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IMAPS Mid-Atlantic Chapters Announce the

Mid-Atlantic Microelectronics Conference
June 23-24, 2011
Atlantic City Hilton
Atlantic City, New Jersey - USA

General Chair:
Erica Folk
Northrop Grumman
erica.folk@ngc.com

Technical Chair:
Benson Chan
Endicott Interconnect Technologies
Benson.chan@eitny.com

Co-Chair:
John Mazurowski
Penn State Electro-Optics Center
jmazurowski@eoc.psu.edu

Vendor & Sponsorship Chair:
Leo Garvey
LFG Micro
Leo.Garvey@LFGMicro.com

Chapters Organizing Committee:
Steve Lehnert (Metro), Bruce Romenesko (Chesapeake), David Seeger (Garden State), Ray Fillion & Bruce Chamberlin (Empire), Lee Levine (Keystone) and Robert Marchiando (Cleveland Pittsburgh)

Technical Program


Early Registration Deadline: June 8, 2011
Early Hotel Deadline: June 8, 2011

Download Progam PDF | Hotel Reservations | Speaker Deadlines
Professional Development Courses (PDCs) | Tabletop Exhibition Details | 2011 Exhibitors


Conference Focus:
Many IMAPS leaders in the Empire, Metropolitan, Garden State, Keystone, Chesapeake and Cleveland/Pittsburgh chapters invite you to attend the upcoming Mid-Atlantic Microelectronics Packaging Conference.

The Conference will be co-located with two half-day professional development courses and will begin on the afternoon of Thursday, June 17. The Conference will also feature an evening reception that night.

Thursday, June 23

Registration: 12 Noon - 5:30 pm

Reception: 4:15 pm – 6:00 pm

Professional Development Courses (1/2 Day)
1:00 pm – 5:00 pm

PDC1: 3D Integration: Technology, Applications & Markets for 3D Integrated Circuits
Instructor: Philip Garrou, Microelectronic Consultants of NC

This course is based on the authors activity over the past 7 years with numerous companies in the industry, his weekly 3D blog “Insights From the Leading Edge “ in Solid State Technology and the 2nd volume Wiley-VCH book “Handbook of 3D IC Integration: Technology and Applications of 3D IC Circuits” which he authored. The course will begin by defining and contrasting 3D Integration (thinning, bonding and TSV) to 3D packaging (thinning, stacking and wire bonding to the BGA base). The various drivers for 3D integration including the electrical performance and economic issues will be examined. We will examine the various process sequences being proposed for 3D integration and the process unit operations necessary to fabricate a 3D stack. The process sequences proposed by IDMs, Universities, and Institutes will be compared and contrasted. We will then examine applications and the evolving infrastructure that will be necessary to accomplish this. The course will end by looking at the remaining technical and market barriers (design, thermal and test) and looking at the current best sources of 3D information.

PDC2: Advanced Packaging Technologies: Chip Scale & Embedded Chip
Instructor: Ray Fillion, GE Global Research, Retired, Consultant

This course has been cancelled

Session 1: Industry Topics
Chair: Olivia Mao, Northrop Grumman
1:00 pm – 2:00 pm

Expanding Use of Onsite UHP Hydrogen Production Improves Safety, Quality and Productivity in Forming and Carrier Gas Applications
David E. Wolff, Proton Energy Systems

An Update on the SAE G-19 Committee and Electronic Counterfeit Detection Standards
Anne Poncheri, Silicon Cert Laboratories

Break: 2:00 pm – 2:30 pm

Session 2: Flex Interconnect
Chair: Sarah Kemp, Northrop Grumman
2:30 pm – 4:00 pm

Flexible Substrates Continue to Advance Medical Device Technology
Richard Elbert, Valtronic Technologies (USA), Inc.

Crack Development of Aluminum Thin Film Deposited on Flexible Substrate under Low Cyclic Bending Fatigue Condition
Mohammad M. Hamasha, Khalid M. Alzoubi, James C. Switzer III, Susan Lu, Charles R. Westgate, Mark Poliks, State University of New York at Binghamton

A Comparative Study Between the Crack Development of Deposited Titanium and Silicon Oxides on Flexible Substrate for Solar Photovoltaic Applications
Mohammad M. Hamasha, Mohammad M. Hamasha, Khalid M. Alzoubi, James C. Switzer III, Elizabeth M Tiberio, Susan Lu, Charles R. Westgate, Mark Poliks, State University of New York at Binghamton

Reception: 4:30 pm – 6:00 pm


Friday, June 24

Registration: 7:00 am - 5:40 pm

Breakfast: 7:30 am - 8:20 am

Opening Remarks: 8:30 am – 8:45 am
General Chair: Erica Folk, Northrop Grumman

Exhibit Hours: 9:45 am – 4:30 pm
(Refreshment Break; Lunch & Raffle Drawing will be held in the Exhibit Area.)

Session 3: Advanced Chip Interconnection
Chair: Lee Levine, Process Solutions Consulting, Inc.
8:45 am – 11:15 am

Session 3 Sponsored by:
Laser Processing Technology, Inc.

Etching Method for Enhanced Contrast of Cu-Al Intermetallic Compounds on Aluminum Bond Pads
Son Nguyen, Temple University; Horst Clauberg, Kulicke and Soffa Industries, Inc.

The Growth of Copper Ball Bonding
Lee Levine, Process Solutions Consulting, Inc.

Session 4: Modeling
Chair: Angela Martin, Northrop Grumman
8:45 am – 11:15 am

Rated Power and VSWR Characteristics improvement by Efficient Thermal Management and Integrated Matching Network
Akhlaq Rahman, Fred Olinger, Thin Film Technology Corporation

Damage Mechanisms and Acceleration Factors for No-Pb LGA, TSOP and QFN Type Assemblies in Thermal Cycling
Luke Wentlent, Babak Arfaei, Peter Borgesen, Binghamton University

Break in Exhibit Hall: 9:45 am – 10:15 am

A Scheduling Tool for Processing Large-Area Flexible Electronics
Matthew Sommerhalter, Daryl L. Santos, Binghamton University

Advance Anisotropic Conductive Paste (ACP) for Flip Chip Assembly
Ken Araujo, Tony Ruscigno, NAMICS Technologies, Inc.

Acceleration of Huge Data Processing Using Hilbert Engine on A Single Processor
An Vi Dang, Joan Delalic, Bjorn Gruenwald, Temple University

Increasing Organic Solar Cell Efficiency through Cell Structure Optimization
J. Weiss, L. Zhu, Peter Borgesen, Binghamton University

Keynote Address & U. S. Coast Guard – Air Base Atlantic City
The HH-65 Helicopter and Search and Rescue
(Indoor Presentation & LIVE SAR off the beach)

11:15 am - 12:25 pm

Keynote Presenter:
Pilot LT Alex Barker, U. S. Coast Guard – Air Base Atlantic City

Keynote Abstract:
The MH-65 is the "backbone" of U.S. Coast Guard Aviation and carries with it a highly distinguished service history spanning nearly 30 years. Constructed with ultra-light composite materials, designed with innovative aerodynamic features, and outfitted with a highly sophisticated electronics, the Dolphin is well equipped for the wide ranging missions of the Coast Guard. These include Search and Rescue, Maritime Law Enforcement, and Homeland Security to name a few.

At the conclusion of this presentation all attendees are invited out beyond the boardwalk to the beachfront where the MH-65 Search & Rescue will take place.

Lunch in the Exhibit Hall: 12:25 pm – 2:00 pm (Lunch Served: 12:25 pm – 1:15 pm)

Poster Session in Exhibit Hall
Chair: TBD
12:25 pm – 2:10 pm

Rated Power Improvement for Low Ohm Current Sense Resistor by Optimum Thermal Management and Innovative Packaging Technique
Akhlaq Rahman, Fred Olinger, Thin Film Technology Corporation

Hardware Design for Gas Detection System Using Zeolite Coated with Nile Red
Son Nguyen, Joan Delalic, Zameer Hasan, Joel B. Sheffield, David M. Kargbo, Temple University

Preliminary Analysis of Overlay Registration Components for Roll-to-Roll Technology in Photolithography
Denisse Yepez, Daryl Santos, Binghamton University

Session 5: Reliability/Thermal
Chair: John Mazurowski, Penn State Electro-Optics Center
2:10 pm – 5:40 pm

Metallic TIMs for High Brightness LED Packaging
Amanda Hartnett, Seth Homer, Indium Corporation

Passive 2-Phase Immersion Cooling of High Power GPUs
Steve Pignato, Phillip Tuma, 3M Company

LED Failure Mechanisms
Moon-Hwan Chang, Diganta Das, Michael Pecht, University of Maryland - CALCE

Session 6: Advanced Packaging
Chair: Ray Fillion, Consultant
2:10 pm – 5:10 pm

Copper Plated TSVs in Silicon Wafers Using a Novel Process
Emir Adanur, Charles D. Ellis, Robert N. Dean, Auburn University; Eric Tuck, Derek Strembicke, AEgis Technologies

Wrist Computing System
Michael Moore, Myra Torres, Impact Technologies LLC; Glenn Thomas, Endicott Interconnect Technology

Embedded Chip Power Packaging
Ray Fillion, Consultant

Break in Exhibit Hall: 3:40 pm – 4:10 pm
Raffle Drawing / Closing Remarks: 4:00 pm (must be present to win)
Vendor & Sponsorship Chair: Leo Garvey, LFG Micro

Package Reliability Testing Challenges and Trends
Mike Ferrara, RFMD

Rated Power Improvement of Termination Resistor by Employing Innovative Thermal Management Techniques
Akhlaq Rahman, Fred Olinger, Michael Howieson, Thin Film Technology Corporation

Flux Free Die Attach Utilizing Pressure Variation to Achieve Void Free Results
Bruce Wilson, SST International

Technology Needs as Driven by One Potential Future - A Day Made of Glass
J. Micheal Harris, Corning Incorporated

Multilayer Ceramics for MEMS Packaging
Adam Schubring, Kyocera America, Inc.

Closing Remarks: 5:40 pm (Join us in Session 5)
General Chair: Erica Folk, Northrop Grumman

 



Housing:

Hotel Cut-off is June 8, 2011
Atlantic City Hilton
Boston Ave. & The Boardwalk
Atlantic City, NJ 08401

IMAPS Room Rate:
$65 per night 6/22 & 6/23/11
$89 per night 6/24/11


Speaker Dates/Information:

  • Abstract(s) due to IMAPS: April 30, 2011
  • Speaker Notification/Confirmation emailed: May 11, 2011
  • Extended Abstract or Presentation Material due: June 3, 2011
  • Early Registration Deadline: June 8, 2011
  • Hotel Reservation Deadline: June 8, 2011
  • Powerpoint/Presentation file for CD-Rom due not later than: June 24, 2011
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

 

Corporate Sponsor:

Corporate Sponsor - Riv Inc.


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