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Advanced Technology Workshop on
Passive Integration
(download pdf of program)

Hilton Marco Island Beach Resort
560 South Collier Boulevard
Marco Island, FL 34145
P: 239-394-5000; www.marcoisland.hilton.com
January 24 - 26, 2005

Sponsored by
International Microelectronics And Packaging Society (IMAPS)
“ Everything in electronics between the chip and the system!”

General Chair:
Dr. Leonard Schaper, University of Arkansas
P: 479-575-8408; F: 479-575-2719
Email: schaper@uark.edu

Technical Program Chair:
Dr. Richard Ulrich, University of Arkansas
P: 479-575-5645; F: 479-575-7926
Email: rulrich@uark.edu


Program by Day: Monday | Tuesday | Wednesday
Program by Session: 1 | 2 | 3 | 4
Register On-line

Monday, January 24

Registration: 7:30 am - 6 pm

Continental Breakfast: 8 am - 9 am

Session I: Applications I
9 am - Noon
Chair: Leonard Schaper, University of Arkansas

Embedded Passives for Digital System Applications
Moises Cases, Nam Pham, Daniel N. deAraujo, Pravin Patel, IBM Corporation

Thin Film Passive Integration inside System in Package
Eric Bernier, STMicroelectronics

Thin Film for the Realization of High Quality On-Chip and In-Package RF Passives
Geert Carchon, Walter De Raedt, Eric Beyne, IMEC-MCP/HDIP

Break: 10:30 am - 11 am

Novel SrTiO3-Based Flexible and Thin Capacitors
Akinobu Shibuya, Shintaro Yamamichi, NEC Corporation

Electrical Performance Limitation of On-Package Decoupling Capacitors
Leonard W. Schaper, University of Arkansas

Chip Package Co-Design of Receiver Front-End for 5 GHz Wireless LAN Applications
Yasar Amin, Hannu Tenhunen, Li-Rong Zheng, Xinzhong Duo, University of Engineering and Technology Taxila, Pakistan

Lunch: 12:30 pm - 1:30 pm

Session 2: Components and Layout
2 pm - 3:30 pm
Chair: Leonard Schaper, University of Arkansas

Trimming Embedded Resistors using Ink Jet Technology
Virang G. Shah, Donald J. Hayes, MicroFab Technologies, Inc.

High Q Planar Inductors and their Applications in Thin-Film Integrated Passive Devices
George Korony, AVX Corporation

Design of Multilayer Embedded Passive Circuits using a PEEC Simulation Tool
W. R. Smith, RF Design Consultant

Break: 3:30 pm - 4 pm

Demonstration of Mentor Graphics Embedded Passive Layout Software
4 pm - 5 pm
Speaker: Per Viklund, Mentor Graphics

Reception: 5 pm - 5:30 pm

Dinner: 5:30 pm - 6:30 pm


Tuesday , January 25

Registration: 7:30 am - 7:30 pm

Continental Breakfast: 8 am - 9 am

Session 3: Decoupling
9 am - Noon
Chair: Richard Ulrich, University of Arkansas

Decoupling High Speed Digital Electronics with Embedded Capacitance
Joel S. Peiffer, 3M Company

Are Supercapacitive Nanocomposite Thin Films Suitable for Embedded Decoupling?
P. Markondeya Raj, Devarajan Balaraman, Vinu Govind, Isaac Robin Abothu, Swapan Bhattacharya, Madhavan Swaminathan, Rao Tummala, Georgia Institute of Technology

Decoupling Capacitors by Reactive Sputtering and Anodization Processes
Rohit Raghuveer, Susan L. Burkett, Leonard W. Schaper, Richard K. Ulrich, University of Arkansas - HiDEC; Bridget Rogers, Vanderbilt University

Break: 10:30 am - 11 am

Integration of Thin Film Capacitors on Organic Laminates for Systems in Package Applications
Takeshi Shioga, John D. Baniecki, Yoshikatsu Ishizuki, Masataka Mizukoshi, Kazuaki Kurihara, Fujitsu Laboratories Ltd.

Decoupling Simulation for Embedded Capacitors
Richard K. Ulrich, University of Arkansas

Lunch: 12:30 pm - 1:30 pm

Afternoon Free

Reception: 5 pm - 5:30 pm
Dinner: 5:30 pm - 7 pm

Panel Discussion and Late Developments
7 pm - 9 pm


Wednesday, January 26

Registration: 7:30 am - Noon

Continental Breakfast: 8 am - 9 am

Session 4: Applications II
9 am - Noon
Chair: Richard Ulrich, University of Arkansas

Integrated Passive Filter Incorporating Inductors and ESD Protectors
Dominick Richiuso, Anguel Brankov, Rong Liu, California Micro Devices

Integrated Low-Cost Thin-Film RF Filters on Glass
Ernest Demaray, Symmorphix

TBD
Robert Croswell, Motorola

Break: 10:30 am - 11 am

Development and Manufacture of LTCC Resistors for A6S/A6M Tape
Michail Moroz, Ferro Electronic Material Systems

Design of Embedded Capacitors in PCBs and Organic Chip Packages using Ultra-Thin Substrates
John Andresakis, Takuya Yamamoto, Pranabes Pramanik, Oak-Mitsui Technologies, LLC; Nick Biunno, Sanmina-SCI Corporation

Register On-line




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611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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