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IMAPS Topical Workshop on 

Optoelectronics Packaging and Micro-Optoelectromechanical Systems (MOEMS)

Hotel Bethlehem
Bethlehem, Pennsylvania

October 8-11, 2002

Sponsored by IMAPS and the Local IMAPS Keystone Chapter

General Chair:
Thomas Green
National Training Center for Microelectronics
Tel: 610-861-4572

Technical Chair:
Rajeshuni Ramesham
Jet Propulsion Laboratory, California Institute of Technology
Tel: 818 354 7190

Vendor Chair:
Dao Phan


Register On-Line and $ave

View Exhibitor Information

Download a FREE Exhibits Pass


Tuesday, October 8

Registration: 7:30 am – 8:30 pm 

Continental Breakfast: 7:30 am – 8:30 am

Professional Development Courses: 8:30 am – 12:20 pm

PDC 1: Overview of Optical-fiber Communication and Components

Instructor:  William R. Heffner, Agere Systems Inc.


The objective of this course is to provide an overview of fiber-optic communications and the optoelectronic components that enable its capability.  The course is designed for the technical professional, with or without experience in optoelectronics, who wants to see how all of the pieces fit together.  The course will cover basic principles of the fiber optic transmission systems interwoven with the story of the evolving list of devices (components) and technologies that continue to expand the fiber’s capacity for carrying data.

The course begins with a discussion of the information explosion and the unique capabilities of the fiber in its transmission.  We examine the issues of attenuation and dispersion and illustrate the significance that the light source plays in determining both distance and bandwidth.  From here we trace the evolution of optical fiber systems from the single wavelength, point to point systems of the 80s through the DWDM systems of the 90s to today’s focus on wavelength routing. 

Components are introduced within the context of this discussion showing how greater system performance is directly linked to the unique advantages that each new device contributes.  Discussions will focus primarily on the active components which include lasers, modulators (external and integrated), integrated tunable sources, fiber amplifiers (EDFA and Raman) and optical MEMS for add drop and other functions. 

Who Should Attend?

This PDC is intended as an introductory level course for any engineer or technical professional working in the IC or opto process or packaging field who would like to have a better understanding of what all those OE devices are about and why others are so excited about them.

Instructor Bio:

Bill is a distinguished member of technical staff at Agere Systems (formerly Lucent Technologies) where he has worked for the past 24 years in electro-optic device technology, ranging from basic research in liquid crystals device technology to manufacturing and development positions in InP based semiconductor lasers and detectors.  He is an active member of both OSA and IMAPS having served as opto packaging chair at several recent conferences.  Bill also teaches as an adjunct member of the engineering faculty at Penn State University (GV) where he offers courses on laser and OE device physics. His educational experience includes an MS in Chemical Physics from Indiana University and a PhD in Physics from Stevens Institute of Technology.  He has 15 publications and holds 6 patent in OE device related technology.


PDC 2: Fiber Optic Communications/Devices  -- CANCELLED
Instructor:  W. Jeffrey Shakespeare, T-Networks Inc.

PDC Luncheon: 12:20 pm – 1:20 pm 

Opening Remarks: 1:20 pm – 1:30 pm
General and Technical Chairs


Session 1: Optoelectronics Overview Session 
Session Chairs:  Ron Petkie, Diamonex; Mike Cheney, Department of Defense

1:30 pm – 5:30 pm

An Overview of Optoelectronic(OE) Packaging
Rao V. Yelamarty, Agere Systems Inc.

OE Optical Design Concepts
Curtis A. Jack, Agere Systems, Inc.

BREAK: 2:30 pm – 3:00 pm

What is the Future for Technology Roadmaps on Optoelectronics Packaging?
Herbert Bennett, NIST

OIDA's Initiatives in Photonics Manufacturing
Fred Welsh, Optoelectronics Industry Development Association

BREAK: 4:00 pm – 4:15 pm 

Packaging Approaches for Photonic Integrated Circuits
Dan Meerovich, Erik Reuter, Bill Mordarski, Hong Hao, ASIP Incorporated

Silicon-on-Insulator Mode and Pitch Converters for Optical Interconnection
Philip Keating, Eugene Fike, Mickey Frish, Confluent Photonics Corp.

Optoelectronic Packaging Using Passive Optical Coupling
Amaresh Mahapatra, Robert Mansfield, Linden Photonics, Inc.

Reception: 5:30 pm

Dinner: 6:30 pm

Keynote: 8:00 pm

Speaker:  Dr. Ravindra A. Athale, Photonics Program Manager 
Defense Advanced Research Projects Agency (DARPA)
Talk Title: Optoelectronics Programs at DARPA

Wednesday, October 9

Registration: 7:30 am – 5:30 pm 

Continental Breakfast: 7:30 am – 8:30 am

Session 2: Assembly and Automation 

Session Chairs: Ben Velsher, Kyocera America; Guna Selvaduray, San Jose State University
8:30 am – Noon

High Speed Solderless Interconnect for use with Fiber Optic Transceivers
Robert Wagner, Hesham Elkhatib, Cinch Connectors, Inc.

Precision Automation Technology for the Assembly, Alignment and Bonding of Active and Passive Fiber Optic Components
Ernie Bancroft, Adept Technology, Inc.

Optoelectronic Packaging Concepts Using Active Polymer Systems
Leo M. Higgins III, Siemens Dematic EAS

BREAK: 10:00 am -10:30 am 

Integrated Optoelectronic Component Manufacturing Techniques and Methodologies
Joseph S. Bell, Palomar Technologies, Inc.

Designing an Optoelectronic Package
Robert Irvin, Coviant

High-accuracy Eutectic Die Bonding Techniques for Optoelectronic Packaging
Daniel F. Crowley, MRSI, A Newport Corporation Company

LUNCH: Noon – 1:30 pm


Session 3:  Materials for Optoelectronics
Session Chairs:  Ray Pearson, Lehigh University; Carl Zweben, Zweben Consulting
1:30 pm – 5:20 pm

Aspects of CVD Diamond in High Performance Microelectronics
Ronald Petkie, Diamonex

Reliability Enhancements with AlSiC Composite Structures for Optoelectronics and Wireless Packaging
Dave Saums, Ceramics Process Systems Corporation

Low Temperature Co-fired Ceramic (LTCC) Packages for High Frequency and Optoelectronic Packaging Applications
Michael T. Lanagan, Dean Anderson, Amanda Baker, Clive Randall, The Pennsylvania State University

Lead and Cadmium Free Acid Resistant Electronic Overglazes
Srinivasan Sridharan, Michail Moroz, Ferro Corporation

BREAK: 3:10 pm – 3:40 pm 

High Speed Dielectric Materials for Optoelectronic Modules and Transponders
Gregg Wildes, C. P. Ganatra, W. L. Gore & Associates 

Solder/Substrate Interactions in Optoelectronic Packaging
Michael R. Notis, Lehigh University

Alternative Solder Alloy Considerations for Optoelectronic Assembly
Brian O'Neill, David Suraski, AIM

Improvement of Interconnection Reliability for GC-SOA Chip by Incorporating Cu6Sn5-Containing Composite Solder
Jong-Hyun Lee, Yong-Sung Eom, Kwang-Seong Choi, Byung-Seok Choi, Jong-Tae Moon, Electronics and Telecommunications Research Institute (ETRI)

Reception: 5:30  pm

Dinner: 6:30 pm

Evening Activity: TBD


Thursday, October 10

Registration: 7:00 am – 7:00 pm

Continental Breakfast: 7:00 am – 8:00 am

Exhibitor Setup: 8:00 am – 10:00 am

Exhibits Open: 10:00 am – 7:00 pm 


Session 4: Reliability in Optoelectronics 
Session Chairs: Ephraim Suhir,
University of Illinois; Gene Fike, Confluent Photonics 

8:00 am – 10:00 am

Accelerated Life Testing in Optoelectronics and its Interaction with Qualification Tests
E. Suhir, University of Illinois

"Smart" Photonics Package with a Tunable Liquid Microlens: Performance and Reliability
Tom Krupenkin, Shu Yang, Peter Mach, Bell Labs, Lucent Technologies

Highly Reliable Laser Modules for Undersea Applications
R. C. Schweizer, S. F. Tesarik, Agere Systems Inc.

Warpage Evaluation in Optoelectronic Devices
Arkady Voloshin, Lehigh University

Lunch in Exhibit Hall: 11:30 am – 1:30 pm  

Professional Development Courses: 1:00 pm – 5:00 pm

PDC 3: Predictive Modeling and Accelerated Life Testing in Photonics Packaging

Instructor:  Ephraim Suhir, University of Illinois at Chicago, Iolon, Inc., and ERS Co.


The objective of this course is to describe the role and use of predictive modeling in photonics packaging engineering, as well as the role, attributes, challenges and pitfalls in accelerated life testing (ALT) of photonics structures and packages.

Accordingly, we address first the role and importance of predictive modeling in photonics package structures, and discuss its merits, shortcomings and interaction with experiment. Particularly, we indicate the importance of analytical (“mathematical”) modeling, and its interaction with numerical (primarily finite-element) modeling. We use as examples adhesively bonded and soldered assemblies, subjected to thermal loading; solder joint structures in thermally matched assemblies; and various thin-film structures.  Recommendations for materials selection and improved reliability are formulated and discussed.

We address then accelerated life testing (ALT), its interaction with other types of accelerated tests, and, especially, with qualification tests; and describe various ALT models designed for particular ALT conditions and potential modes of failure. We indicate how one can predict, based on ALTs and predictive modeling, the probability of failure of the given photonic structure under the given use conditions at the given time of its operation. In this connection, we discuss the role and usefulness of the probabilistic approach in physical design of photonic packages.

Who Should Attend?         

This PDC is intended as an introductory course for designers, reliability and quality engineers, as well as experienced technicians and technical managers, that would like to get familiar with the role of predictive modeling and accelerated life testing in photonics packaging engineering.

Instructor Bio:

Dr. E. Suhir is Adjunct Professor, University of Illinois-at-Chicago, Chicago, Illinois (since August 2001) and University of Maryland (since 1999), VP of Reliability and Quality, Iolon, Inc. (since June 2001), and partner, ERS Co. (since May 1888).  He was Distinguished Member of Technical Staff, Bell Laboratories, Physical Sciences and Engineering Research Division from October 1984 until June 2001. Dr. Suhir is Fellow of the ASME, the IEEE and the SPE, and member of the APS, IMAPS, and the JSME (Japan Society of Mechanical Engineers). He is Editor-in-Chief of the ASME Journal of Electronic Packaging. Dr. Suhir has authored about 250 technical publications (papers, book chapters, books, patents), including monographs “Structural Analysis of Microelectronic and Fiber Optic Systems”, Van-Nostrand, 1991 and “Applied Probability for Engineers and Scientists”, McGraw-Hill, 1997. Dr. Suhir received numerous distinguished service and professional awards, including 2001 IMAPS John A. Wagnon Technical Achievement Award; 2000 IEEE-CPMT Outstanding Sustained Technical Contribution Award;  2000 International SPE Fred O. Conley Award , and 1999 ASME and Pi-Tau-Sigma Charles Russ Richards Memorial Award. Dr. Suhir is Distinguished Lecturer of the ASME and the IEEE CPMT Society. He presented numerous invited and keynote talks at professional conferences and taught many professional development courses on various topics of materials, reliability and mechanical problems in microelectronics and photonics engineering.


PDC 4: Designing MEMS/MOEMS for Reliability 

Instructors:  Susanne Arney, Arman Gasparyan and Herb Shea, Lucent Technologies, Bell Labs                               


a) Objectives of Course: This course will provide attendees with a basic working knowledge of how to design MEMS/MOEMS for reliability. The course will concentrate on MEMS design, reliability physics, MEMS-specific fundamental reliability phenomena and failure modes, and accelerated testing protocols. Practical and useful examples from various MEMS arenas will be provided. 

b) Course Outline:

• Overview of MEMS technology along with Photonic Applications

• Evidence that MEMS are Reliable

• The Design-for-Reliability Paradigm

• Reliability Statistics: how to assess reliability test results to obtain truly robust MEMS designs

• MEMS Reliability and Testing Toolkit: learn what tools are needed to construct a reliability test plan to expand beyond qualification-based knowledge

• MEMS Reliability Physics and Failure Mechanisms: 1) Become fluent with the many aspects of MEMS reliability physics and failure mechanisms. 2) Understand the importance of fundamental models of MEMS failure mechanisms in designing accelerated testing strategies

Who Should Attend?

This PDC is intended as an introductory to intermediate course for anyone who needs to understand how to design reliable MEMS/MOEMS. The course will be of value to those who either design their own MEMS or those who work with MEMS designers. MEMS Materials, Fabrication, Packaging, Design, Reliability and Test engineers will benefit from this overview of MEMS Reliability physics.

Instructors Bio:

In 1992 Susanne Arney received her Ph.D. in Electrical Engineering from Cornell University, and joined AT&T Bell Labs in Murray Hill, NJ, now Lucent Technologies, Bell Labs. The founder of the Bell Labs MEMS Reliability Research group, she currently directs the Micromechanics Research Department. Susanne's seminal contributions to MEMS Component Design, Fabrication, and Reliability span 15 years, with current emphasis on Design for Reliability of Optical MEMS components for commercial lightwave network applications.

Arman Gasparyan earned the Ph.D. degree in physics in 1998 and during the same year joined Bell Laboratories, Lucent Technologies where he has done pioneering fundamental physics based MEMS Reliability research in the Micromechanics Research department. Arman's specialty is non-invasive characterization of optical, mechanical and electrical aspects of MEMS/MOEMS reliability physics.

Herb Shea received his Ph.D. in physics from Harvard in 1997. He was then a postdoctoral fellow for two years at IBM’s Watson Research Center in Yorktown Heights, NY. In 1999 Herb joined Bell Labs' MEMS Reliability group. He specializes in the reliability of Silicon based micromachines used in telecommunication applications, and currently leads the MEMS Reliability Research group at Lucent Technologies, with reliability responsibility for commercialization of Optical MEMS (MOEMS) products.

Breaks in the Exhibit Hall: 3:00 pm – 3:30 pm 

Student Poster Papers: 3:00 pm – 6:00 pm 

Reception in the Exhibits Hall: 5:30 pm 

Dinner: 6:45 pm


Friday, October 11

Registration: 7:30 am – Noon 

Continental Breakfast: 7:30 am – 8:30 am

Session 5: Micro-Optoelectromechanical Systems (MOEMS)
Session Chairs:  Bill Heffner, Agere Systems Inc.; Susanne Arney, Lucent Technologies Bell Labs.
8:30 am – 12:15 pm

Overcoming MOEMS Design Challenges using a System Level Design Methodology
Larry Mosiman, Omar Zhoni, Chris Kennedy, Coventor, Inc.

Design for Reliability of MEMS /MOEMS for Lightwave Telecommunications
Susanne Arney, Vladimir A. Aksyuk, David J. Bishop, Cristian A. Bolle, Robert E. Frahm, Arman Gasparyan, C. Randy Giles, Suresh Goyal, Bell Laboratories, Lucent Technologies

Challenges of MOEMS Characterization
Zino Altman, Advent Optronics Corporation

BREAK: 10:00 am – 10:15 am

MEMS Components for DWDM Transmission Systems
Khanh Nguyen, Agere Systems Inc.

Materials and Design of Reliable Seam-Sealable Window Lids
John D. Weld, Lucent Technologies Bell Labs

Fatigue Testing of Freestanding Al Thin Films
Paul El-Deiry, Richard P. Vinci Nicholas Barbosa III Ming-Tzer Lin, Lehigh University

Concluding Remarks


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View Exhibitor Information

Download a FREE Exhibits Pass


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611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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