Technical Program:

9:00   “Power Ribbon Interconnects.”  Mike McKeown, Orthodyne Electronics
                                                   
9:30  “Flip-Chip Packaging.”  William Bernier, IBM

10:00   Refreshment Break  

10:45  “Trends of Embedded Passive and Active Devices.”  Karen Carpenter, TechSearch Intl.

11:15 “Potential of Flexible Electronics in Biology and Medicine.” James Turner, Binghamton University  

11:45  “C4NP.”  Eric Perfecto, IBM

12:15  Lunch

1:15  “Advanced Packaging Requirements.”  How Lin, Endicott Interconnect

1:45  “New Materials for Advanced Packaging.”  Karl Dietz & Chester Balut, DuPont

2:15  Refreshment Break

3:00  “PZT Packaging.”  Charles Woychik, GE Global Research

3:30   “Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World.”  Kevin Knadle, Endicott Interconnect

4:00  "Is the Outsourcing Gold Rush to Asia Over?”   Edward Slavetski, Endicott Interconnect

4:30 - 7:00 Networking and Dinner  
       

Registration:

Click Here to Register

On-line/Early Fees:   IMAPS members $35.00.  Non-members $45.00.  Students $5.00.   Vendors $175.00

Event Location:

Endicott Interconnect Technologies, Inc.
The event is being held at the McKinley on the corner of North Street and McKinley Ave in Endicott 13760. You can use 1701 North Street to get to parking for the event.
Phone: 866 820-4820

 

Event Director–Voya Markovich.  Technical Director–Benson Chan.   Both of Endicott Interconnect
For more information, contact Steve Greene, IMAPS Membership Manager - sgreene@imaps.org, 202-548-8711