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Advanced Program

IMAPS Advanced Technology Workshop on
Military, Aerospace, Space
and Homeland Security:
Packaging Issues and Applications

Renaissance Harbor Place Hotel
Baltimore, Maryland 21202
March 12 - 14, 2003

Sponsored by
International Microelectronics And Packaging Society (IMAPS)

General Chair:
Greg Caswell, BridgePoint Technical Manufacturing
Office: 512-637-4752; Cell: 512-657-4860
Email: gcaswell@bridgept.com

Don't miss the Advanced 3D Packaging Innovations and Applications for MCM and System-in-Package ATW being held in conjunction with this workshop. Receive a special discount for attending both workshops!


View Program By Day: Wednesday (Day 1) | Thursday (Day 2) | Friday (Day 3)

REGISTER ONLINE and $ave


Wednesday, March 12
Registration: 7 a.m. - 6 p.m.
Continental Breakfast: 7:30 a.m. - 8:25 a.m.

Opening Remarks: 8:25 a.m. - 8:30 am
Greg Caswell, General Chair

Session I: Materials Issues for Military and Spaceborne Electronics
8:30 a.m. - Noon
Chair: Chuck Reusnow, Lockheed

High Reliability Cyanate Ester Underfills for CSP, BGA and Flipchip Attach on BT and Ceramic Substrates
David Peard, Emerson & Cuming

Near Hermetic Seal Passivation for Advanced Packages and Harsh Environments
Chuck Reusnow, Lockheed; Brian Russell, Dow

Thin Film Packaging for Microwave and RF
Kevin Callery, Aeroflex

Break: 10:00 a.m. - 10:15 am

Reliability of Conductive Adhesives used to Attach Solder/Sn-Terminated Components on Flex and FR-4 Substrates
Vito Buffa, Emerson &Cuming

Thermal Management for High Performance Applications
Jill A. Voss, DuPont Microcircuit Materials

Wafer Scale Flip Chip Technology for HgCdTe IRFPA
M. Fendler, CEA Grenoble - Leti

Lunch: Noon - 1 p.m.

Session II-A: Packaging Issues and Applications for High Reliability Military and Spaceborne Systems
1:15 p.m. - 5:00 p.m.
Chair: Harry Shaw, Goddard Space Flight Center

Overmolded Electronic Packaging for Harsh Environments
Scott Brandenberg, Delphi

High Performance Multilayer Aluminum Nitride Packages for Military Applications: DC to 18GHz
Chris Mosher, CMC Wireless

Packaging of Silicon Carbide Power Devices for 350C Military Applications
R. Wayne Johnson, Auburn University

Break: 2:45 p.m. - 3:00 p.m.

Predicting the Reliability of High Density Packaging using Mechanical Modeling
Dave Alcoe, Endicott Interconnect

COTS Approach for Military Microprocessor MCMs
Tom Terlizzi, Aeroflex

Flip Chip Bonding Packaged Silicon-on-Sapphire VCSEL Optical Interconnects
J. Jiang Liu, Kimberly Olver, Wayne Chang, George Simonis, Army Research Laboratory

Reception/Dinner: 5:00 p.m. - 7:00 p.m.

Session II-B: Packaging Issues and Applications for High Reliability Military and Spaceborne Systems
7:15 p.m. - 9:00 p.m.
Chair: Greg Caswell, BridgePoint Technical Manufacturing

Issues in Long-Term Storage of Commercial Plastic Encapsulated Microcircuits
Craig D. Hillman, Patrick McCluskey, University of Maryland

Designing with 0201 Components for High Yield, High Reliability, and Harsh Environments
Daniel F. Baldwin, Paul N. Houston, Engent Incorporated

Reliable High Power 1610nm Free-Space Hermetically Sealed Fabry Perot Single-mode Laser
Stewart W. Wilson, A. W. Yu, J. Cho, F. Rogers, Quantum Photonics

Processing and Designing for Fine Pitch Chip Scale Packages
Brian J. Lewis, Daniel F. Baldwin, Engent Incorporated

Thursday, March 13
Registration: 8:00 a.m. - 6 p.m.
Continental Breakfast: 7:30 a.m. - 8:30 a.m.

Session III: System Level and Manufacturing Issues
8:30 a.m. - Noon
Chair: Cory Tourino, BridgePoint Technical Manufacturing

Techniques of Collective Interconnection and Assembly for the PACS Instrument
Patrick Agnese, J-L. Pornin, J-C. Cigna, A. Vandeneynde, N.Colombel, J.Martignac, Commissariat a l'Energie Atomique

The Implications of Lead-free Implementation on Military Electronics and Systems
Subramanian Rajagopal, Michael Pecht, Davinder Anand, University of Maryland

Designing a High Performance Package
Susheel Dharia, Andy Piloto, Derek Mrazek, Chris Gordon, Joe Tallo, Paul Garland, Rei Yamada, Kyocera

Break: 10:00 a.m. - 10:15 a.m.

Microelectronic Manufacturing Solutions - The Benefits and Considerations of Outsourcing
James Angeloni, Natel Engineering Co., Inc.

Streamlining Your Outsourcing Experience: What Your Contract Manufacturer Needs to Know
Cory Tourino, BridgePoint Technical Manufacturing

Achieving Higher Yields and Reliability with Automated Assembly of Military Hybrid Circuits and Microwave Modules
Dan Crowley, Peter Cronin, Michael Chalsen, MRSI, A Newport Corporation Company

Lunch: Noon - 1:00 p.m.

Session IV: Short Course
1:00 p.m. - 4:30 p.m.
Title: Critical Materials Factors in Modern Electronics

Synopsis:
In the ever increasing requirements for high performance, high reliability electronic systems and assemblies, materials are becoming more and more the critical limiting factor. This is especially true for electrically insulating elements, ranging from circuit boards to coatings to molded and formed plastic and ceramic structures. All of this makes it increasingly important for all of those involved in these assemblies and materials to better understand the fundamental properties of these critical insulating materials.

This presentation will be devoted to easy-to understand explanations of critical electrical and critical non-electrical properties of these materials, and the further criticality of difficult operating environments, such as temperature, humidity, and space on degradation of these properties. Further, the anatomy of circuit boards will be detailed, and the role of the various circuit board elements explained. Properties to be explained will include electrical resistivity, electrical losses, voltage surges, thermal expansion, thermal conductivity, and more. This presentation will be invaluable for all disciplines, as it covers subjects which are all too often misunderstood, if understood at all, but which can so easily lead to major electronic assembly and system problems-even catastrophies-if not properly understood.

Speaker Bio:
Charles A. Harper is President of Technology Seminars, Inc. an organization devoted to presentation of on-site educational training courses on electronic packaging and materials. He is also Series Editor for two major McGraw-Hill Book Series, namely, Electronic Packaging and Interconnection Series, and Materials Science and Engineering Series. Previously, he was Manager of Electronic Packaging and Materials Technologies for Westinghouse Electric Corporation. He is a Past President and Fellow of IMAPS.

Reception/Dinner: 5:00 p.m. - 7:00 p.m.

Friday, March 14
Registration: 8:00 a.m. - Noon
Continental Breakfast: 7:30 a.m. - 8:30 a.m.

Session V: Homeland Security
8:30 a.m. - Noon
Chair: Doug Kozlay, Biometrics Associates Inc.

Counterfeit Electronic Parts: A Security Threat
Sanjay Tiku, Michael Pecht, University of Maryland

Laser Assisted Advanced Packaging for Solder Ball Attach (Bumping), 3-D Packaging and Flip Chip Assembly
Thorsten Teutsch, Ronald G. Blankenhorn, Elke Zakel, Ghassem Azdasht, Lars Titerle, PacTech USA

Electronics Packaging & Homeland Security
Dan Donahoe, Daniel N. Donahoe, Omar M. Ramahi, Michael G. Pecht, University of Maryland

Break: 10:00 a.m. - 10:15 a.m.

Packaging a Subminiature Biometric System on Smartcard for Homeland Security Applications
Doug Kozlay, Biometrics Associates Inc.

Nanopackaging for Integrated Systems: Challenges and Opportunities
Ajay Malshe, University of Arkansas

Evaluation of Uprating Methods of Electronic Parts-A Crucial Concern for the Defense Industry
Diganta Das, Michael Pecht, University of Maryland

Concluding Remarks: General Chair


REGISTER ONLINE and $ave


Don't miss the Advanced 3D Packaging Innovations and Applications for MCM and System-in-Package ATW being held in conjunction with this workshop. Receive a special discount for attending both workshops!

 




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IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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