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IMAPS 6th Topical Workshop on
Packaging of MEMS and Related Micro-Nano-Bio Integrated Systems

November 18 – 19, 2004
Hyatt Regency Hotel
Long Beach, CA 90802
Rates: Single/Double $165;
Business Plan $185; Regency Club: $200
Housing Deadline: October 8, 2004
longbeach.hyatt.com

General Chair:
Ajay P. Malshe, HiDEC-MEEG, University of Arkansas
apm2@engr.uark.edu

Sponsored by:
International Microelectronics And Packaging Society (IMAPS)

In conjunction with the IMAPS 2004 Symposium – November 14 – 18*
*visit www.imaps2004.org for details on IMAPS 2004




Packaging and integration of MEMS and related Microsystems, integrated nano systems, and recent bio systems are subjects of immense interest to diverse application areas such as micro optical switches, RF, pressure and vibration sensors, gyros, microfluidic devices, bio-MEMS, quantum optical detectors, etc. The subject interests various scientists, engineers, managers and investors striving for advanced and next-generation products and leadership.

The last five successful annual workshops focused on MEMS, related micro and nano systems packaging challenges and broad opportunities. The objective of the current workshop is “application-specific” MEMS and related micro-nano-bio devices and their application-specific packaging schemes, unlike IC packaging. Another objective is introduction to novel topics related to “nano, bio and integrated packaging.”

Application-specific packaging demands can seriously affect everything from chip to system, in particular designs, processes, materials, packaging schemes and cost of the product. In the core packaging arena it demands diverse designing, fabrication, testing, handling, etc., requirements such as designing of multisignal systems, tailoring environmental-specific package surfaces and interfaces, wafer-scale encapsulation, dicing, release, stiction, bonding stress, vacuum packaging, etc.

Thursday, November 18

Registration: 11 am – 5 pm

Opening Remarks: General Chair

Plenary Talk
Title: MEMS and MOEMS for National Security Applications
Speaker: Dr. Marion W. Scott

Director of the Microsystems Science, Technology and Components Center
Sandia National Laboratories
1 pm – 1:30 pm

Session 1
Chair: Changhan Hobie Yun, Analog Devices

1:30 pm – 4 pm

Think Additive: Ink Jet Deposition of Materials for MEMS Device Fabrication
David B. Wallace, Donald Hayes, Ting Chen, Virang Shah, Delia Radulescu, Patrick Cooley, Microfab Technologies, Inc.; Kurt Wachtler, Texas Instruments; Arunkumar Nallani, The University of Texas at Dallas

Development of RF-MEMS on Printed Wiring Board Platform
Keryn Lian, Manes Eliacin, Robert Lempkowski, Gabriela Dyrc, Raj Desai, Marc Chason, Motorola Labs

Break: 2:30 pm – 3 pm

Development of Biocompatible MEMS Wireless Capacitive Pressure Sensor
Shankaran Janardhanan, Joan Z. Delalic, Fuzhang Zhao, Michael Ruggieri, Michel Pontari, Temple University; Jeffrey Catchmark, The Pennsylvania State University

Packaging Considerations when Interfacing MEMS Devices to Harsh Environments
Ajay P. Malshe, University of Arkansas

Reception/Dinner: 4 pm – 5:30 pm

Friday, November 19

Registration: 7 am – 8:00 pm

Continental Breakfast: 7 am – 8 am

Session 2
Chair: Ajay P. Malshe, University of Arkansas

8 am – 11:30 am

Finite Element Analysis of MEMS Based Pressure Sensor
Narasimham Pulugundla, Raghu N. Chintakunta, Temple University

Cost Effective Plastic Packaging for Rapid MEMS Prototyping
David Hypnarowski, William Lawrence, Robert Blue, Quik-Pak, Division of Delphon Industries

The Minipackage: A Flexible Wafer-Level Packaging Solution for MEMS
P. De Moor, K. Baert, L. Bogaerts, B. Du Bois, G. Jamieson, A. Jourdain, C. Van Hoof, IMEC

Break: 9:30 am – 10 am

Surface Micromachining of Thin Films on LCP Substrates for Biomedical Applications
Robert Dean, Jenny Weller, Michael J. Bozack, Ken MacAllister, Nicole Schutz, Auburn University; Brian Farrell, Joseph Ting, Linas Jauniskis, Foster-Miller, Inc.; David Edell, InnerSea Technology Inc.; Jamille Hetke, University of Michigan

Future of Inorganic MEMS Packaging
Susheel Dharia, Kohta Uchiyama, Kyocera America, Inc.

Lunch: 11:30 am – 12:30 pm

Session 3
Chair: William D. Brown, University of Arkansas
1 pm – 3 pm

Microjoining in an Enhanced Scanning Electron Microscope
Gerald A. Knorovsky, B. M. Nowak-Neely, J. A. Jones, D. O. MacCallum, Sandia National Laboratories

Characterization of Monolayer Surface Treatments for MEMS Exposed to Possible Back-End-of-Line Process Conditions
Joshua S. Wiehn, Michael T. Dugger, Sandia National Laboratories

Characterization of Chlorosilane-based Self-assembled Monolayers in Fluidic Environments
Elizabeth E. Parker, Honeywell FM&T; W. Robert Ashurst, Carlo Carraro, Roya Maboudian, University of California – Berkeley

Sub Micron Cleaning using Vacuum Cavitational Streaming (VCS)
Charlotte Frederick, HyperFlo, LLC; Donald Gray, University of Rhode Island

Reception/Dinner: 3:30 pm – 5 pm

Session 4
Chair: Sean Cian O'Mathuna, University College
5:30 pm – 7 pm

Micromachined Packaging Structures for Isolating Sensitive Devices from High Frequency Mechanical Vibrations
Robert Dean, George Flowers, Ken MacAllister, Nicole Sanders, Auburn University; Mike Kranz, Morgan Research Corporation

Wafer-to-Wafer Bonding an Enabling Technology
Ron B. Foster, Ajay P. Malshe, Chad B. O’Neal, University of Arkansas; Ashwin Mohan, OmniPak LLC

Polysilicon MEMS Opto-Thermal Actuator Design and Performance
Kelly A. Klody, Leslie M. Phinney, John T. Sackos, Jeremy A. Walraven, Sandia National Laboratories

Closing Remarks: 7 pm


Housing Deadline: October 8, 2004

HYATT REGENCY LONG BEACH
200 South Pine Avenue
Long Beach, CA 90802
Phone: 562-491-1234
Fax: 562-432-1972
longbeach.hyatt.com
Rates: Single/Double $165;
Business Plan $185; Regency Club: $200

Housing Accommodations MUST be made directly to the hotel. Please make your reservation before October 8, 2004. A one night’s deposit is required to guarantee your accommodations.

All IMAPS room blocks will be released on October 8, 2004, after which IMAPS can not guarantee rates listed above.




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IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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