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2nd Advanced Technology Workshop on
Military, Aerospace, Space
and Homeland Security:
Packaging Issues and Applications

Renaissance Harbor Place Hotel
Baltimore, Maryland 21202
March 28 - 30, 2004

Sponsored by
International Microelectronics And Packaging Society (IMAPS)
“Everything in electronics between the chip and the system”

General Chair:
Greg Caswell, Silicon Hills Design Inc.
Office: 512-836-1088; Cell: 512-771-1215
Email: greg@siliconhills.com
Technical Chair:
James Cook, Holl Technologies Company - BlitzWave Division
Office: 805-389-3499
Email: jcook@holltechnologies.com



Sunday, March 28

Registration: 7 am – 5:15 pm

Continental Breakfast: 7:30 am – 8:45 am

Opening Remarks: 8:50 a.m.
General Chair: Greg Caswell, Silicon Hills Design, Inc.
Technical Chair: James Cook, Holl Technologies Company - BlitzWave Division

KEYNOTE PRESENTATION (Tentative)
9 am
Speaker: Dr. David Boyd
The Office of Science and Technology, Department of Homeland Security

Break: 10 am – 10: 30 am

Session I: Military, Space, Spaceborne and Homeland Security Marketing Issues
Chair: Paul Galletta, Teledyne
10:30 am – Noon

An EMS Perspective on the Military, Space, Spaceborne and Homeland Security Markets
Jeff Bain, Celestica Inc.

The NASA Electronic Parts and Packaging (NEPP) Program
C. Barnes, P. Zulueta, Jet Propulsion Laboratory; M. Sampson, K. LaBel, NASA Goddard Space Flight Center

Microelectronics DMSMS (Obsolescence) Risk Mitigation
Walter Tomczykowski, ARINC

Lunch: Noon – 1 pm

Session II: Materials Issues for Military and Spaceborne Electronics
Chair: James Cook, Holl Technologies Company - BlitzWave Division
1:15 pm – 5:15 pm

Development of a Process-Friendly Film for High Performance Thermal Management Applications
Andrew P. Collins, Chih-min Cheng, Emerson and Cuming

Lead-Free Solders: A Status Update for Hi-Rel Printed Wiring Assemblies
John K. Bonner, Linda Del Castillo, Atul Mehta, Jet Propulsion Laboratory

Conductive Adhesives as Solder Alternatives: Recent Advances and Applications
Vito Buffa, John Wood, Emerson & Cuming

Break: 2:45 pm – 3:15 pm

A Candidate DC-DC Converter for Hi-Rel
Joseph Castaldo, Aeroflex Circuit Technology

High Performance Cyanate Ester Based Underfill Technology for CSP Assembly in Military Applications
Jayesh Shah, Paul Morganelli, Dave Peard, Emerson & Cuming

Lead-Free Assembly: What’s So Different about Flip Chip?
Peter Borgesen, Universal Instruments Corporation

Decoupling High Speed Digital Electronics with Embedded Capacitance
Joel Peiffer, 3M Company

Reception/Dinner: 5:15 pm – 7:30 pm

KEYNOTE PRESENTATION
7 pm
Speaker: Colonel Danny McKnight
US ARMY (Retired)

Col. Danny McKnight recently retired after a distinguished and highly decorated career as a U. S. Army Ranger. His experience represents a lifetime of dedication to the defense of America.

Col. McKnight served as Chief of Staff for the First Army, based out of Fort Gilliam, Georgia. His efforts as the Commander of the 75th Ranger Regiment detachment assigned to Task Force Ranger in Mogadishu, Somalia were chronicled in the book Black Hawk Down and the movie by the same name.

In addition to his expertise in all matters military, highlights of his management career include:

• Providing direct financial management, guidance, and oversight of an annual operational budget of approximately $50 million.

• Developing a strategic planning concept (Training Support XXI) and a measurable results program to track its successful implementation (Campaign Plan 2000 - 2005) for the integration of active and reserve component soldiers as part of the Army’s training strategy for the year 2000 and beyond.

• Directing a staff of more than 300 to provide support for a field force of 10,000 people, who had to meet the training requirements for approximately 250,000 reserve component soldiers.

Col. McKnight also has extensive experience in the areas of communications, public affairs, and emergency management.

Col. McKnight’s awards and decorations include the Legion of Merit with Two Oak Leaf Clusters; Bronze Star for Valor; Purple Heart; Meritorious Service Medal with Five Oak Leaf Clusters; Army Commendation Medal with Oak Leaf Cluster; Army Achievement Medal; National Defense Service Medal with Bronze Star; Armed Forces Expeditionary Medal with Arrowhead and Bronze Star; Combat Infantryman’s Badge; Ranger Tab; Master Parachutist Badge with Bronze Star; and Pathfinder Badge.

He graduated from the U. S. Army War College, Air Command and Staff College, Infantry Officer Advanced Course, Ranger School, Airborne School, and Infantry Officer Basic Course. He also served as an Assistant Professor of Military Science at the University of Florida ROTC Department.

Col. McKnight earned his master’s degree in higher education and administration from the University of Florida in 1985 and his bachelor’s degree in management from Florida State University in 1973.

Monday, March 29

Registration: 7:30 am - 5 pm

Continental Breakfast: 7:30 am – 8:30 am

Session III: Packaging Issues and Applications for High Reliability Military and Spaceborne Systems
Chair: David Gerke, Jet Propulsion Laboratory
8:30 am - Noon

High Temperature SiC Packaging Technologies
R. Wayne Johnson, Michael Palmer, Cai Wang, Yi Liu, Auburn University

Increased usage of Integrated Passive Components in Low Temperature Co-Fired Ceramic (LTCC) for the Microelectronic Industry
Steve Annas, Kyocera America, Inc.

High Density, High Performance, Chip-On-Flex Modules
David J. Mountain, Douglas R. Ketchum, John Starr, D. Michael Flint, Microelectronics Research Laboratory

Break: 10 am – 10:30 am

High Performance, Lightweight, Hermetic AlSi Packages for Military, Aerospace, and Space Applications
Stuart Weinshanker, Advanced Packaging Associates; David Jacobson, Andrew Ogilvy, Osprey Metals; David Cutter, Pacific Aerospace and Electronics; Raymond J. De Lea Jr., Raytheon Systems Company

Heatsink Developments for Advanced Military Fighter and Helicopter Avionics Modules
Scott Newland, Harris - GCSD

Ceramic and Plastic Ball Grid Array Packaging for High Reliability Applications
Hernando E. Arauco, Northrop Grumman Space & Technology; Kinzy Jones, Florida International University

Lunch: Noon - 1 pm

Session IV-A: Reliability Issues
Session Chair: Greg Caswell, Silicon Hills Design
1:15 pm – 2:45 pm

Volume CT (Computed Tomography) Provides 3D Insights to High Reliability Package Defects
Chester Lowe, Lance Scott, FEINFOCUS

Processing and Reliability of High Performance Flip Chip on Flex Modules
Daniel F. Baldwin, Engent Incorporated

First and Second Level Interconnect Durability Testing of Large Flip Chip BGA Packages for Military Avionics Applications
Scott Newland, Harris - GCSD

Break: 2:45 pm – 3:15 pm

Session IV-B: Emerging Technologies
Session Chair: Greg Caswell, Silicon Hills Design
3:15 pm – 5:15 pm

Tin Whisker Growth on Plated Electronic Components in High Reliability Applications: Root Cause, Vulnerability Factors, and Mitigation Techniques
Don Bitting, American Competitiveness Institute

Micro-Composite Polymer-Ceramic Substrate Technology for High Band RF Packaging
James T. Cook, Holl Technologies Company - BlitzWave Division

Unique Solderless Interconnect Technology for High Performance Military, Aerospace and Space Packaging Applications
David Philippi, Arun Shah, Cinch Connectors, Inc.

Nanosecond Voltage Protection with Femtofarad Capacitance for ESD Protection of GaAs and SiGe Devices
Karen Shrier, Electronic Polymers; John Anderson, D2M; Jimmie Felps formerly of Agilent; Tuyen Truong, EPI

Reception/Dinner: 5:30 pm – 7:30 pm


Tuesday, March 30

Registration: 7:30 am - Noon

Continental Breakfast: 7:30 am – 8:30 am

Session V: Homeland Security
Session Chair: Chuck Busick, Ascentry Technologies
8:30 am - 11:30 am

Risks of Offshore Supply Chain for Strategic Electronic Parts
Dan Donahoe, Michael Pecht, University of Maryland

Homeland Security Communications: Put Software at the Center to Enhance Interoperability
Chuck Busick, Ascentry Technologies

Break: 9:30 am - 10:00 am

Smart Card Product & Manufacturing Challenges for Government ID Badges
Neville Pattinson, Axalto - A Schlumberger Company

Advanced Authentication Mythology Deployed in DHS
Barry Sheldon, Symbol

Wrap up – General Chair


Tour of Axalto Smart Card Manufacturing Facility
March 30, 2004
1:30 pm – 4:30 pm
9800 Reisterstown Road, Owings Mills, MD 21117

Tour will be 3 hours including bus trip.
Maximum 30 attendees on a first come - first served basis.
Register Early!

The Axalto smart card factory tour will be through a highly secure manufacturing facility. Axalto requires advanced notification of names/affiliations and citizenship – and each attendee will be required to sign a Non-Disclosure Agreement on arrival and present a Government Issued photo ID. We will split into 3 or 4 tour groups.

Axalto’s Advanced Smart Card Manufacturing Center does both mag stripe and smart cards for Banks, GSM operators and ID cards for many clients. It is the main supplier for Department of Defense Common Access Cards and is also working with Department of Homeland Security for its ID badges and those being considered for TSA’s Transportation Worker Identification Credential (TWIC).

Register On-line and Save




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IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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