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IMAPS Advanced Technology Workshop on
Integrated/Embedded Passives

San Jose Convention Center/Fairmont Hotel
San Jose, California - USA
November 15 - 16, 2007

immediately following the IMAPS 2007 Symposium - November 11th thru 15th -

Advance Program
download pdf

RF Section of a WLAN Receiver - 5.2 GHz - Provided by IMEC
RF Section of a WLAN Receiver - 5.2 GHz

General Chair
Dr. Timothy G. Lenihan, Consultant
Tel: 303-772-8416
Technical Chair
Dr. Eric Beyne, IMEC
Tel: +32-16-28-1261

Register On-line
Hotel Reservations | Speaker Information
Sessions: Materials | Processing | Applications | Design | Market Trends

Workshop Overview:

The Advanced Technology Workshop (ATW) on Passive Integration features the latest papers on integrating resistors, capacitors, and inductors into leading edge applications. Topics will be presented from industry leaders like AVX, DuPont, NXP Semiconductors, Oak Mitsui, Omega Technologies, Samsung and leading research institutions like Georgia Tech, Fraunhofer Institute, IMEC, University of Arkansas and others. This workshop will focus on all aspects of passive integration from basic materials to design to manufacturing to applications like SiP. In addition, passive integration technology and market trends will be covered.

Passive technologies are essential for implementing smaller, cheaper and faster products. This workshop is an opportunity for passive integration developers to interact with industry leaders who are bringing these technologies to the marketplace.

Thursday, November 15
Thursday’s session will be at the San Jose Convention Center.

Registration: 11:00 am - 6:00 pm

Opening Remarks: 12:45 pm
Workshop Chairs

Session I: Materials
1:00 pm - 6:00 pm
Chair: Daniel Amey, DuPont Electronic Technologies

Embedded Discrete High K Capacitor Characterization in LTCC
Timothy P. Mobley, Mark F. McCombs, Michael A. Skurski, K. M. Nair, DuPont Microcircuit Materials

Filtering Capacitor with Bi-Zn-Oxide Dielectric Embedded in a LTCC Substrate
Jean-Pierre Ganne, Michel Pate, Richard Lebourgeois, Thales Research & Technology France; Jean-Pierre Bertinet, Eddie Leleux, Thales Microelectronics; Edda Mueller, Franz Bechtold, Via-Electronic

Multilayered Composite Dielectric Thin Films on Flexible Copper Foil for Advanced Packaging Applications
Taeyun Kim, Daniel J. Lichtenwalner, Angus I. Kingon, North Carolina State University

Sintering LTCC with Dissimilar Dielectric Materials
Yong-Bin Sun, Eui-Jung Choi, Jun-Yong Park, Kyonggi University

Development of an Improved Process for Integrated Passive Capacitors
Susan Jacob, Leonard W. Schaper, University of Arkansas

Break: 3:30 pm - 4:00 pm

A Low Temperature Process to Integrate High K-Low Loss Pyrochlore Films in Organic Substrates for Thin Film RF Capacitors
P. Markondeya Raj, Kent Coulter, Jin-Hyun Hwang, Isaac Robin Abothu, Steve Wellinghoff, Mahadevan Iyer, Rao Tummala, Georgia Institute of Technology

Low Temperature Sintering of Printed Nano-Particulate Materials for Fabrication of Passive Electronics
James W. Sears, Michael Carter, South Dakota School of Mines & Technology

Performance Improvements Through the Use of Embedded Capacitors in Flip-Chip IC Packages
Daniel I. Amey, Karl Dietz, William Borland, DuPont Electronic Technologies

Antiferroelectric Thin Films for High-Energy-Density Capacitors
Do-Kyun Kwon, Beihai Ma, Manoj Narayanan, Uhtamalingam Balachandran, Argonne National Laboratory

Friday, November 16
Friday’s sessions will be at the Fairmont Hotel.

Registration: 7:00 am - 6:00 pm

Continental Breakfast: 7:00 am - 8:00 am

Session 2: Processing
8:00 am - 10:00 am
Chair: Timothy Lenihan, TechSearch International

Embedded Thin-Film NiP Resistor Technology for PWB's Recent Developments in Lead-Free and Microwave Applications
Bruce P. Mahler, Ohmega Technologies, Inc.

Copper Electroplating Process for Passive Si-Based System in Package Applications
Laetitia Hamelin, Sophie Ladain, Catherine Bunel, NXP Semiconductors; Elisabeth Dufour-Gergam, Institut d'Electronique Fondamentale, Université Paris

Dielectric Properties of Liquid Crystalline Polymers and CaTiO3-LaAlO3 Composites for Embedded Matching Capacitors
Jin Cheol Kim, Samsung Electro-Mechanics

PCB Screen Printing Process for Embedded Capacitors and Resistors in RF Application
Chang-Sheng Chen, Chang-Lin Wei, Wei-Ting Chen, Cheng-Hua Tsai, Industrial Technology Research Institute; Yo-Shen Lin, National Central University

Break: 10:00 am - 10:30 am

Session 3: Applications
10:30 am - 12:30 pm
Chair: Jean-Marc Yannou, NXP Semiconductors

Embedding Technologies for Active and Passive Components
Thomas Loeher, Dionysios Manessis, Alexander Neumann, Andreas Ostmann, Herbert Reichl, Technische Universität Berlin

The Use of Embedded Planar Capacitors for I/O Decoupling
Daniel I. Amey, Sounak Banerji, Karl Dietz, DuPont Electronic Technologies

Resistance Behavior & Reliability of Embedded Resistor According to Temperature and Humidity
Hyung Mo Hwang, Hyunseok Choi, Yonghyun Kim, Dongchun Lee, Sidon Choi, Samsung Electronics

Use of Embedded Passives for Enhanced Performance and Integration: Case Studies
John Andresakis, Oak-Mitsui Technologies, LLC; Jun Fan, Norm Smith, NCR-Teradata; Mark Harvey, Sanmina-SCI; Yoshi Fukawa, TechDream; Dan Brandler, Bruce Mahler, Dong Nong, Ohmega Technologies

Lunch: 12:30 pm - 1:30 pm

Session 4: Design
1:30 pm - 5:00 pm
Chair: Leonard W. Schaper, University of Arkansas

Embedded Magnetics Construction: Materials, Design and Process
Jim Quilici, Radial Electronics Inc.; Milica Markovic, Cal State University

A Design Approach for the Miniaturization of Embedded RF Filters for System-in-Package (SiP) Applications
Mohamadou Baba, Herbert Reichl, Stephan Guttowski, Fraunhofer Institute for Reliability and Microintegration (FhG-IZM)

LTCC Integration of High Valued High Q Passive Components
Eric E. Hoppenjans, William J. Chappell, Phil Fisher, Purdue University

Inter-Wafer Inductors with 3D Hyper-Integration for Power Delivery Applications
Guoyan Zhang, Jian Sun, Jian-Qiang Lu, Rensselaer Polytechnic Institute

Break: 3:30 pm - 4:00 pm

Microstrip Thin-Film MCM-D Technology as Enabling Platform for the Integration of High-Performance SiP Modules
Guillermo Posada Quijano, G. Carchon, P. Soussan, N. Pham, B. Majeed, D. Sabuncouglu, W. Ruythooren, B. Nauwelaers, W. De Raedt, E. Beyne, IMEC

Effective EMC Management of Large Size Digital Circuits and Memories Thanks to High Capacitance Density Integrated Passive Devices (IPDs)
Jean-Marc Yannou, Bill Price, Guillaume Boguszewski, Sophie Ledain, NXP Semiconductors

Session 5: Market Trends
5:00 pm - 6:00 pm
Chair: Eric Beyne, IMEC

Integrated Passive Components for Filter Applications
George Korony, AVX Corporation

Integrated Passives: Trends in IC Packages
E. Jan Vardaman, Timothy G. Lenihan, TechSearch International, Inc.

Wrap-up: 6:00 pm

Register On-line | Hotel Reservations

Hotel Information

Housing for Passives 2007 is now open and making hotel reservations has never been easier. Make your reservations as early as possible.  The Passives 2007 room block will sell out quickly!

IMAPS has secured a special group rate of $178 plus applicable taxes. 

Book On-line:
Visit to book your Fairmont San Jose hotel reservations today!

Book by Phone, Email or Fax:
If you prefer, you may also contact the housing bureau directly with hotel questions or to make reservations::

IMAPS 2007 Housing Office
PHONE: (866) 766-0910 or (703) 770-3919
FAX: (703) 205-0235

Why should I book my room through IMAPS?

Host Hotel Location:
Fairmont San Jose
170 S. Market St.
San Jose, CA 95113

The Fairmont Hotel will not accept direct reservations and any correspondence sent to the hotel or IMAPS directly may result in substantial delays in processing your request. All reservations are assigned on a first-come, first-served basis.

Speaker Dates/Information:

  • Early registration and hotel reservation deadlines: October 10, 2007
  • Extended Abstract or Presentation Material due: October 12, 2007
  • Powerpoint/Presentation file for CD-Rom due not later than: November 17, 2007
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to prior to event)


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611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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