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Advanced Technology Workshop and Tabletop Exhibits on
Microelectronic Packaging and Materials
for Medical Devices

June 9-10, 2010
Crowne Plaza Minneapolis Northstar Downtown
Minneapolis, MN

General Chairs:
Jay Ellingboe
Smiths Medical
jay.ellingboe@smiths-medical.com

General Chairs:
Tom Green
TJ Green Associates, LLC
tgreen1@ptd.net

Technical Chairs:
Sean Ferrian
Ferrian Sales
sean@ferrian.com

Technical Chairs:
Thomas Jacobs
DYCONEX
thomas.jacob@dyconex.com

Early Registration, Exhibit Reservation and Hotel Deadlines: May 26, 2010



Corporate Sponsors:

Corporate Sponsor - DYCONEX
Corporate Sponsor - SelectConnect Technologies (A Division of Arlington Plating)

Microelectronic Packaging and Materials for Medical Devices Workshop Focus:

The International Microelectronics and Packaging Society (IMAPS) and IMAPS Viking Chapter will host an Advanced Technology Workshop on Microelectronic Packaging and Materials for Medical Devices. The workshop will be held in Minneapolis, Minnesota at the Crowne Plaza Minneapolis Northstar Downtown.

Overview: The combination of advancing demographics (an aging world population) and an explosion of new micro-electronics technology set the stage for significant improvement and miniaturization in the area of medical electronics.


Wednesday, June 9, 2010

Registration: 12:00 pm – 5:00 pm

Professional Development Course (PDC):
Hermetic and “Near Hermetic” Testing of Class III Medical Implants

1:00 pm - 5:00 pm
Course Instructor: Thomas Green, TJ Green Associates

This PDC is co-located with the Workshop and available for a separate registration fee. This course is intended as an intermediate level course for process engineers, designers, quality engineers, and managers responsible for hermetic sealing, leak testing and RGA results and for those responsible for evaluating new polymeric cavity style packages.

Historically, hermeticity requirements for Class III Medical Implants have mirrored that for military and telecom applications. This course will briefly review the traditional hermeticity test methods (helium leak test and bubble method) and some of the pitfalls and lessons learned over the years. Recent changes to the hermeticity spec will be discussed along with the difficulties in testing to leak rates that are two orders of magnitude tighter than what exists today.

Packages made from polymeric materials (e.g. LCP and others) as opposed to traditional hermetic seals (i.e. metals, glasses, ceramic etc) require a different approach from a hermeticity design and testing standpoint. The problem is now one of moisture diffusion through the bulk and package interfaces, which is different than water vapor permeating a crack in a glass to metal seal. A brief review of the techniques and methods to evaluate a "near-hermetic" approach is presented along with a discussion of the pitfalls and issues with TM 1014 (Seal)  and TM 1018 (Internal Water Vapor) as applied to a “near hermetic package”.  Fick’s law of moisture diffusion is the dominant theory guiding “near hermetic” package styles and testing such as  WVTR, TGA and moisture diffusion coefficients are used in lieu of traditional helium based hermeticity techniques to evaluate and understand the integrity of the seal.  Applications of moisture sensing inside a package and a discussion on how to qualify a “near hermetic” package will also be presented.

Biography:
Mr. Thomas Green is an independent consultant and respected teacher. He has over twenty-eight years experience in the microelectronics industry and has worked at Lockheed Martin Astro Space and USAF Rome Laboratories. At Lockheed he was a Staff engineer responsible for the materials and manufacturing processes used in building custom high reliability space qualified hybrid microcircuits for military satellites. Tom has demonstrated expertise in seam sealing and hermeticity leak testing processes. He has conducted numerous hermeticity experiments and presented technical papers at NIST (National Institute Standards and Technology) and IMAPS on leak testing techniques including,  CHLD (cumulative helium leak detection) and OLT (optical leak test). At USAF Rome Labs he worked as a senior reliability engineer and analyzed hermeticity component failures from AF avionic equipment along with providing technical support for a variety of Mil specs including  MIL-STD-883 TM 1014 (Seal). Tom is an active IMAPS member and Society Fellow and has worked as a hermeticity consultant for a variety military and medical companies. He has a B.S. in Materials Engineering from Lehigh University and a Masters from the University of Utah. Tom is the principal at TJ Green Associates LLC (www.tjgreenllc.com).

Welcome Reception: 5:00pm - 6:30 pm

Reception Sponsored by:
Reception Sponsor - Ferrian Sales & Associates


Thursday, June 10, 2010

Registration: 7:00 am – 5:00 pm

Continental Breakfast: 7:00 am – 8:00 am

Exhibit Hours: 8:00 am – 5:00 pm
Sessions, Tabletop Exhibits and Food/Beverage all in the same room

Opening Remarks: 8:00 am – 8:15 am
General Chairs: Jay Ellingboe, Smiths Medical; Thomas Green, TJ Green Associates

Keynote Presentation:
8:15 am – 9:00 am

Emerging Markets for Microfluidics Applications
Jeff Perkins, General Manager, Yole, Inc.

Yole Développement is a market research and business development consulting firm facilitating market access for advanced technologies. Yole has been tracking the MEMS industry for over 10 years and maintains a focus on industries using wafer based manufacturing processes.

Jeff has over 20 years of experience working in emerging technologies. Jeff leads Yole’s business development activities in North America. His experience in emerging technology covers energy, medical, aerospace and consumer markets.

Session I: 3D Packaging and Technologies
9:00 am - 12:00 am
Session Chair: AJ Ries, Medtronic

Printing Silicon Integrated Circuits for Wireless Sensors
Jayna Sheats, Hamidreza Alemohammad, Ehsan Foroozmehr, Ara Kim, Tony Mantell, Amir Zadeh and David Biesty, Terepac Corporation

Stacking of Known Good Rebuilt Wafers Without TSV Applications to Memories and SiP
Christian Val, Pascal Couderc, Nadia Boulay, 3D Plus

Break: 10:00 am - 10:30 am

Laser Direct Structuring Method of Integrating Circuitry with Three-Dimensional Components
James Liddle, SelectConnect Technologies

3D Packaging Technique for a Flexible and Biocompatible Antenna Using Z-axis for Wireless Monitoring of Intraocular Pressure (IOP)
Tse-Yu Lin, Byung Guk Kim, Dohyuk Ha, Sungwook Moon, Eric Hoppenjans, William Chappell, Purdue University

High Performance and High Reliability Passives for Miniature Medical Devices Based Upon Silicon Technologies
Franck Murray, IPDIA

Lunch Break: 12:00 pm - 1:30 pm

Session II: Microelectronics and Applications
1:30 pm – 5 :00 pm
Session Chair: Ron Jensen, Honeywell International

Advances in Solid-State Magnetic Sensors for Medical Devices
Daniel Baker, Jay Brown, NVE Corporation

Hermetic, Radio-transparent Micropackaging for Implantable Neural Prosthetics
Charles Byers, Guangqiang Jiang, Alfred Mann Foundation

High Voltage, High Impedance Resistors Small Sized for Medical Applications
Wolfgang Tschanun, Hansperter Good, Dieter Kaegi, Reinhardt Microtech AG

Break: 3:00 pm - 3:30 pm

Leveraging the Insatiable Need for Smaller Microelectronic Packages: Opportunities for Medical Devices
Frank Stepniak, Texas Instruments

Ceramic Packaging in Medical Applications
Arne Knudsen, Iris Labadie, Ross Linker, Kyocera America

Advanced Technologies for High Reliability Medical Electronics Manufacturing 
Thomas Jacob, Ravi Subrahmanyan, Dyconex Inc. 

Closing Remarks: 5:00 pm – 5:15 pm
Technical Chairs: Sean Ferrian, Ferrian Sales; Thomas Jacob, Dyconex, Inc.


Minnesota Twins vs. Kansas City Royals Major League Baseball Game



Hosted by the IMAPS Viking Chapter
Thursday, June 10, 2010
7:10 pm Start
Club Level Seating
$20/Ticket - IMAPS Members
$26/Ticket - Non-Members

Registration closed

 

 



Speaker Dates/Information:

  • Extended Abstract Due: May 14, 2010 (email PDF to jmorris@imaps.org)
  • Early Registration and Hotel Deadlines: May 26, 2010
  • Powerpoint/Presentation file for CD-Rom due not later than: June 10, 2010
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Hotel Reservations: (Hotel Deadline: May 26, 2010)
Reservation must be made directly with the:

Crowne Plaza Northstar Hotel
618 Second Ave.
Minneapolis, Minnesota 55402

$119 single/double IMAPS group rate

 

Corporate Sponsors:

Corporate Sponsor - DYCONEX

Corporate Sponsor - SelectConnect Technologies (A Division of Arlington Plating)

 

Reception Sponsor:

Reception Sponsor - Ferrian Sales & Associates

 


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IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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