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IMAPS Microelectronics Marketing Research Council (MMRC) 


Winter Conference on

Military and Aerospace Electronics

December 8-10, 2002

U.S. Grant Hotel
326 Broadway Avenue
San Diego, CA 92101
619-232-3121

Hotel Cut-off is November 25, 2002
Single/Double Rate: $169.00 
Be sure to reference IMAPS when making your reservation.
IMAPS will not guarantee rooms or room rates after the above date.

On-line Registration

This meeting, sponsored by the MMRC, will include forecasting of markets in this area and the expectations of the military and aerospace industries for such applications as airborne radar systems, T/R modules, and SATCOM electronics. Supporting these topics will be presentations on electronic components, materials and packaging. The meeting will end with a discussion on the future prognosis of the Military and Aerospace Electronics Components Market.


General Chair:

Richard Sigliano
VP and GM, Sales and Marketing
Kyocera America, Inc.
Email: rick.sigliano@kyocera.com  

Co-chair:

Don Brown
Director
Inter. Wireless Packaging Consortium
(IWPC)
Email: donbrown@iwpc.org

Co-Chair:

Ray Petit
President and CEO
Pacific Rim Technology Associates, Inc.
Email: ray@pacificrimtech.com 


Program

Sunday, December 8
6:00 pm  -- Opening Reception

Monday, December 9 
8:00 am  --  Continental Breakfast 

8:45 am  --  Opening Remarks
Rick Sigliano, IMAPS Organizational Director
Peter Barnwell, IMAPS President
 
9:00 am - 12:00 pm
Session I: Market Overview of Military & Aerospace Applications 

Session Chair: Jeffrey Demmin, Tessera Technologies, Inc.

Active Array Technology, Not Just For The Military Anymore
Andy Pilato, Kyocera America, Inc.

Cryptographic History
Bud Mittenthal and Paul Galletta, Teledyne Microelectronics

Military & Aerospace Electronics Markets Overview
Jim Lawson, C-MAC MicroTechnology (a Solectron company)

Market Drivers for Lead & Bromine Free Conversions
Vivek Gupta and Jack McCullen, Intel Corp.

12:00 pm - 1:00 pm  --  Lunch 

2:00 pm - 5:00 pm
Session II: Outsourcing Trends for Military & Aerospace Suppliers
 
Session Chairs: Howard Imhof, Midas Vision Systems, Inc. - Vern Stygar, FEMS 

Microelectronic Manufacturing Solutions
Jim Angeloni, Natel Engineering Company

GaAs Foundry Services for the Defense Industry
Richard Koba, M/A-COM

High Frequency Materials Requirements for Military & Aerospace
Vern Stygar, FEMS

Surface Mountable High Frequency Chip Packaging Technology
River Huang, Scott Stole, and Simon Hawksworth, HEI Inc.

A K-Band Dielectric Resonator Oscillator
Yongnan Xuan, Flextronics International

ITAR Registration - What it Really Take to Get Qualified
Robert Whisler, Kyocera America, Inc.

5:00 pm – MMRC Steering Committee Meeting

6:00 pm  -- Reception and Dinner

Tuesday, December 10 
8:00 am  --  Continental Breakfast 

9:00 am - 12:00 pm
Session III: Packaging and Materials Requirements for Military & Aerospace 
Session Chair: Steve Bezuk, Kyocera America Inc.

Multi-Channel Data Converters with Digital Post-Processing for Higher Performance
Chris Chipman, Analog Devices 

Achieving MIL-Aero Reliability in BGA Technology
Jack Bogdanski, White Electronic Designs Corporation

Precision Die Attach for High Reliability Applications
Walter Gisler, ESEC USA

Hermetic High Performance Microwave Packages for Military Applications
Alan Lindner, Stratedge Corporation

Flip Chip Connections using Gold Stud Bumps
Jerry Jordan, Palomar Technologies, Inc.

Program is subject to change.

On-line Registration



Click the logo below to learn about Pennwell's Military and Aerospace Event

December 10-11, 2002
San Diego Concourse, San Diego, California

 



© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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