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Advanced Technology Conference and Tabletop Exhibits on
Non-Hermetic Packaging Technology for Reliable Microelectronics

January 18, 2012
Rosen Centre Hotel
9840 International Drive
Orlando, Florida - USA

Technical Co-Chair:
Thomas J. Green
TJ Green Associates LLC

Technical Co-Chair:
Robert Lowry
Electronic Materials Consultant

Early Registration/Hotel Deadline: December 23, 2011

Download Program PDF
Tabletop Exhibition | 2012 Exhibitors
Speaker Information

(Co-located with IMAPS Southeastern Microelectronics Packaging Conference, January 17, 2012 -

Hermetic packaging has long provided the required protection from dust, dirt, contamination, moisture, and other threats to operating reliability for sensitive electronic devices. Hermetic packages are expensive and technical and manufacturing resources for them are diminishing in availability. Designers are searching for ways to lower cost, reduce weight and increase performance by looking to design-in alternate material sets including engineered plastics such as LCP and robust barriers offering enhanced protection from moisture permeation. There are a variety of materials and approaches that hold the promise of enhancing reliability of non-hermetics while reducing cost. The problem essentially becomes one of minimizing moisture diffusion through the bulk of package materials and at package/lead interfaces. Packages made from polymeric materials, or robust barrier coatings, as opposed to traditional hermetic seals (i.e. metal, ceramics, eutectic etc.) require a different approach from a reliability testing and qualification standpoint.

Packaging technologies and materials that are not hermetic, and that offer reliability without hermeticity, are available to the industry. These approaches include flip-chip laminate designs or cavity packages made of materials that provide physical protection for sealed devices, but which are not positively absolute barriers to moisture. The conference proposes to bring together providers of non-hermetic concepts, products, and materials, with package designers, manufacturing and assembly production engineers, quality and reliability managers, and program managers to explore and explain enhanced moisture resistance packaging and provide technical guidance to those capabilities for potential users of such packages especially, for high reliability environments with extended service life expectations.

Wednesday, January 18, 2012

Registration: 7:00 am - 5:00 pm

Continental Breakfast: 7:00 am - 8:00 am

Exhibit Opens: 10:00 am - 5:00 pm

Opening Remarks: 8:00 am - 8:15 am
Tom Green, TJ Green Associates LLC

Moisture Failures in Electronic Devices
Robert K. Lowry, Electronic Materials Characterization

Class Y Update
Shri G. Agarwal, Jet Propulsion Laboratory/NASA

Verification of the QSS Model for Predicting Moisture Ingress in Hollow Plastic Packages
Ray Pearson, Lehigh University

Advantages of using LCP Based Pre-Molded Leadframe Packages for RF & MEMS Applications
Andy Longford, Interplex Engineered Products/PandA Europe; Jack Matlis, Interplex Engineered Products USA; Joseph Lynch, Interplex Industries Inc, USA 

Coffee Break in Exhibit Hall: 10:15 am - 10:45 am

Development of Epoxy Sealed Packages for MEMS
S. Joshua Jacobs, Texas Instruments Inc. 

Near-Hermetic Polymer Based Ultra-Thin Packages for Consumer Electronics and Bio-Electronics
Venky Sundaram, Georgia Institute of Technology (PRC)

Lunch in the Exhibit Hall: 11:45 am - 1:30 pm

KEYNOTE Speaker Presentation: 1:30 pm - 2:00 pm

Dr. Shri G. Agarwal

Infusion of New Technology into the QML System

Dr. Shri G. Agarwal, Program Manger, Jet Propulsion Laboratory/NASA
Dr. Agarwal is a Program Manager at NASA / Jet Propulsion Laboratory - California Institute of Technology. Additionally, he is the NASA point of contact on all matters related to QML (Qualified Manufacturer's List) microcircuits. He has over 35 years experience, and several publications to his credit. He received numerous awards for supporting NASA/JPL space flight projects. He holds Master's degrees from Agra University, India; IIT Delhi, India; and USC, Los Angeles. Currently, Shri is leading a NASA championed effort for the worldwide space community to bring the complex state-of-the-art non-hermetic microcircuits into the QML system (a.k.a. the Class Y initiative).

Characterization of Plastic Encapsulants for Packaging of Non-Hermetic Electronic Modules for Monitoring of Steam Sterilizers
Jinto George, John Barrett, Cork Institute of Technology

Low Cost, Non-Hermetic Multi-Chip Module
Matthew Gruber, Lockheed Martin

Coffee Break in Exhibit Hall: 3:00 pm - 3:30 pm

Corporate Sponsor Presentation: 3:00pm - 3:10pm

Materion - Corporate Sponsor

Wafer-Level Parylene Diffusion Barriers for a Self-Referenced CMOS LC Oscillator
Nathaniel Gaskin, Bhusan Gupta, Integrated Device Technology 

Advanced Conformal Barrier Technology for Non-Hermetic Packaging of Electronics
Rakesh Kumar, Specialty Coating Systems, Inc.

Moisture Sensing in Microelectronic Packages
Tom Green, TJ Green Associates LLC

Open Panel Discussion: 5:00 pm - 6:00 pm
Government - Academia - OEMs - Suppliers

Closing Remark: 6:00 pm
Robert Lowry, Electronic Materials Consultant



Housing: Hotel Cut-off is December 23, 2011

Rosen Centre Hotel
9840 International Drive
Orlando, Florida - USA

Discounted IMAPS Room Rates available - view online or call for rates

Speaker Dates/Information:

  • Abstract(s) due to IMAPS: October 24, 2011
  • Speaker Notification/Confirmation emailed: November 11, 2011
  • Extended Abstract or Presentation Material due: December 14, 2011
  • Early Registration/Hotel Deadlines: December 23, 2011
  • Powerpoint/Presentation file for CD-Rom due not later than: January 18, 2012
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)


Corporate Sponsor:

Materion - Corporate Sponsor

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