Registration: 7:30 am - 6 pm
Continental Breakfast: 8 am - 9 am
Session I: Applications I
9 am - Noon
Chair: Leonard Schaper, University of Arkansas
Embedded Passives for Digital System Applications
Moises Cases, Nam Pham, Daniel N. deAraujo, Pravin Patel, IBM Corporation
Thin Film Passive Integration inside System in Package
Eric Bernier, STMicroelectronics
Thin Film for the Realization of High Quality On-Chip and In-Package RF
Passives
Geert Carchon, Walter De Raedt, Eric Beyne, IMEC-MCP/HDIP
Break: 10:30 am - 11 am
Novel SrTiO3-Based Flexible and Thin Capacitors
Akinobu Shibuya, Shintaro Yamamichi, NEC Corporation
Electrical Performance Limitation of On-Package Decoupling Capacitors
Leonard W. Schaper, University of Arkansas
Chip Package Co-Design of Receiver Front-End for 5 GHz Wireless LAN Applications
Yasar
Amin, Hannu Tenhunen, Li-Rong Zheng, Xinzhong Duo, University of
Engineering and Technology Taxila, Pakistan
Lunch: 12:30 pm -
1:30 pm
Session 2:
Components and Layout
2 pm - 3:30 pm
Chair: Leonard Schaper, University of Arkansas
Trimming Embedded Resistors using Ink Jet Technology
Virang G. Shah, Donald J. Hayes, MicroFab Technologies, Inc.
High Q Planar Inductors and their Applications in Thin-Film
Integrated Passive Devices
George Korony, AVX Corporation
Design of Multilayer Embedded Passive Circuits using a
PEEC Simulation Tool
W. R. Smith, RF Design Consultant
Break: 3:30 pm - 4 pm
Demonstration of Mentor Graphics
Embedded Passive Layout Software
4 pm - 5 pm
Speaker: Per Viklund, Mentor Graphics
Reception: 5 pm - 5:30 pm
Dinner: 5:30 pm - 6:30 pm
Tuesday ,
January 25
Registration: 7:30 am - 7:30 pm
Continental Breakfast: 8 am - 9 am
Session 3:
Decoupling
9 am - Noon
Chair: Richard Ulrich, University of Arkansas
Decoupling High Speed Digital Electronics with Embedded
Capacitance
Joel S. Peiffer, 3M Company
Are Supercapacitive Nanocomposite Thin Films Suitable for
Embedded Decoupling?
P. Markondeya Raj, Devarajan Balaraman, Vinu Govind, Isaac Robin
Abothu, Swapan Bhattacharya, Madhavan Swaminathan, Rao Tummala,
Georgia Institute of Technology
Decoupling Capacitors by Reactive Sputtering and Anodization
Processes
Rohit Raghuveer, Susan L. Burkett, Leonard W. Schaper, Richard
K. Ulrich, University of Arkansas - HiDEC; Bridget Rogers, Vanderbilt
University
Break: 10:30 am - 11 am
Integration of Thin Film Capacitors on Organic Laminates
for Systems in Package Applications
Takeshi Shioga, John D. Baniecki, Yoshikatsu Ishizuki, Masataka
Mizukoshi, Kazuaki Kurihara, Fujitsu Laboratories Ltd.
Decoupling Simulation for Embedded Capacitors
Richard K. Ulrich, University of Arkansas
Lunch: 12:30 pm - 1:30 pm
Afternoon Free
Reception: 5 pm - 5:30 pm
Dinner: 5:30 pm - 7 pm
Panel Discussion and Late Developments
7 pm - 9 pm
Wednesday, January
26
Registration: 7:30 am - Noon
Continental Breakfast: 8 am - 9 am
Session 4:
Applications II
9 am - Noon
Chair: Richard Ulrich, University of Arkansas
Integrated Passive Filter Incorporating Inductors and ESD
Protectors
Dominick Richiuso, Anguel Brankov, Rong Liu, California Micro Devices
Integrated Low-Cost Thin-Film RF Filters on Glass
Ernest Demaray, Symmorphix
TBD
Robert Croswell, Motorola
Break: 10:30 am - 11 am
Development and Manufacture of LTCC Resistors for A6S/A6M
Tape
Michail Moroz, Ferro Electronic Material Systems
Design of Embedded Capacitors in PCBs and Organic Chip
Packages using Ultra-Thin Substrates
John Andresakis, Takuya Yamamoto, Pranabes Pramanik, Oak-Mitsui
Technologies, LLC; Nick Biunno, Sanmina-SCI Corporation
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