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IMAPS Advanced Technology Workshop on

Packaging of MEMS and Related Micro Integrated Nano Systems


The Adam's Mark Hotel
Denver, Colorado
September 6-8, 2002   


General Chair:
Ajay P. Malshe
University of Arkansas/HiDEC
Fayetteville, AR USA
Email: apm2@engr.uark.edu

Technical Program Chair:
William D. Brown
University of Arkansas
Email: wdb@engr.uark.edu


Register On-Line and $ave


 

Friday, September 6 

Registration - 4:00 pm - 9:30 pm 

Reception - 5:00 pm - 5:45 pm 

Dinner - 5:45 pm - 6:45 pm

 

Session I:
Introduction and Plenary Address 

Session chairs: Ajay P. Malshe, University of Arkansas; TBD

7:00 pm - 10:00 pm

Plenary Speaker: Masayoshi Esashi
Tohoku University - Japan

7:00 pm - 8:00 pm

Title: MEMS Packaging using Electrical Feedthrough in Glass
 

MEMS packaging: moving from curiosity to commodity
Ted Tessier, Amkor Technologies

Micromachining technology for enabling system-in-a-package
R. Huang, C. Lee, M. Lin, Asia Pacific Microsystems, Inc., Taiwan

MEMS Integrated into main stream IC processes
R. Markunas, P. Enquist, T. Connolly, Ziptronix, Inc.

 

Saturday, September 7 

Registration- 7:00 am - 9:30 pm 

Continental Breakfast: 7:30 am - 8:30 am

 

Session II - Invited Session:
Microsystems Packaging at Sandia National Laboratories 

Session chairs: L. Rohwer, Sandia National Laboratories; W. Brown, University of Arkansas

8:30 am - Noon
 

Applying new LTCC/LIGA construction techniques in realizing a miniaturize ion mobility spectrometer
S. Rohde, K. Peterson, Sandia National Laboratories
 

Comparison of three methods of packaging microfluidic devices
P. Galambos, M. Okanda, G. Benavides, J. Custer, Sandia National Laboratories
 

Development of robust wafer level packaging technologies for MEMS
L. Rohwer, A. Oliver, M. Collins, S. Smith, K. McGuire, S. Mani, P. Clews, P. Resnick, M. Hankins, Sandia National Laboratories

Break: 10:00 am - 10:30 am

Application specific MEMS packaging examples at Sandia National Laboratories
M. Polosky, Frank J., P. Andrew, D. Oliver, G. Sleefe, J. Custer, Sandia National Laboratories

Integrated nanotechnologies: putting small things to work
T. Michalske, A. Romig, Sandia National Laboratories

MEMS-based packaging requirements
J. Custer, Sandia National Laboratories

Lunch: Noon - 1:30 pm

 

Session III - Special Session:
PCB and Polymer for MEMS and Microsystems Packaging

Session chairs:  R. Dean, Auburn University; David Fries, University of South Florida

2:00 pm - 5:30 pm
 

Development of MEMS on Printed Wiring Board Platform
Keryn Lian, Shawn O’Rouke, Manes Eliacin, Claudia Gamboa, Robert Terbrueggen, Daniel Sadler, Marc Chason, Motorola Labs

MEMS devices in printed circuit board technology
R. Dean, L. Thomas, S. Tully, B. Farwell, Auburn University
 

Microfluidic components and system in PCB technologies
L. Pagel, University of Rostock, Germany

Break: 3:30 pm - 4:00 pm

Maskless Lithographic PCB/Laminate MEMS for a Salinity Sensing System
D. Fries, G.Steimle, H.Broadbent, S. Natarajan, T. Weller, University of South Florida

Realizing Micro-Fluidic Structures in LCP
Brian Farrell, Paul Jaynes, Suneet Chadha, Foster-Miller; Robert Dean, Auburn University; Pete Black, AMCOM-U.S. Army

Liquid Crystal Polymer Based MEMS Applications
Xuefeng Wang, Jonathan Engel, Chang Liu, University of Illinois at Urbana-Champaign

Reception/Dinner: 5:30 pm - 6:45 pm

 

Session IV - Special Session:
Processes for wafer-level and CSP of MEMS and Related Microsystems

Session chairs:  TBD

7:00 pm - 10:00 pm

Laser-Assisted Selective Bonding and Through Substrate Holes for Wafer-Level CSP Approach for RF and Optical MEMS and Related Micro Systems
A. Malshe, Y. Tao, M. Kelly, Darryl J., R. Foster, C. O’Neal, L. Schaper, F. Barlow, W. Brown, University of Arkansas and SYSCONN

Packaging for MEMS devices – A wafer level CSP Approach
E. Jung, M. Wiemer, V. Grosser, K. Bock, J. Wolf, Fraunhofer IZM - Germany

MEMS 0-level packaging using thin-film poly-SiGe caps
C. Rusu, A. Verbist, B. Parmentier, A. Witvrouw, IMEC - Germany

Pressure sensors built in low temperature co-fired ceramic materials
A. Moll, D. Plumlee, H. Ackler, A. Paris, Boise State University

3-D Photolithography using multilevel exposure method on electrodeposited photoresist
Vineet Sharma, A. Suriadi, F. Berauer, Hewlett-Packard, Singapore

Design, fabrication and testing of a micromirror device
Z. Xiao, J. Bai, R. Maeda, Nanyang Technological University, Singapore

 

Sunday, September 8 

Registration- 8:00 am - Noon 

Continental Breakfast: 8:00 am - 9:00 am

 

Session V - Special Session:
Application Specific Packaging of MEMS and Related Microsystems

Session chairs:  TBD; Ajay Malshe, University of Arkansas

9:00 am - Noon
 

Miniaturized fuel cell arrays for portable power using printed circuit technology
S. Lee, S. Cha, T. Fabian, R. O’Hayre, F. Prinz, Stanford University
 

Wafer level packaging of DMDTM devices
V. Lopes, J. Ehmke, P. Harrism, I. Kmecko, Texas Instruments, Inc.

Packaging field emission array for electron gun applications
R. Schueller, Extreme Devices Inc.

Ink-jet printing of optical and electrical components for MEMS packaging
D. Wallace, T. Chen, W. Cox, V. Shah, D. Hayes, MicroFab Technologies, Inc.

Metrology for microwave MEMS probing
J. Moreland, J. Baker, J. Pavel, M. Kabos, D. Janezic, D. Williams, NIST

Concluding Remarks

 

Register On-Line and $ave

 



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