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International Microelectronics And Packaging Society (IMAPS) and the IMAPS Keystone Chapter

present

Advanced Technology Workshop & Exhibition on
Optoelectronics Device Packaging and Materials

Radisson Hotel Bethlehem
Bethlehem, Pennsylvania

October 7-10, 2003

General Chair:

Technical Chair:

Exhibits Chair:
Raymond A. Pearson
Lehigh University
Phone: 610-758-3857; FAX: 610-758-4244
E-mail: rp02@lehigh.edu
Ben Velsher
OptoVia Corporation
Phone: 978-266-2830, x218; FAX: 978-266-2835
E-mail: velsher@optovia.com
Elizabeth Stasik
NorCom Systems, Inc.
Phone: 610-631-5043
Fax: 610-631-0934
Email: estasik@norcomsystemsinc.com

Technical Program




Tuesday, October 7

Registration: 7:00 am - 7:00 pm

PDC Continental Breakfast: 7:30 am - 8:30 am

Professional Development Courses (1/2 DAY)
8:30 am - 1:00 pm


PDC 1
OPTOELECTRONICS PACKAGING AND PROCESSES

INSTRUCTOR: THOMAS J. GREEN, NATIONAL TRAINING CENTER FOR MICROELECTRONICS

DESCRIPTION
The intent of this course is to advance the students' understanding of the basic materials and processing steps used in the assembly of active optoelectronic components such as lithium niobate modulators and pump lasers. The basic processes essential to building optoelectronic components are covered including; AuSn eutectic attach of laser chips, micro alignment of fibers within the package, silicon optical bench technology, deep access wire and ribbon bonding, attachment of window lenses, hermetic sealing and optical package leak testing. In addition, material issues such as, choosing the proper adhesive and problems associated with outgassing of organic species inside the OE package are discussed. The industry has struggled to automate the manufacture of OE components and has missed out on the corresponding cost reductions. Issues in automation of OE processes and future packaging challenges will also be presented.

TOPICS
· Eutectic attach of laser chips using Au/Sn die attach
· Micro fiber alignment within the package cavity
· Deep access wire and ribbon bonding
· Hermetic testing of optical components using optical leak test methodologies
· Challenges in automation and assembling OE components

WHO SHOULD ATTEND?
This course is a must for designers, process engineers, quality inspectors and technicians interested in understanding the basic materials and processing issues relevant to assembling optoelectronic devices. An easy to follow powerpoint presentation and color photos guide the student through the intricacies of building the next generation optoelectronic assemblies

INSTRUCTOR BIO:
Tom is a respected industry consultant and adjunct Professor at the National Training Center for Microelectronics located Bethlehem Pennsylvania. At NTCm he designs curriculum and teaches industry short courses relating to advanced microelectronics and optoelectronics manufacturing processes. He has over twenty years experience in the microelectronics manufacturing industry at Lockheed Martin and USAF Rome Laboratories. During that time period he was a senior staff engineer responsible for the materials and manufacturing processes used in building custom high reliability space qualified microcircuits and optoelectronics components for military and commercial applications. Tom has a Masters of Engineering from University of Utah and a B.S. degree in Metallurgy and Materials Engineering from Lehigh University.

PDC 2
OVERVIEW OF OPTICAL-FIBER COMMUNICATION AND COMPONENTS

INSTRUCTOR: WILLIAM R. HEFFNER, SCITONICS - OPTOELECTRONICS CONSULTING AND TRAINING

DESCRIPTION:
The objective of this course is to provide an overview of fiber-optic communications and the optoelectronic components that enable its capability. The course is designed for the technical professional, with or without experience in optoelectronics, who wants to see how all of the pieces fit together. The course will cover basic principles of the fiber optic transmission systems interwoven with the story of the evolving list of devices (components) and technologies that continue to expand the fiber's capacity for carrying data.

The course begins with a discussion of the information explosion and the unique capabilities of the fiber in its transmission. We examine the issues of attenuation and dispersion and illustrate the significance that the light source plays in determining both distance and bandwidth. From here we trace the evolution of optical fiber systems from the single wavelength, point to point systems of the 80s through the DWDM systems of the 90s to today's focus on wavelength routing.

Components are introduced within the context of this discussion showing how greater system performance is directly linked to the unique advantages that each new device contributes. Discussions will focus primarily on the active components which include lasers, modulators (external and integrated), integrated tunable sources, fiber amplifiers (EDFA and Raman) and optical MEMS for add drop and other functions.

WHO SHOULD ATTEND?
This PDC is intended as an introductory level course for any engineer or technical professional working in the IC or opto process or packaging field who would like to have a better understanding of what all those OE devices are about and why others are so excited about them.

INSTRUCTOR BIO:
Bill is an optoelectronics consultant with more 25 years experience in electro-optic device technology, ranging from basic research in liquid crystals device technology to manufacturing and development positions in InP based semiconductor lasers and detectors. He was formerly a distinguished member of technical staff at Agere Systems where he was employed for most of his career. He is an active member of both the OSA and IMAPS having served as opto packaging chair at several recent conferences. Bill also teaches as an adjunct member of the engineering faculty at Penn State University (GV) where he offers courses on laser and OE device physics. His educational experience includes an MS in Chemical Physics from Indiana University and a PhD in Physics from Stevens Institute of Technology. He has 15 publications and holds 6 patents in OE device related technology.


Tuesday Afternoon

OPENING REMARKS
GENERAL AND TECHNICAL CHAIRS

SESSION I: OPTOELECTRONIC PACKAGING OVERVIEW
2 pm - 5:30 pm
SESSION CHAIRS:
GARO KHANARIAN, ROHM & HAAS; ALAN LYONS, LUCENT TECHNOLOGIES

NATIONAL ELECTRONICS MANUFACTURING INITIATIVE (NEMI) YEAR 2002 OPTOELECTRONICS ROADMAP
Laura Turbini, University of Toronto

CONTRACT MANUFACTURING AFTER THE BUBBLE
Paul A. Magill, Coviant Manufacturing

EMBEDDED OPTICAL INTERCONNECTS IN PRINTED CIRCUIT BOARDS
Daniel Guidotti, Georgia Institute of Technology

BREAK: 3:30 PM - 4 PM

ISSUES RELATED TO OPTICAL INTERCONNECTS AND BACKPLANES
Edward S. Binkley, Promex Industries

HIGH-BRIGHTNESS FIBER COUPLED LASER DIODE PACKAGE FOR LOW-COST, HIGH RELIABILITY APPLICATIONS
Raj Singh, MKPA

HERMETIC, SMALL FORM FACTOR PACKAGE FOR EDGE EMITTING OPTO-ELECTRONIC DEVICES
Arnd Kilian, HYMITE GmbH

WELCOME RECEPTION: 5:30 PM - 6 PM
DINNER: 6 PM - 7 PM

KEYNOTE ADDRESS
7 PM - 7:45 PM
Speaker: Tom Koch, Lehigh University


Wednesday, October 8

REGISTRATION: 7 AM - 7 PM

CONTINENTAL BREAKFAST: 7:30 AM - 8:30 AM

SESSION II: ASSEMBLY AND AUTOMATION IN OPTOELECTRONICS
8:30 am - Noon
SESSION CHAIRS:
ROBERT IRVIN, COVIANT; JEFFREY SHAKESPEARE, CONSULTANT

ADVANCED FLIP CHIP MANUFACTURING TECHNIQUES FOR OPTOELECTRONICS
J. Medernach, MRSI, A Newport Corporation Company

LOW COST, DESKTOP PHOTONICS ASSEMBLY PLATFORM WITH NANOMETER PRECISION
Tetsuo Ohara, MKPA-Panasonic

METALLIZED OPTICAL FIBER REQUIREMENTS FOR RELIABLE MINI-DIL PUMP LASER MODULES
Nick Nelson, Flextronics Photonics

BREAK: 10 AM - 10:30 AM

ADHESIVES AND ADHESION RELIABILITY: QUALITY, DURABILITY, & PRODUCTIVITY IN BONDED ASSEMBLIES
Nicole Langer, Dymax Corporation

SPACE-QUALIFIABLE SIX-AXIS FIBER ALIGNMENT TECHNIQUE
Jerry Mulder, Jet Propulsion Laboratory

OPTOELECTRONIC PACKAGING: THE NEED FOR ±1 µM POST-BOND ACCURACY DEVICE BONDING
Gilbert Lecarpentier, SUSS MicroTec

LUNCH: NOON

SESSION III: MATERIALS IN OPTOELECTRONICS I
2 pm - 5:30 pm

SESSION CHAIR:
DAVE SAUMS, CPS

LTCC-M TECHNOLOGY FOR LED PACKAGING
Ellen S. Tormey, Lamina Ceramics, Inc.

LOW COST, HERMETIC OPTICAL PORT USING LIQUID CRYSTAL POLYMER
A. Mahapatra, Linden Photonics, Inc.

BONDABILITY, RELIABILITY AND YIELD BENCHMARKS FOR HIGH VOLUME AU FINE WIRE BONDING
M. Zasowski, Williams Advanced Materials

BREAK: 3:30 PM - 4 PM

SEALING OPTICAL FIBERS WITH SOLDER GLASS: DESIGN GUIDELINES
R.Dietz, Diemat, Inc.

TEST RESULTS FOR VARIOUS METALLIZED FIBER DEPOSITS
Robert Botkins, Shipley Company, L.L.C.

FABRICATION AND PACKAGING TECHNIQUES FOR INTEGRATED PHOTONIC DEVICES USING POLYMER-BASED SUBSTRATE MATERIALS
Don Bitting, Photon-X, Inc.

DINNER: 5:30 PM - 6:30 PM


SESSION IV MATERIALS IN OPTOELECTRONICS II
6:30 pm - 8 pm
SESSION CHAIR:
DAVE SAUMS, CPS

PACKAGING AND ASSEMBLY MADE SIMPLE WITH VAPOR DEPOSITED EUTECTIC SOLDERS
John Snook, Stellar Industries Corporation

INJECTION MOLDED PLASTIC PACKAGING FOR OPTOELECTRONIC APPLICATIONS
John W. Roman, RJR Polymers Incorporated

TESTING THE ELECTRICAL PROPERTIES OF ZERO SHRINK HL2000 FOR MANUFACTURE INTO LOW TEMPERATURE CO-FIRED CERAMIC SYSTEMS
Steven Scrantom, Sea Ceramics Technologies


Thursday, October 9

REGISTRATION: 7 AM - 7 PM

CONTINENTAL BREAKFAST: 7:30 AM - 8:30 AM

EXHIBITOR SETUP: 11:00 AM - NOON

EXHIBIT HOURS: NOON - 5:30 PM
Refreshment Breaks and Lunch in the Exhibit Area

SESSION V: RELIABILITY IN OPTOELECTRONICS PACKAGING
8:30 am - Noon
SESSION CHAIRS:
ALEX ROSIEWICZ, EM4 PHOTONICS; DANIEL MEEROVICH, ASIP

EVALUATION OF OPTO-ELECTRONIC COMPONENTS UTILIZING ACOUSTIC MICRO IMAGING (AMI) TECHNIQUES
Jennifer Bailey, Sonoscan, Inc.

A METHOD FOR GETTERING GAS-PHASE CONTAMINANTS WITHIN A SEALED OPTOELECTRONIC PACKAGE
S. Wakelin, PowerNetix, Inc.

DETERMINING LIFETIME OF SILVER-FILLED ICA'S/SOLDER PLATED INTERCONNECTIONS
C. Hillman, University of Maryland

BREAK: 10 AM - 10:30 AM

OPTICAL LEAK TESTING OF HERMETIC OPTOELECTRONIC DEVICES
J. Newman, NorCom Systems Inc.

SCANNING ACOUSTIC MICROSCOPY (SAM) FOR THE INSPECTION OF OPTOELECTRONICS DEVICES
James McKeon, Sonix Incorporated

HERMETIC PROJECTION WELDING
Thomas E. Salzer, Hermetric, Inc.

LUNCH IN EXHIBITS AREA: NOON

SESSION VI: OPTOELECTRONIC PACKAGE DESIGN
4 pm - 6 pm

SESSION CHAIR:
BEN VELSHER, OPTOVIA CORPORATION

OPTOELECTRONIC STANDARDS - THE FOUNDATION FOR RELIABLE IMPLEMENTATION AND ASSESSMENT
Dieter Bergman, IPC

PACKAGING OF A HIGH POWER MEMS OPTICAL SWITCH
Michael Deeds, Naval Surface Warfare Center

THERMAL DESIGN OF OPTOELECTRONIC PACKAGES
Jeffrey Shakespeare, Lehigh University

METALLURGICAL STUDY OF LASER WELDING JOINTS IN PHOTONIC PACKAGING
C. W. Tan, City University of Hong Kong

RECEPTION: 6 PM
DINNER: 6:30 PM - 8 PM

STUDENT POSTER PAPERS: 6:30 PM - 8 PM


Friday, October 10

REGISTRATION: 7 AM - NOON

CONTINENTAL BREAKFAST: 7:30 AM - 8:30 AM

SESSION VII: CONSORTIA/UNIVERSITY PROGRAMS IN OPTOELECTRONICS
8:30 am - Noon
SESSION CHAIRS:
MIKE LANAGAN, PENN STATE UNIVERSITY; SHAPNA PAL, DEPARTMENT OF DEFENSE

DIMENSIONAL STABILITY OF OPTICAL PACKAGES
Robert Sullivan, High Density Packaging User Group International, Inc.

OVERVIEW OF OPTOELECTRONIC PACKAGING EFFORTS AT LEHIGH UNIVERSITY
Ray Pearson, Lehigh University

ELECTRONIC AND MEMS PACKAGING RESEARCH AT SUNY BINGHAMTON
Junghyun Cho, State University of New York at Binghamton

BREAK: 10 AM - 10:30 AM

THE NSF CENTER FOR DIELECTRIC STUDIES: A COOPERATIVE VENTURE FOR INDUSTRY, GOVERNMENT, AND UNIVERSITIES
Michael Lanagan, The Pennsylvania State University

PHYSICS-OF-FAILURE RELIABILITY ASSESSMENT OF OPTOELECTRONICS AND PHOTONICS
Patrick McCluskey, University of Maryland

OPTOELECTRONICS PACKAGING RESEARCH WITHIN THE UIC AREA ARRAY CONSORTIUM
Peter Borgesen, Universal Instruments Corporation

CONCLUDING REMARKS: NOON




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IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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