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IMAPS Advanced Technology Workshop on
Optoelectronics Packaging

Radisson Hotel Bethlehem
Bethlehem, Pennsylvania
October 11-14, 2001


General Chair:
Thomas Green
National Training Center for Microelectronics NTCm
Northampton Community College
Bethlehem, PA 18020
P: 610-861-4128

Technical Chair:
Bill Heffner
Agere Systems
Reading, PA 19612-3396
P: 610-939-3854

Housing (Hotel Cut-off is September 4, 2001)

Housing Accommodations must be made directly to:

Radisson Hotel Bethlehem
437 Main Street
Bethlehem, PA 18018
P: 610-625-5000, press 3 for reservation
F: 610-867-9955

Single $109
Double $119

You can register on-line for this event by using the
IMAPS 2001 registration page


Thursday, October 11

Registration: 2 pm - 8 pm

Reception: 5 pm - 6 pm

Buffet Dinner: 6 pm - 7 pm

Opening Remarks: 7 pm - 7:15 pm

Keynote Talk

7:15 pm - 8 pm

The Rise and Fall of the Photon
John Pittman, VP of Manufacturing, Agere Systems

Evening Social

Open Invitation

8:15 pm - 9 pm

"New Kids in Town"
Local start-ups and emerging players in the optoelectronics packaging community will be given a few minutes each to introduce themselves and state the major technical challenges in packaging optoelectronic devices.

Friday, October 12

Continental Breakfast: 7:30 am - 8:30 am

Session 2.1
Optoelectronic Devices and Packaging Challenges

Session Chair: Prof. Aicha Elshabini, University of Arkansas

8:30 am - Noon

Quantum Dot Laser and Microcavity Sources for 1.3 Micron Wavelength
Prof. D.G. Deppe, Microelectronics Research Center, 
University of Texas at Austin

Modulators & Amplifiers
Prof. C.L. Tang, Cornell University

Waveguide Devices, Filters, and Optical Multiplexers:Current and Future Trends
Prof. Greg Salamo, University of Arkansas

Break: 10 am - 10:30 am

Touch Me Not: Challenges in the Packaging and Interfacing of Optical MEMS Devices
Ajay P. Malshe, University of Arkansas; Chad O’Neal, SYSCONN Corporation

Fiber Optic Sensors: State-of-the-Art 
Dr. Kent Murphy, Luna Innovations, Inc.

Photonic Bandgap Devices
Prof. J. Joannapoulos, MIT

Lunch: Noon - 1 pm

Recreational Period: 1 pm - 3 pm
Hosted by local IMAPS Keystone Chapter

Session 2.2
Optoelectronic Packaging and Processes

Session Chair: Dr. Rajeshuni Ramesham, Jet Propulsion Lab/NASA

3 pm - 6 pm

Achieving Low Cost Manufacturing with Automation and Integration
Dean Walters, Amkor

Photonic Packaging for Space Applications
Chuck Chalfant, Space Photonics, Inc.

Flux Free and Void Free Fiber Optic Packaging Assembly Process
Paul W. Barnes, SST International

Break: 4:15 pm - 4:45 pm

Temperature Controlled Crystal Mount for High-reliability Laser
George Conway, Lightwave Electonics

Optics and Wavefront Control Technology for the Next Generation Space Telescope
Andrew E. Lowman, Jet Propulsion Laboratory/NASA

Large format, Broadband and Multi-Color GaAs/AlGaAs Quantum Well Infrared Photodetector (QWIP) Focal Plane Arrays
Sumith Bandara, Jet Propulsion Lab/NASA

Reception/Dinner: 6 pm - 7:30 pm

Evening Social with Poster Session
8:15 pm - 9 pm

Saturday, October 13

Continental Breakfast: 7:30 am - 8:30 am

Session 3.1
Fiber Alignment and Attachment

Session Chair: Robert "Hutch" Hutchison, Melles Griot

8:30 am - Noon

Tools and Methods for Obtaining Precision Fiber Alignments
Jim Scott and Mike Eiklenborg, Melles Griot

Rapid Deployment Automation for Photonics Manufacturing
Brian W. Powell, Adept

Speed Up Alignment by Realtime Synchronization (of Motion, Vision and Data Acquisition)
Jeff Steele, National Instruments

Break: 9:45 am - 10:15 am

Leveraging Automation into the Manufacturing Process: Connecting Package Design, Process, and Automation Technology 
Randy Heyle
r, Photonics Packaging and Advanced
Automation, Newport Corporation

Adhesive Curing Options for Optoelectronic Assembly and Packaging 
Steve Martin, EFOS

Characterization of Rapid-Cure Adhesives for Optoelectronic Applications
Joyce Koo, Resonance Photonics Inc. and Andrew Hudson, EFOS

Optoelectronic Package for Integrated Sealing of Optical Fibers
Ben Velsher, Kyocera America, Inc.

Lunch: Noon - 1 pm

Recreational Period: 1 pm - 3 pm
Hosted by Lehigh University

Session 3.2
Package Assembly and Materials

Session Chairs: Lee Levine, Agere Systems; Prof. Ray Pearson, Lehigh University

3 pm - 6 pm

"Session held at Lehigh University Asa Packer Campus"

Lead Free Solder Alloys for Reflow Soldering
Benlih Huang and Ning-Cheng Lee, Indium Corporation of America

AuSn Thin Film Solder Layers for Assembly of Optoelectronic Devices
Georg Greitmann, Hightec MC AG, Switzerland

Providing High Performance Solutions with Automatic Ribbon Bonding
Paul Reid, Kulicke and Soffa Industries, Inc.

Break: 4:15 pm - 4:45 pm

Ceramic Properties for Optical Electronic Packaging
Mike Ehlert, National Semiconductor Corp.

Practical Aspects of Optical Leak Testing Hermetic Fiberoptic Devices
John Newman, NorCom Systems Inc.

Fiber and Alignment Technology for OE Components
Curt Jack, Agere Systems

Reception/Dinner: 6 pm - 7:30 pm

Evening Social with Educators
8:15 pm - 9 pm

Student Poster Competition

Sunday, October 14

Continental Breakfast: 8 am - 9 am

Closing Session: 9 am - 10:30 am

Bus Departs for BWI Airport: 1 pm


You can register on-line for this event by using the
IMAPS 2001 registration page


© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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