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IMAPS 5th Topical Technology Workshop on
MEMS, Related Microsystems and Nanopackaging

Sheraton Boston Hotel
Boston, MA, USA
November 20 - 22, 2003
Early Registration and Hotel Deadline: October 3, 2003

Sponsored by:
International Microelectronics And Packaging Society (IMAPS)
in conjunction with the IMAPS 2003 Symposium - November 16 - 20*
*visit for details on IMAPS 2003

General Chairs:
Ajay P. Malshe
University of Arkansas/HiDEC
Fayetteville, AR USA
Ephraim Suhir
University of Illinois, Chicago, IL, and ERS Co.
Los Altos, CA USA

Workshop Overview

Packaging and integration of micro electro mechanical systems (MEMS) and related micro and nano systems are subjects of immense interest for the past few years. As the products such as accelerometers, micro mirrors, etc. are gaining success for various applications, lessons learned in packaging and manufacturing are of essence for future progress of this subject. IMAPS has catalyzed the growth of this industry through various MEMS packaging events; in particular the last four Topical Workshops on this topic have had great response and success. The 5th MEMS, Related Microsystems and Nanopackaging workshop will highlight state-of-the-art developments in design, processing, and manufacturing of application-specific micro and nano packaging. The subject is of monumental interest to scientists, engineers, managers, investors and students, across the globe who will continue to find the event prolific for their mission.

Thursday, November 20

Registration: 11 am - 8:30 pm

Opening Remarks: General Chairs

Pad Printing Functional Inks
Mike Amero, Amero Sales & Development, Inc.; Silvio Morano, Creative Materials Inc.; Bill White, TecaPrint Inc.

The Characteristics of Low Cost, High Volume Thermoplastic Air Cavity Packages for MEMS Devices
Charles W. Marshall, Jr., Handy & Harman Electronic Materials Corp.

Break: 2 pm - 2:30 pm

Low Stress Die-attach Technology for MEMS Packaging
Liang-Yu Chen, Ohio Aerospace Institute/NASA Glenn Research Center; F.
Patrick McCluskey, Karumbu Meyyappan, University of Maryland; Shun-Tien Lin, Hamilton Sundstrand Corp.

Heterogeneous Integration of MEMS Devices through Low Temperature Wafer Bonding
Markus Wimplinger, Shari Farrens, Joshua Palensky, Paul Lindner, EV Group

Reception/Dinner: 4 pm - 5:30 pm

Session II: Application Specific Packaging
Chair: Ajay P. Malshe, HiDEC-MEEG, University of Arkansas
5:30 pm - 8 pm

Thermofludic Packaging Approach for the MEMS Rotary Engine Power System
David C. Walther, Fabian C. Martinez, Kelvin Fu, Albert P. Pisano, Paul Koeneman, Michael Pleskach, Carol Gamlen, Mike Newton, University of California - Berkeley

MEMS Packaging Prototyping Leveraging Open Cavity Plastic Packages
David S. Hypnarowski, William Lawrence, Robert Blue, Quik-Pak, a Division of Gel-Pak, LLC

Low Temperature 0-Level Hermetic Packaging for MEMS based on Solder and Polymer Bonding
P. De Moor, K. Baert, B. Du Bois, G. Jamieson, A. Jourdain, H. A. C. Tilmans, M. Van de Peer, C. Van Hoof, IMEC

Break: 7 pm - 7:30 pm

Advanced Packaging Techniques for MEMS Devices
Daniel F. Crowley, Peter Cronin, MRSI, A Newport Corporation Company

A Novel Approach to Integrating Nanowires to Transductors, without Nanosurface Contamination
Shekhar Bhansali, Kevin Lluango, Shyam Aravamudhan, University of South Florida

Friday, November 21

Registration: 7 am - 7:30 pm

Continental Breakfast: 7:30 am - 8:30 am

Session III: Sandia - Invited Session
Chairs: Jonathan Custer, Sandia National Laboratories; W.D. Brown, University of Arkansas
8:30 am - 11:30 am

Systems Considerations for Reliable MEMS in Shock Environments
Darren A. Hoke, Michelle Duesterhaus, Vesta Bateman, Sandia National Laboratories

Realization of Packaging Solutions for MEMS Devices with Optical and Electrical Interconnects
Bernhard Jokiel, Jr., Dave W. Peterson, Melissa V. Collins, Frank J. Peter, Sandia National Laboratories

Unified Characterization of Surfaces and Gases in MEMS Devices
S. M. Thornberg, K. R. Zavadil, J. A. Ohlhausen, M. R. Keenan, G. A. Knorovsky, D. O. MacCallum, B. M. Nowak-Neely, D. E. Peebles, I. C. Abraham, R. A. Plass, Sandia National Laboratories

Break: 10 am - 10:30 am

A Novel Test System for RF MEMS Reliability
David L. Barr, Fred W. Sexton, Sandia National Laboratories

Aging Effects on the Structure and Performance of Monolayer Surface Treatments for MEMS
Josh Wiehn, Mike T. Dugger, Sandia National Laboratories

Lunch: Noon - 1 pm

Session IV: Device and Materials
Chair: Ephraim Suhir, University of Illinois
1 pm - 2:30 pm

MEPS - MEMS Electrochemical Power Supplies: A Solution for Integrated Power for Microsystems
Charles Lakeman, Patrick Fleig, Jenniffer DeGreeff, TPL Inc.

MEMS-Based Permanently Implanted Brain Pressure Measurement System
Ingelin Clausen, Igor Godovitsyn, Ola Sveen, University of Oslo

Computational Environment for Predictive Modeling and Simulation of MEMS and MEMS Packaging
Ryszard J. Pryputniewicz, Worcester Polytechnic Institute; Andrzej J. Przekwas, Marek Turowski, Michal Furmanchyk, Andreas Hieke, CFD Research Corporation; Dariusz R. Pryputniewicz, Draper Laboratory

Break: 2:30 pm - 3 pm

Session V: Truth and Mystery of Nanopackaging - Panel Discussion
Chair: Ajay P. Malshe, HiDEC-MEEG, University of Arkansas
3 pm - 5:30 pm

John Custer, Sandia Laboratories
W.D. Brown, University of Arkansas
Ajay P. Malshe, University of Arkansas

Reception/Dinner: 6pm - 7:30 pm

Saturday, November 22

Registration: 7 am - 10:30 am

Continental Breakfast: 7:30 am - 8:30 am

Session VI: Products and Manufacturing
Chair: Jay Jayaraj, Si Wave Inc.
8:30 am - 10:30 am

Effects of Environmental and Operational Stresses on RF MEMS Switch Technologies for Space Applications
Muzar Jah, Eric Simon, Ashok Sharma, NASA Goddard Space Flight Center

Challenges in Packaging Large Port Count Optical Switches
Kumaraswamy Jayaraj, Robert Calvet, Darrell Harrington, Roman Gutierrez, Tony Kai Tang, Si Wave Inc.

Design and Fabrication of Microheater for Locally Heated Wafer-Level-Scale MEMS Device Package
Sihai Chen, Xinjian Yi, Mingxiang Chen, Tao Xiong, Sheng Liu, Honghai Zhang, Huazhong University of Science and Technology

Near Hermetic Air Cavity Plastic Packaging for MEMS
John W. Roman, RJR Polymers Incorporated

Concluding Remarks: 10:40 am

(Hotel Cut-off is October 3, 2003)

Housing Accommodations must be made directly to:

Sheraton Boston Hotel
39 Dalton Street
Boston, MA 02199
Phone: 617-236-2000; Fax: 617-236-1702
When making reservation, please reference IMAPS.

Single: $199; Double: $241
Sheraton Boston Hotel requires a deposit for the first night's room and tax to hold your room. Deposit refunded if reservation is cancelled fourteen (14) days prior to arrival. After which time, deposit is non-refundable.

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IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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