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IMAPS Advanced Technology
Workshop on
Optoelectronics Packaging
Radisson
Hotel Bethlehem
Bethlehem, Pennsylvania
October 11-14, 2001
General Chair:
Thomas Green
National Training Center for Microelectronics NTCm
Northampton Community College
Bethlehem, PA 18020
P: 610-861-4128
E-mail: tgreen@northampton.edu
Technical Chair:
Bill Heffner
Agere Systems
Reading, PA 19612-3396
P: 610-939-3854
E-mail: wheffner@agere.com
Housing (Hotel Cut-off is September
4, 2001)
Housing Accommodations must be made directly to:
Radisson Hotel Bethlehem
437 Main Street
Bethlehem, PA 18018
P: 610-625-5000, press 3 for reservation
F: 610-867-9955
Single $109
Double $119
You
can register on-line for this event by using the
IMAPS 2001 registration page
Thursday, October 11
Registration:
2 pm - 8 pm
Reception:
5 pm - 6 pm
Buffet Dinner:
6 pm - 7 pm
Opening Remarks:
7 pm - 7:15 pm
Keynote Talk
7:15 pm - 8
pm
The Rise and
Fall of the Photon
John
Pittman, VP of Manufacturing, Agere Systems
Evening Social
Open Invitation
8:15 pm - 9
pm
"New Kids
in Town"
Local start-ups and emerging players in the optoelectronics
packaging community will be given a few minutes each to
introduce themselves and state the major technical challenges
in packaging optoelectronic devices.
Friday, October 12
Continental
Breakfast: 7:30 am - 8:30 am
Session 2.1
Optoelectronic Devices and Packaging Challenges
Session Chair:
Prof. Aicha Elshabini, University of Arkansas
8:30 am - Noon
Quantum Dot
Laser and Microcavity Sources for 1.3 Micron Wavelength
Prof. D.G. Deppe, Microelectronics Research Center,
University of Texas at Austin
Modulators
& Amplifiers
Prof. C.L. Tang, Cornell University
Waveguide Devices,
Filters, and Optical Multiplexers:Current and Future Trends
Prof. Greg Salamo, University of Arkansas
Break: 10 am
- 10:30 am
Touch Me Not:
Challenges in the Packaging and Interfacing of Optical MEMS
Devices
Ajay P. Malshe, University of Arkansas; Chad O’Neal,
SYSCONN Corporation
Fiber Optic
Sensors: State-of-the-Art
Dr. Kent Murphy, Luna Innovations, Inc.
Photonic Bandgap
Devices
Prof. J. Joannapoulos, MIT
Lunch: Noon
- 1 pm
Recreational
Period: 1 pm - 3 pm
Hosted by local IMAPS Keystone Chapter
Session 2.2
Optoelectronic Packaging and Processes
Session Chair:
Dr. Rajeshuni Ramesham, Jet Propulsion Lab/NASA
3 pm - 6 pm
Achieving Low
Cost Manufacturing with Automation and Integration
Dean Walters, Amkor
Photonic Packaging
for Space Applications
Chuck Chalfant, Space Photonics, Inc.
Flux Free and
Void Free Fiber Optic Packaging Assembly Process
Paul W. Barnes, SST International
Break: 4:15
pm - 4:45 pm
Temperature
Controlled Crystal Mount for High-reliability Laser
George Conway, Lightwave Electonics
Optics and
Wavefront Control Technology for the Next Generation Space
Telescope
Andrew E. Lowman, Jet Propulsion Laboratory/NASA
Large format,
Broadband and Multi-Color GaAs/AlGaAs Quantum Well Infrared
Photodetector (QWIP) Focal Plane
Arrays
Sumith Bandara, Jet Propulsion Lab/NASA
Reception/Dinner:
6 pm - 7:30 pm
Evening Social
with Poster Session
8:15 pm - 9 pm
Saturday, October 13
Continental
Breakfast: 7:30 am - 8:30 am
Session 3.1
Fiber Alignment and Attachment
Session
Chair: Robert "Hutch" Hutchison,
Melles Griot
8:30 am - Noon
Tools and Methods
for Obtaining Precision Fiber Alignments
Jim Scott and Mike Eiklenborg, Melles Griot
Rapid Deployment
Automation for Photonics
Manufacturing
Brian W. Powell, Adept
Speed Up Alignment
by Realtime Synchronization
(of Motion, Vision and Data Acquisition)
Jeff Steele, National Instruments
Break: 9:45
am - 10:15 am
Leveraging
Automation into the Manufacturing Process: Connecting Package
Design, Process,
and Automation Technology
Randy Heyler, Photonics
Packaging and Advanced Automation,
Newport Corporation
Adhesive Curing
Options for Optoelectronic Assembly and Packaging
Steve Martin, EFOS
Characterization
of Rapid-Cure Adhesives for Optoelectronic Applications
Joyce
Koo, Resonance Photonics Inc. and
Andrew
Hudson, EFOS
Optoelectronic
Package for Integrated Sealing of Optical Fibers
Ben Velsher, Kyocera America, Inc.
Lunch: Noon
- 1 pm
Recreational
Period: 1 pm - 3 pm
Hosted by Lehigh University
Session 3.2
Package Assembly and Materials
Session
Chairs: Lee Levine, Agere Systems;
Prof. Ray Pearson, Lehigh University
3 pm - 6 pm
"Session
held at Lehigh University Asa Packer Campus"
Lead Free Solder
Alloys for Reflow Soldering
Benlih Huang and Ning-Cheng Lee, Indium Corporation of America
AuSn Thin Film
Solder Layers for Assembly of Optoelectronic Devices
Georg Greitmann, Hightec MC AG, Switzerland
Providing High
Performance Solutions with Automatic Ribbon Bonding
Paul Reid, Kulicke and Soffa Industries, Inc.
Break: 4:15
pm - 4:45 pm
Ceramic Properties
for Optical Electronic Packaging
Mike Ehlert, National Semiconductor Corp.
Practical Aspects
of Optical Leak Testing Hermetic Fiberoptic Devices
John Newman, NorCom Systems Inc.
Fiber and Alignment
Technology for OE Components
Curt Jack, Agere Systems
Reception/Dinner:
6 pm - 7:30 pm
Evening Social
with Educators
8:15 pm - 9 pm
Student Poster
Competition
Sunday, October 14
Continental
Breakfast: 8 am - 9 am
Closing Session:
9 am - 10:30 am
Bus Departs
for BWI Airport: 1 pm
FREE BUS SERVICE
TO & FROM BETHLEHEM
IF ATTENDING IMAPS 2001
You
can register on-line for this event by using the
IMAPS 2001 registration page
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