IMAPS Topical Workshop on
Packaging and Micro-Optoelectromechanical Systems (MOEMS)
October 8-11, 2002
Sponsored by IMAPS and the Local IMAPS Keystone Chapter
National Training Center for Microelectronics
Jet Propulsion Laboratory, California Institute of Technology
Tel: 818 354 7190
On-Line and $ave
a FREE Exhibits Pass
Registration: 7:30 am 8:30 pm
Breakfast: 7:30 am 8:30 am
Development Courses: 8:30 am 12:20 pm
PDC 1: Overview
of Optical-fiber Communication and Components
William R. Heffner, Agere Systems Inc.
The objective of this
course is to provide an overview of fiber-optic communications
and the optoelectronic components that enable its capability.
The course is designed for the technical professional,
with or without experience in optoelectronics, who wants to
see how all of the pieces fit together. The course will cover basic principles of the fiber optic transmission
systems interwoven with the story of the evolving list of
devices (components) and technologies that continue to expand
the fibers capacity for carrying data.
The course begins with
a discussion of the information explosion and the unique capabilities
of the fiber in its transmission.
We examine the issues of attenuation and dispersion
and illustrate the significance that the light source plays
in determining both distance and bandwidth.
From here we trace the evolution of optical fiber systems
from the single wavelength, point to point systems of the
80s through the DWDM systems of the 90s to todays focus
on wavelength routing.
Components are introduced
within the context of this discussion showing how greater
system performance is directly linked to the unique advantages
that each new device contributes. Discussions will focus primarily on the active components which
include lasers, modulators (external and integrated), integrated
tunable sources, fiber amplifiers (EDFA and Raman) and optical
MEMS for add drop and other functions.
This PDC is intended
as an introductory level course for any engineer or technical
professional working in the IC or opto process or packaging
field who would like to have a better understanding of what
all those OE devices are about and why others are so excited
is a distinguished member of technical staff at Agere Systems
(formerly Lucent Technologies) where he has worked for the
past 24 years in electro-optic device technology, ranging
from basic research in liquid crystals device technology to
manufacturing and development positions in InP based semiconductor
lasers and detectors.
He is an active member of both OSA and IMAPS having
served as opto packaging chair at several recent conferences.
Bill also teaches as an adjunct member of the engineering
faculty at Penn State University (GV) where he offers courses
on laser and OE device physics. His educational experience
includes an MS in Chemical Physics from Indiana University
and a PhD in Physics from Stevens Institute of Technology.
He has 15 publications and holds 6 patent in OE device
PDC 2: Fiber
Jeffrey Shakespeare, T-Networks Inc.
PDC Luncheon: 12:20 pm 1:20 pm
Remarks: 1:20 pm 1:30 pm
General and Technical Chairs
Session 1: Optoelectronics
Session Chairs: Ron
Petkie, Diamonex; Mike Cheney, Department of Defense
1:30 pm 5:30 pm
Overview of Optoelectronic(OE) Packaging
Rao V. Yelamarty, Agere Systems Inc.
Optical Design Concepts
Curtis A. Jack, Agere Systems, Inc.
BREAK: 2:30 pm 3:00 pm
What is the Future for Technology Roadmaps on Optoelectronics Packaging?
Herbert Bennett, NIST
Initiatives in Photonics Manufacturing
Fred Welsh, Optoelectronics Industry Development Association
4:00 pm 4:15 pm
Approaches for Photonic Integrated Circuits
Dan Meerovich, Erik Reuter, Bill Mordarski, Hong Hao, ASIP
Mode and Pitch Converters for Optical Interconnection
Philip Keating, Eugene Fike, Mickey Frish, Confluent Photonics
Packaging Using Passive Optical Coupling
Amaresh Mahapatra, Robert Mansfield, Linden Photonics, Inc.
Dr. Ravindra A. Athale, Photonics Program Manager
Defense Advanced Research Projects Agency (DARPA)
Talk Title: Optoelectronics Programs at DARPA
7:30 am 5:30 pm
Breakfast: 7:30 am 8:30 am
Session 2: Assembly and Automation
Session Chairs: Ben Velsher, Kyocera America; Guna Selvaduray,
San Jose State University
8:30 am Noon
Speed Solderless Interconnect for use with Fiber Optic Transceivers
Robert Wagner, Hesham Elkhatib, Cinch Connectors, Inc.
Automation Technology for the Assembly, Alignment and Bonding
of Active and Passive Fiber Optic Components
Ernie Bancroft, Adept Technology, Inc.
Packaging Concepts Using Active Polymer Systems
Leo M. Higgins III, Siemens Dematic EAS
10:00 am -10:30 am
Optoelectronic Component Manufacturing Techniques and Methodologies
Joseph S. Bell, Palomar Technologies, Inc.
an Optoelectronic Package
Robert Irvin, Coviant
Eutectic Die Bonding Techniques for Optoelectronic Packaging
Daniel F. Crowley, MRSI, A Newport Corporation Company
Noon 1:30 pm
Session 3: Materials for Optoelectronics
Session Chairs: Ray
Pearson, Lehigh University; Carl Zweben, Zweben Consulting
1:30 pm 5:20 pm
of CVD Diamond in High Performance Microelectronics
Ronald Petkie, Diamonex
Enhancements with AlSiC Composite Structures for Optoelectronics
and Wireless Packaging
Dave Saums, Ceramics Process Systems Corporation
Temperature Co-fired Ceramic (LTCC) Packages for High Frequency
and Optoelectronic Packaging Applications
Michael T. Lanagan, Dean Anderson, Amanda Baker, Clive Randall,
The Pennsylvania State University
and Cadmium Free Acid Resistant Electronic Overglazes
Srinivasan Sridharan, Michail Moroz, Ferro Corporation
3:10 pm 3:40 pm
Speed Dielectric Materials for Optoelectronic Modules and
Gregg Wildes, C. P. Ganatra, W. L. Gore & Associates
Interactions in Optoelectronic Packaging
Michael R. Notis, Lehigh University
Solder Alloy Considerations for Optoelectronic Assembly
Brian O'Neill, David Suraski, AIM
of Interconnection Reliability for GC-SOA Chip by Incorporating
Cu6Sn5-Containing Composite Solder
Jong-Hyun Lee, Yong-Sung Eom, Kwang-Seong Choi, Byung-Seok
Choi, Jong-Tae Moon, Electronics and Telecommunications Research
7:00 am 7:00 pm
Breakfast: 7:00 am 8:00 am
Setup: 8:00 am 10:00 am
Open: 10:00 am 7:00 pm
Session 4: Reliability
Session Chairs: Ephraim Suhir, University
of Illinois; Gene Fike,
8:00 am 10:00 am
Life Testing in Optoelectronics and its Interaction with Qualification
E. Suhir, University of Illinois
Photonics Package with a Tunable Liquid Microlens: Performance
Tom Krupenkin, Shu Yang, Peter Mach, Bell Labs, Lucent Technologies
Reliable Laser Modules for Undersea Applications
R. C. Schweizer, S. F. Tesarik, Agere Systems Inc.
Evaluation in Optoelectronic Devices
Arkady Voloshin, Lehigh University
in Exhibit Hall: 11:30 am 1:30 pm
Professional Development Courses: 1:00 pm 5:00 pm
PDC 3: Predictive Modeling and Accelerated Life Testing in
Ephraim Suhir, University of Illinois at Chicago, Iolon,
Inc., and ERS Co.
The objective of this
course is to describe the role and use of predictive modeling
in photonics packaging engineering, as well as the role, attributes,
challenges and pitfalls in accelerated life testing (ALT)
of photonics structures and packages.
Accordingly, we address
first the role and importance of predictive modeling in photonics
package structures, and discuss its merits, shortcomings and
interaction with experiment. Particularly, we indicate the
importance of analytical (mathematical) modeling,
and its interaction with numerical (primarily finite-element)
modeling. We use as examples adhesively bonded and soldered
assemblies, subjected to thermal loading; solder joint structures
in thermally matched assemblies; and various thin-film structures.
Recommendations for materials selection and improved
reliability are formulated and discussed.
We address then accelerated
life testing (ALT), its interaction with other types of accelerated
tests, and, especially, with qualification tests; and describe
various ALT models designed for particular ALT conditions
and potential modes of failure. We indicate how one can predict,
based on ALTs and predictive modeling, the probability of
failure of the given photonic structure under the given use
conditions at the given time of its operation. In this connection,
we discuss the role and usefulness of the probabilistic approach
in physical design of photonic packages.
Who Should Attend?
PDC is intended as an introductory course for designers, reliability
and quality engineers, as well as experienced technicians
and technical managers, that would like to get familiar with
the role of predictive modeling and accelerated life testing
in photonics packaging engineering.
is Adjunct Professor, University of Illinois-at-Chicago, Chicago,
Illinois (since August 2001) and University of Maryland (since
1999), VP of Reliability and Quality, Iolon, Inc. (since June
2001), and partner, ERS Co. (since May 1888).
He was Distinguished Member of Technical Staff, Bell
Laboratories, Physical Sciences and Engineering Research Division
from October 1984 until June 2001. Dr. Suhir is Fellow of
the ASME, the IEEE and the SPE, and member of the APS, IMAPS,
and the JSME (Japan Society of Mechanical Engineers). He is
Editor-in-Chief of the ASME Journal of Electronic Packaging.
Dr. Suhir has authored about 250 technical publications (papers,
book chapters, books, patents), including monographs Structural
Analysis of Microelectronic and Fiber Optic Systems,
Van-Nostrand, 1991 and Applied Probability for Engineers
and Scientists, McGraw-Hill, 1997. Dr. Suhir received
numerous distinguished service and professional awards, including
2001 IMAPS John A. Wagnon Technical Achievement Award; 2000
IEEE-CPMT Outstanding Sustained Technical Contribution Award; 2000 International SPE Fred O. Conley Award , and 1999 ASME
and Pi-Tau-Sigma Charles Russ Richards Memorial Award. Dr.
Suhir is Distinguished Lecturer of the ASME and the IEEE CPMT
Society. He presented numerous invited and keynote talks at
professional conferences and taught many professional development
courses on various topics of materials, reliability and mechanical
problems in microelectronics and photonics engineering.
PDC 4: Designing
MEMS/MOEMS for Reliability
Susanne Arney, Arman Gasparyan and Herb Shea, Lucent
Technologies, Bell Labs
Objectives of Course:
This course will provide attendees with a basic working knowledge
of how to design MEMS/MOEMS for reliability. The course will
concentrate on MEMS design, reliability physics, MEMS-specific
fundamental reliability phenomena and failure modes, and accelerated
testing protocols. Practical and useful examples from various
MEMS arenas will be provided.
Overview of MEMS technology along with Photonic Applications
Evidence that MEMS are Reliable
The Design-for-Reliability Paradigm
Reliability Statistics: how to assess reliability test results
to obtain truly robust MEMS designs
MEMS Reliability and Testing Toolkit: learn what tools are
needed to construct a reliability test plan to expand beyond
MEMS Reliability Physics and Failure Mechanisms: 1) Become
fluent with the many aspects of MEMS reliability physics and
failure mechanisms. 2) Understand the importance of fundamental
models of MEMS failure mechanisms in designing accelerated
Who Should Attend?
This PDC is intended
as an introductory to intermediate course for anyone who needs
to understand how to design reliable MEMS/MOEMS. The course
will be of value to those who either design their own MEMS
or those who work with MEMS designers. MEMS Materials, Fabrication,
Packaging, Design, Reliability and Test engineers will benefit
from this overview of MEMS Reliability physics.
1992 Susanne Arney
received her Ph.D. in Electrical Engineering from Cornell
University, and joined AT&T Bell Labs in Murray Hill,
NJ, now Lucent Technologies, Bell Labs. The founder of the
Bell Labs MEMS Reliability Research group, she currently directs
the Micromechanics Research Department. Susanne's seminal
contributions to MEMS Component Design, Fabrication, and Reliability
span 15 years, with current emphasis on Design for Reliability
of Optical MEMS components for commercial lightwave network
earned the Ph.D. degree in physics in 1998 and during the
same year joined Bell Laboratories, Lucent Technologies where
he has done pioneering fundamental physics based MEMS Reliability
research in the Micromechanics Research department. Arman's
specialty is non-invasive characterization of optical, mechanical
and electrical aspects of MEMS/MOEMS reliability physics.
Herb Shea received his Ph.D. in physics from Harvard in 1997. He was then a postdoctoral
fellow for two years at IBMs Watson Research Center
in Yorktown Heights, NY. In 1999 Herb joined Bell Labs' MEMS
Reliability group. He specializes in the reliability of Silicon
based micromachines used in telecommunication applications,
and currently leads the MEMS Reliability Research group at
Lucent Technologies, with reliability responsibility for commercialization
of Optical MEMS (MOEMS) products.
Breaks in the Exhibit Hall: 3:00 pm 3:30 pm
Poster Papers: 3:00 pm 6:00 pm
in the Exhibits Hall: 5:30 pm
7:30 am Noon
Breakfast: 7:30 am 8:30 am
Session 5: Micro-Optoelectromechanical
Session Chairs: Bill
Heffner, Agere Systems Inc.; Susanne Arney, Lucent Technologies
8:30 am 12:15 pm
MOEMS Design Challenges using a System Level Design Methodology
Larry Mosiman, Omar Zhoni, Chris Kennedy, Coventor, Inc.
for Reliability of MEMS /MOEMS for Lightwave Telecommunications
Susanne Arney, Vladimir A. Aksyuk, David J. Bishop, Cristian
A. Bolle, Robert E. Frahm, Arman Gasparyan, C. Randy Giles,
Suresh Goyal, Bell Laboratories, Lucent Technologies
of MOEMS Characterization
Zino Altman, Advent Optronics Corporation
10:00 am 10:15 am
Components for DWDM Transmission Systems
Khanh Nguyen, Agere Systems Inc.
and Design of Reliable Seam-Sealable Window Lids
John D. Weld, Lucent Technologies Bell Labs
Testing of Freestanding Al Thin Films
Paul El-Deiry, Richard P. Vinci Nicholas Barbosa III Ming-Tzer
Lin, Lehigh University
a FREE Exhibits Pass