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IMAPS 6th Topical Workshop on
Packaging of MEMS and Related Micro-Nano-Bio Integrated Systems
November 18 – 19,
2004
Hyatt Regency Hotel
Long Beach, CA 90802
Rates: Single/Double $165;
Business Plan $185; Regency Club: $200
Housing Deadline: October 8, 2004
longbeach.hyatt.com
General Chair:
Ajay P. Malshe, HiDEC-MEEG, University of Arkansas
apm2@engr.uark.edu
Sponsored by:
International Microelectronics And Packaging Society (IMAPS)
In conjunction with the
IMAPS 2004 Symposium – November 14 – 18*
*visit www.imaps2004.org for details on IMAPS 2004
Packaging and integration of MEMS and related Microsystems, integrated
nano systems, and recent bio systems are subjects of immense interest to
diverse application areas such as micro optical switches, RF, pressure
and vibration sensors, gyros, microfluidic devices, bio-MEMS, quantum optical
detectors, etc. The subject interests various scientists, engineers, managers
and investors striving for advanced and next-generation products and leadership.
The last five successful
annual workshops focused on MEMS, related micro and nano systems packaging
challenges and broad opportunities.
The objective of the current workshop is “application-specific” MEMS and
related micro-nano-bio devices and their application-specific packaging
schemes, unlike IC packaging. Another objective is introduction to novel
topics related to “nano,
bio and integrated packaging.”
Application-specific packaging demands can seriously affect everything
from chip to system, in particular designs, processes, materials, packaging
schemes and cost of the product. In the core packaging arena it demands
diverse designing, fabrication, testing, handling, etc., requirements such
as designing of multisignal systems, tailoring environmental-specific package
surfaces and interfaces, wafer-scale encapsulation, dicing, release, stiction,
bonding stress, vacuum packaging, etc.
Thursday, November 18
Registration: 11 am – 5
pm
Opening Remarks: General Chair
Plenary Talk
Title: MEMS and MOEMS for National Security Applications
Speaker: Dr. Marion W. Scott
Director of the Microsystems Science, Technology and Components Center
Sandia National Laboratories
1 pm – 1:30 pm
Session 1
Chair: Changhan Hobie Yun, Analog Devices
1:30 pm – 4 pm
Think Additive: Ink Jet Deposition of Materials for MEMS Device Fabrication
David B. Wallace, Donald Hayes, Ting Chen, Virang Shah, Delia Radulescu,
Patrick Cooley, Microfab Technologies, Inc.; Kurt Wachtler, Texas
Instruments; Arunkumar Nallani, The University of Texas at Dallas
Development of RF-MEMS on Printed Wiring Board Platform
Keryn Lian, Manes Eliacin, Robert Lempkowski, Gabriela Dyrc, Raj
Desai, Marc Chason, Motorola Labs
Break: 2:30 pm – 3 pm
Development of Biocompatible MEMS Wireless Capacitive Pressure Sensor
Shankaran Janardhanan, Joan Z. Delalic, Fuzhang Zhao, Michael Ruggieri,
Michel Pontari, Temple University; Jeffrey Catchmark, The Pennsylvania
State University
Packaging Considerations when Interfacing MEMS Devices to Harsh Environments
Ajay P. Malshe, University of Arkansas
Reception/Dinner: 4 pm – 5:30
pm
Friday, November 19
Registration: 7 am – 8:00
pm
Continental Breakfast: 7 am – 8
am
Session 2
Chair: Ajay P. Malshe, University of Arkansas
8 am – 11:30 am
Finite Element Analysis of MEMS Based Pressure Sensor
Narasimham Pulugundla, Raghu N. Chintakunta, Temple University
Cost Effective Plastic Packaging for Rapid MEMS Prototyping
David Hypnarowski,
William Lawrence, Robert Blue, Quik-Pak, Division of Delphon Industries
The Minipackage: A Flexible Wafer-Level Packaging Solution for MEMS
P. De Moor, K. Baert, L. Bogaerts, B. Du Bois, G. Jamieson, A. Jourdain,
C. Van Hoof, IMEC
Break: 9:30 am – 10 am
Surface Micromachining of Thin Films on LCP Substrates for Biomedical
Applications
Robert Dean, Jenny Weller, Michael J. Bozack, Ken MacAllister, Nicole
Schutz, Auburn University; Brian Farrell, Joseph Ting, Linas Jauniskis,
Foster-Miller, Inc.; David Edell, InnerSea Technology Inc.; Jamille
Hetke, University of Michigan
Future of Inorganic MEMS Packaging
Susheel Dharia, Kohta Uchiyama, Kyocera America, Inc.
Lunch: 11:30 am – 12:30
pm
Session 3
Chair: William D. Brown, University of Arkansas
1 pm – 3 pm
Microjoining in an Enhanced Scanning Electron Microscope
Gerald A. Knorovsky, B. M. Nowak-Neely, J. A. Jones, D. O. MacCallum,
Sandia National Laboratories
Characterization of Monolayer Surface Treatments for MEMS Exposed to
Possible Back-End-of-Line Process Conditions
Joshua S. Wiehn, Michael T. Dugger, Sandia National Laboratories
Characterization of Chlorosilane-based Self-assembled Monolayers in
Fluidic Environments
Elizabeth E. Parker, Honeywell FM&T; W. Robert Ashurst, Carlo Carraro,
Roya Maboudian, University of California – Berkeley
Sub Micron Cleaning using Vacuum Cavitational Streaming (VCS)
Charlotte Frederick, HyperFlo, LLC; Donald Gray, University of Rhode
Island
Reception/Dinner: 3:30 pm – 5
pm
Session 4
Chair: Sean Cian O'Mathuna, University College
5:30 pm – 7 pm
Micromachined Packaging Structures for Isolating Sensitive Devices
from High Frequency Mechanical Vibrations
Robert Dean, George Flowers, Ken MacAllister, Nicole Sanders, Auburn
University; Mike Kranz, Morgan Research Corporation
Wafer-to-Wafer Bonding an Enabling Technology
Ron B. Foster, Ajay P. Malshe, Chad B. O’Neal, University of Arkansas;
Ashwin Mohan, OmniPak LLC
Polysilicon MEMS Opto-Thermal Actuator Design and Performance
Kelly A. Klody, Leslie M. Phinney, John T. Sackos, Jeremy A. Walraven,
Sandia National Laboratories
Closing Remarks: 7 pm
Housing Deadline: October 8, 2004
HYATT REGENCY LONG BEACH
200 South Pine Avenue
Long Beach, CA 90802
Phone: 562-491-1234
Fax: 562-432-1972
longbeach.hyatt.com
Rates: Single/Double $165;
Business Plan $185; Regency Club: $200
Housing Accommodations MUST be made directly
to the hotel. Please make your reservation before October 8,
2004. A
one night’s deposit is required to
guarantee your accommodations.
All IMAPS room blocks will be released on October 8, 2004, after which
IMAPS can not guarantee rates listed above.
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