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Advanced Technology Workshop and Tabletop Exhibits on
Packaging the Next Generation of Nano Devices

June 14-15, 2012
College of Nanoscale Science and Engineering (CNSE)
NanoFab South Rotunda and Auditorium
257 Fuller Road
Albany, New York 12203 USA

General Chair:
Benson Chan
Endicott Interconnect

Technical Chair:
Bruce Chamberlin
IBM Corporation
Technical Chair:
Ray Fillion
Fillion Consulting

In collaboration with:

CNSE - University of Albany

Binghamton University

Workshop Focus:
The International Microelectronics And Packaging Society (IMAPS) is organizing an Advanced Technology Workshop and Tabletop Exhibition on “Packaging the Next Generation of Nano Devices” to be held June 14th and June 15th, in Albany, New York.

Overview: With each new generation of high density devices, the packaging community faces ever more difficult challenges. Diverse technologies such as: 3D, 2.5D, silicon carrier, MEMs, Hybrid electro-opto packages, etc require different packaging technologies, different materials, different processing, testing etc. All these variables are the focus of this conference which will be held in the heart of New York State's premier silicon device fabrication center. We hope that you will come and join us to see the progress of the industry and see where it is headed.

Thursday, June 14, 2012

Registration Open
12:00 pm – 7:00 pm

Tabletop Exhibits
3:00 pm - 7:00 pm

Opening Remarks - Benson Chan, General Chair
1:00 pm – 1:15 pm

1:15 pm - 3:15 pm

Fabrication and Electrical Characterization of Amorphous Black Silicon on Metal Electrodes
George A. Hernandez, Auburn University (Pingye Xu, Michael C. Hamilton)

Gold replacement - Nanofilm for oxidation barrier
Wusheng Yin, YINCAE Advanced Materials, LLC (Mary Liu)

Additive Manufacturing of Fine Lines and Embedded Electronics for use in Chip Carriers and Microelectronic Systems
Scott Lauer, AdvantechUS, Inc  (Pierluigi Benci, Compunteics; John Mazurowski, Penn State Electro-Optics Center; Whit Little, AdvantechUS)

Flux Free Die Attach Utilizing Pressure Variation to Achieve Void Free Results
Bruce Wilson, SST International (Paul Barnes)

Break: 3:15 pm - 3:45 pm

3:45 pm - 5:45 pm

Glass Wafers as Support Carriers for 3D-IC Wafer Thinning Processes
Joe Canale, Corning, Incorporated, (Aric Shorey, Windsor Thomas)

Use of Parylene as a 3D TSV Strain Relief Jacket
John F. McDonald, RPI/ECSE/CIE (James Lu, Jay Senkovich, Ryan Clarke)

Thin wafer processing - yield enhancement through integrated metrology
Daniel Burgstaller, EV Group, Inc. (Garrett Oakes, Thorsten Matthias, Jürgen Burggraf, Paul Kettner)

Piezoelectric sensor array for pressure uniformity measurements
Graham Potter, College of Nanoscale Science and Engineering (SUNY Albany) (Alison Gracias, Natalya Tokranova and James Castracane)

Reception in Exhibit Area
5:45 pm - 7:00 pm

Friday, June 15, 2012

Registration Open
7:00 am - 4:00 pm

Tabletop Exhibits
10:00 am - 2:00 pm

8:00 am - 9:00 am

CNSE Derivatives Center Applications and Strategy

Dr. Douglas Coolbaugh, Assistant VP of CMOS Derivatives Development, CNSE
Dr. Douglas Coolbaugh is assistant Vice President of CMOS derivatives development at CNSE. Derivative technologies consisting of Silicon Photonics, 3D integration, RF CMOS and magnetic memory are the focus of his group’s efforts at this time. Before CNSE, Dr. Coolbaugh spent 30 years at IBM Corporation. For the initial half of his career he worked on materials / process development of first and second level packaging. For the remaining 15 years, he worked on RF and derivative technologies at IBM Burlington, Vt and Fishkill, NY. In this capacity, Doug drove the development of passives elements across many nodes, RFCMOS development from the 180 to 32 nm nodes, and bulk logic in the 65 nm node. Dr. Coolbaugh is an avid inventor and was elected Master inventor in 2006 and 2009 and IBM Fishkill, NY.

9:00 am - 12:30 pm

Technology and Market Drivers for 3D ICs
Charles Woychik, Invensas 

Package-Interposer-Package (PIP): A Breakthrough Package-on-Package (PoP) Technology for High End Electronics
Rabindra N. Das, Endicott Interconnect Technologies, Inc. (Frank D. Egitto, Barry Bonitz, Mark. D. Poliks, and Voya R. Markovich)  

Break :10:00 am - 10:30 am

What's real in 3D ICs and TSVs in today's and tomorrow's microelectronics.
Ray Fillion, Fillion Consulting  

Development of Through Glass Via (TGV) Substrates for 3D-IC Integration
Aric Shorey, Corning, Incorporated, (Garrett Piech, Scott Pollard, Windsor Thomas)

Optical, non-contact TSV evaluation
Alexander Knüttel, ISIS sentronics GmbH (Stefan Dickopf, ISIS sentronics GmbH; Wolfram Steller, Juergen Wolf, Fraunhofer Institut IZM/ ASSID)  

Standards for 3D Stacked Integrated Circuits
Richard A. Allen, SEMATECH

Lunch in Exhibit
12:30 pm - 1:30 pm

1:30 pm - 4:00 pm

Package Innovations for Meeting Challenging Requirements
How T. Lin, Endicott Interconnect Technologies, Inc. (Subahu Desai)

Why Wedge Bond- Nano Devices and Materials?
Lee Levine, Hesse & Knipps, Inc. (Joe Bubel)

Inclusion of unique DNA markers in semiconductor packaging to authenticate originality and exclude
counterfeits from the supply chain

Alex Tran, Applied DNA Sciences (Ben Liang, Lawrence Jung, Janice Meraglia)

NAMICS Materials for Thin & Advanced Packaging Technology
Tony Ruscigno, NAMICS Technologies, Inc.  (Brian Schmaltz, Abe Yukinari)

RF performance of In-coated CNT flexible interconnects
Pingye Xu, Auburn University (Michael C. Hamilton)

Closing Remarks - Ray Fillion & Bruce Chamberlin, Technical Chairs
4:00 pm


Student Competition sponsored by The Microelectronics Foundation:

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student author with a $1,000 check. The selected student must attend the event to present his or her work and receive the award.
The Microelectronics Foundation

Speaker Dates/Information:

  • Abstracts Due: May 22, 2012
  • Speaker Email Notification: May 29, 2012
  • Early Registration Deadline: June 6, 2012
  • Speaker 2-3 sentence biography due not later than: June 12, 2012
  • Powerpoint/Presentation file for CD-Rom due not later than: June 15, 2012
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop/usb or email to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Registration Information: (Early Registration Deadline: June 6, 2012)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, exhibits, meals, refreshment breaks, and one (1) CD-ROM of presentations; cd will contain the extended abstract and presentation as submitted by the presenter. CD will be mailed 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Early Fee
Through 6/6/12
Advance/Onsite Fee
After 6/6/12
IMAPS Member
Chapter Officer
Tabletop Exhibit (Member)
Tabletop Exhibit (Non-Member)
Premier Sponsorship (Includes Tabletop - Limit 4)

Hotel Reservations:

There is no contracted "Host Hotel" for this Workshop.
Here are some hotel options in the area that you can book rooms directly with:

Desmond Hotel & Conference Center - Hotel Website
660 Albany Shaker Road
Albany, NY

1228 Western Avenue
Albany, NY

Fairfield Inn Albany SUNY - Hotel Website
1383 Washington Avenue
Albany, NY

Hilton Garden Inn Albany Medical Center - Hotel Website
62 New Scotland Avenue Suite 1
Albany, NY

Travelodge Inn And Suites Albany - Hotel Website
42 Wolf Road
Albany, NY



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IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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