Advanced Technology Workshop on
Advanced Packaging for Medical Microelectronics

Handlery Hotel, San Diego, California
January 31 - February 1, 2017

General Co-Chair:
Tim LeClair
General Co-Chair:
Vern Stygar
Asahi Glass Company
General Co-Chair:
Matt Nowak

Organizing Committee:
Susan Bagen, MST | Caroline Bjune, Draper | Farhad Kiaei, HD Microsystems | Urmi Ray, Qualcomm | Kedar Shah, Verily Life Sciences

Exhibitors/Sponsors | Speaker Information

Thank you to our Premier Sponsors/Exhibitors:

Premier Sponsor - Micro Systems Technologies (MST)
Corporate Sponsor - Kyocera America
Corporate Sponsor - SemiDice Inc.
Corporate Sponsor - NGK NTK
Corporate Sponsor - CMS Circuit Solutions
Corporate Sponsor - Promex
Corporate Sponsor - cicor
Corporate Sponsor - Pac Tech
Corporate Sponsor - F&K Delvotec
Corporate Sponsor - Micralyne
Corporate Sponsor - SMART Microsystems
Corporate Sponsor - FRT of America


The International Microelectronics Assembly and Packaging Society (IMAPS) will host an Advanced Technical Workshop in San Diego on Advanced Packaging for Medical Microelectronics on January 31 and February 1, 2017. The workshop will bring together technologists in semiconductor packaging with life science experts interested in applying advanced packaging methods to enable the next generation of medical microelectronic devices. The workshop will provide a venue for presentations and discussions focused on traditional and emerging packaging technologies for wearable, portable and implantable devices, medical instrumentation, and life sciences consumables. Attendees and Exhibitors will be exposed to a wide variety of disciplines to encourage new products, discussions and collaborations. This two-day event will draw invited experts in the medicine, sensing, microelectronics, and semiconductor packaging.

MicroCircuit Labs.





Registration Open


Exhibits Open (when not in session)




Opening Remarks: General Co-Chairs –
Tim LeClair, Cerapax; Vern Stygar, Asahi Glass Company; Matt Nowak, Qualcomm


Challenges for Hermetic Packaging of Wireless Brain Implants for Chronic Use

Abstract: A key challenge for the development of high data rate implantable electronic brain interfaces for chronic use is the hermetic sealing of the microelectronics to small form factor, electro-magnetically transparent enclosures. One contemporary challenge are implants on the microscale where biocompatible packaging is required on sub-mm scale active integrated circuits.

Arto Nurmikko | Brown University
Arto V. Nurmikko, a native of Finland, is a L. Herbert Ballou University Professor of Engineering and Physics at Brown. Professor Nurmikko conducts research in neuroengineering, brain sciences, nanophotonics and microelectronics, especially for the translation of device research to new technologies in biomedical, life science, and photonics applications. His current interests include development of implantable wireless neural interfaces, nanoscale neural circuit sensors, and compact red/green/blue semiconductor lasers. Nurmikko has published in several fields (about 400 articles), led many multi-institutional research teams, advised federal funding agencies, and lectured worldwide. Professor Nurmikko is a Fellow of the American Physical Society, Fellow of the Institute of Electrical and Electronics Engineers, and Fellow of the Optical Society of America. He has been elected to the American Academy of Arts and Sciences and the Academy of Letters and Science of Finland.


Session Chair: Tim LeClair, Cerapax



Nanotechnology for a Genomic Revolution
Shane Bowen, Illumina


Coffee Break in the Exhibit/Session Room (Crystal Ballroom)


System Integration and Hermetic Encapsulation of an Active Neural Probe for Intra-Fascicular Implantation in the Peripheral Nervous System
Maaike Op de Beeck, IMEC

11:30am-12:00pm Complexity of State-of-the art Microfluidic Devices Require the Application of Leading Edge BIO-MEMS Technology
Alexios Tzannis, IMT Masken und Teilungen AG


Lunch in the Terrace Room


Miniaturization - Challenges and Developments in Translating Technology Advances into the Clinic


  • How will new miniaturization technologies be qualified and validated, compared with traditional (approved) technologies?
  • How do we prove the reliability or longevity of long-term devices in the lab? What are some of the challenges and methods in developing new accelerated testing models
  • Is new infrastructure (vendors, materials, equipment, etc) required for manufacturing novel miniaturized devices?

Moderator: Kedar Shah, Verily Life Sciences
Panelists: Maaike Op De Beecke, IMEC; Razi-ul Haque, Dose Medical; Jim Ohneck, AEMtec GmbH; Claude Clement, Wyss Center for Neurotechnologies


Session Chair: Vern Stygar, Asahi Glass Company


2:00pm-2:30pm Development of Deep Discharge Capable Micro-Batteries for Implantable Medical Devices 
Som Mohanty, EnerSys Quallion (Ryo Tamaki, Hiroshi Nakahara)

2:30pm-3:00pm Challenges Designing Highly-Integrated Implantable Microsystems: Intraocular Pressure Measurement 
Razi-ul Haque, Dose Medical


Coffee Break in the Exhibit/Session Room (Crystal Ballroom)

3:30pm-4:00pm Benefits of Packaging for RF Communications in Implantable Medical Devices 
Perry Li, St. Jude Medical

4:00pm-4:30pm Advanced Chip Mounting Technologies for Ultra-Miniaturized Implants
Gaston Boulard, Valtronic (Rainer Platz)

4:30pm-5:00pm The Use of Advanced Microelectronic Packaging Techniques to Miniaturize an Implantable Neuro Stimulator 
Jim Ohneck, AEMtec GmbH


Beer/Wine & Networking in the Exhibits Area


MicroCircuit Labs.





Registration Open


Exhibits Open (when not in session)




Opening Remarks: General Co-Chairs –
Tim LeClair, Cerapax; Vern Stygar, Asahi Glass Company; Matt Nowak, Qualcomm


Material Solutions for RF connected Medical and Healthcare Devices

Abstract: In last decade, we have experienced tremendous change in mobility of personal devices. During this period, “anywhere” and “anytime” has become very common in our daily lives. Wireless technology has emerged as the key enabler for this functionality. In addition to these functionalities, “any device formats” have become more common in personal devices. Under these circumstances, new devices for medical and healthcare are connected through advanced personal device networks. To orchestrate wireless technologies for medical and healthcare needs, we believe there are new opportunities in the packaging industry. It is so-called “Smart phone centric” world.

Any device formats” can expand the new business opportunities. Many of these new devices require new technology both in materials and packaging technologies. In material, chemical durability, electrical properties and optical properties are required. In packaging technologies, small form factor and mechanical durability are also required. Combining both industry’s knowledge, we can bring these new device from lab to road.

AGC is a leader in specialized glass compositions not only for electronics and RF devices, but medical devices. AGC has lead the way to commercialize specialize forms, chemistry and surface functionality to enable to convergence of such disciplines as chemistry, photonics and electronics. AGC’s nano and micro fabrication technologies will enable the designer to produce devices both in electronics and biomedical applications. AGC has developed in via formation, metallization, coatings and nanoimprint capabilities. These technological platform in electronics will offer a synergistic discipline approach for the next generation of medical devices. In this presentation we will elaborate on material solutions for “being connected”: the blurring of the lines between RF and medical devices.

Nobuhiko Imajyo | Asahi Glass Co., Ltd.
With more than 25 years of experience in technology development and business development in display, photovoltaic and semiconductor processing materials, Nobu IMAJYO has led new business development functions in Asahi Glass’s Electronics Company. He holds a M.E. and B.E. in Electronic Materials from Waseda University, School of Science and Engineering.


Session Chair: Matt Nowak, Qualcomm


9:30am-10:00am Embedding of Active Components in LCP for Implantable Medical Devices 
Eckhardt Bihler, Dyconex AG / MST (Marc Hauer, Susan Bagen)

10:00am-10:30am Advanced Cermet Ceramic Composites for Encapsulation of Medical Devices 
Robert Dittmer, Heraeus Medical Components (Ulrich Hausch, Jens Trötzschel)


Coffee Break in the Exhibit/Session Room (Crystal Ballroom)

11:00am-11:30am High-Density Flex Circuits Serve as Enabling Interface for Medical Sensors 
Scott Corbett, MicroConnex Inc.

11:30am-12:00pm Microfluidics and Nanopatterning Capabilities for Biomedical Devices
Nameseok Park, University of California at San Diego


Lunch in the Terrace Room and Networking in the Exhibit/Session Room (Crystal Ballroom)


Medical Application Opportunities Enabled by Microelectronics Technology Evolution

Microelectronic sensors are a key enabling technology for health and wellness monitoring are one of the most exciting growth areas on the horizon. A recent study predicts that sensors will enables a $75 billion wearables technology market by 2025—with health and wellness as a significant application area. The study forecasts 3 billion wearable sensors by 2025, with about 1/3 being new sensor types. Where there are sensors, there are needs for other microelectronic components, e.g., analog frontend, microprocessor, memory, wireless radio, charging modules, etc. To the extent that these microelectronic components have to be collocated with the sensors, the sensor packaging requirements also extend to them.

Use of microelectronic sensors to monitor the health condition of chronic disease patients is key to the quality of life of the patient and to reduction of cost of health care—by keeping the patient out of the hospital and emergency rooms. Chronic diseases account for 75%+ of the US health care expenditures, i.e., $2 trillion.  141 million (45% of the population) have at least one chronic disease, 72 million of which have two or more.  Examples of prevalent chronic diseases are hypertension, obesity, arthritis, asthma, chronic kidney disease, depression, chronic obstructive pulmonary disease (COPD), diabetes, sleep disorder and heart failure.

This presentation will elaborate on sensor packaging technology and cost evolution, as well as areas of application opportunity for microelectronic sensors.

Mehran Mehregany, Ph.D. | Case School of Engineering San Diego
Mehran Mehregany is an innovator, researcher, educator, and an entrepreneur. His interests are in sensors, micro/nano-electro-mechanical systems, silicon carbide microsystems, wearables, wireless health, and innovation models. He has made notable research and/or commercialization contributions in each of these areas.

He received his M.S. and Ph.D. in Electrical Engineering from Massachusetts Institute of Technology in 1986 and 1990, respectively. Thereafter, he joined Case Western Reserve University as an assistant professor in the Electrical Engineering and Computer Science Department. He is currently the Founding Director of Case School of Engineering San Diego, where he developed and launched the wireless health and wearable computing graduate programs in 2011 and 2014, respectively. He holds the Veale Professor of Wireless Health Innovation endowed chair, and previously held the Goodrich (2000-2015) and the George S. Dively (1997-2000) endowed chairs. He has a secondary appointment in the Biomedical Engineering Department.


Session Chair: Susan Bagen, MST


2:15pm-2:45pm Development of a Catheter: A Case Study in Material Selection, Design and Process Development for a High Yield and Reliable Medical Device 
Dennis Barbini, Universal Instruments

2:45pm-3:15pm Medical Device Fabrication and Packaging at External Foundries
Collin Twanow, Micralyne Inc.

3:15pm-3:45pm Electrodeposited Platinum-Iridium Alloys for Enabling Flex Circuit Leads for Implantable Neuromodulation Applications
Jack Whalen, Platinum Group Coatings, LLC

3:45pm-4:15pm Advance Glass Packaging for the Next Generation Medical Diagnostics Devices
Georges Roussos, Invenios (Ray Karam)


Closing Remarks


Please contact Brian Schieman by email at if you have questions.


Speaker Dates/Information:

  • Abstract Deadline: October 14, 2016
  • Speaker Email Notification: December 5, 2016
  • Early Registration Deadline: January 16, 2017
  • Hotel Cut-off: January 16, 2017
  • Speaker 2-3 sentence biography due not later than: January 15, 2017
  • Powerpoint/Presentation file for Workshop DOWNLOAD due not later than: February 1, 2017
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop/usb or email to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Registration Information: (Early Registration Deadline: January 16, 2017)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; download will contain the presentations as submitted by the presenter. Download will be available 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Early Fee
Through 1/16/17
Advance/Onsite Fee
After 1/16/17
IMAPS Member
Session Chair
Chapter Officer
Premier Event Sponsorship
(includes: 1 tabletop exhibit w/ 1 attendee registration/badge, print advertisement in programs, flyer/giveaway distributed to all attendees, logo/advertisement on event webpages)
$1500 - SOLD OUT
$1500 - SOLD OUT

Hotel Reservations

Reservations must be made directly with the:

Handlery Hotel
950 Hotel Circle N.
San Diego, CA 92108




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