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Topical Workshop and Tabletop Exhibit on
Military, Aerospace, Space and Homeland Security (MASH):
Packaging Issues and Applications

Radisson Plaza Lord Baltimore Hotel
20 W. Baltimore Street; Baltimore, MD 21201
May 7 - 10, 2007
May 8-9, 2007
Workshop & Events
May 7-10, 2007

Photo Courtesy of JSF

General Chair:
Tom Green
TJ Green Associates LLC
Phone: 610-625-2158
Technical Chair:
Keith Sturcken
BAE Systems
Phone: 703-367-4948

Early Registration and Hotel Deadline: April 11, 2007
Exhibit Discounts Deadlines: April 2, 2007

Register | Hotel
Three 1/2-Day Professional Development Courses | Speaker Dates/Info | Program PDF
Tabletop Exhibit Info | Reserve Tabletop

Monday Professional Development Courses (PDCS):
Reliability of Pb-Free Components, Printed Boards and Assemblies
| DMSMS for Executives Plus | Failure Mode Analysis of Flip Chip in Advanced Package and Board Assemblies
Tuesday Keynote - TBD | Performance Packaging: Thermal, Noise & Mechanical Considerations | Lead Free | Panel Discussion on Lead-Free | Dinner Speaker - The State of the Aerospace Industry
Wednesday Hermetic Packaging and Testing | Advanced Designs and Processes | Advanced Photonic Packaging
Thursday Keynote - Avoiding the Procurement of Counterfeit Parts during DMSMS Operations | Counterfeit, Suspect Parts and Mitigation Strategies | Advanced Reliability
Monday, May 7th

Registration: 11:00 am - 5:00 pm

Professional Development Courses: 1:00 pm - 5:00 pm (30 min break at 3:00 pm)

Reliability of Pb-Free Components, Printed Boards and Assemblies

Instructor: Dr. Gerd M. Fischer, DfR Solutions

Course Description:
Although July 2006 has passed, the potential reliability implications of switching to Pb-free materials and a Pb-free process will potentially be felt for years to come.  Numerous American companies in industries exempt from RoHS have already decided to make the jump to Pb-free.  These include automotive, appliance, telecommunications, and military.  These applications demand long-life in potentially severe operating environments.  Understanding how to predict and ensure quality (can I make Pb-free just as good an SnPb?) and long-term reliability (will it last just as long?) is critical to customer satisfaction and, eventually, the success of your company.

This presentation provides a focused but comprehensive discussion on all potential issues that can arise during the transition to Pb-free.  All areas of potential risk are examined.  For each reliability concern, a brief description is provided, followed by the current state of industry knowledge and an opportunity for risk mitigation based upon the product design, materials, complexity, volumes, and customer expectations of reliability.  A final summary provides attendees a roadmap for ensuring the reliability of Pb-free products.

Topics to be covered will include:

  • Introduction
    • Review of RoHS Legislation
    • What has changed?
  • Components
    • Robustness
    • Popcorning (PEMs and capacitors)
  • Tin Whiskering
    • Background
    • Matte vs. Bright
    • Mechanical Behavior
    • Mitigation (component-level)
    • Mitigation (OEM level)
    • Prediction
  • Solderability Platings
    • ENIG failure mechanisms
    • Immersion Tin failure mechanisms
    • Immersion Silver failure mechanisms
    • OSP failure mechanisms
    • Lead-Free HASL
  • Printed Board Robustness
    • Tg and Thermal Stability
    • PTH Barrel Cracking
    • Conductive Anodic Filaments
  • Solder
    • Copper Dissolution
    • Mixed Solder
    • Mechanical Loading
    • Intermetallic Formation
    • Tin Pest
  • Reliability
    • Temperature Cycling
    • Vibration
  • Metallography of Pb-Free Solder
  • Conclusion

Who Should Attend?
All personnel involved in the process of transitioning to Pb-free, including procurement, design engineers, reliability and quality personnel, failure analysts, and management involved in new product introduction (NPI) and program support.

Dr. Gerd Fischer is a technical senior staff member at DfR Solutions.  He has more than 15 years experience in solid state physics, materials and device development, and analytical procedures, with an emphasis on failure analysis and design.  He holds a Ph.D. in Physics from the University of Tübingen, Germany, and is a member of the German Physical Society and the American Physical Society.  Dr. Fischer has performed Failure Analysis on a wide range of electronic products (e.g., automotive, industrial, consumer), with intensive experience on medical devices.  Dr. Fischer has a particular emphasis on material degradation mechanisms with recent investigations in tin whiskers, passive devices (high CV ceramic capacitors, diodes), and state-of-the-art chip scale packaging (CSP).  Prior to joining DfR Solutions, Dr. Fischer held positions of senior scientist, member of technical staff, and assistant research professor at companies and institutions including Columbia Telecommunications Corporation, Geballe Laboratory of Advanced Materials at Stanford University, Superconductor Technologies, Inc. and Optical Data Storage Center at the University of Arizona.  He held research positions at the Technical University of Denmark and Chalmers University of Technology in Sweden.  Dr. Fischer has authored or co-authored 25 articles.  He is fluent in English, German and Danish.

DMSMS for Executives Plus

Instructor: Charles Marshall, ARINC Engineering Services, LLC

(Sponsored by the DLA DMSMS IST, David Robinson and ARINC, Walt Tomczykowski)

Course Description:
This is an event-tailored version of the original Diminishing Manufacturing Sources and Material Shortages (DMSMS) for Executives course.  The course provides information for the busy professional or Program Manager who requires an understanding of DMSMS impacts to their operations. DMSMS impacts multiple processes including reliability, maintainability, supply chain efficiency, funding, policy, procedure, and staffing. This course offers the student a perspective of management/supervisory actions necessary to enable effective DMSMS mitigation, thereby enhancing mission readiness, efficiency, and cost effectiveness. This course is designed to empower the student through an understanding of the challenges and options to ensure proper establishment of an optimum proactive DMSMS team.  Information to help the student understand the difference between the required item-of-supply vs. a base item (a condition often the cause of false DMSMS indications) and a short summary of the DOD DMSMS initiatives have been included to enhance the core course for MASH 2007. This course is presented in a service/function neutral manner.

There is a one-hour web-based version of the original course (CLL202) available through the Defense Acquisition University's Continuous Learning website.

Who Should Attend?
This course is open to anyone who needs a basic understanding of the DMSMS problem and basic approaches to managing or resolving the problem.  Managers, technical, acquisition and logistics professionals (and anyone just generally interested) are all invited.

Mr. Marshall is an Operations Manager for the Life Cycle Management Division of ARINC Engineering Services, LLC.  He is the lead for Diminishing Manufacturing Sources and Material Shortages (DMSMS) Operations and Defense Logistics Agency (DLA) Programs and DMSMS training.

Mr. Marshall has 24 years of combined government service, beginning his career with the Army in 1976 where he became expert in microcircuits and microelectronics. He served as an Army Aviator prior to becoming a Short Range Air Defense Systems maintenance Warrant Officer. He later worked for the DLA, at the Defense Electronics Supply Center (DESC) and the Defense Supply Center, Columbus (DSCC) as senior technical supervisor for microcircuits (FSC 5962).

Mr. Marshall joined ARINC in August 2000 as a DMSMS operations technician in the B2 Program. He became involved in DMSMS Training and DLA Programs, and developed an operations core team.  Mr. Marshall is the integrating author of the course content documents used to create the courses developed for the DMSMS Knowledge Sharing Portal (DKSP), the DLA, and the Defense Acquisition University (DAU).

Mr. Marshall obtained an Associate of Science from the University of the State of New York in 1981, and Bachelor of Science, Operations Management, from the University of the State of New York, 1994.

Failure Mode Analysis of Flip Chip in Advanced Package and Board Assemblies

Instructor: Dr. Daniel F. Baldwin, Engent, Inc.

Course Description:
Over the past few years, several process technology improvements have emerged for advanced electronics package processing such as fast-flow snap-cure underfills, no-flow underfills, emerging wafer scale underfills and associated innovative process technology.  These developments have presented new solutions for area array package applications in the area of underfill application, which in the past was a time-consuming post-reflow process.  With these processes, much of the cycle time for underfilling has been drastically reduced or eliminated, thereby allowing the flip chip process to become more transparent to high speed surface mount assembly. These processes will make direct chip attachment more readily accessible to the electronics assembly industry. Current market projections and technology roadmaps state that usage of flip chip will increase rapidly over the next decade requiring expanded technology transfer of advanced materials and process solutions addressing the diminishing industry-based research and development programs.  While a large number of technical publications are available to help with process requirements, understanding failure modes and reliability standards will be essential for this growth to continue.

This course will present reliability test procedures and common failure modes that occur in advanced area array packages and board assemblies.  The course will focus on accelerated reliability tests, failure mechanisms and analysis tools such as thermal shock, thermal cycle, autoclave, X-ray analysis, acoustic microscopy and scanning electron microscopy.  It will also present different process defects using several analysis tools and discuss reasons why the defects cause failure. 


  • Reliability Test Standards
  • Destructive and Non-Destructive Failure Analysis and Equipment
  • Process Defects and Effects on Failure and Reliability
  • Reliability Modeling
  • Failure Modes and Reliability Implications
  • Delamination and Void Growth
  • Solder Migration
  • Solder Extrusion
  • Die Cracking - Center
  • Die Cracking - Edge
  • Underfill Cracking - Fillets
  • Underfill Cracking - Bulk
  • Solder Fatigue
  • UBM Pad Lift
  • Solder Creep Fracture
  • Gold Embrittlement
  • Interconnect, Substrate, and Chip Design Factors
  • In Situ Stress Analysis of Flip Chip Assemblies

Who Should Attend?
Individuals associated with low cost surface mount assembly and low cost electronics packaging are encouraged to attend, specifically, the following:

  • Managers.  Knowledge gained through this course will allow managers to make informed decisions about the technical feasibility, implementation factors, performance benefits, reliability, and costs of implementing low cost flip chip processing technology.  In addition, the hands-on experience gained will provide practical experience with state-of-the-art flip chip process technology and emerging low cost process technologies.

  • Engineers.  Manufacturing, quality, design, and packaging engineers in integrated circuit, equipment, materials, and system design who are challenged to solve tomorrow’s process solutions and next generation packaging problems.  Of particular benefit to technical professionals is the practical hands-on experience with low cost flip chip process technologies and emerging technologies that will be gained through the course. 

Dr. Daniel F. Baldwin is President of Engent, Inc. providing enabling process technologies and manufacturing services in the areas of electronics, optoelectronics, and MEMS.  He was formerly Vice President of the Advanced Assembly Technology Division at Siemens Dematic Electronic Assembly Systems.   He also holds an Associate Professor of Mechanical Engineering position at Georgia Institute of Technology, heading the Low Cost Flip Chip Processing program for the Packaging Research Center, the Advanced Interconnect Technologies research program for the Manufacturing Research Center, and the Low Cost Assembly Processing Program for the CBAR.  Dr. Baldwin has served as General Chair and Program Chair of the International Advanced Technology Workshop on Flip Chip Technology for four years.  He has also served as Technical Program Chair for the 4th International Symposium on Advanced Packaging Materials: Processing, Properties and Interfaces. In addition, he was the recipient of the 1998 Outstanding Research Faculty of the Year Award and 1995-1996 Outstanding Faculty of the Year Award from the NSF - Packaging Research Center for his exemplary contributions in research, education, technology transfer, and infrastructure development.  Prior to joining the faculty, he was a Member of the Technical Staff at Bell Laboratories, Princeton, NJ, working on electronic product miniaturization.  Dr. Baldwin received his S.M. and Ph.D. degrees in Mechanical Engineering from MIT in 1990 and 1994, respectively.  He has eleven years of experience in the electronics manufacturing and polymer processing industries, four U.S. Patents, over 100 scholarly publications, and expertise in electronics packaging, MEMS packaging, advanced materials processing and manufacturing systems design.  Dr. Baldwin is on the Board of Advisors for the Society of Manufacturing Engineers/Electronics Manufacturing Division (SME/EM) and on the Board of Directors for the Surface Mount Technology Association (SMTA).

Tuesday, May 8th

Registration: 7:00 am - 7:45 pm

Continental Breakfast: 7:00 am - 8:00 am

Opening Remarks: 8:00 am - 8:15 am
General Chair: Tom Green, TJ Green Associates LLC
Technical Chair: Keith Sturcken, BAE Systems

Keynote Presentation, Paul A. Schneider

Keynote Presentation: 8:15 am - 8:45 am
Title: TBA
Speaker: Paul Schneider, Under Secretary for Management, Department of Homeland Security

Bio: Paul A. Schneider was sworn in January 3, 2007, as the Department of Homeland Security’s (DHS) Under Secretary for Management. He is responsible for all the department’s budget, appropriations, expenditure of funds, accounting and finance; procurement; human resources and personnel; information technology systems; facilities, property, equipment, and other material resources; and identification and tracking of performance measurements.

Prior to coming to DHS, Schneider served as a defense and aerospace consultant where he led a congressionally-directed study for NASA on the costs, risks and benefits of human space flight and a study of open architectures for the U.S. Navy. He led an independent review of the presidential helicopter replacement program, played a role in the administration’s effort to develop the plan for the Next Generation Air Transportation System and led reviews of Defense network centric warfare and interoperability programs.

Schneider holds a degree in nuclear engineering and is a member of the American Society of Naval Engineers (ASNE), Armed Forces Communications and Electronics Association (AFCEA), Association of Scientists and Engineers (ASE), Navy League, Association of Old Crows and the Naval Institute.

Session 1: Performance Packaging: Thermal, Noise & Mechanical Considerations
Session Chairs:  Richard LaBennett, Tenebal, Inc.; Bruce LaMattina, US Army Research Office
8:45 am - 12:15 pm  

The Challenge to Integrate High Performance Organic Packaging into High End ASIC Strategic Space Based Applications
Ronald Nowak, Endicott Interconnect Technology

Leveraging Wafer-Level Packaging and Advanced Stacked Packaging for Military Applications
Naghmeh Sarkeshik, Tessera, Inc.

Power Plane Noise Suppression for Next Generation High Speed Busses
Daniel I. Amey, Sounak Banerji, DuPont Electronic Technologies

Break in the Exhibit Hall: 10:00 am - 10:30 am

Exhibit Hours: 10:00 am - 6:30 pm

Experimental Results of Total Ionizing Dose Effects on 0.5 Micron SOS MOSFET Test Structures
Michael Fujita, M. Arshad, J. Lauinger, Defense Microelectronics Activity; R. Greenwell, EagleST

Thermally Enhanced Packages for High Heat Density Electronics
Robert Hay, sp3 Diamond Technologies; Brian Edward, Pete Ruzicka, Sensis Corporation

Heat Pipe Enhanced Conduction for Conduction Cooled Cold Plates
Scott D. Garner, Pete Dussinger, Advanced Cooling Technologies

High Reliability Flip Chip Assembly using Fluxless Reflow Techniques
Daniel F. Baldwin, Paul Houston, Engent, Inc.

Lunch in the Exhibit Hall: 12:15 pm - 1:15 pm

Session 2: Lead Free
Session Chairs:  Carolynn Drudik, Defense Microelectronics Activity (DMEA); Norman Helmold, NASA
1:15 pm - 4:35 pm

Nanopackaging for Miniaturized Multifunctional Wearable Electronics
P. Markondeya Raj, Rao Tummala, Mahadevan Iyer, Janagama Goud, Kent Coulter, Venky Sundaram, Georgia Institute of Technology

The DoD Response to Lead-Free Electronics
Vance Anderson, Defense Microelectronics Activity (DMEA)

Lead-Free Electronics - A Reliability Update
Andrew D. Kostic, Northrop Grumman Electronic Systems

Break in Exhibit Hall: 2:30 pm - 3:15 pm

Reliability Testing of Sn63 Solder Flip Chip Bumps on Metalized LTCC and Development of a Fluxless Flip Chip Bonding Process for Optical Military Electronics
Michael Girardi, David Kautz, Carl Gustafson, Greg Barner, Honeywell Federal Manufacturing and Technologies, LCC

Reliability of Solder Joint Quality on J-Lead Oscillators Using HALT with Lead and Lead-Free Compositions
Todd H. Treichel, Precision Devices, Inc.; Steve Laya, Elite Electronic Engineering, Inc.

Impact of RoHS Legislations on National Security
Michael Osterman, Michael Pecht, Diganta Das, University of Maryland - CALCE

Panel Discussion on Lead-Free
4:35 pm - 5:20 pm

An expert panel will address the global transition to lead-free solders and finishes in electronic assemblies.  This RoHS-and-WEEE induced transition has had considerable impact on the US electronics industry.  As most of the consumer electronics manufacturers’ transition to lead-free assemblies, much of the aerospace, defense and high-reliability industries are struggling to remain with the proven tin-lead products.  The panel will discuss key issues including component availability, manufacturing, solder joint reliability, tin whiskers, qualification, repair, and process development.

Craig Hillman, CEO, DfR Solutions
Vance Anderson, Senior Engineer, Defense Microelectronics Activity (OSD/DMEA) & Co-Chairman Executive Lead-Free Integrated Process Team (ELFIPT)
Andrew Kostic, Fellow Engineer, Northrop Grumman Electronic Systems

Reception in Exhibit Hall: 5:25 pm – 6:30 pm

Dinner: 6:30 pm – 7:45 pm     

Dinner Speaker, John Douglass

Dinner Speaker:  7:15 pm – 7:45 pm
Title: The State of the Aerospace Industry
Speaker: John Douglass, President and Chief Executive Officer, Aerospace Industries Association

Bio: John W. Douglass is president and chief executive officer of the Aerospace Industries Association (AIA), which represents the nation’s leading manufacturers and suppliers of civil, military, and business aircraft; helicopters; UAVs; space systems; aircraft engines, material, and related components; equipment services; and information technology. Mr. Douglass became the seventh full-time chief executive of the association in 1998. Before that, he served for nearly three years as assistant secretary of the Navy for research, development and acquisition of defense systems for the U.S. Navy and U.S. Marine Corps.

A nationally-recognized expert in systems acquisition, Mr. Douglass has extensive acquisition experience in Congress, the Defense Department, and the Executive branch as a policy authority, contracting officer, engineering officer, test and evaluation officer, program control officer, and research director.

A native of Miami, he earned a Bachelor of Science degree in industrial engineering from the University of Florida, a Master of Science degree in industrial engineering from Texas Tech University and a Master of Science degree in management science from Fairleigh Dickinson University. Mr. Douglass has done postgraduate work at Cornell University Center for International Studies where he was an Air Force Research Fellow with the Peace Studies Program.

Wednesday, May 9th

Registration: 7:00 am – 5:20 pm

Continental Breakfast: 7:00 am – 8:00 am

Session 3: Hermetic Packaging and Testing
Session Chairs:  Rob Hands, North Carolina State University; John Mazurowski, Pennsylvania State University
8:00 am – 11:55 am

Application of the MIL-STD-883F Based Helium Fine Leak Test Guidelines in Practice
Arindam Goswami, Bongtae Han, University of Maryland - College Park

Planar Getter Systems for Maintaining the Reliability of Hermetically Sealed Devices
Richard Kullberg, SAES Getters/USA, Inc.; Marco Amiotti, SAES Getters S.p.A.Viale Italia

Board Level Hermeticity Testing of Assembled Modules using Optical Leak Testing: A New Model for Enhanced System Reliability
John W. Newman, NorCom Systems Inc.

Quality Analysis of Hermetically Sealed Quartz Crystal Package Mounted in Clock Oscillator Designed for Space Flight
Todd H. Treichel, Precision Devices, Inc.

Cumulative Helium Leak Detection (CHLD), First New Test Method for Testing Hermetic Packages in over 30 Years, Case Studies of Previously Manufactured Parts that Failed after Years on Shelf
John C. Pernicka, Pernicka Corporation

Exhibit Hours: 10:00 am – 4:00 pm

Break in Exhibit Hall: 10:05 am – 10:35 am

Obtaining True Leak Rates of Non-Hermetic Micro to Nanoliter Packages Using a Helium Mass Spectrometer
Arindam Goswami, Bongtae Han, University of Maryland - College Park

Wafer-Level Hermetic Packaging for MEMS Devices
Wallace Tang, Hudi Brenman, Kaosio Saechao, David Woolsey, Michael Cohn, Micro Assembly Technologies

Utilizing Vacuum Soldering, in a Flux Free Environment, to Reduce Voids in Microwave Packaging Assemblies
Paul W. Barnes, SST International

Lunch in Exhibit Hall: Noon - 1 pm

Session 4A: Advanced Designs and Processes
Session Chairs:  John Mazurowski, Pennsylvania State University; Keith Sturcken, BAE Systems
1:05 pm - 3:10 pm

Non-Hermetic Packaging of RF Multi-Chip Modules
Matthew Gruber, Lockheed Martin

Liquid Crystal Polymer (LCP) Printed Circuit Board (PCB) Based Packaging and Interconnects
Linas Jauniskis, Brian Farrell, Andrew Harvey, Foster-Miller, Inc.

Understanding Moisture Ingress into Cavity Style Teflon Laminate Packages
Bayard "Bud" J. Osthaus, Merrimac Industries; Tom Green, TJ Green Associates LLC

Technology Assessment of Sensor Systems for Prognostics and Health Monitoring
Brian Tuchband, Shunfeng Cheng, Michael Pecht, University of Maryland – CALCE

Silicone Encapsulation of Extreme Environment Sensors
Jeff Caruso, Bill Riegler, Rob Thomiaer, NuSil Technology LLC

Break in Exhibit Hall: 3:10 pm - 4:00 pm

Session 4B: Advanced Photonic Packaging
Session Chairs:  John Mazurowski, Pennsylvania State University; Keith Sturcken, BAE Systems
4:05 pm - 5:20 pm

Leveraging the Militarization of COTS Adhesives for Significant Cost Savings of Terrestrial Fiber Optic Cables
Gregory T. Daly, Lockheed Martin MS2

Photonic Device Packaging Applications for Future Generation Military Avionics Fiber Optics
Mark W. Beranek, Naval Air Systems Command

Issues in Space Qualification of Fiber Optics Components
Robert W. Irvin, Ralph S. Jameson, Clear Align LLC

Thursday, May 10th

Registration: 7:00 am - 12:10 pm

Continental Breakfast: 7:00 am - 8:00 am

Keynote Presenter, Mr. David Robinson

Keynote Presentation: 8:00 am – 8:30 am
Title: Avoiding the Procurement of Counterfeit Parts during DMSMS Operations
Speaker: David G. Robinson, DLA DMSMS IST and GEM Program Manager, Defense Supply Center, Columbus

Bio: Mr. David Robinson is the DLA DMSMS Integrated Supplier Team (IST) manager and lead for all DLA DMSMS issues.  He also serves as Generalized Emulation of Microcircuits (GEM) Program Manager, DoD DMSMS Knowledge Sharing Portal (DKSP) Program Manager, DMSMS Work Shop Chair and Chairman of the DoD DMSMS Working Group Outreach Committee. He is responsible for over 1.7 million spare parts, all with the potential to go DMS, used by over 28,000 customers supporting 124 nations.

Mr. Robinson began his federal career in 1981 at the Defense Electronics Supply Center (DESC) in Kettering, Ohio, as an Electronic Equipment Specialist.  Initially working Federal Supply Class (FSC) 5998, Circuit Cards, he gained experience and rose through the ranks to become the Microcircuit Branch Chief managing FSC 5962, microcircuits for the Active Devices Commodity group at Defense Supply Center, Columbus.

In this capacity he became intimately familiar with the problem known as Diminishing Manufacturing Sources and Material Shortages (DMSMS). Working with his government and private sector contacts, he became very involved in DMSMS at the HQ-DLA and DoD level.  Mr. Robinson is a recognized and sought-out problem solver.

Session 5A: Counterfeit, Suspect Parts and Mitigation Strategies
Session Chairs:  Walt Tomczykowski, ARINC; Todd Treichel, Precision Devices, Inc.
8:30 am – 10:35 am

Counterfeit Electronic Components - An Overview
Robert K. Lowry, Oneida Research Services & Consultant in Electronic Materials

A Case Against Buying from Part Brokers
Diganta Das, Kaushik Chatterjee, Michael Pecht, University of Maryland - CALCE; Jack Stradley, Rochester

The Impact of Uncertified Parts in Military Systems
Jack Stradley, Rochester Electronics

Counterfeit Detection through Inspection
Kaushik Chatterjee, Diganta Das, Michael Pecht, University of Maryland - CALCE; Michael Sosnowski, EMC Corporation

Demonstration of an Authentication Technique on an International Supply Chain
Diganta Das, Michael G. Pecht, University of Maryland - CALCE; Chris Ricci, Peter Suorsa, Prime Technologies; Dave Pinsky, Raytheon

Break: 10:35 am – 11:00 am

Session 5B: Advanced Reliability
Session Chairs:  Walt Tomczykowski, ARINC; Todd Treichel, Precision Devices, Inc.
11:00 am – 12:15 pm

Summary Report for Implementing Solder Mask Pillars to Standoff Leadless Components
Louis Greco, Martha Veselka, Howard Adams, L-3 Communications - Communication Systems East

CAF Formation in High Density PWBs
Keith L. Rogers, Department of Defense

Multi Chip Modules (MCM) Miniaturization meets Reliability and Optimum Performance
Bob Costa, C&D Technologies

Closing Remarks: Workshop Chairs


Hotel Reservations (Hotel Deadline Friday, April 11, 2007)
Reservation must be made directly with the:

Radisson Lord Baltimore Hotel
20 West Baltimore Street
Baltimore, MD 21201
Phone: 410-539-8400 or 800-333-3333

Single/Double - $179/night

Register on-line at and enter IMAPS as the Promotional Code.

Please reference International Microelectronics And Packaging Society when making reservations by phone.

Speaker Dates/Information:

  • Extended Abstract or Presentation Material due: April 9, 2007
  • Powerpoint/Presentation file for CD-Rom due not later than: May 10, 2007
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to prior to event)
  • Technical Presentation Time: 25 minutes (20 to present; 5 for Q&A)
  • Keynote Presentation Time: 30 minutes (25 to present; 5 for Q&A)
  • Dinner Speaker Presentation Time: 30 minutes (25 to present; 5 for Q&A)

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611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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