Advanced Technology Workshop on
Advanced Packaging for Wireless Medical Devices

San Diego Marriott Mission Valley
San Diego, California
January 26-27, 2016

General Co-Chair:
Matt Nowak
General Co-Chair:
Vern Stygar
Asahi Glass Company
General Co-Chair:
Tim LeClair

Early Registration & Hotel Deadlines: January 11, 2016

Register Online

Hotel & Registration Details | Download Program PDF | Speaker Information

Thank you to our Premier Sponsors:

Premier Sponsor - Micro Systems Technologies (MST)
Quik-Pak - Premier Sponsor
Premier Sponsor - Teikoku  Taping System
Corporate Sponsor - Kyocera America
Corporate Sponsor - NGK NTK

The International Microelectronics Assembly and Packaging Society (IMAPS) will host an Advanced Technical Workshop in San Diego on Advanced Packaging for Wireless Medical Devices on January 26-27, 2016. The workshop will bring together technologists in semiconductor packaging with life science experts interested in applying the Internet of Things to healthcare. The workshop will provide a venue for papers, poster sessions, and discussions focused on traditional packaging, and emerging packaging technologies for medical diagnostic devices including RF circuits used to monitor patients or to connect remote patients with doctors. Attendees at this event will be exposed to a wide variety of disciplines to encourage new products, discussions and collaborations. The two day event will draw invited experts in the fields of medicine, chemistry, RF, and semiconductor packaging.


Tuesday, January 26, 2016

Registration: 8:00 am – 4:30 pm
Continental Breakfast: 8:00 am - 8:45 am

9:00 am – 9:15 am: Opening Comments
Workshop Chairs
Matt Nowak, Qualcomm; Vern Stygar, Asahi Glass; Tim LeClair, Cerapax

Jack Young - KEYNOTE

9:15 am - 10:00 am: KEYNOTE SPEAKER
Medical Devices in the Wireless Era

Dr. Lucian Iancovici
Managing Member, dRx Capital
Senior Investment Manager, Qualcomm Ventures

Abstract: The advent of the connected health has fueled a new generation of companies trying to turn healthcare into a system where information can flow more easily to drive more efficient and effective care.  The excitement around the possibilities has driven billions of dollars of investment over the last few years.  With this investments, there seems to be a pattern emerging -- bring the data on-line from many sources, aggregate the data, analyze the data, and then use the insights to effect change.  In other words -- mobilize, organize, analyze, catalyze.  What will the future hold?  Venture funding in digital health continues to rise despite a dip in pharma and med-tech investment.  Start-ups that reached scale have raised massive new rounds.  Institutional and corporate investors have built up portfolios. This talk will provide an overview of this exciting new application space and will highlight opportunities for medical sensor, wearable and device companies.

Dr. Lucian Iancovici is a Managing Member at dRx Capital, and he also serves as a Senior Investment Manager at Qualcomm Ventures, who makes investments through Qualcomm’s Life Fund. His background and experience in medicine lead him to believe that this is a transformative period in the healthcare space, especially given the renewed interest in performance and cost metrics prevalent today. In this context, Lucian is focused on wireless healthcare opportunities. He is on the board of S37, formerly Predilytics (Acquired). He has also led investments in among others Practice Fusion, Edico Genome. Previously, Lucian worked at McKinsey & Company, where he spent most of his time in the North American healthcare practice advising on clinical and business model transformation for large hospital systems. Prior to McKinsey, Lucian was a board certified internal medicine doctor practicing in New York. Lucian trained in internal medicine at Columbia University Medical Center in New York and completed both medical school and his undergraduate studies at Tufts University.


The Internet of Things is Wasted on the Young: ONKÖL’s Solution to Elderly Technology Adoption
10:00 am – 10:30 am -- Erich Jacobs, OnKol

Networking Break: 10:30 am – 11:00 am

What is in Store for Glass in the Next 50 Years?
11:00 am – 11:30 am -- Nobu Imajyo, AGC Electronics Asahi Glass Co., Ltd.

Transitioning Mobile Functionality and Packaging to Wireless Medical Devices
11:30 am – 12:00 pm -- E. Jan Vardaman, Trevor Yancey, TechSearch International, Inc.

Lunch: 12:00 pm - 1:00 pm


1:00 pm - 2:30 pm: PANEL DISCUSSION
Consumable Medical Devices that utilize Si Micro-Chips

Moderator: Jan Vardaman, TechSearch International
Panelists: TBD

- end markets; consumer, clinical, laboratory, other
- functions; analytical, diagnostic, therapeutic, other
- microchip purposes; fluidics, electrical, optical, other
- packaging; interconnect, modules, instrument interfacing
- cost, assembly, reliability, supply chain


IoT Packaging for Polymer Absorption Sensors; Medical and Environmental Uses
2:30 pm – 3:00 pm -- Chris Neidre, Leek Technologies (Alex Robertson, Tim LeClair, Sam Crivello)

Networking Break: 3:00 pm – 3:30 pm

Scalable Wafer Level Production of Consumables Made of Non-CMOS Compatible Materials on Glass, Challenges and Opportunities Utilizing a Foundry Concept   
3:30 pm – 4:00 pm -- Alexios Tzannis, IMT Masken und Teilungen AG

New Packaging and Manufacturing Tools for In Vivo Projects
4:00 pm – 4:30 pm – Berkeley Johnson, Raymond Karam (CEO) Invenios

4:30 pm – 5:30pm – Networking Reception
Appetizers, Beer, Wine & Networking!

Thank you to our Premier Sponsors:

Premier Sponsor - Micro Systems Technologies (MST)
Quik-Pak - Premier Sponsor
Premier Sponsor - Teikoku  Taping System
Corporate Sponsor - Kyocera America
Corporate Sponsor - NGK NTK


Wednesday, January 27, 2016

Registration: 8:00 am – 3:30 pm
Continental Breakfast: 8:00 am - 8:45 am

9:00 am – 9:15 am: Opening Comments
Workshop Chairs
Matt Nowak, Qualcomm; Vern Stygar, Asahi Glass; Tim LeClair, Cerapax

Advanced Packaging Techniques as Enablers for the Health IoT Ecosystem
9:15 am – 9:45 am -- Andreas Middendorf, Fraunhofer IZM (Erik Jung, Michael Toepper, Rafael Jordan, Klaus Dieter Lang)

How to Select the Optimal WiFi Module? Transystem WiFi Module Technical Strength
9:45 am – 10:15 am -- Tony Yang, Transystem Inc. and Lumimax Optoelectronic Technology (Henry Chen)

Smart Medical Microelectronics: Design and Reliability Considerations in Miniaturized
Wireless Circuit Topologies
10:15 am – 10:45 am -- Ravi Subrahmanyan, Micro Systems Engineering, Inc. (Hal Paver, Micro Systems Technologies, Inc.; Danbo Shen, Micro Systems Engineering, Inc.)

Networking Break: 10:45 am – 11:00 am

SigNature® DNA Marking and Forensic Traceability
11:00 am – 11:30 am -- Bob MacDowell, Applied DNA Sciences

Processing Techniques for Medical Device Platform Miniaturization
11:30 am – 12:00 pm -- Yuhwa Lo, University of California - San Diego (Xuekun Lu, Iftikhar Ahmad Niaz, Bernd Fruhberger)

Lunch: 12:00 pm - 1:00 pm


1:00 pm - 2:30 pm: PANEL DISCUSSION
Miniaturization Strategies for Mobile Medical Products

Moderator: Susan Bagen, Micro Systems Technologies, Inc.
Panelists: TBD

- range of applications driving miniaturization
- design rules and guidelines
- materials and package technology selection
- interconnect and assembly methods
- performance, compatibility, and reliability issues

Networking Break: 2:30 pm - 2:45 pm

3D Silicon IPD for Smaller and More Reliable Implantable Medical Devices
2:45 pm – 3:15 pm -- Mohamed Mehdi Jatlaoui, IPDiA (Sébastien Leruez, Olivier Gaborieau, Catherine Bunel)

Packaging Architecture for an Implanted System that Monitors Brain Activity and Applies Therapeutic Stimulation
3:15 pm – 3:45 pm -- Caroline Bjune, Charles Stark Draper Laboratory (Thomas Marinis)

Closing Remarks: 3:45 pm

Register Online

Speaker Dates/Information:

  • Abstract Deadline Extended to: December 1, 2015
  • Speaker Email Notification: December 18, 2015
  • Early Registration Deadline: January 11, 2016
  • Hotel Cut-off: January 11, 2016
  • Speaker 2-3 sentence biography due not later than: January 15, 2016
  • Powerpoint/Presentation file for Workshop DOWNLOAD due not later than: January 27, 2016
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop/usb or email to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Registration Information: (Early Registration Deadline: January 11, 2016) | REGISTER ONLINE

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; download will contain the presentations as submitted by the presenter. Download will be available 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Early Fee
Through 1/11/16
Advance/Onsite Fee
After 1/11/16
IMAPS Member
Premier Event Sponsorship -- Limited to 4 Sponsors
(includes: 1 attendee registration, 1 tabletop exhibit, print advertisement in programs, flyer/giveaway distributed to all attendees, logo/advertisement on event webpages)

Register Online

Hotel Reservations (Hotel Deadline: January 11, 2016)

Reservations must be made directly with the:

San Diego Marriott Mission Valley
8757 Rio San Diego Drive
San Diego, California 92108

$149 single/double + tax/fees

Online Reservations

Phone Reservations: 619-692-3800 - reference IMAPS when making reservation

Book your hotel reservation today! We have reserved a block of rooms at the host hotel to accommodate our attendees. The discounted room rates are only available until the hotel deadline listed above, or until the room block sells out (and they often sell out early - before the expire dates). Reservations received after the noted deadline or after the room block has been filled may be subject to significantly higher rates. IMAPS room blocks at most hotels historically sell out ahead of the discount deadline, so we encourage you to make your hotel reservations quickly for the best price and availability.


  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic