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MMRC Fall Meeting

Optoelectronics Packaging:  Issues, Enabling Technology,
and Government Policy Considerations


October 5-7, 2001
Westin Fairfax Hotel
Washington, D.C.  
202-293-2100

Friday, October 5 

4:30 - 6:00

Registration

5:00 - 5:30

Welcome - Jan Vardaman

6:00 - 9:00

Reception & Dinner at the Cosmos Club

 

 


Saturday, October 6
 

8:00 - 9:00

Continental Breakfast

 

 

9:00 - 9:15

Introduction and Greetings

 

Jan Vardaman, President, TechSearch International, Inc.

 

 

9:15 - 10:00

Optoelectronics Market Update

 

Lawrence Gasman, President, Communications Industry Researchers, Inc.

 

 

10:00 - 10:15

Morning Break

 

 

GOVERNMENT FUNDING AND POLICY CONSIDERATIONS

 

 

10:15 - 11:00

Introductions, Roland Tibbetts, NSF (Retired)

 

 

 

Small Business Initiative Research (SBIR) Program Success Story:  Epitaxx and Sensors Unlimited, Inc.

 

Dr. Greg Olsen, CEO, Sensors Unlimited, Inc.

 

 

11:00 - 11:30

National Institute of Standards and Technology (NIST) Activities in Optoelectronics Standards and Measurement,

 

Dr. Gordon Day

 

 

12:00 - 1:00

Lunch

 

 

INTERNATIONAL OPTOELECTRONICS PACKAGING ROADMAPS AND TRENDS

 

 

1:00 - 1:30

Japanese Optoelectronics Packaging Roadmaps,

 

Doug Feicht, TechSearch International, Inc.

 

 

1:30 – 2:00

North American Optoelectronics Packaging Roadmap (NEMI's 2000 Optoelectronics Roadmap),

 

John Stafford, JWS Consulting P.L.C. and NEMI Optoelectronics Technology Working Group, Chair

 

 

 

 

2:00 - 2:30

Optoelectronics Automation Issues and Solutions

 

Paul Magill, Vice President of Photonics Packaging, JDS Uniphase

 

 

2:30 - 3:00

Break

 

 

3:00 - 3:30

Trends and Challenges for Printed Circuit Boards,

 

Craig Allen, Director of Emerging Technology, Shipley

 

 

3:30 - 4:00

Ceramic Interconnect Technology for Photonic Packaging

 

Dr. Samuel J. Horowitz, Marketing Manager, Dupont iTechnologies and Chair of the Ceramic Interconnect Initiative Steering Committee

 

 

4:00 - 4:30

Trends for Flex Circuits

 

Eric Dibble, Director of Engineering, International Flex Technologies

 

 

4:30 - 5:00

Discussion

 

 

6:00

Dinner

 

 


Sunday, October 7
 

8:00 - 9:00

Continental Breakfast

 

 

OPTOELECTRONICS MARKETS AND MANUFACTURING:  WALL STREET VIEW

 

 

9:00-9:30

Optoelectronics Manufacturing Infrastructure Development in China

 

Tim Urekew, Senior Analyst, TechSearch International, Inc.

 

 

9:30 – 10:15

Financial Perspective on Optoelectronics Manufacturing,

 

Francis Tucci, Director, U.B.S. Warburg, L.L.C.

 

 

10:15 - 11:00

Component Assembly Equipment Industry Outlook

 

Ed White Jr., Lehman Brothers

 

 

11:00 - 11:45

The Pick and Shovel of the Photonics Gold Rush

 

Eric Chen, Senior Analyst and Donald Lu, Associate Analyst, J.P. Morgan Securities

 

 

11:45 - 12:00

Closing Remarks and Adjourn

 

Going to IMAPS 2001?
Hop on the bus at 12:30 p.m. for Baltimore
Its FREE and will take you to your hotel.
Be sure to request a set on the bus when you register!


Registration Prices
IMAPS Member Company - $650, After September 4 - $750

2nd Attendee from Same Company - $550, After September 4 - $650

Non-Member Company* - $1150, After September 4 - $1250
*Includes one year Organizational Membership in IMAPS.


For more information, please call Ann Bell at 202-548-8717 or e-mail her at abell@imaps.org.
 

Register Online and $ave $50 - http://www.imaps.org/registration/IMAPS2001.htm

 



© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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