IMAPS Microelectronics Marketing Research
Council (MMRC)
Winter Conference on
Military and Aerospace Electronics
December 8-10, 2002
U.S. Grant Hotel
326 Broadway Avenue
San Diego, CA 92101
619-232-3121
Hotel Cut-off is November 25,
2002
Single/Double Rate: $169.00
Be sure to reference IMAPS when making your
reservation.
IMAPS will not guarantee rooms or room rates after the above
date.
On-line
Registration
This meeting, sponsored by the MMRC, will include forecasting
of markets in this area and the expectations of the military
and aerospace industries for such applications as airborne
radar systems, T/R modules, and SATCOM electronics. Supporting
these topics will be presentations on electronic components,
materials and packaging. The meeting will end with a discussion
on the future prognosis of the Military and Aerospace Electronics
Components Market.
General
Chair:
Richard Sigliano
VP and GM, Sales and Marketing
Kyocera America, Inc.
Email: rick.sigliano@kyocera.com |
Co-chair:
Don Brown
Director
Inter. Wireless Packaging Consortium
(IWPC)
Email: donbrown@iwpc.org
|
Co-Chair:
Ray Petit
President and CEO
Pacific Rim Technology Associates, Inc.
Email: ray@pacificrimtech.com
|
Program
Sunday, December 8
6:00 pm -- Opening Reception
Monday, December 9
8:00 am -- Continental Breakfast
8:45 am -- Opening Remarks
Rick Sigliano, IMAPS Organizational Director
Peter Barnwell, IMAPS President
9:00 am - 12:00 pm
Session I: Market Overview of Military & Aerospace Applications
Session Chair: Jeffrey Demmin, Tessera Technologies,
Inc.
Active Array Technology, Not Just For The Military Anymore
Andy Pilato, Kyocera America, Inc.
Cryptographic History
Bud Mittenthal and Paul Galletta, Teledyne Microelectronics
Military & Aerospace Electronics Markets Overview
Jim Lawson, C-MAC MicroTechnology (a Solectron company)
Market Drivers for Lead & Bromine Free Conversions
Vivek Gupta and Jack McCullen, Intel Corp.
12:00 pm - 1:00 pm -- Lunch
2:00 pm - 5:00 pm
Session II: Outsourcing Trends for Military & Aerospace
Suppliers
Session Chairs: Howard Imhof, Midas Vision Systems, Inc. -
Vern Stygar, FEMS
Microelectronic Manufacturing Solutions
Jim Angeloni, Natel Engineering Company
GaAs Foundry Services for the Defense Industry
Richard Koba, M/A-COM
High Frequency Materials Requirements for Military &
Aerospace
Vern Stygar, FEMS
Surface Mountable High Frequency Chip Packaging Technology
River Huang, Scott Stole, and Simon Hawksworth, HEI Inc.
A K-Band Dielectric Resonator Oscillator
Yongnan Xuan, Flextronics International
ITAR Registration - What it Really Take to Get Qualified
Robert Whisler, Kyocera America, Inc.
5:00 pm MMRC Steering Committee Meeting
6:00 pm -- Reception and Dinner
Tuesday, December 10
8:00 am -- Continental Breakfast
9:00 am - 12:00 pm
Session III: Packaging and Materials Requirements for
Military & Aerospace
Session Chair: Steve Bezuk, Kyocera America Inc.
Multi-Channel Data Converters with Digital Post-Processing
for Higher Performance
Chris Chipman, Analog Devices
Achieving MIL-Aero Reliability in BGA Technology
Jack Bogdanski, White Electronic Designs Corporation
Precision Die Attach for High Reliability Applications
Walter Gisler, ESEC USA
Hermetic High Performance Microwave Packages for Military
Applications
Alan Lindner, Stratedge Corporation
Flip Chip Connections using Gold Stud Bumps
Jerry Jordan, Palomar Technologies, Inc.
Program is subject to change.
On-line
Registration
Click the logo below to learn about
Pennwell's Military and Aerospace Event

December 10-11, 2002
San Diego Concourse, San Diego, California
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