Topical
Workshop and Tabletop Exhibit on
Military, Aerospace, Space
and Homeland Security:
Packaging Issues and Applications (MASH
2006)
Doubletree
Hotel
1515
Rhode Island Avenue, NW
Washington, DC 20005 USA
June
6 - 8, 2006 |
Courtesy of
JPL/NASA
(NASA’s Mars Reconnaissance Orbiter) |
Conference & Events
June 6-8, 2006
|
Exhibits
June 6-7, 2006
|
|
Tabletop Exhibits have Sold Out
On-line Registration Deadline June 2, 2006
Sponsored by:
The International Microelectronics And Packaging Society (IMAPS)
Everything in electronics between the chip and the system!
General
Chair: |
Technical
Chair: |
|
Walter Tomczykowski,
Director
ARINC Engineering Services, LLC
Phone: 410-266-4535
Email: wtomczyk@arinc.com |
Message from the General Chair
Activities in Military, Aerospace, Spaceborne and Homeland Security
Electronics continue to advance the state-of-the-art
in high reliability electronics packaging. This year’s technical
program consists of a special “Keynote Needs” session where
David Berteau, former Principal Deputy Assistant Secretary of Defense for
Production
and Logistics, will address manufacturing Trends in Electronics
Interconnect Technology; Michael Sampson will discuss NASA’s vision
for future packaging requirements; David Robinson will address
methods for device emulation from the Defense Logistics
Agency perspective; and a prognostic and diagnostic health monitoring
methodology presented
by Kwok Tom of the US Army Research Laboratory will initiate the
workshop. This session will be followed by 28 presentations
on the latest military, aerospace, space and homeland security electronic
devices, systems, and applications, with particular emphasis on
materials
selection, thermal management, packaging, reliability and emerging
technologies. In addition to this powerful program we
are delighted to have a very special keynote dinner speaker, Colonel
Danny McKnight returns. Danny was ground forces commander during
the battle in Mogadishu depicted in the movie Black Hawk Down who mesmerized
us in Baltimore 2 years ago. Come join us and participate
in
this exciting event.
See
you in Washington,
Greg Caswell |
|
Tuesday, June 6th
Registration: 7 a.m. - 7:00 p.m.
Continental Breakfast: 7:00 a.m. - 8:00 a.m.
Exhibit Hours: 3:00 p.m. - 6:00 p.m.
Refreshment Break and Reception will be in the Exhibit Area
Opening Remarks: 8:20 a.m.
General Chair - Greg Caswell, VirTex Assembly Services, Inc.
Technical Chair - Walt Tomczykowski, ARINC Engineering Services,
LLC
SESSION
I: MILITARY, SPACE, SPACEBORNE AND HOMELAND SECURITY - SPECIAL “NEEDS”
Session Chair: Greg Caswell, VirTex Assembly Services, Inc.
8:30 a.m. - Noon
Keynote Presentations
Title: Linkages: Manufacturing Trends in Electronic Interconnect
Technology
Speaker: David Berteau, Clark and Weinstock
Title: Electronic Packaging for NASA’s Exploration Vision
Speaker: Michael Sampson, Program Manager, NASA GSFC
Break: 10:00 a.m. - 10:30 a.m.
Title: Generalized Emulation of Microcircuits
Speaker: David Robinson, DMSMS IST & Emulation Program Manager,
Defense Logistics Agency
Title: Prognostics and Diagnostics Health Monitoring Development for Army
Systems
Speaker: Kwok F. Tom, Senior Engineer, Army Research Laboratory
Lunch: Noon - 1 p.m.
SESSION IIA: MATERIALS FOR MASH APPLICATIONS
Session Chair: Carolynn Drudik, Defense Microelectronics Activity
(DMEA)
1:30 p.m. - 3:00 p.m.
Reliability
of High Power Electronics Assembled by Microwave Bonding Technology
Nasser Budraa, Microwave Bonding Instruments Inc. (MBI)
Electronic Assembly Packaging using Thermoplastic and Thermoset Molding
Scott Brandenburg, Delphi Electronics & Safety
Trends
in Organic Packaging and EI Roadmap and Vision
Voya Markovich, Endicott Interconnect Technologies, Inc.
Break in Exhibit Hall: 3:00 p.m. - 3:30 pm
SESSION IIB: THERMAL MANAGEMENT TRENDS
Session Chair: Carolynn Drudik, Defense Microelectronics Activity
(DMEA)
3:30 p.m. - 5:30 p.m.
XRF
as a Screen Tool for the Presense of Pb and Other Elements
Drew Hession-Kunz, Innov-x Systems, Inc.
An Overview of Advanced Thermal Technologies for Electronic Packaging:
Issues and Applications
David Sarraf, William G. Anderson, Scott Garner, Advanced Cooling
Technologies
Increased
Usage of Integrated Passive Components in Low Temperature Co-Fired Ceramic
(LTCC) for the
RF & Microwave Industry
Steve Annas, NATEL Engineering Company
Embedded Thermoelectric Cooler for Semiconductor Thermal Management
Bob Conner, David Koester, Randy Alley, Marco Soto, Rama Venkatasubramanian,
Nextreme Thermal Solutions
Reception in the Exhibit Hall: 5:30 p.m. - 6:00 p.m.
Dinner: 6:00 p.m. - 7:30 p.m.
Dinner
Speaker: Colonel Danny McKnight
7:00 p.m.
SEATING
FOR THE DINNER SPEECH WILL BE LIMITED AND ONLY AVAILABLE ON A FIRST
COME, FIRST SERVE BASIS
Col.
Danny McKnight retired in January 2002 after serving 28½ years
in a distinguished and highly decorated career as a U.
S. Army Ranger. His experience
represents a lifetime of dedication to the defense of America.
Col.
McKnight’s
final assignment was as Chief of Staff for First Army, based
at Fort Gillem, Georgia. His efforts as Commander of the
75th Ranger
Regiment elements assigned to Task Force Ranger in Mogadishu,
Somalia were chronicled in the book Black Hawk Down and
the movie by the
same name.
In addition to
his expertise in many matters military, highlights of his skills
in the leadership and management aspects of his career includes: |
 |
- Providing
direct financial management, guidance, and oversight of an
annual operational budget of approximately $50 million.
- Developing
a strategic planning concept and a measurable results program
to track its successful implementation for the integration
of active and reserve component soldiers as part of the Army’s
training strategy for the year 2000 and beyond.
- Directing
a staff of more than 300 military and DA civilian personnel
to provide support for
a field force of 10,000 people, who had to meet training requirements for approximately
250,000 reserve component soldiers.
Col. McKnight also has extensive experience in the areas of communications,
public affairs, and emergency management.
Col. McKnight’s awards and decorations include the Legion of Merit
with Two Oak Leaf Clusters; Bronze Star for Valor; Purple Heart; Meritorious
Service Medal with Five Oak Leaf Clusters; National Defense Service Medal
with Bronze Star; Armed Forces Expeditionary Medal with Arrowhead and Bronze
Star; Combat Infantryman’s Badge; Ranger Tab; Master Parachutist
Badge with Bronze Star; and Pathfinder Badge.
He graduated from the U. S. Army War College, Air Command and Staff College,
Infantry Officer Advanced Course, Ranger School, Airborne School, and Infantry
Officer Basic Course. He also served as an Assistant Professor of Military
Science at the University of Florida in the Army ROTC Department.
Col. McKnight
earned his master’s degree in higher education and
administration from the University of Florida in 1985 and his bachelor’s
degree in management from Florida State University in 1973.
Wednesday, June 7th
Registration: 7:00 a.m. - 6:30 p.m.
Continental Breakfast: 7:00 a.m. - 8:00 a.m.
Exhibit Hours: 10:00 a.m. - 4:00 p.m.
Refreshment Breaks will be in the Exhibit Area
SESSION III: PACKAGING ISSUES AND APPLICATIONS
Session Chair: Carolynn Drudik, Defense Microelectronics Activity
(DMEA)
8:00 a.m. - Noon
The Impact of Nanotechnology on the Communication Networks of the Future
Elsa Reichmanis, Lucent Technologies
Rapid Prototyping of Micro-Systems Packaging by Data-Driven Chip-First
Process Using Nano-Particles Metal Colloids
Daniel F. Baldwin, Sungchul Joo, Georgia Institute of Technology
Advanced Space and Defense Microelectronic Devices Enabled by Ultra-Lightweight
Osprey CE Alloys
Stuart Weinshanker, Advanced Packaging Associates; Alan Leatham,
Andrew Ogilvy, Sandvik Osprey Ltd.; Satti Sangha, EADS Astrium
Organic Flip Chip Packages for use in Military and Aerospace Applications
Kim J. Blackwell, David Alcoe, Irving Memis, Endicott Interconnect
Break in Exhibit Hall: 10:00 a.m. - 10:30 a.m.
Leveraging
the Militarization of COTS Adhesives
Gregory T. Daly, Lockheed Martin Maritime Systems & Sensors
Print Forming Complex Micro-Reactors for Fuel Cell Applications
Arthur Chait, EoPlex Technologies, Inc.
An Attractive Hermetic Packaging Option
Thomas E. Salzer, Hermetric Inc.
Lunch: Noon - 1:00 p.m.
SESSION IV: RELIABILITY
Session Chair: Walt Tomczykowski, ARINC Engineering Services, LLC
1:10 p.m. - 6:00 p.m.
Effects of Plasma Pretreatment on Flip Chip and CSP Substrate Level Assembly
Yield and Reliability
Daniel F. Baldwin, Georgia Institute of Technology; Paul Houston,
Brian Lewis, Engent, Inc.
Techniques for Component Traceability in the Manufacture of PCB Assemblies
Jim Havener, Optimal Electronics Corp.
A New Prognostics Method for Extending the Life of Legacy Systems
Brian Tuchband, Nikhil Vichare, Michael Pecht, University of Maryland
- CALCE
Storage & Quality
Requirements for Military MEMS Program
James L. Zunino III, Don Skelton, US Army ARDEC
Break in Exhibit Hall: 3:10 p.m. - 4:00 p.m.
Counterfeit Electronics as Weapons of Mass Disruption
Michael Pecht, Diganta Das, University of Maryland - CALCE
Utilizing Modules and Interposers to Solve IC Obsolescence Issues: An
Alternative to Board Re-Spins and Life-Time Buys
Mark Gilliam, Interconnect Systems, Inc.
Thermal
Management of Critical Military Electronics
Nelson Gernert, Thermacore, Inc.
High
Reliability Products - What does it really take? – A Test Perspective
Subahu D. Desai, Endciott Interconnect Technologies, Inc.
Thursday,
June 8th
Registration:
7:00 a.m. – 11:00 a.m. Continental
Breakfast: 7:00 a.m. - 8:00 a.m. |
 |
SESSION V: EMERGING TECHNOLOGIES
Session Chair: Walt Tomczykowski, ARINC Engineering Services, LLC
8:00 a.m. - 10:50 a.m.
3D Technologies for Advanced Hybrid/MCM Designs
Tom Dlouhy, Gordon Jensen, CAD Design Software
A System-In-Package Approach for Military and Aerospace Applications using
FlipChip and 3-D Packaging
Keith Sturken, John A. Hughes, BAE Systems
An
Effectual Approach to Substantial Cost Savings: The Utilization of Advanced
Commercially Available Polymers in Military Fiber Optic Applications
Gregory T. Daly, Lockheed Martin Maritime Systems & Sensors
Break: 9:30 a.m. - 9:45 a.m.
Using Embedded
Capacitance to Improve Electrical Performance and Reduce Board
Size
Joel Peiffer, 3M Company
IC Packaging Challenges in High Performance, High Reliability Applications
Anna Fontanelli, Mentor Graphics Corporation
Wrap up: General Chair
Tour of the Smithsonian Institution’s National Air and Space
Museum
Thursday, June 8, 2006
6th & Independence Avenue, SW, Washington, DC 20560
FREE
OF CHARGE
PRE-REGISTRATION REQUIRED. The Smithsonian
Institution’s National
Air and Space Museum maintains the largest collection of
historic air and spacecraft in the world. It is also a vital
center for research into the history, science, and
technology of aviation and space flight, as well as planetary
science and terrestrial geology and geophysics.
The National Mall Building in Washington, D.C. has hundreds
of artifacts on display including the original
Wright 1903 Flyer, the Spirit of St. Louis, the Apollo 11
command module, and a lunar rock sample that
visitors can touch. Following the conclusion of the morning
sessions on Thursday, June 8th, please join us
at 1:00 p.m. for a guided tour of this spectacular museum.
Tours are usually one and a half hours. For museum
information, go to http://www.nasm.si.edu/museum/.
You are asked
to pre-register using the registration forms.
At the Controls Flight Simulator at the National Mall Museum |
HOTEL RESERVATION (Hotel Cut-off is May 1, 2006)
Reservation must be made directly with the:
Doubletree
Hotel Washington DC
1515 Rhode Island Ave., N.W.
P: 202-232-7000; F: 202-332-8436
On-line: http://doubletree.hilton.com/en/dt/groups/personalized/wasdtdt_mas/index.jhtml
Single/Double: $175
Please
reference IMAPS when making reservations.
The Doubletree
Hotel requires a deposit for the first night's room and tax to hold your
room.
Deposit refunded if reservation is cancelled seven (7) working
days prior to arrival.
Register
On-Line
|
