Free Time: 1 pm – 2 pm
Session I: Devices
Chair: Jeff Shakespeare, GlucoLight Corporation
2 pm – 3:30 pm
Metallic MEMS Structures for Assembly of Optoelectronic Components
Arun Kumar Nallani, University of Texas – Dallas; Ting Chen, JB
Lee, Donald J. Hayes, David B. Wallace, MicroFab Technologies, Inc.
Ultra Small Form Factor 10 GB Low Cost Integrated Transmitter
Marion Volpert, F. Berger, F. Marion, P. Grosse, C. Louis, C. Kopp,
C. Rossat, S. Bernabe, R. Stevens, CEA-LETI
Low Cost Flip Chip Packaging of VCSEL Device using Silicon Carrier and
Sn-2.5Ag Solder Bumping
Yongwoon Yeo, NEPES Corporation
Break: 3:30 pm – 4 pm
Session II: Pb Free Solders
Chair: Michael Notis, Lehigh University
4 pm – 5:30 pm
Mechanical Properties of Sn-based Intermetallics Measured at Reduced Length
Scales
R. R. Chromik, D.-N. Wang, R. P. Vinci, M. R. Notis, Lehigh University
Cyclic Twin Nucleation in Tin Based Alloys
Lawrence P. Lehman, SUNY at Binghamton
Growth Rate and Morphology of Ag3Sn and Cu6Sn5 in the Sn-Ag-Cu Pb-Free
Solder Alloys
R. K. Kinyanjui, E. J. Cotts, SUNY at Binghamton
Welcome Reception: 5:30 pm – 6 pm
Dinner: 6 pm – 7 pm
Keynote Address
7 pm – 7:45 pm
Speaker: Dr. John V. Pilitsis, CEO of CyOptics
Tuesday , October 12
Registration: 7 am – 6:30 pm
Continental Breakfast: 7:30 am – 8:30
am
Session III: Consortia / University Programs
Co-Chairs: Pat McCluskey, University of Maryland; Roe Hemmenway,
Corning
8:30 am – Noon
Optipac Consortium
Doron Peleg, Optipac
Canadian Consortium
TBD
Break: 10 am – 10:30 pm
Lehigh University
University of Maryland
SUNY Binghamton
Lunch: Noon – 1 pm
Free Time: 1 pm – 2 pm
Session IV: Inorganic Materials
Chair: Eric Cotts, SUNY at Binghamton
2 pm – 5:30 pm
Characterization of Thermally Evaporated Thin Films of MgPc
Munish Puri, R. K. Bedi, GND University - AMRITSAR
Low Temperature Epoxy-Free and Flux-Less Bonding Process Applied to Solid-State
Microchip Laser
Christophe Kopp, Karen Gilbert, CEA-LETI
Advanced Thermal Management Materials for Optoelectronics Packaging
Carl Zweben, Advanced Packaging Materials and Composites Consultant
Break: 3:30 pm – 4 pm
Visi-Lid: Transparent Combo Lids
Michael Zasowski, Heiner Lichtenberger, Gery Lovitz, Joseph J Alfano,
Williams Advanced Materials
Interface, Buffer Layer, Waveguide, and Optoelectronics System Integration
on Printed Circuit Boards
Fuhan Liu, Daniel Guidotti, Zhaoran Huang, Gee-Kung Chang, Rao R.
Tummala, Georgia Institute of Technology
Optical Waveguide and fiber array Connectivity and Packaging Solutions
Bruce Booth, Optical Crosslinks
Reception: 5:30 pm – 6 pm
Dinner: 6 pm – 7 pm
Wednesday, October 13
Registration: 7 am – 7 pm
Continental Breakfast: 7:30 am – 8:30
am
Exhibitor Setup: 11 am – Noon
Exhibit Hours: Noon – 5:30 pm
Lunch in the Exhibit Area
Session V: Reliability
Chair: Raja Parvez, CyOptics
8:30 am – Noon
Analysis of the In-Plane Deformation of the Thermoelectric Cooler due
to Power Cycling
Arkady Voloshin, Refael Reichenberg, Yoram Berlinsky, Lehigh University
MEMS Integrated Submount Alignment for Optoelectronics
W. Jeffrey Shakespeare, Ray Pearson, Joachim Grenestedt, Parsaoran
Hutapea, Vikas Guptam, Lehigh University
Interconnect Aging of Au / Al Wedge Bonding
Mike Reffle, Stephen Pennypacker, Joseph Riska, Infinera
Break: 10 am – 10:30 am
Reliability Test Strategies for New and Novel Optoelectronic Devices:
Receiver Module with an Integrated MEMS Variable Optical Attenuator
Martin Helfand, JDS Uniphase Corp.
Hermeticity Testing of Hi-Rel Devices and Board Mounted components using
Laser Holographic Technology
Bruce Wilson, NorCom Systems, Inc.
Optimization Techniques for Reducing Warpage of Populated and Unpopulated
Organic Substrates
Joachim Grenestedt, Lehigh University
Lunch in Exhibit Area: Noon
Session VI: Sensors
Chair: Matt Schurman, GlucoLight
4 pm – 5:30 pm
Packaging of Spectral Biometric Sensors
Lu Fang, Stephen P. Corcoran, Robert K. Rowe, Kristin A. Nixon, Lumidigm,
Inc.
Integrated Linear Image Sensors Array
Anton Pletersek, Faculty of Electrical Engineering - Ljubljana
Optical Coherence Tomography
Matt Schurman, GlucoLight
Dinner: 5:30 pm – 6:30 pm
Student Poster Session: 6:30 pm
Thursday, October 14
Registration: 7 am – Noon
Continental Breakfast: 7:30 am – 8:30
am
Session VII: Organic Materials
Chair: Ray Pearson, Lehigh University
8:30 am – Noon
Strength of Underfill-Passivation Interfaces
B. J. McAdams, R. A. Pearson, Lehigh University
Simulation of Underfill Encapsulant Cure in the Solder-Reflow Oven during
Flip-Chip Packaging Process
Rajesh R. Gomatam, John P. Coulter, Lehigh University
Stability of Epoxy Glass Interfaces
R. A. Pearson, O. Khayankarn, Lehigh University
Break: 10 am – 10:30 am
Low Cost Air Cavity LCP (Liquid Crystal Polymer) Packaging for Optoelectronics
Michael Zimmerman, Quantum Leap; Richard B. Bylsma, CyOptics
LCP Based Packaging
John Roman, RJR Polymers
Polymer Barrier Materials for Opto-Electronic Packaging
Maria Petrucci, Jose Rodriguez-Parada, Mark E. Lewittes, J. Bryan
Brown, E.I. DuPont De Nemours & Co.
Lunch: Noon – 1 pm
Free Time: 1 pm – 2 pm
Session VIII: Tour of Center for Optical Technologies - Lehigh University
2 pm – 5:30 pm
