2018 Advanced Technology Workshop on
Advanced Packaging for Medical Microelectronics

Handlery Hotel, San Diego, California
January 23-24, 2018

General Co-Chair:
Susan Bagen,
General Co-Chair:
Kedar Shah,
Verily Life Sciences

Organizing Committee:
Steve Annas, Samtec | Matt Apanius, SMART Microsystems | Caroline Bjune, Draper |
Rick Elbert, Cicor | Tim LeClair, Cerapax | Vern Stygar, Asahi Glass Company


Hotel & Registration Details | Exhibitors/Sponsors | Speaker Information

Thank you to our Premier Sponsors:

Premier Sponsor - SMART Microsystems
Premier Sponsor - Micro Systems Technologies (MST)
Corporate Sponsor - Kyocera America
Corporate Sponsor - ISI


The International Microelectronics Assembly and Packaging Society (IMAPS) will host an Advanced Technical Workshop in San Diego on Advanced Packaging for Medical Microelectronics on January 23-24, 2018. The workshop will bring together technologists in semiconductor packaging with life science experts interested in applying advanced packaging methods to enable the next generation of medical microelectronic devices. The workshop will provide a venue for presentations and discussions focused on traditional and emerging packaging technologies for wearable, portable and implantable devices, medical instrumentation, and life sciences consumables. Attendees and Exhibitors will be exposed to a wide variety of disciplines to encourage new products, discussions and collaborations. This two-day event will draw invited experts in the medicine, sensing, microelectronics, and semiconductor packaging.





Registration Open


Exhibits Open (when not in session)

Thank you to our sponsors and exhibitors:

AEMtec GmbH

Cicor Group

CMS Circuit Solutions, Inc.

Grinding and Dicing Services, Inc. (GDSI)

Heraeus Electronics

Interconnect Systems, Inc.

Kyocera International, Inc.

Micralyne, Inc.

Micro Systems Technologies Management AG

NTK Technologies

Quik-Pak, a division of Promex Industries

Samtec, Inc.

Semi Dice, Inc.

SMART Microsystems Ltd

Valtronic Technologies (USA), Inc.




Opening Remarks: General Co-Chairs –
Susan Bagen, MST; and Kedar Shah, Verily Life Sciences


Medical Imaging and Diagnostic: Current Status and Future Trends

Abstract: Medical imaging continues to play a significant role in healthcare. Technological advancements have led to transformations in the industry that in turn have led to medical imaging devices that are more accurate, smaller, less expensive and capable of imaging smaller structures and lesions. These advancements have led to the use of imaging devices for screening, diagnosis, staging, procedure guidance and monitoring. Future advancements in technology promise continued transformation of imaging modalities.

In this presentation we will focus on medical imaging devices and related applications, and touch upon the brief history of imaging, the current status and future trends. Other technologies that could impact imaging in the future will be discussed. Significant emphasis will be put on Ultrasound as an important imaging modality, and potential “stethoscope of the future”.

KEYNOTE: Shalabh Chandra
Mr. Shalabh Chandra, CEO, Gyan Business Advisors
Mr. Shalabh Chandra is a healthcare executive with experience in Medical Devices, primarily Medical Imaging. Currently, he is the CEO of Gyan Business Advisors, a company that provides consulting services from Leadership, Strategy/Business Development to Commercialization including Product Development and Sourcing/Manufacturing. In his most recent role, Mr. Chandra worked as the SVP at Analogic and ran their Global Ultrasound Business in Peabody, Massachusetts. Prior to that, he established Analogic’s Asia Operation out of Shanghai, China. Before coming to Analogic, he worked for Philips where he started as a Clinical Scientist. His last role with Philips was GM of the Global MRI Patient Monitoring business in Orlando, Florida. He started his career working in a hospital setting as a research engineer at the Cleveland Clinic in Cleveland, Ohio. His experience covers many imaging modalities including CT, MRI, Mammography and Ultrasound. He was one of the inventors of Cardiac CT at Philips. Mr. Chandra received his BS in electrical engineering from IIT Kanpur, India, his MS in Biomedical Engineering from Ohio State, and an MBA from Wharton, UPenn. He has multiple patents and publications.


Session Chair: Tim LeClair, Cerapax



Nanotechnology for a Genomic Revolution
Shane Bowen, Illumina


Microfluidics and Nanopatterning Capabilities for Biomedical Devices
Yu-Hwa, University of California, San Diego


Coffee Break in the Foyer/Palm Area with Exhibitors.


Molecular Cloning Involving the AAV CXCL12 Gene
Kripa Raj Ahuja, UNC Chapel Hill


Microelectronic Sensor Systems for Improving Patient Outcomes
Matt Apanius, SMART Microsystems (Barbara Morrison Wilford, Lorain County Community College)


BioMEMS: How Emerging Paradigms in Microelectronics can be Harnessed to Address Fundamental Challenges in Biosensing
Joshua Windmiller, Biolinq Inc.


Lunch in the Terrace Room.


Scaling Down: FDA Regulation of Microelectronic Medical Devices

Abstract: Innovations in medical technology require new approaches to medical device regulation, while still ensuring safety and effectiveness. In the last several years, the Center for Devices and Radiological Health have implemented new program to encourage novel approaches to medical technology regulation. This presentation will overview basic medical device regulation, and highlight several recent initiatives, with an emphasis on implications for microelectronics.

KEYNOTE: Cristin Welle Cristin Welle, Ph.D. Assistant Professor Boettcher Investigator University of Colorado, Denver Departments of Neurosurgery and Bioengineering
Dr. Welle is an Assistant Professor in University of Colorado Departments of Neurosurgery and Bioengineering faculty, and her lab investigates circuit-level structure and function in the context of translational neurotechnology. Using chronic in vivo electrophysiology, in vivo multiphoton imaging and advanced histological techniques, her lab examines the electrode/tissue interface of high-density recording electrodes for brain-computer interface systems. Prior to her time at the University of Colorado, she spent 5 years as the principal investigator of the Neural Implant Lab in the Division of Biomedical Physics, Center for Devices and Radiological Health, Food and Drug Administration, exploring safety and performance of invasive neural recording electrodes used in neuroprosthetic systems and novel electrode technology for the detection of traumatic brain injury. A neurophysiologist by training, she received her PhD in Neuroscience from the University of Pennsylvania in 2010.


Session Chair: Caroline Bjune, Draper Laboratory



Miniaturizing Implantable Medical Devices Through Custom Integrated Circuit Design 
Andrew Kelly, Cactus Semiconductor


Biodegradable Packaging for Solid Thin Film Batteries for Transient Medical Applications 
Messaoud Bedjaoui, CEA-LETI


Coffee Break in the Foyer/Palm Area with Exhibitors.


Miniaturized Hermetic Modules for Medical Implants  
Eckardt Bihler, Dyconex AG


Durable Conducting Polymer Electrode Materials on Flex Circuits for Neuromodulation
Jeff Hendricks, Heraeus Medical Components


Pb-free Solders, Creep, and Body Temperature 
Guna Selvaduray, San Jose State University


Happy Hour & Networking in the Foyer/Palm Area with Exhibitors.






Registration Open


Exhibits Open (when not in session)




Opening Remarks: General Co-Chairs –
Susan Bagen, MST; and Kedar Shah, Verily Life Sciences


Body Area Sensing: from Wearables to Implants

Abstract: Rapid advances in wireless communications, sensing technologies, and materials are opening new and hitherto unexplored opportunities in body area sensing. Next-generation wireless devices are envisioned that operate either upon or inside the human body to unobtrusively provide round-the-clock health status information. Example applications include, but are not limited to, healthcare, sports, military, consumer electronics, etc. In this presentation, we will review transformational wireless technologies for body area sensing, addressing their potential and challenges raised. Particular focus will be on a novel class of flexible E-textile electronics, as well as game-changing wireless implants that sense deep-brain neuropotentials without batteries. Other technologies required to make these wearable and implanted devices a reality will also be discussed, including antennas, power harvesting, in-vitro / in-vivo testing, patient safety, etc.

KEYNOTE: Asimina Kiourti
Asimina Kiourti, Assistant Professor ElectroScience Laboratory, Dept. of Electrical and Computer Engineering The Ohio State University
Asimina Kiourti joined The Ohio State University (OSU) as an Assistant Professor of Electrical and Computer Engineering in Fall 2016. From 2013 to 2016 she served as a Post-Doctoral Researcher and then a Senior Research Associate at the OSU ElectroScience Laboratory. Prior to that, she received the Ph.D. degree in Electrical and Computer Engineering from the National Technical University of Athens, Greece (2013) and the M.Sc. degree from University College London, UK (2009). Prof. Kiourti’s research interests include: wearable and implantable sensors, antennas and electromagnetics for body area applications, and flexible textile-based electronics. Her publication record includes 7 book chapters, 4 patents/disclosures, 33 journal papers, and over 80 conference papers. She has received more than 40 awards and scholarships, among which, the IEEE EMB-S "BRAIN Young Investigator Award" (2014), the Chorafas Foundation "Outstanding Ph.D. Dissertation Award" (2013), the IEEE MTT-S "Graduate Fellowship for Medical Applications" (2012), and the IEEE AP-S "Doctoral Research Award" (2011). Prof. Kiourti's research has gained international reputation and has recently been featured by TechCrunch, Gizmodo, Times of India, Australia Network News, and the ALN Magazine, among others.


Session Chair: Rick Elbert, Cicor Advanced Microelectronics & Substrates Division



Implant Packaging for Next-Generation Neurotechnology
Jack Judy, University of Florida


Technical Specificities and Challenges of Neurological Active Implants  
Claude Clement, Wyss Center for Bio and Neuroengineering


Coffee Break in the Foyer/Palm Area with Exhibitors.


Glass-based Hermetic Micro-packaging Platform for Untethered, Implantable, Wireless Neural Systems 
David Borton, Brown University, Brown Institute for Brain Science (BIBS)


Package Architecture and Component Design for an Implantable, Designed-for-Human-Use Peripheral Nerve Stimulation and Recording System for Advanced Prosthetics 
Caroline Bjune, Draper


Advancing BRAIN Research with Implantable MEMS Optoelectrodes  
Komal Kampasi, Lawrence Livermore National Laboratory


Lunch in the Terrace Room and Networking in the Foyer/Palm Area with Exhibitors.


The Needs and Challenges Facing All Aspects of Medical Applications & Packaging

When faced with medical device and component needs and challenges, most packaging engineers thrive in defining innovations, workarounds, and solutions addressing those needs and challenges. However, advanced biomedical devices require extensive interdisciplinary development efforts from technologists and medical professionals as well as extensive testing and certification. Various new, exciting, and novel applications of MEMS & sensor technologies are central to the medical industry, from improving & innovating large medical equipment and portable medical instrumentation to enabling medical wearables and point of care devices. Areas of medical device packaging technology development and pathfinding need to include: heterogeneous device technologies, biocompatible materials, elimination of cytotoxicity, miniaturization schemes, robust interconnects (at device, package, module, & system levels), and the incorporation of microfluidics and optics. This presentation will focus on specific needs and challenges within upcoming medical applications and medical device packaging.

KEYNOTE: Steven Groothuis Steven Groothuis, Chief Technology Officer, Samtec Microelectronics
Mr. Steven Groothuis is the Chief Technology Officer at Samtec Microelectronics in Colorado Springs and maintains the package technology & strategic roadmaps for Samtec’s microelectronic packaging products. He is involved in Integrated Circuit, MEMS, sensor, optical, and photonics package technology path finding. He is a strategist, technologist, and internal technology advisor. He has dealt with products in the autonomous vehicles, biomedical, optical/photonics, MEMS/Sensors, and microelectronics arenas. Prior to joining Samtec, he was a Distinguished Member of Technical Staff at Micron Technology providing technology advancements on the advanced Hybrid Memory Cube package development, technology path finding, and wafer- and package-related simulations. Mr. Groothuis also worked at ANSYS as a Multiphysics Industry Specialist on various MEMS simulation initiatives. He started his career as a package technologist at Texas Instruments and served as TI’s Advanced Semiconductor Packaging Lab Manager. Mr. Groothuis received his BS Physics from Michigan State University and MS Physics from University of Texas at Dallas. He has coauthored over 50 technical papers, holds eleven US patents, and has been a worldwide technical instructor on IC and MEMS technologies.


Session Chair: Steve Annas, Samtec



Emerging Technology Trends Driving Glass Properties
Vern Stygar, Asahi Glass Company


Glass Core Technology for Medical Applications
Samuel Rogers, Roupen Keusseyan, Samtec Microelectronics


Hermetic and Additive Free Glass Bonding Technique for Medical Applications
Antti Peltonen, Primoceler Oy


Coffee Break in the Foyer/Palm Area with Exhibitors.


Moisture Absorbers for Implantable Devices
Michael Previti, Alpha Advanced Materials


Accelerated Testing and Predicted Useful Lifetime of Medical Electronics
Ephraim Suhir, Portland State University; Technical University, Vienna; ERS Co.


Digital Holographic Microscopy: How Real-Time Imaging of 3D Topography is Revolutionizing Microelectronics Testing
Julia Brueckner, Quantum Analytics


Closing Remarks




Speaker Dates/Information:

  • Abstract Deadline Extended to: NOVEMBER 17, 2017
  • Speaker Email Notification: November 20, 2017
  • Early Registration Deadline: January 5, 2018
  • Speaker 2-3 sentence biography due not later than: January 10, 2018
  • Powerpoint/Presentation file for Workshop DOWNLOAD due not later than: January 24, 2018
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop/usb or email to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Registration Information: (Early Registration Deadline: January 5, 2018) - REGISTER ONLINE

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; download will contain the presentations as submitted by the presenter. Download will be available 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Early Fee
Through 1/5/18
Advance/Onsite Fee
After 1/5/18
IMAPS Member
Session Chair
Chapter Officer
Premier Event Sponsorship
(Includes: 1 tabletop exhibit w/ 1 booth personnel badge, 1 full session badge, print advertisement in programs, flyer/giveaway distributed to all attendees, logo/advertisement on event webpages and printed program. Additional discounted full badges available to sponsors at $400/person)
Tabletop Exhibit
(Includes: 1 tabletop exhibit w/ 1 booth personnel badge. Full session badges NOT included - discounted full badges available to exhibitors at $400/person)

Register Online

Hotel Reservations

Reservations must be made directly with the:

Handlery Hotel
950 Hotel Circle N.
San Diego, CA 92108

Courtesy rate for IMAPS Guests: $109/night + taxes and fees

How to Book:
Guests must call 800-676-6567 and request the group rate of $109+tax for the International Microelectronics Assembly and Packaging Society. There is no online booking link for this hotel.

Note: This is not a block, but a courtesy rate. It is subject to availability of rooms, so guests are encouraged to book as soon as possible to get the rate. There is no pre-determined cutoff date.



  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic