IMAPS Home
Members Only
Login
About IMAPS
Events Calendar
Online Store
Membership
Chapters/Committees
Global Business Council
Industry News
Publications
Careers
IMAPS Microelectronics Foundation
Contact Us

Advanced Technology Workshop on
High Reliability Microelectronics for Military Applications

May 17-19, 2011
Holiday Inn Baltimore-BWI International Airport
(Soon to be the Doubletree BWI - March 2011)
890 Elkridge Landing Rd, Linthicum Heights, MD 21090

Early Registration and Hotel Deadlines: April 30, 2011

General Chair:
Greg Caswell
DfR Solutions
Office: 301-474-0607
gcaswell@dfrsolutions.com

Technical Team:
Bruce Romenesko-JHU-APL - Bruce.Romenesko@jhuapl.edu
Jeremy Palmer, Sandia National Laboratories - japalme@sandia.gov
Jeff Kennedy, Celestica, Inc. - kennedj@celestica.com
Carolynn Drudik, DMEA - carolynn.drudik@dmea.osd.mil



Tuesday, May 17

Registration: 7:00 am - 5:40 pm
Continental Breakfast: 7:15 am - 8:00 am

Opening Remarks: 8:00 am - 8:15 am
General Chair: Greg Caswell, DfR Solutions

Keynote Presentation: 8:15 am - 9:00 am
Department of Homeland Security Project Shield America Export Compliance

William F. Corcoran, Special Agent, Department of Homeland Security

Session 1: Reliability Issues
Session Chair: Jeff Kennedy, Celestica, Inc
9:00 am - 12:00 pm

CLCC Life Prediction under Complex Temperature Cycling Test 
Fei Chai, Michael Osterman, Michael Pecht, University of Maryland - CALCE

Thermal Cycling Reliability of Sn96.5Ag3.0Cu0.5 Solder Assembled with ENIG and OSP Pad Finishes
Preeti Chauhan, Michael Osterman, Michael Pecht, University of Maryland

Impact of Dwell Time on Solder Joint Reliability under Four Point Bend Testing 
Sandeep Menon, Michael Osterman, University of Maryland - CALCE

Break: 10:30 am - 11:00 am

Effectiveness of Conformal Coatings on Surface Mount Components as Tin Whisker Mitigation 
Curtis Johnson, Sungwon Han, Michael Osterman, University of Maryland - CALCE

3D X-Ray CT Analysis of Solder Joints in Area Array Electronic Package Assemblies 
Rajen Chanchani, Jeremy Palmer, Sandia National Laboratories

Lunch: 12:30 pm - 1:20 pm

Keynote Speaker: 1:25 pm - 2:10 pm
The Revolution in Military Affairs: IT and CYBER
Mark B. Pizzo, Colonel, USMC (Ret.)
Chief of Staff / Dean of Students
National War College

Colonel Mark B. Pizzo enlisted in March 1971, and was commissioned a second lieutenant in October, 1971.  He reported to 3rd Marine Division, Okinawa, Japan, and was assigned to the 9th Marines where he completed duties in Vietnam and Southeast Asia.  In 1974, he completed naval aerial observer training and then Amphibious Warfare School.

As a Major, from 1982 to 1984, he was assigned duties as the Commanding Officer, Marine Barracks, Sigonella, Sicily, and CO, 14th Interrogator Translator Team, Beirut, Lebanon.  Following these tours, he attended the Marine Corps Command and Staff College where he was a distinguished graduate.

Upon promotion to Lieutenant Colonel, he was ordered to Washington D.C., where he served at Headquarters Marine Corps, attended the National War College, and served in the Office of the Secretary of Defense for Drug Enforcement Policy and Strategy.

Promoted to the rank of Colonel in 1993, he was ordered to Okinawa, Japan where he served as the 3rd Marine Division G3 (Operations), and as Commanding Officer, 31st Marine Expeditionary Unit (Special Operations Capable).  In 1998, he was ordered to duties as the Senior Marine Fellow, National War College, where he completes a career of over 31 years of honorable service to the nation.

In 2002, he worked as a consultant for ANSER Homeland Security and The Department of Agriculture regarding Bio-terrorism. From 2002-2004 he conducted seminars and lectures about National Security Strategy, Military Operations, and Terrorism for community outreach programs.

In 2004 he assumed the civilian position (SES equivalent) as Chief of Staff and Dean of Students of the National War College, where he continues to work and teach today.

Session 2: System Level Issues
Session Chairs: Carolynn Drudik, DMEA
 2:10 pm - 5:40 pm

Conversion of a High Reliability Exempt Product to Lead Free: Lessons Learned - 4 Years Into RoHS 
Robert Farrell, Paul Bodmer, Jim Angell, Tony Cosentino, David Sparrow, Robert Gardiner, Greg Morose, Benchmark Electronics

Structural Electronics: A New 3D Additive Manufacturing Paradigm 
Ken Church, Mike Newton, Eric MacDonald, Ryan Wicker, nScrypt, Inc. 

Microelectronics Packaging of a Micro Gas Analyzer 
Jay Johnson, Dahwey Chu, Matt Moorman, R. J. Simonson, Greg Bogart, Sandia National Laboratories 

Break: 3:50 pm - 4:20 pm

Canary - Ion Spectroscopy for Ionospheric Sensing 
Howard Feldmesser, M. A. G. Darrin, R. Osiander, L. J. Paxton, A. Q. Rogers, J. A. Marks, The Johns Hopkins University Applied Physics Laboratory; M. G. McHarg, R. L. Balthazor, L. H. Krause, J. G. FitzGerald, United States Air Force Academy   

DNA to Safeguard Electrical Components & Protect Against Counterfeiting & Diversion
Janice Meraglia, Applied DNA Science

Considerations for System Level Integration of High-Reliability Microelectronics
Maxine Pennington, Honeywell Federal Manufacturing and Technology

Wednesday, May 18

Registration: 7:00 am - 3:30 pm
Continental Breakfast: 7:15 am - 8:00 am

Session 3: Application Issues
Session Chair: Jeremy Palmer, Sandia National Laboratories
8:00 am - 11:30 am

Using Manifold Microchannel Coolers to Reduce the Power Electronics Thermal Stack
Lauren Boteler, Nicholas Jankowski, Brian Morgan, Army Research Laboratory; Patrick McCluskey, University of Maryland - CALCE

Prognostics of Lithium-Ion Batteries using Extended Kalman Filtering
Wei He, Nicholas Williard, Michael Osterman, Michael Pecht, University of Maryland - CALCE

Quantitatively Predicting the Reliability of Complex Integrated Circuits
Ed Wyrwas, DfR Solutions, LLC

Break: 9:30 am - 10:00 am

Superhydrophobic Coatings on Microelectronics
Andrew Jones, Vinod Sikka, Ross Nanotechnologies, LLC

Why Wedge Bond?
Lee Levine, Process Solutions Consulting, Inc.; Joe Bubel, Hesse & Knipps Inc.

Reliability Strategies for Lithium-Ion Batteries in Portable Electronic Systems
Nicholas Williard, Wei He, Michael Osterman, University of Maryland - CALCE

Lunch: 11:30 am - 12:30 pm

Session 4: Package Related Reliability Issues
Session Chair: Greg Caswell, DfR Solutions, LLC; Pamela Ball, DoD
12:30 pm - 3:30 pm

Evaluation of Process Indicators in High-Reliability Microelectronic Package Failure Analysis 
Jeremy Palmer, Michael K. Neilsen, Paul T. Vianco, Sandia National Laboratories

Identification of Cracked MLCCs on Printed Circuit Board Assemblies using Time Domain Reflectometry 
Thomas Fritzler, Michael H. Azarian, Michael Pecht, University of Maryland 

High Performance and Reliability Microelectronics Packaging
Kevin G. Ewsuk, Lu Fang, Dahwey Chu, Nathan Young, Sandia National Laboratories 

Break: 2:00 pm - 2:30 pm

Likelihood of Metal Vapor Arc by Tin Whiskers
Sungwon Han, Michael Osterman, University of Maryland - CALCE

This Is Not a Test
Walt Tomczykowski, Cheryl Tulkoff, DfR Solutions, LLC

Thursday, May 19

Registration: 7:00 am - 11:00 am
Continental Breakfast: 7:30 am - 8:00 am

Session 5: Short Course - An Expert Reliability Analysis Tool
Session Chair: Dr. Nathan Blattau, Chief Technologist DfR Solutions, LLC
8:00 am - 11:00 am

This course will introduce a first‐of‐its‐kind Electronics Design Reliability (EDR) solution that will transform the process of analyzing, grading, and certifying the expected reliability of electronics products at the circuit board level.  Three outputs that become critical to the design process will be presented:

  • A reliability score – which calculates the likelihood that a product will perform reliably in the marketplace. The higher the score, the better the reliability.
  • Predicted performance over time – which product teams can use to help to project the profitability of a product over its lifecycle.
  • A physical map of reliability issues – which identifies to the user the likely points of failure (red flags) for rapid comprehension.

For the first time the principles of Physics‐of‐failure (PoF)‐based analysis - a new, more accurate method for predicting product reliability - including the following will be demonstrated, addressing:

  • Thermal measurement
  • PTH fatigue
  • Solder fatigue
  • CAF Analysis
  • Mechanical response to vibration, shock, and bending
  • IC Wearout
  • Electrolytic Capacitor Wearout
  • Component stress analysis
Dr. Nathan Blattau, Vice President of DfR Solutions, LLC has been involved in the packaging and reliability of electronic equipment for over eight years. Dr. Blattau is also experienced in failure analysis and accelerated testing methods. His primary research interests are in the areas of development of Physics of Failure models and algorithms, design-for-reliability in electronic packaging, nonlinear finite element analysis, solder joint reliability, fracture, and fatigue mechanics of materials. Through extensive testing, analysis, and simulation, Dr. Blattau has developed a thorough understanding of the defects and degradation mechanisms that can induce failure in Pb-free product.  Due to his efforts, Dr. Blattau was recently selected to lead a comprehensive reliability study on SN100C, a Pb-free alternative that is being considered as a replacement for SAC due to superior manufacturability. Dr. Blattau has written numerous articles and holds two patents pending in software-based simulation and accelerated life testing. He holds a B.S. in Civil Engineering, M.S. in Mechanical Engineering, and PhD in Mechanical Engineering, all from the University of Maryland.

Closing Remarks: 11:00 am

MET Laboratories Tour (Free to all Workshop Attendees)
Pre-Registration Required - See Registration Page.

Attendees have a special opportunity to extend their workshop with a free tour of a local testing laboratory. 

MET Laboratories does extensive MIL-STD testing, including Environmental Simulation (810, 202, 167 & RTCA/DO-160) and EMC Testing (461 & 462).

MET also does extensive testing and certification for Product Safety, Energy Star, Wireless, and Telecom/NEBS. In addition to its Baltimore lab, MET also has labs and operations in California, Texas, North Carolina, China, Korea, and Taiwan.

MET is just 7 miles away, and has offered to provide a free lunch and complimentary transportation to and from the hotel.  MET will be showing off a new EMC chamber that was just built in March 2011.

Here is the agenda:
11:45 Leave for MET
12:00 Lunch at MET
1:00 Introduction to MET & Lab Tour
2:30 Leave for hotel
2:45 Arrive at hotel

 

Register On-Line


Housing:

Hotel Deadline: April 30, 2011

Holiday Inn Baltimore-BWI International Airport
(Soon to be the Doubletree BWI - March 2011)
890 Elkridge Landing Rd, Linthicum Heights, MD 21090

For reservations, call 1-800-465-4329 or direct to the hotel 410-859-8400 and mention group rate for “IMA
Group Rate: $100/night plus tax

Complimentary Internet in guest rooms.
All parking is complimentary to all paid guests.


Speaker Dates/Information:

  • Abstract Deadline: March 11, 2011
  • Speaker Notification/Confirmation emailed: March 18, 2011
  • Extended Abstract or Presentation Material due: April 25, 2011
  • Early Registration and Hotel Deadlines: April 30, 2011
  • Powerpoint/Presentation file for CD-Rom due not later than: May 19, 2011
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A); 40-45 minutes for Keynote Presenters

 


© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001