Microelectronic Packaging for Medical and Hi-Rel Devices Workshop Focus:
The International Microelectronics and Packaging Society (IMAPS) and IMAPS Viking Chapter will host an Advanced Technology Workshop on Microelectronic Packaging for Medical and Hi-Rel Devices. The workshop will be held in Minneapolis, Minnesota at the Crowne Plaza Minneapolis Northstar Downtown.
Overview: The combination of advancing demographics (an aging world population) and an explosion of new micro-electronics technology set the stage for significant improvement and miniaturization in the area of medical electronics.
Tuesday, June 14, 2011
Registration: 12:00 pm – 5:00 pm
Professional Development Course (PDC):
Hermetic and “Near Hermetic” Testing of Class III Medical Implants
1:00 pm - 5:00 pm
Course Instructor: Thomas Green, TJ Green Associates
This PDC is co-located with the Workshop and available for a separate registration fee. This course is intended as an intermediate level course for process engineers, designers, quality engineers, and managers responsible for hermetic sealing, leak testing and RGA results and for those responsible for evaluating new polymeric cavity style packages.
Historically, hermeticity requirements for Class III Medical Implants have mirrored that for military and telecom applications. This course will briefly review the traditional hermeticity test methods (helium leak test and bubble method) and some of the pitfalls and lessons learned over the years. Recent changes to the hermeticity spec will be discussed along with the difficulties in testing to leak rates that are two orders of magnitude tighter than what exists today.
Packages made from polymeric materials (e.g. LCP and others) as opposed to traditional hermetic seals (i.e. metals, glasses, ceramic etc) require a different approach from a hermeticity design and testing standpoint. The problem is now one of moisture diffusion through the bulk and package interfaces, which is different than water vapor permeating a crack in a glass to metal seal. A brief review of the techniques and methods to evaluate a "near-hermetic" approach is presented along with a discussion of the pitfalls and issues with TM 1014 (Seal) and TM 1018 (Internal Water Vapor) as applied to a “near hermetic package”. Fick’s law of moisture diffusion is the dominant theory guiding “near hermetic” package styles and testing such as WVTR, TGA and moisture diffusion coefficients are used in lieu of traditional helium based hermeticity techniques to evaluate and understand the integrity of the seal. Applications of moisture sensing inside a package and a discussion on how to qualify a “near hermetic” package will also be presented.
Mr. Thomas Green is an independent consultant and respected teacher. He has over twenty-eight years experience in the microelectronics industry and has worked at Lockheed Martin Astro Space and USAF Rome Laboratories. At Lockheed he was a Staff engineer responsible for the materials and manufacturing processes used in building custom high reliability space qualified hybrid microcircuits for military satellites. Tom has demonstrated expertise in seam sealing and hermeticity leak testing processes. He has conducted numerous hermeticity experiments and presented technical papers at NIST (National Institute Standards and Technology) and IMAPS on leak testing techniques including, CHLD (cumulative helium leak detection) and OLT (optical leak test). At USAF Rome Labs he worked as a senior reliability engineer and analyzed hermeticity component failures from AF avionic equipment along with providing technical support for a variety of Mil specs including MIL-STD-883 TM 1014 (Seal). Tom is an active IMAPS member and Society Fellow and has worked as a hermeticity consultant for a variety military and medical companies. He has a B.S. in Materials Engineering from Lehigh University and a Masters from the University of Utah. Tom is the principal at TJ Green Associates LLC (www.tjgreenllc.com).
Welcome Reception: 5:00pm - 6:30 pm
Reception Sponsored by:
Wednesday, June 15, 2011
Registration: 7:00 am – 5:00 pm
Continental Breakfast: 7:00 am – 8:00 am
Exhibit Hours: 8:00 am – 5:00 pm -- DURING Lunch/Breaks
Sessions, Tabletop Exhibits and Food/Beverage all in the same room
Opening Remarks: 8:00 am – 8:15 am
General Chairs: Thomas Green, TJ Green Associates
Session I: 3D Packaging and Technologies
8:15 am - 11:30 am
Session Chair: Luke Horak, Rockwell Collins
Advancements in a Low Input Voltage Monolithic Ceramic Flyback Transformer for High Voltage Output Applications
Daryl Schofield, NASCENTechnology Manufacturing, Inc. (James Galipeau, George Slama)
How Flexible Substrates Continue to Advance Medical Device Technology
Richard Elbert, Valtronic Technologies (USA), Inc.
Break: 9:15 am – 10:00 am
New SMD Packaging Technology for Thin-Film Passive Components in Medical Implantable Devices
George Korony, AVX Corporation (Robert Heistand)
Stacking of Known Good Rebuilt Wafers without TSV and without interposer
Christian Val, 3D Plus (Pascal Couderc, Nadia Boulay)
A Reliable and Comfortable Package for Wearable Medical Devices
Tom Sterken, IMEC and CMST (Jan Vanfleteren, Frederick Bossuyt, Steven Brebels, Wim Christiaens, Thomas Vervust, Michal Jablonski, Sheila Dunphy, Filip Vermeiren, Hsu Yung-Yu, Tom Torfs, Maaike Op de Beeck)
Lunch Break: 11:30 am - 1:30 pm
(Food Served From 12:00pm - 1:00 pm)
DURING LUNCH - 11:30am - 1:30 pm
Session Chair: Thomas Green, TJ Green Associates
Fabrication and Characterization of Key Components of a Microfluidic System for Fast SNP Detection in DNA
Maaike Op de Beeck, IMEC (Ben Jones, Bivragh Majeed, Sara Peeters, Maki Hiraoka, Lei Zhang, Wim De Malsche, Hiroyuki Tanaka , Ichiro Yamashita, Paolo Fiorini)
Session II: Microelectronics and Applications
1:30 pm – 4:45 pm
Session Chair: Sean Ferrian, Ferrian Sales
Processing Challenges from Mixed (Surface Mount & Wire Bonding) Product Assembly
Luke Horak, Rockwell Collins
Novel Packaging Techniques for Electronics with Conformal Tissue Contact
Roozbeh Ghaffari, mc10 (Kevin Dowling, Jeffrey Carbec)
Why Wedge Bond?
Lee Levine, Process Solutions Consulting (Joe Bubel, Hesse & Knipps)
Break: 3:00 pm - 3:30 pm
Wafer Level Technique Applied to the Micro-Camera
Christian Val, 3D Plus (Pascal Couderc, Cendrine Noir, Eric Leroy)
New Hermetic Packaging Concept for Implantable Medical Devices
Maaike Op de Beeck, IMEC (Paolo Fiorini, Josine Loo, Karl Malachowski, Karen Qian, Chris Van Hoof)
Closing Remarks: 4:30 pm – 4:45 pm
Technical Chairs: Sean Ferrian, Ferrian Sales; Luke Horak, Rockwell Collins
Minnesota Twins vs. Chicago White Sox Major League Baseball Game
Hosted by the IMAPS Viking Chapter
Wednesday, June 15, 2011
7:10 pm Start
Club Level Seating
Select under SESSIONS on Registration page