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3rd Advanced Technology Workshop on Packaging of MEMS and Related Micro Integrated Nano Systems


Hilton San Jose South/Scotts Valley
Scotts Valley, California
November 8-10, 2001


Sponsored by:
International Microelectronics And Packaging Society (IMAPS)


General Chair:
Ajay P. Malshe, University of Arkansas/HiDEC-MEEG

Technical Chairs:
Albert Chiou, Motorola and Steve Anderson, Silicon Bandwidth 

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Thursday, November 8

Registration: 3 pm - 8 pm 

Reception: 5 pm - 6 pm

Dinner: 6 pm - 7:30 pm

Session I:
7:30 pm - 10 pm

The Micro_Millipid_Units Cum Parasitic_Worm like Micro Robotic Cells for Future Biomedical Applications (Session- BioMEMS)
D.B. Ghare, M. Jahangeer, Indian Institute of Science - India; Gurudev, Univ. of Texas at Austin; J.Gurudutt, A SCO Technology Center; S. Anand, Wipro Technologies

MEMS Vacuum Tooling for Handling Micro-Optics
Robert Dean, Charles Ellis, George Robertson, Lori Thomas, Auburn University

A Laminate Based MEMS Accelerometer
Robert Dean, Alex Matras, Lori Thomas, Holly Garrison, Auburn University

Advanced MEMS Packaging for Microfluidic Systems Containing Electrical and Mechanical Functionality
Arum Han, Olivia Wang, and A. Bruno Frazier, Georgia Institute of Technology

Micro-Packaging of COTS MEMS for Remote Monitoring Systems
Michael Kranz, Morgan Research Corporation; Ron Legowik, U.S. Army Aviation and Missile Command; L William Bowers, IITRI PMTEC; Robert Dean, Auburn University

Friday, November 9

Continental Breakfast: 7 am - 8 am

Session II:
8 am - Noon

Flip-Chip Hermetic Packaging Of RF MEMS
Patrick Wilkerson, CFD Research Corporation; Michael Kranz, Morgan Research Corporation; Andrzej Przekwas, CFDRC; Tracy Hudson, AMCOM

MEMS Future Application Directions: A Blending of Old and New Technology 
Robert J. Walker, Daya Nadamuni, Mary Ann Olsson, Charles Smulders, Jim Tully, Michael Williams, Dataquest

Benefits of MEMS Wafer Level Packaging
Katrin Persson, IMEGO (Institute of Microelectronics in Gothenburg) - Sweden; Katarina Boustedt, Ericsson Mobile Communications - Sweden

KGD Solution MEMS Technology apply to IC Testing
Kristy Chang, SCS Hightech Inc. - Taiwan

Practical Methods for Vacuum Maintenance in Hermetically Sealed MEMS Packages and Directions for the Future
Richard C. Kullberg, SAES

Packaging Integrated MEMS Inertial Sensors
Larry Felton, Analog Devices, Inc.

Lunch: Noon - 1 pm

Session III:
1 pm - 5 pm

Robert M. Giasolli, Coventor Inc. 

MEMS in the "Outback" and Their Packaging
Dinesh Sood and R.B. Zmood, Royal Melborne Institute of Technology (RMIT), - Australia

Packaging and Integration Scheme for RF MEMS and other related Microsystems using Microelectronics Platform (Application Specific)
Ajay P. Malshe, Rebecca Cragan, Yi Tao, L.W. Schaper and W.D. Brown, University of Arkansas (HiDEC); Chad O'Neal, SYSCONN

Friction and Wear Control for Reliable MEMS Operation
J.S. Zabinski, S.T. Patton and K.C. Eapen, AFRL/MLBT 

Packaging of MEMS based Fine-pitch Probing System
Ryutaro Maeda, Zhen Yang, Integrated Solid-state Electro Mechanical Instruments (ISEMI), National Institute of Advanced Science and Technology 

Sean Cian O Mathuna, NMRC

Reception: 5:30 pm - 6:30 pm

Dinner: 6:30 pm - 8 pm

Session IV:
8 pm - 10 pm

Daniel F. Baldwin, Georgia Institute of Technology 

Vacuum Encapsulation Processes for MEMS Resonators
Liwei Lin, University of California at Berkeley 

MEMS and Packaging and Integrated Approach
Gilberto Morales, Michael Haji-Sheikh, Honeywell Sensing and Control Division; Dereje Agonafer, Bo Ping Wang, University of Texas at Arlington 

Advancement of MEMS Packaging Technology
Steve Anderson, Silicon Bandwidth

Using MEMS to Lower Costs of Fiber Interconnection and Packaging
James Aberson, Coventor

Saturday, November 10

Continental Breakfast: 7 am - 8 am

Session V:
8 am - Noon

Material Advancements for MEMS Packaging
Art Burkhart, Dexter Corporation

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611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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