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Topical Workshop and Tabletop Exhibit on
Military, Aerospace, Space and Homeland Security:
Packaging Issues and Applications
(MASH 2006)

Doubletree Hotel
1515 Rhode Island Avenue, NW
Washington, DC 20005 USA
June 6 - 8, 2006


Courtesy of JPL/NASA
(NASA’s Mars Reconnaissance Orbiter)
Conference & Events
June 6-8, 2006
Exhibits
June 6-7, 2006


Tabletop Exhibits have Sold Out
On-line Registration Deadline June 2, 2006

Sponsored by:
The International Microelectronics And Packaging Society (IMAPS)
Everything in electronics between the chip and the system
!

General Chair:
Technical Chair:
Greg Caswell, Director-Engineering
VirTex Assembly Services
Phone: 512-680-6269 cell
Email: gregc@virtexassembly.com
Walter Tomczykowski, Director
ARINC Engineering Services, LLC
Phone: 410-266-4535
Email: wtomczyk@arinc.com


Message from the General Chair
Activities in Military, Aerospace, Spaceborne and Homeland Security Electronics continue to advance the state-of-the-art in high reliability electronics packaging. This year’s technical program consists of a special “Keynote Needs” session where David Berteau, former Principal Deputy Assistant Secretary of Defense for Production and Logistics, will address manufacturing Trends in Electronics Interconnect Technology; Michael Sampson will discuss NASA’s vision for future packaging requirements; David Robinson will address methods for device emulation from the Defense Logistics Agency perspective; and a prognostic and diagnostic health monitoring methodology presented by Kwok Tom of the US Army Research Laboratory will initiate the workshop. This session will be followed by 28 presentations on the latest military, aerospace, space and homeland security electronic devices, systems, and applications, with particular emphasis on materials selection, thermal management, packaging, reliability and emerging technologies. In addition to this powerful program we are delighted to have a very special keynote dinner speaker, Colonel Danny McKnight returns. Danny was ground forces commander during the battle in Mogadishu depicted in the movie Black Hawk Down who mesmerized us in Baltimore 2 years ago. Come join us and participate in this exciting event.

See you in Washington,
Greg Caswell

Tuesday, June 6th

Registration: 7 a.m. - 7:00 p.m.

Continental Breakfast: 7:00 a.m. - 8:00 a.m.

Exhibit Hours: 3:00 p.m. - 6:00 p.m.
Refreshment Break and Reception will be in the Exhibit Area

Opening Remarks: 8:20 a.m.
General Chair - Greg Caswell, VirTex Assembly Services, Inc.
Technical Chair - Walt Tomczykowski, ARINC Engineering Services, LLC

SESSION I: MILITARY, SPACE, SPACEBORNE AND HOMELAND SECURITY - SPECIAL “NEEDS”
Session Chair: Greg Caswell, VirTex Assembly Services, Inc.

8:30 a.m. - Noon

Keynote Presentations
Title: Linkages: Manufacturing Trends in Electronic Interconnect Technology
Speaker: David Berteau, Clark and Weinstock

Title: Electronic Packaging for NASA’s Exploration Vision
Speaker: Michael Sampson, Program Manager, NASA GSFC


Break: 10:00 a.m. - 10:30 a.m.

Title: Generalized Emulation of Microcircuits
Speaker: David Robinson, DMSMS IST & Emulation Program Manager,
Defense Logistics Agency

Title: Prognostics and Diagnostics Health Monitoring Development for Army Systems
Speaker: Kwok F. Tom, Senior Engineer, Army Research Laboratory

Lunch: Noon - 1 p.m.

SESSION IIA: MATERIALS FOR MASH APPLICATIONS
Session Chair: Carolynn Drudik, Defense Microelectronics Activity (DMEA)

1:30 p.m. - 3:00 p.m.

Reliability of High Power Electronics Assembled by Microwave Bonding Technology
Nasser Budraa, Microwave Bonding Instruments Inc. (MBI)

Electronic Assembly Packaging using Thermoplastic and Thermoset Molding
Scott Brandenburg, Delphi Electronics & Safety

Trends in Organic Packaging and EI Roadmap and Vision
Voya Markovich, Endicott Interconnect Technologies, Inc.

Break in Exhibit Hall: 3:00 p.m. - 3:30 pm

SESSION IIB: THERMAL MANAGEMENT TRENDS
Session Chair: Carolynn Drudik, Defense Microelectronics Activity (DMEA)

3:30 p.m. - 5:30 p.m.

XRF as a Screen Tool for the Presense of Pb and Other Elements
Drew Hession-Kunz, Innov-x Systems, Inc.

An Overview of Advanced Thermal Technologies for Electronic Packaging: Issues and Applications
David Sarraf, William G. Anderson, Scott Garner, Advanced Cooling Technologies

Increased Usage of Integrated Passive Components in Low Temperature Co-Fired Ceramic (LTCC) for the RF & Microwave Industry
Steve Annas, NATEL Engineering Company

Embedded Thermoelectric Cooler for Semiconductor Thermal Management
Bob Conner, David Koester, Randy Alley, Marco Soto, Rama Venkatasubramanian, Nextreme Thermal Solutions

Reception in the Exhibit Hall: 5:30 p.m. - 6:00 p.m.
Dinner: 6:00 p.m. - 7:30 p.m.

Dinner Speaker: Colonel Danny McKnight
7:00 p.m.
SEATING FOR THE DINNER SPEECH WILL BE LIMITED AND ONLY AVAILABLE ON A FIRST COME, FIRST SERVE BASIS

Col. Danny McKnight retired in January 2002 after serving 28½ years in a distinguished and highly decorated career as a U. S. Army Ranger. His experience represents a lifetime of dedication to the defense of America.

Col. McKnight’s final assignment was as Chief of Staff for First Army, based at Fort Gillem, Georgia. His efforts as Commander of the 75th Ranger Regiment elements assigned to Task Force Ranger in Mogadishu, Somalia were chronicled in the book Black Hawk Down and the movie by the same name.

In addition to his expertise in many matters military, highlights of his skills in the leadership and management aspects of his career includes:

  • Providing direct financial management, guidance, and oversight of an annual operational budget of approximately $50 million.
  • Developing a strategic planning concept and a measurable results program to track its successful implementation for the integration of active and reserve component soldiers as part of the Army’s training strategy for the year 2000 and beyond.
  • Directing a staff of more than 300 military and DA civilian personnel to provide support for a field force of 10,000 people, who had to meet training requirements for approximately 250,000 reserve component soldiers.

Col. McKnight also has extensive experience in the areas of communications, public affairs, and emergency management.

Col. McKnight’s awards and decorations include the Legion of Merit with Two Oak Leaf Clusters; Bronze Star for Valor; Purple Heart; Meritorious Service Medal with Five Oak Leaf Clusters; National Defense Service Medal with Bronze Star; Armed Forces Expeditionary Medal with Arrowhead and Bronze Star; Combat Infantryman’s Badge; Ranger Tab; Master Parachutist Badge with Bronze Star; and Pathfinder Badge.

He graduated from the U. S. Army War College, Air Command and Staff College, Infantry Officer Advanced Course, Ranger School, Airborne School, and Infantry Officer Basic Course. He also served as an Assistant Professor of Military Science at the University of Florida in the Army ROTC Department.

Col. McKnight earned his master’s degree in higher education and administration from the University of Florida in 1985 and his bachelor’s degree in management from Florida State University in 1973.

Wednesday, June 7th

Registration: 7:00 a.m. - 6:30 p.m.

Continental Breakfast: 7:00 a.m. - 8:00 a.m.

Exhibit Hours: 10:00 a.m. - 4:00 p.m.
Refreshment Breaks will be in the Exhibit Area

SESSION III: PACKAGING ISSUES AND APPLICATIONS
Session Chair: Carolynn Drudik, Defense Microelectronics Activity (DMEA)

8:00 a.m. - Noon

The Impact of Nanotechnology on the Communication Networks of the Future
Elsa Reichmanis, Lucent Technologies

Rapid Prototyping of Micro-Systems Packaging by Data-Driven Chip-First Process Using Nano-Particles Metal Colloids
Daniel F. Baldwin, Sungchul Joo, Georgia Institute of Technology

Advanced Space and Defense Microelectronic Devices Enabled by Ultra-Lightweight Osprey CE Alloys
Stuart Weinshanker, Advanced Packaging Associates; Alan Leatham, Andrew Ogilvy, Sandvik Osprey Ltd.; Satti Sangha, EADS Astrium

Organic Flip Chip Packages for use in Military and Aerospace Applications
Kim J. Blackwell, David Alcoe, Irving Memis, Endicott Interconnect

Break in Exhibit Hall: 10:00 a.m. - 10:30 a.m.

Leveraging the Militarization of COTS Adhesives
Gregory T. Daly, Lockheed Martin Maritime Systems & Sensors

Print Forming Complex Micro-Reactors for Fuel Cell Applications
Arthur Chait, EoPlex Technologies, Inc.

An Attractive Hermetic Packaging Option
Thomas E. Salzer, Hermetric Inc.

Lunch: Noon - 1:00 p.m.

SESSION IV: RELIABILITY
Session Chair: Walt Tomczykowski, ARINC Engineering Services, LLC

1:10 p.m. - 6:00 p.m.

Effects of Plasma Pretreatment on Flip Chip and CSP Substrate Level Assembly Yield and Reliability
Daniel F. Baldwin, Georgia Institute of Technology; Paul Houston, Brian Lewis, Engent, Inc.

Techniques for Component Traceability in the Manufacture of PCB Assemblies
Jim Havener, Optimal Electronics Corp.

A New Prognostics Method for Extending the Life of Legacy Systems
Brian Tuchband, Nikhil Vichare, Michael Pecht, University of Maryland - CALCE

Storage & Quality Requirements for Military MEMS Program
James L. Zunino III, Don Skelton, US Army ARDEC

Break in Exhibit Hall: 3:10 p.m. - 4:00 p.m.

Counterfeit Electronics as Weapons of Mass Disruption
Michael Pecht, Diganta Das, University of Maryland - CALCE

Utilizing Modules and Interposers to Solve IC Obsolescence Issues: An Alternative to Board Re-Spins and Life-Time Buys
Mark Gilliam, Interconnect Systems, Inc.

Thermal Management of Critical Military Electronics
Nelson Gernert, Thermacore, Inc.

High Reliability Products - What does it really take? – A Test Perspective
Subahu D. Desai, Endciott Interconnect Technologies, Inc.

Thursday, June 8th

Registration: 7:00 a.m. – 11:00 a.m.

Continental Breakfast: 7:00 a.m. - 8:00 a.m.

SESSION V: EMERGING TECHNOLOGIES
Session Chair: Walt Tomczykowski, ARINC Engineering Services, LLC

8:00 a.m. - 10:50 a.m.

3D Technologies for Advanced Hybrid/MCM Designs
Tom Dlouhy, Gordon Jensen, CAD Design Software

A System-In-Package Approach for Military and Aerospace Applications using FlipChip and 3-D Packaging
Keith Sturken, John A. Hughes, BAE Systems

An Effectual Approach to Substantial Cost Savings: The Utilization of Advanced Commercially Available Polymers in Military Fiber Optic Applications
Gregory T. Daly, Lockheed Martin Maritime Systems & Sensors

Break: 9:30 a.m. - 9:45 a.m.

Using Embedded Capacitance to Improve Electrical Performance and Reduce Board Size
Joel Peiffer, 3M Company

IC Packaging Challenges in High Performance, High Reliability Applications
Anna Fontanelli, Mentor Graphics Corporation

Wrap up: General Chair

Tour of the Smithsonian Institution’s National Air and Space Museum
Thursday, June 8, 2006

6th & Independence Avenue, SW, Washington, DC 20560

FREE OF CHARGE
PRE-REGISTRATION REQUIRED.

The Smithsonian Institution’s National Air and Space Museum maintains the largest collection of historic air and spacecraft in the world. It is also a vital center for research into the history, science, and technology of aviation and space flight, as well as planetary science and terrestrial geology and geophysics. The National Mall Building in Washington, D.C. has hundreds of artifacts on display including the original Wright 1903 Flyer, the Spirit of St. Louis, the Apollo 11 command module, and a lunar rock sample that visitors can touch. Following the conclusion of the morning sessions on Thursday, June 8th, please join us at 1:00 p.m. for a guided tour of this spectacular museum. Tours are usually one and a half hours. For museum information, go to http://www.nasm.si.edu/museum/.

You are asked to pre-register using the registration forms.


At the Controls Flight Simulator at the National Mall Museum

 


HOTEL RESERVATION (Hotel Cut-off is May 1, 2006)
Reservation must be made directly with the:

Doubletree Hotel Washington DC
1515 Rhode Island Ave., N.W.
P: 202-232-7000; F: 202-332-8436
On-line: http://doubletree.hilton.com/en/dt/groups/personalized/wasdtdt_mas/index.jhtml

Single/Double: $175

Please reference IMAPS when making reservations.

The Doubletree Hotel requires a deposit for the first night's room and tax to hold your room.
Deposit refunded if reservation is cancelled seven (7) working days prior to arrival.


Register On-Line


© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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