thin Film Capacitors into Polymer-Based Wiring Boards or MCM-L
A. Kingon, Jon-Paul Maria, Taeyun Kim, North Carolina State University; Robert Croswell, Motorola Advanced Technology Center

Fabrication and RF Characterization of Embedded High Q Inductors and Capacitors on Organic Laminates for System-on-Package (SOP) Application
Swapan Bhattacharya, Sidhartha Dalmia, Devarajan Balaraman, P.M. Raj, Farrokh Ayazi, Madhavan Swaminathan, Rao R. Tummala, PRC Georgia Institute of Technology

Lunch: 12:30 pm - 1:30 pm

Afternoon Free for Networking

Reception/Dinner: 4 pm – 6 pm

Session 3:
PWB: Embedded Resistors
6:30 pm - 9:30pm

Topics include applications in high-speed digital circuits; volume manufacturing of screen-printed polymer thick film resistors; patterned, electroless plated resistors; trimming technologies: up, down & large panel; & unique flex based packaging.

Embedded Passive Applications, and High Yield Manufacturing of Polymer Thick Films on Organic Laminates
N. Biunno, A. Patel, Sanmina-SCI, Inc.; I. Novak, V. St. Cyr, Sun Microsystems, Inc.

Plated Embedded Resistors in Printed Wiring Boards
Dennis Fritz, Joe D’Ambrisi, Dave Sawoska, MacDermid, Incorporated

Break: 7:50 pm – 8:05 pm

Laser Trimming of Embedded Resistors for PWB Manufacturing
Andrei Naumov, Anton Kitai, GSI Lumonics; Sabine Purger, Wolfgang Bauer, AT&S AG

Flex Based Multiple Die Chip-Scale Package
Vern Solberg, Tessera, Technologies


Friday, June 21

Continental Breakfast: 7:45 am – 8:30 am

Session 4A:
Inductors: Q and Power
8:30 am - 10:30 am

Session focuses on volume manufacturing, design for high Q, design for power, high efficiency, & magnetic material processing for inductors.

Volume Production of Integrated Passives in Thin Film Technology
Thierry Touchais, PHS MEMS; Albert Achen, Dow Chemical; Didier Belot, ST Microelectronics

Integrated Magnetic Components for Distributed Power Electronics
Erik J. Brandon, Emily Wesseling, Victor White, Chris Ramsey, Linda Del Castillo, Udo Lieneweg, Jet Propulsion Laboratory

Fabrication of Thin Film V-Groove Inductors using Composite Magnetic Materials
Satish Prabhakaran, Charles.R.Sullivan, Christopher.G.Levey, Kapil Venkatachalam, Dartmouth College

Break: 10:30 am – 10:50 am

Session 4B:
Thin and Thick Film Material Properties & Design Parameters
10:50 am - 12:30 pm

Tutorials on designing with thin and thick film materials covering tantalum pentoxide, BCB, LaRC-SI flex substrates, X7R LTCC tapes, lead free LTCC tapes & pastes, and co-fireable ferrite tape.

Embedded Thin Film Capacitors-Design Space and Boundaries
Eugene Rymaszewski and Pushkar Jain, Rensselaer Polytechnic Institute

Integrated R, C, L Filters, Terminators and Dividers on LARC-SI Flex Substrates
Richard K. Ulrich, Integral Wave Technologies; Kevin Barnes, James Bockman, NASA Langley Research Center

Capacitor and Inductor Compositions for Buried Components
Alvin Feingold, R.L. Wahlers, C.Y.D. Huang, S.J. Stein, Electro-Science Labs, Inc.

Concluding Remarks:
Robert Heistand, General Chair


Register on-line now and $ave

 



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