IMAPS Home
Members Only
Login
About IMAPS
Events Calendar
Online Store
Membership
Chapters/Committees
Global Business Council
Industry News
Publications
Careers
IMAPS Microelectronics Foundation
Contact Us
Optoelectronics Device Packaging
Topical Workshop and Exhibition

Radisson Hotel Bethlehem
437 Main Street
Bethlehem, Pennsylvania 18018
Phone: 610-625-5000
October 11 - 14, 2004

Sponsored by:
International Microelectronics and Packaging Society (IMAPS)
“ Everything in electronics between the chip and the system”
and the
IMAPS Keystone Chapter

General Chair:
Raymond A. Pearson
Lehigh University
P: 610-758-3857; F: 610-758-4244
E-mail: rp02@lehigh.edu

Technical Chair:
Jeff Shakespeare
GlucoLight Corporation
Phone: 610-419-6250; FAX: 610-861-8247
E-mail: wjs2@lehigh.edu

Exhibit Chair:
Bruce Wilson
NorCom Systems, Inc.
P: 610-669-4090; F: 610-451-0776


 

Monday, October 11

Registration: 7 am – 7 pm

PDC Continental Breakfast: 7:30 am – 8:30 am

Professional Development Courses (PDC)
8:30 am – 1 pm

PDC 1: Optoelectronics Packaging and Processes
INSTRUCTOR: Thomas J Green, National Training Center for Microelectronics

cancelled

PDC 2: Fundamentals of Adhesion for Microelectronic and Optoelectronic Applications
INSTRUCTOR: Ray Pearson, Lehigh University

cancelled

Free Time: 1 pm – 2 pm

Session I: Devices
Chair: Jeff Shakespeare, GlucoLight Corporation
2 pm – 3:30 pm

Metallic MEMS Structures for Assembly of Optoelectronic Components
Arun Kumar Nallani, University of Texas – Dallas; Ting Chen, JB Lee, Donald J. Hayes, David B. Wallace, MicroFab Technologies, Inc.

Ultra Small Form Factor 10 GB Low Cost Integrated Transmitter
Marion Volpert, F. Berger, F. Marion, P. Grosse, C. Louis, C. Kopp, C. Rossat, S. Bernabe, R. Stevens, CEA-LETI

Low Cost Flip Chip Packaging of VCSEL Device using Silicon Carrier and Sn-2.5Ag Solder Bumping
Yongwoon Yeo, NEPES Corporation

Break: 3:30 pm – 4 pm

Session II: Pb Free Solders
Chair: Michael Notis, Lehigh University
4 pm – 5:30 pm

Mechanical Properties of Sn-based Intermetallics Measured at Reduced Length Scales
R. R. Chromik, D.-N. Wang, R. P. Vinci, M. R. Notis, Lehigh University

Cyclic Twin Nucleation in Tin Based Alloys
Lawrence P. Lehman, SUNY at Binghamton

Growth Rate and Morphology of Ag3Sn and Cu6Sn5 in the Sn-Ag-Cu Pb-Free Solder Alloys
R. K. Kinyanjui, E. J. Cotts, SUNY at Binghamton

Welcome Reception: 5:30 pm – 6 pm
Dinner: 6 pm – 7 pm

Keynote Address
7 pm – 7:45 pm
Speaker: Dr. John V. Pilitsis, CEO of CyOptics


Tuesday , October 12

Registration: 7 am – 6:30 pm

Continental Breakfast: 7:30 am – 8:30 am

Session III: Consortia / University Programs
Co-Chairs: Pat McCluskey, University of Maryland; Roe Hemmenway, Corning
8:30 am – Noon

Optipac Consortium
Doron Peleg, Optipac

Canadian Consortium

TBD

Break: 10 am – 10:30 pm

Lehigh University

University of Maryland

SUNY Binghamton

Lunch: Noon – 1 pm

Free Time: 1 pm – 2 pm

Session IV: Inorganic Materials
Chair: Eric Cotts, SUNY at Binghamton
2 pm – 5:30 pm

Characterization of Thermally Evaporated Thin Films of MgPc
Munish Puri, R. K. Bedi, GND University - AMRITSAR

Low Temperature Epoxy-Free and Flux-Less Bonding Process Applied to Solid-State Microchip Laser
Christophe Kopp, Karen Gilbert, CEA-LETI

Advanced Thermal Management Materials for Optoelectronics Packaging
Carl Zweben, Advanced Packaging Materials and Composites Consultant

Break: 3:30 pm – 4 pm

Visi-Lid: Transparent Combo Lids
Michael Zasowski, Heiner Lichtenberger, Gery Lovitz, Joseph J Alfano, Williams Advanced Materials

Interface, Buffer Layer, Waveguide, and Optoelectronics System Integration on Printed Circuit Boards
Fuhan Liu, Daniel Guidotti, Zhaoran Huang, Gee-Kung Chang, Rao R. Tummala, Georgia Institute of Technology

Optical Waveguide and fiber array Connectivity and Packaging Solutions
Bruce Booth, Optical Crosslinks

Reception: 5:30 pm – 6 pm
Dinner: 6 pm – 7 pm


Wednesday, October 13

Registration: 7 am – 7 pm

Continental Breakfast: 7:30 am – 8:30 am

Exhibitor Setup: 11 am – Noon

Exhibit Hours: Noon – 5:30 pm
Lunch in the Exhibit Area

Session V: Reliability
Chair: Raja Parvez, CyOptics
8:30 am – Noon

Analysis of the In-Plane Deformation of the Thermoelectric Cooler due to Power Cycling
Arkady Voloshin, Refael Reichenberg, Yoram Berlinsky, Lehigh University

MEMS Integrated Submount Alignment for Optoelectronics
W. Jeffrey Shakespeare, Ray Pearson, Joachim Grenestedt, Parsaoran Hutapea, Vikas Guptam, Lehigh University

Interconnect Aging of Au / Al Wedge Bonding
Mike Reffle, Stephen Pennypacker, Joseph Riska, Infinera

Break: 10 am – 10:30 am

Reliability Test Strategies for New and Novel Optoelectronic Devices: Receiver Module with an Integrated MEMS Variable Optical Attenuator
Martin Helfand, JDS Uniphase Corp.

Hermeticity Testing of Hi-Rel Devices and Board Mounted components using Laser Holographic Technology
Bruce Wilson, NorCom Systems, Inc.

Optimization Techniques for Reducing Warpage of Populated and Unpopulated Organic Substrates
Joachim Grenestedt, Lehigh University

Lunch in Exhibit Area: Noon

Session VI: Sensors
Chair: Matt Schurman, GlucoLight
4 pm – 5:30 pm

Packaging of Spectral Biometric Sensors
Lu Fang, Stephen P. Corcoran, Robert K. Rowe, Kristin A. Nixon, Lumidigm, Inc.

Integrated Linear Image Sensors Array
Anton Pletersek, Faculty of Electrical Engineering - Ljubljana

Optical Coherence Tomography
Matt Schurman, GlucoLight

Dinner: 5:30 pm – 6:30 pm

Student Poster Session: 6:30 pm


Thursday, October 14

Registration: 7 am – Noon

Continental Breakfast: 7:30 am – 8:30 am

Session VII: Organic Materials
Chair: Ray Pearson, Lehigh University
8:30 am – Noon

Strength of Underfill-Passivation Interfaces
B. J. McAdams, R. A. Pearson, Lehigh University

Simulation of Underfill Encapsulant Cure in the Solder-Reflow Oven during Flip-Chip Packaging Process
Rajesh R. Gomatam, John P. Coulter, Lehigh University

Stability of Epoxy Glass Interfaces
R. A. Pearson, O. Khayankarn, Lehigh University

Break: 10 am – 10:30 am

Low Cost Air Cavity LCP (Liquid Crystal Polymer) Packaging for Optoelectronics
Michael Zimmerman, Quantum Leap; Richard B. Bylsma, CyOptics

LCP Based Packaging
John Roman, RJR Polymers

Polymer Barrier Materials for Opto-Electronic Packaging
Maria Petrucci, Jose Rodriguez-Parada, Mark E. Lewittes, J. Bryan Brown, E.I. DuPont De Nemours & Co.

Lunch: Noon – 1 pm

Free Time: 1 pm – 2 pm

Session VIII: Tour of Center for Optical Technologies - Lehigh University
2 pm – 5:30 pm


Housing (Hotel Cut-off is September 3, 2004 )

Housing accommodations must be made directly to:

Radisson Hotel Bethlehem
437 Main Street
Bethlehem, PA 18018
Phone: 610-625-5000; Fax: 610-867-9955
www.radisson.com

When making reference, please reference IMAPS.

Single/Double: $119
Radisson Hotel Bethlehem requires a deposit for the first night's room and tax to hold your room. Deposit refunded if reservation is cancelled fourteen (14) days prior to arrival, after which time, deposit is non-refundable.


Register On-line | Exhibit Information

 




© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

<% rsCategory.Close() Set rsCategory = Nothing %>