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Advanced Technology Workshop and Tabletop Exhibits on
Packaging the Next Generation of Nano Devices

April 30-May 1, 2013
College of Nanoscale Science and Engineering (CNSE)
NanoFab South Rotunda and Auditorium
257 Fuller Road
Albany, New York 12203 USA

Early Registration/Exhibit Deadline: April 20, 2013

General Chair:
Ray Fillion
Fillion Consulting
fillion.consulting@gmail.com

Technical Chair:
John Torok
IBM Corporation
jtorok@us.ibm.com
Technical Chair:
Jing Zhang
IBM Corporation
jingzhan@us.ibm.com

In collaboration with:

CNSE - University of Albany

Binghamton University


Workshop Focus:
The International Microelectronics Assembly and Packaging Society (IMAPS) is organizing an Advanced Technology Workshop and Tabletop Exhibition on “Packaging the Next Generation of Nano Devices” to be held April 30 and May 1 in Albany, New York.

Overview: With each new generation of high density devices, the packaging community faces ever more difficult challenges. Diverse technologies such as: 3D, 2.5D, silicon carrier, MEMs, Hybrid electro-opto packages, etc require different packaging technologies, different materials, different processing, testing etc. All these variables are the focus of this conference which will be held in the heart of New York State's premier silicon device fabrication center. We hope that you will come and join us to see the progress of the industry and see where it is headed.


Tuesday, April 30, 2013

CNSE Site/Lab Tours: 10:00 am– 12:00 pm
Registration: 12:00 pm – 7:00 pm
Tabletop Exhibition: 3:00 pm - 7:00 pm

Opening Remarks: 12:30 pm – 12:45 pm
Ray Fillion, General Chair

Keynote Presentation: 12:45 pm – 1:30 pm
College of Nanoscience and Engineering Overview and Derivative Center

With over $14 billion in high-tech investments, the College of Nanoscale Science and Engineering (CNSE) represents the world’s most advanced university-driven research enterprise, with over 300 corporate partners. CNSE’s Albany Nanotech Complex contains 135,000 square feet of Class 1 capable cleanrooms, including a fully-integrated, 300mm wafer, computer chip pilot prototyping and demonstration line, as well as a new expansion that houses the world’s first Global 450mm Wafer Consortium (G450C).

CNSE’s Derivative Center offers a fully integrated 65nm low power CMOS with plans for 28nm LP BEOL process flows, derivative development in areas that include silicon photonics, memory, and 3D integration. These technologies are fully installed and are available for fully integrated customer prototypes.

In this talk, an overview of CNSE and these leading edge technologies will be discussed.

Dr. Douglas Coolbaugh, Derivatives and 3Di Manager
College of Nanoscale Science and Engineering at Albany-State University of New York NanoFab
Douglas Coolbaugh
received his PhD in Physical Chemistry from SUNY Binghamton, NY in 1987. Doug retired from IBM in 2010 after working 30 years in microelectronics development. Presently he is the Assistant VP of derivatives at the College of Nanoscale Science and Engineering.


SESSION I: Advanced Processing & Reliability
Chair: Benson Chan, Endicott Interconnect
1:30 pm - 5:30 pm

Waferbumping Fluxes Enabling 2.5D and 3D Technology
Andy Mackie, Indium Corporation (Maria Durham, Indium Corporation; Laura Mauer, SSEC)

Wedge Bonding New Wire Alloys for Nano Applications
Lee Levine, Hesse Mechatronics Inc. (Joseph Bubel) 

Solder Joint Encapsulant Adhesive - POP TMV High Reliability And Low Cost Assembly Solution 
Wusheng Yin, YINCAE Advanced Materials, LLC (Mary Liu) 

Inspection and Metrology for 2.5/3D Interconnect Solution
Victor Vartanian, SEMATECH, 3D Interconnect Division

Break in Exhibit Hall:3:30 pm - 4:00 pm

Chemically Vapor Deposited Polymer Coatings for the Environmental Protection of Micro- and Nano-Electronics
Seth Johnson, GVD Corporation 

Understanding Temperature Programmable Behavior of SWCNT-Epoxy Undefill for Component Level Reworkability 
Vishwas Bedekar, University of Arkansas (Ajay Malshe, University of Arkansas; Deepnarayan Gupta, Hypres Inc)

Reliability of Lead-Free BiAgX Solder Paste for Die Attach application 
Hongwen Zhang, Indium Corporation (Runsheng Mao, Ning-Cheng Lee)

Reception in Exhibit Hall: 5:30 pm - 7:00 pm


Wednesday, May 1, 2013

Registration Open : 7:00 am - 4:00 pm
Tabletop Exhibits : 10:00 am - 3:30 pm

Opening Remarks:  8:00 am – 8:15 am
John Torok and Jing Zhang, Technical Co-Chairs

Keynote Presentation: 8:15 am – 9:00 am
Advancing Technology in Expert Integrated Systems

In the era of smart computing, big data and deep analytics place a strong demand on our IT infrastructure and are significant drivers for hardware development to meet those needs. The computing systems on which these applications can efficiently operate are integrated systems where computing, storage, networking and software components work well together. High compute density, high bandwidth and low-latency are key metrics to define the raw processing capability of these systems that provide a foundation for the targeted applications. These key metrics must be met under stringent power and cost constraints. New technology elements including nanotechnology provide many opportunities. Some examples are 3D stacked silicon and packaging provides computing density, integrating new magnetic material enables advanced voltage regulation integrated into devices, materials with advanced propagation characteristics overcome signal loss limitations, and advances in thermal interface materials allow the increased performance to be realized while the cost, power and reliability constraints are still met.

Dr. W. Dale Becker, Distinguished Engineer
IBM Corporation
Dale Becker
received the B.E.E degree from the University of Minnesota, M.S.E.E. from Syracuse University and the Ph.D. from the University of Illinois at Urbana Champaign. He is a Distinguished Engineer in IBM Systems and Technology Group and a member of the IBM Academy of Technology. He is the System Electrical Architect for the IBM POWER and System Z Enterprise Systems. His responsibilities include designing the high-speed channels to enable the computer system performance and the power distribution networks for reliable operation of the integrated circuits that make up the processor subsystem. Dr. Becker has 25 patents on electrical design of computer systems and has presented 75 papers in refereed journals and international conferences covering many aspects of electrical computer system design including power distribution analysis and design and modeling of signal and power distribution networks. He is a senior member of IEEE, a iNEMI Technical Committee member and a member of IMAPS.


SESSION II: 3D Processing
Chair: Ray Fillion, Fillion Consulting
9:00 AM – 10:30 AM

Packaging Materials for 2.5/3D Technology 
Tony Ruscigno, NamicsTechnologies, Inc. (Brian Schmaltz). 

A Novel Underfill for 3D TSV Package
Wusheng Yin, YINCAE Advanced Materials, LLC 

Characterization of AL-X Carbon Resistors 
George Hernandez, Auburn University (Stephen Patenaude, Daniel Martinez, Maria Auad, Michael Hamilton) 

Break in Exhibit Hall:10:30 am - 11:00 am

SESSION III: 3D Interconnects
Chair: Ying Yu, IBM Corporation
11:00 am - 12:30 pm

3D Integration with High Performance Coaxial Through Silicon Via (TSV) 
Stephen Adamshick, College of Nanoscale Science and Engineering, University at Albany, SUNY (Douglas Coolbaugh, Michael Liehr)

Development of Glass and Silicon 3D-IC Interposers: A Comparison in Performance and Reliability 
Aric Shorey, Corning Incorporated 

Standard Measurement Methods for Enabling 3D Stacked Integrated Circuits
Richard Allen, SEMATECH (Victor Vartanian, Iqbal Ali, SEMATECH; David Read, NIST/SEMATECH)

Lunch in Exhibit Hall: 12:30 pm - 1:30 pm

SESSION IV: 3D Advanced Packaging & Materials
Chairs: John Torok, Jing Zhang, IBM Corporation
1:30 pm - 4:00 pm

Infusion of Next Generation of Nano Devices into Military/Space Standards
Shri Agarwal, NASA Jet Propulsion Laboratory - Will be presented by Committee

Signal Integrity Comparison between Copper and CNT-based TSVs 
Bruce Kim, City University of New York (Sukeshwar Kannan, Anurag Gupta, Kaushal Kannan)

Break in Exhibit Hall: 2:30 pm – 3:00 pm

Ink-jet Printed Cu/Ag Memristor 
Simin Zou, Auburn University (Pingye Xu, Michael Hamilton)

Organic Interposer Technology for 2.5D and 3D Packages
Tomoyuki Yamada, Kyocera America, Inc.

Closing Remarks - Ray Fillion: 4:00 pm

 

 



Speaker Dates/Information:

  • Abstracts Due: March 8, 2013
  • Speaker Email Notification: March 22, 2013
  • Early Registration Deadline: April 20, 2013
  • Speaker 2-3 sentence biography due not later than: April 25, 2013
  • Powerpoint/Presentation file for CD-Rom due not later than: May 1, 2013
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop/usb or email to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All session presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.

 


Registration Information: (Early Registration Deadline: April 20, 2013)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, exhibits, meals, refreshment breaks, and one (1) CD-ROM of presentations; cd will contain the extended abstract and presentation as submitted by the presenter. CD will be mailed 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 4/20/13
Advance/Onsite Fee
After 4/20/13
IMAPS Member
$100
$125
Non-Member
$150
$175
Speaker
$50
$75
Chair
$50
$75
Student
$25
$25
Chapter Officer
$50
$75
Tabletop Exhibit (Member)
$275
$300
Tabletop Exhibit (Non-Member)
$300
$325
Premier Sponsorship (Includes Tabletop - Limit 4)
$1000
$1000

 


Hotel Reservations:

There is no contracted "Host Hotel" for this Workshop.
Here are some hotel options in the area that you can book rooms directly with:

Desmond Hotel & Conference Center - Hotel Website
660 Albany Shaker Road
Albany, NY

BEST WESTERN SOVEREIGN - www.sovereignhotels.com
1228 Western Avenue
Albany, NY

Fairfield Inn Albany SUNY - Hotel Website
1383 Washington Avenue
Albany, NY

Hilton Garden Inn Albany Medical Center - Hotel Website
62 New Scotland Avenue Suite 1
Albany, NY

Travelodge Inn And Suites Albany - Hotel Website
42 Wolf Road
Albany, NY

 

 


© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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